JPS5314612A - Lead wire - Google Patents
Lead wireInfo
- Publication number
- JPS5314612A JPS5314612A JP8903776A JP8903776A JPS5314612A JP S5314612 A JPS5314612 A JP S5314612A JP 8903776 A JP8903776 A JP 8903776A JP 8903776 A JP8903776 A JP 8903776A JP S5314612 A JPS5314612 A JP S5314612A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- bendability
- repeating
- prepare
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
PURPOSE: To prepare without the conductivity decrease the lead wire got semiconductor superior in strength and repeating bendability by adding Ni, Be etc. to Cu, hot rolling, cold drawing, heating, rapid cooling and annealing finally.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8903776A JPS6012421B2 (en) | 1976-07-28 | 1976-07-28 | Manufacturing method of lead wire material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8903776A JPS6012421B2 (en) | 1976-07-28 | 1976-07-28 | Manufacturing method of lead wire material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5314612A true JPS5314612A (en) | 1978-02-09 |
JPS6012421B2 JPS6012421B2 (en) | 1985-04-01 |
Family
ID=13959683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8903776A Expired JPS6012421B2 (en) | 1976-07-28 | 1976-07-28 | Manufacturing method of lead wire material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6012421B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58124254A (en) * | 1982-01-20 | 1983-07-23 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor equipment |
JPS58122980U (en) * | 1982-02-16 | 1983-08-22 | 不二製油株式会社 | Ohajiki-shaped Chiyokolate |
JPS6072791A (en) * | 1983-09-29 | 1985-04-24 | San Ei Chem Ind Ltd | Printing of bean-jam wafer or other sweet cake |
JPS62199742A (en) * | 1986-02-27 | 1987-09-03 | Ngk Insulators Ltd | High strength copper alloy and its manufacture |
JP2010129455A (en) * | 2008-11-28 | 2010-06-10 | Sekisui Chem Co Ltd | Conductive particle, anisotropic conductive material, connection structure, and manufacturing method of conductive particle |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102640154B1 (en) * | 2021-08-19 | 2024-02-23 | 주식회사 시온 | A reinforcing member for skid of steel packing |
-
1976
- 1976-07-28 JP JP8903776A patent/JPS6012421B2/en not_active Expired
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58124254A (en) * | 1982-01-20 | 1983-07-23 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor equipment |
JPS6314056B2 (en) * | 1982-01-20 | 1988-03-29 | Nippon Mining Co | |
JPS58122980U (en) * | 1982-02-16 | 1983-08-22 | 不二製油株式会社 | Ohajiki-shaped Chiyokolate |
JPS6213484Y2 (en) * | 1982-02-16 | 1987-04-07 | ||
JPS6072791A (en) * | 1983-09-29 | 1985-04-24 | San Ei Chem Ind Ltd | Printing of bean-jam wafer or other sweet cake |
JPS62199742A (en) * | 1986-02-27 | 1987-09-03 | Ngk Insulators Ltd | High strength copper alloy and its manufacture |
JPH036214B2 (en) * | 1986-02-27 | 1991-01-29 | Ngk Insulators Ltd | |
JP2010129455A (en) * | 2008-11-28 | 2010-06-10 | Sekisui Chem Co Ltd | Conductive particle, anisotropic conductive material, connection structure, and manufacturing method of conductive particle |
Also Published As
Publication number | Publication date |
---|---|
JPS6012421B2 (en) | 1985-04-01 |
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