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JPS5355965A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5355965A
JPS5355965A JP13090076A JP13090076A JPS5355965A JP S5355965 A JPS5355965 A JP S5355965A JP 13090076 A JP13090076 A JP 13090076A JP 13090076 A JP13090076 A JP 13090076A JP S5355965 A JPS5355965 A JP S5355965A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
lead
conntact
verge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13090076A
Other languages
Japanese (ja)
Other versions
JPS6027181B2 (en
Inventor
Takashi Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP51130900A priority Critical patent/JPS6027181B2/en
Publication of JPS5355965A publication Critical patent/JPS5355965A/en
Publication of JPS6027181B2 publication Critical patent/JPS6027181B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To increase the yield of the lead pattern on the insulating film and to decrease the number of mounting process while utilizing the specific feature of the tape carrier system. thus preventing the conntact between the element verge and the lead.
COPYRIGHT: (C)1978,JPO&Japio
JP51130900A 1976-10-29 1976-10-29 Manufacturing method of semiconductor device Expired JPS6027181B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51130900A JPS6027181B2 (en) 1976-10-29 1976-10-29 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51130900A JPS6027181B2 (en) 1976-10-29 1976-10-29 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5355965A true JPS5355965A (en) 1978-05-20
JPS6027181B2 JPS6027181B2 (en) 1985-06-27

Family

ID=15045335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51130900A Expired JPS6027181B2 (en) 1976-10-29 1976-10-29 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6027181B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS588953U (en) * 1981-07-08 1983-01-20 日本電気株式会社 semiconductor equipment
JPS5831545A (en) * 1981-08-18 1983-02-24 Nec Corp Manufacture of semiconductor device
JPS5874047A (en) * 1981-10-28 1983-05-04 Toshiba Corp hybrid integrated circuit
JPS62283634A (en) * 1986-05-31 1987-12-09 Mitsubishi Electric Corp Semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61112075U (en) * 1984-12-25 1986-07-15

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS588953U (en) * 1981-07-08 1983-01-20 日本電気株式会社 semiconductor equipment
JPS5831545A (en) * 1981-08-18 1983-02-24 Nec Corp Manufacture of semiconductor device
JPS5874047A (en) * 1981-10-28 1983-05-04 Toshiba Corp hybrid integrated circuit
JPS62283634A (en) * 1986-05-31 1987-12-09 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
JPS6027181B2 (en) 1985-06-27

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