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JPS53105977A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS53105977A
JPS53105977A JP2060677A JP2060677A JPS53105977A JP S53105977 A JPS53105977 A JP S53105977A JP 2060677 A JP2060677 A JP 2060677A JP 2060677 A JP2060677 A JP 2060677A JP S53105977 A JPS53105977 A JP S53105977A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
thin
junction
ensure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2060677A
Other languages
Japanese (ja)
Other versions
JPS5629382B2 (en
Inventor
Masao Kachi
Hiroshi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP2060677A priority Critical patent/JPS53105977A/en
Publication of JPS53105977A publication Critical patent/JPS53105977A/en
Publication of JPS5629382B2 publication Critical patent/JPS5629382B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Formation Of Insulating Films (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To ensure an easy scribing by the laser beam by forming the glass film within the mesa groove sufficiently thin on the PN- junction and thin at the laser irradiation part.
COPYRIGHT: (C)1978,JPO&Japio
JP2060677A 1977-02-26 1977-02-26 Manufacture of semiconductor device Granted JPS53105977A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2060677A JPS53105977A (en) 1977-02-26 1977-02-26 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2060677A JPS53105977A (en) 1977-02-26 1977-02-26 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS53105977A true JPS53105977A (en) 1978-09-14
JPS5629382B2 JPS5629382B2 (en) 1981-07-08

Family

ID=12031915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2060677A Granted JPS53105977A (en) 1977-02-26 1977-02-26 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS53105977A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002523900A (en) * 1998-08-25 2002-07-30 コミツサリア タ レネルジー アトミーク Method of manufacturing an integrated electronic circuit comprising an electronic circuit and at least one power electronic component in a substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002523900A (en) * 1998-08-25 2002-07-30 コミツサリア タ レネルジー アトミーク Method of manufacturing an integrated electronic circuit comprising an electronic circuit and at least one power electronic component in a substrate

Also Published As

Publication number Publication date
JPS5629382B2 (en) 1981-07-08

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