JPS5336468A - Package for integrated circuit - Google Patents
Package for integrated circuitInfo
- Publication number
- JPS5336468A JPS5336468A JP11079976A JP11079976A JPS5336468A JP S5336468 A JPS5336468 A JP S5336468A JP 11079976 A JP11079976 A JP 11079976A JP 11079976 A JP11079976 A JP 11079976A JP S5336468 A JPS5336468 A JP S5336468A
- Authority
- JP
- Japan
- Prior art keywords
- package
- integrated circuit
- utilizing
- chip
- decrease
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Semiconductor Integrated Circuits (AREA)
Abstract
PURPOSE: To decrease the line voltage fall for an IC package by utilizing the cap ring for apart of the feeding line to the IC chip.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11079976A JPS5336468A (en) | 1976-09-17 | 1976-09-17 | Package for integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11079976A JPS5336468A (en) | 1976-09-17 | 1976-09-17 | Package for integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5336468A true JPS5336468A (en) | 1978-04-04 |
Family
ID=14544929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11079976A Pending JPS5336468A (en) | 1976-09-17 | 1976-09-17 | Package for integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5336468A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57211754A (en) * | 1981-06-24 | 1982-12-25 | Fujitsu Ltd | Package |
JPS5972749A (en) * | 1982-10-19 | 1984-04-24 | Nec Corp | Semiconductor device |
US4608592A (en) * | 1982-07-09 | 1986-08-26 | Nec Corporation | Semiconductor device provided with a package for a semiconductor element having a plurality of electrodes to be applied with substantially same voltage |
US4631572A (en) * | 1983-09-27 | 1986-12-23 | Trw Inc. | Multiple path signal distribution to large scale integration chips |
US4677741A (en) * | 1981-11-30 | 1987-07-07 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing package for high power integrated circuit |
JPS63500692A (en) * | 1985-08-27 | 1988-03-10 | ヒユ−ズ・エアクラフト・カンパニ− | Ultra-small electronic package |
-
1976
- 1976-09-17 JP JP11079976A patent/JPS5336468A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57211754A (en) * | 1981-06-24 | 1982-12-25 | Fujitsu Ltd | Package |
US4677741A (en) * | 1981-11-30 | 1987-07-07 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing package for high power integrated circuit |
US4608592A (en) * | 1982-07-09 | 1986-08-26 | Nec Corporation | Semiconductor device provided with a package for a semiconductor element having a plurality of electrodes to be applied with substantially same voltage |
JPS5972749A (en) * | 1982-10-19 | 1984-04-24 | Nec Corp | Semiconductor device |
JPS6322615B2 (en) * | 1982-10-19 | 1988-05-12 | Nippon Electric Co | |
US4631572A (en) * | 1983-09-27 | 1986-12-23 | Trw Inc. | Multiple path signal distribution to large scale integration chips |
JPS63500692A (en) * | 1985-08-27 | 1988-03-10 | ヒユ−ズ・エアクラフト・カンパニ− | Ultra-small electronic package |
JPH0324067B2 (en) * | 1985-08-27 | 1991-04-02 | Hughes Aircraft Co |
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