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JPS5372451A - Laser scriber unit - Google Patents

Laser scriber unit

Info

Publication number
JPS5372451A
JPS5372451A JP14804176A JP14804176A JPS5372451A JP S5372451 A JPS5372451 A JP S5372451A JP 14804176 A JP14804176 A JP 14804176A JP 14804176 A JP14804176 A JP 14804176A JP S5372451 A JPS5372451 A JP S5372451A
Authority
JP
Japan
Prior art keywords
laser scriber
scriber unit
wafer
unit
downward
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14804176A
Other languages
Japanese (ja)
Inventor
Sokichi Yamagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14804176A priority Critical patent/JPS5372451A/en
Publication of JPS5372451A publication Critical patent/JPS5372451A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To prevent the trash due to beam from welding on the wafer surface and to form a deep groove, by holding the surface of semiconductor wafer downward and by scribing the wafer through the laser beam downward the surface.
JP14804176A 1976-12-08 1976-12-08 Laser scriber unit Pending JPS5372451A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14804176A JPS5372451A (en) 1976-12-08 1976-12-08 Laser scriber unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14804176A JPS5372451A (en) 1976-12-08 1976-12-08 Laser scriber unit

Publications (1)

Publication Number Publication Date
JPS5372451A true JPS5372451A (en) 1978-06-27

Family

ID=15443793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14804176A Pending JPS5372451A (en) 1976-12-08 1976-12-08 Laser scriber unit

Country Status (1)

Country Link
JP (1) JPS5372451A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6082286A (en) * 1983-10-08 1985-05-10 Semiconductor Energy Lab Co Ltd Laser working method
US7838796B2 (en) * 2004-11-29 2010-11-23 Fujitsu Limited Stack structure cutting method and stack structure
US12191138B2 (en) 2020-10-02 2025-01-07 Disco Corporation Processing method of workpiece

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6082286A (en) * 1983-10-08 1985-05-10 Semiconductor Energy Lab Co Ltd Laser working method
US7838796B2 (en) * 2004-11-29 2010-11-23 Fujitsu Limited Stack structure cutting method and stack structure
US12191138B2 (en) 2020-10-02 2025-01-07 Disco Corporation Processing method of workpiece

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