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JPS54102568A - Apparatus for dissipating heat lost form electronic construction element - Google Patents

Apparatus for dissipating heat lost form electronic construction element

Info

Publication number
JPS54102568A
JPS54102568A JP230679A JP230679A JPS54102568A JP S54102568 A JPS54102568 A JP S54102568A JP 230679 A JP230679 A JP 230679A JP 230679 A JP230679 A JP 230679A JP S54102568 A JPS54102568 A JP S54102568A
Authority
JP
Japan
Prior art keywords
dissipating heat
construction element
heat lost
form electronic
electronic construction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP230679A
Other languages
English (en)
Japanese (ja)
Inventor
Rooneru Peeteru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KM Kabelmetal AG
Original Assignee
KM Kabelmetal AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KM Kabelmetal AG filed Critical KM Kabelmetal AG
Publication of JPS54102568A publication Critical patent/JPS54102568A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP230679A 1978-01-16 1979-01-16 Apparatus for dissipating heat lost form electronic construction element Pending JPS54102568A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782801660 DE2801660C2 (de) 1978-01-16 1978-01-16 Vorrichtung zum Abführen der Verlustwärme von elektronischen Bauelementen

Publications (1)

Publication Number Publication Date
JPS54102568A true JPS54102568A (en) 1979-08-13

Family

ID=6029571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP230679A Pending JPS54102568A (en) 1978-01-16 1979-01-16 Apparatus for dissipating heat lost form electronic construction element

Country Status (2)

Country Link
JP (1) JPS54102568A (de)
DE (1) DE2801660C2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57140791U (de) * 1981-02-27 1982-09-03

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3016895C2 (de) * 1980-05-02 1982-10-28 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Rotierendes optronisches und/oder elektronisches Gerät oder Systemteil
DE3044314C2 (de) * 1980-11-25 1986-08-14 kabelmetal electro GmbH, 3000 Hannover Gehäuse zur Aufnahme von mit Wärme erzeugenden elektronischen Bauteilen bestückten gedruckten Schaltungen
FR2568712B1 (fr) * 1984-07-31 1987-01-09 Bull Sems Systeme de refroidissement a air pour armoire contenant des circuits electroniques
CH670541A5 (en) * 1985-12-13 1989-06-15 Hasler Ag Ascom Lost heat removal method for module of electrical elements
DE3679978D1 (de) * 1985-12-13 1991-08-01 Hasler Ag Ascom Verfahren und vorrichtung zum abfuehren der verlustwaerme wenigstens einer baugruppe elektrischer elemente.
DE4307902C1 (de) * 1993-03-12 1994-06-09 Bosch Gmbh Robert Kühlbare Einrichtung zur Aufnahme elektrischer Baugruppen
DE29704885U1 (de) * 1997-03-19 1998-04-30 Siemens AG, 80333 München Anordnung zur Abführung von Wärme einer in einem Gehäuse angeordneten Wärmequelle
DE19960840A1 (de) * 1999-12-16 2001-07-05 Siemens Ag Elektronische Schaltung mit Kühlvorrichtung
DE10053258A1 (de) * 2000-10-26 2002-05-16 Guenther Engineering Gmbh Enthitzungseinrichtung für elektronische Geräte
DE10160935A1 (de) * 2001-12-12 2003-07-17 Daimler Chrysler Ag Kraftfahrzeugkühlvorrichtung für elektronische Geräte
DE102005059819A1 (de) * 2005-12-14 2007-06-21 Giga-Byte Technology Co., Ltd., Hsin-Tien Gebläselose Stromversorgung eines Computers mit wärmedissipatierender Vorrichtung
DE102008052112B4 (de) * 2008-10-20 2011-05-19 Bombardier Transportation Gmbh Klimatisierungsanordnung für einen Führerstand
US10757809B1 (en) 2017-11-13 2020-08-25 Telephonics Corporation Air-cooled heat exchanger and thermal arrangement for stacked electronics
US10980151B2 (en) 2018-07-31 2021-04-13 Hewlett Packard Enterprise Development Lp Flexible heat transfer mechanism configurations
US11703921B2 (en) * 2020-03-09 2023-07-18 Nvidia Corporation Configurable heatsink

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3400543A (en) * 1966-10-31 1968-09-10 Peter G. Ross Semi-conductor cooling means
US3829740A (en) * 1973-07-09 1974-08-13 Buehler Corp Cooling arrangement for a direct current power supply
DE2417106A1 (de) * 1974-04-08 1975-10-16 Siemens Ag Thyristorsaeule

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57140791U (de) * 1981-02-27 1982-09-03

Also Published As

Publication number Publication date
DE2801660C2 (de) 1986-01-30
DE2801660A1 (de) 1979-07-19

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