JPS54102568A - Apparatus for dissipating heat lost form electronic construction element - Google Patents
Apparatus for dissipating heat lost form electronic construction elementInfo
- Publication number
- JPS54102568A JPS54102568A JP230679A JP230679A JPS54102568A JP S54102568 A JPS54102568 A JP S54102568A JP 230679 A JP230679 A JP 230679A JP 230679 A JP230679 A JP 230679A JP S54102568 A JPS54102568 A JP S54102568A
- Authority
- JP
- Japan
- Prior art keywords
- dissipating heat
- construction element
- heat lost
- form electronic
- electronic construction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010276 construction Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19782801660 DE2801660C2 (en) | 1978-01-16 | 1978-01-16 | Device for dissipating heat loss from electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54102568A true JPS54102568A (en) | 1979-08-13 |
Family
ID=6029571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP230679A Pending JPS54102568A (en) | 1978-01-16 | 1979-01-16 | Apparatus for dissipating heat lost form electronic construction element |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS54102568A (en) |
DE (1) | DE2801660C2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57140791U (en) * | 1981-02-27 | 1982-09-03 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3016895C2 (en) * | 1980-05-02 | 1982-10-28 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Rotating optronic and / or electronic device or system part |
DE3044314C2 (en) * | 1980-11-25 | 1986-08-14 | kabelmetal electro GmbH, 3000 Hannover | Housing for accommodating printed circuits equipped with heat-generating electronic components |
FR2568712B1 (en) * | 1984-07-31 | 1987-01-09 | Bull Sems | AIR COOLING SYSTEM FOR CABINET CONTAINING ELECTRONIC CIRCUITS |
CH670541A5 (en) * | 1985-12-13 | 1989-06-15 | Hasler Ag Ascom | Lost heat removal method for module of electrical elements |
DE3679978D1 (en) * | 1985-12-13 | 1991-08-01 | Hasler Ag Ascom | METHOD AND DEVICE FOR DISCHARGING THE LOSS OF HEAT AT LEAST ONE ASSEMBLY OF ELECTRICAL ELEMENTS. |
DE4307902C1 (en) * | 1993-03-12 | 1994-06-09 | Bosch Gmbh Robert | Cooled reception housing for automobile electronic control devices - with circulated cooling medium fed through cooling device above cooling jacket enclosing housing |
DE29704885U1 (en) * | 1997-03-19 | 1998-04-30 | Siemens AG, 80333 München | Arrangement for dissipating heat from a heat source arranged in a housing |
DE19960840A1 (en) * | 1999-12-16 | 2001-07-05 | Siemens Ag | Electronic circuit with cooling device |
DE10053258A1 (en) * | 2000-10-26 | 2002-05-16 | Guenther Engineering Gmbh | Heat sink for electronic device has evaporator and condenser heat exchangers connected in hermetically sealed heat sink circuit |
DE10160935A1 (en) * | 2001-12-12 | 2003-07-17 | Daimler Chrysler Ag | Device for motor vehicle cooling, has electrical devices to be cooled fitted in the internal area of the motor vehicle |
DE102005059819A1 (en) * | 2005-12-14 | 2007-06-21 | Giga-Byte Technology Co., Ltd., Hsin-Tien | Heat dissipating system for personal computer, has blower placed at outlet of computer, and heat pipe with bar, which extends to outlet, where temperature of current supply is reduced by blowing bar with blower |
DE102008052112B4 (en) * | 2008-10-20 | 2011-05-19 | Bombardier Transportation Gmbh | Air conditioning arrangement for a driver's cab |
US10757809B1 (en) | 2017-11-13 | 2020-08-25 | Telephonics Corporation | Air-cooled heat exchanger and thermal arrangement for stacked electronics |
US10980151B2 (en) | 2018-07-31 | 2021-04-13 | Hewlett Packard Enterprise Development Lp | Flexible heat transfer mechanism configurations |
US11703921B2 (en) * | 2020-03-09 | 2023-07-18 | Nvidia Corporation | Configurable heatsink |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3400543A (en) * | 1966-10-31 | 1968-09-10 | Peter G. Ross | Semi-conductor cooling means |
US3829740A (en) * | 1973-07-09 | 1974-08-13 | Buehler Corp | Cooling arrangement for a direct current power supply |
DE2417106A1 (en) * | 1974-04-08 | 1975-10-16 | Siemens Ag | Gas-cooled thyristor stack has heat sinks between thyristors - and is fitted with transverse cooling fins and lateral tubes |
-
1978
- 1978-01-16 DE DE19782801660 patent/DE2801660C2/en not_active Expired
-
1979
- 1979-01-16 JP JP230679A patent/JPS54102568A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57140791U (en) * | 1981-02-27 | 1982-09-03 |
Also Published As
Publication number | Publication date |
---|---|
DE2801660C2 (en) | 1986-01-30 |
DE2801660A1 (en) | 1979-07-19 |
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