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JPS5325361A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5325361A
JPS5325361A JP9969876A JP9969876A JPS5325361A JP S5325361 A JPS5325361 A JP S5325361A JP 9969876 A JP9969876 A JP 9969876A JP 9969876 A JP9969876 A JP 9969876A JP S5325361 A JPS5325361 A JP S5325361A
Authority
JP
Japan
Prior art keywords
semiconductor device
damaging
prevented
resin material
thermal stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9969876A
Other languages
Japanese (ja)
Inventor
Atsushi Sasayama
Usuke Enomoto
Nobuo Otani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9969876A priority Critical patent/JPS5325361A/en
Publication of JPS5325361A publication Critical patent/JPS5325361A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:Damaging of a resin material owing to thermal stress is prevented and an inexpensive semiconductor device is obtained.
JP9969876A 1976-08-23 1976-08-23 Semiconductor device Pending JPS5325361A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9969876A JPS5325361A (en) 1976-08-23 1976-08-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9969876A JPS5325361A (en) 1976-08-23 1976-08-23 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5325361A true JPS5325361A (en) 1978-03-09

Family

ID=14254260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9969876A Pending JPS5325361A (en) 1976-08-23 1976-08-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5325361A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5881957U (en) * 1981-10-22 1983-06-03 株式会社　山田製作所 lead frame
JPS58101445A (en) * 1981-12-11 1983-06-16 Mitsubishi Electric Corp Resin-sealed semiconductor device
JPS61183900U (en) * 1985-05-07 1986-11-17
JP2001183122A (en) * 1999-10-12 2001-07-06 Canon Inc Optical rotational angle detecting device, rotation detecting device, and optical rotational angle detecting method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5881957U (en) * 1981-10-22 1983-06-03 株式会社　山田製作所 lead frame
JPS58101445A (en) * 1981-12-11 1983-06-16 Mitsubishi Electric Corp Resin-sealed semiconductor device
JPS61183900U (en) * 1985-05-07 1986-11-17
JPH033519Y2 (en) * 1985-05-07 1991-01-29
JP2001183122A (en) * 1999-10-12 2001-07-06 Canon Inc Optical rotational angle detecting device, rotation detecting device, and optical rotational angle detecting method

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