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JPS5314612A - Lead wire - Google Patents

Lead wire

Info

Publication number
JPS5314612A
JPS5314612A JP8903776A JP8903776A JPS5314612A JP S5314612 A JPS5314612 A JP S5314612A JP 8903776 A JP8903776 A JP 8903776A JP 8903776 A JP8903776 A JP 8903776A JP S5314612 A JPS5314612 A JP S5314612A
Authority
JP
Japan
Prior art keywords
lead wire
bendability
repeating
prepare
strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8903776A
Other languages
Japanese (ja)
Other versions
JPS6012421B2 (en
Inventor
Haruka Machitori
Koichi Tejima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8903776A priority Critical patent/JPS6012421B2/en
Publication of JPS5314612A publication Critical patent/JPS5314612A/en
Publication of JPS6012421B2 publication Critical patent/JPS6012421B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

PURPOSE: To prepare without the conductivity decrease the lead wire got semiconductor superior in strength and repeating bendability by adding Ni, Be etc. to Cu, hot rolling, cold drawing, heating, rapid cooling and annealing finally.
COPYRIGHT: (C)1978,JPO&Japio
JP8903776A 1976-07-28 1976-07-28 Manufacturing method of lead wire material Expired JPS6012421B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8903776A JPS6012421B2 (en) 1976-07-28 1976-07-28 Manufacturing method of lead wire material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8903776A JPS6012421B2 (en) 1976-07-28 1976-07-28 Manufacturing method of lead wire material

Publications (2)

Publication Number Publication Date
JPS5314612A true JPS5314612A (en) 1978-02-09
JPS6012421B2 JPS6012421B2 (en) 1985-04-01

Family

ID=13959683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8903776A Expired JPS6012421B2 (en) 1976-07-28 1976-07-28 Manufacturing method of lead wire material

Country Status (1)

Country Link
JP (1) JPS6012421B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58124254A (en) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor equipment
JPS58122980U (en) * 1982-02-16 1983-08-22 不二製油株式会社 Ohajiki-shaped Chiyokolate
JPS6072791A (en) * 1983-09-29 1985-04-24 San Ei Chem Ind Ltd Printing of bean-jam wafer or other sweet cake
JPS62199742A (en) * 1986-02-27 1987-09-03 Ngk Insulators Ltd High strength copper alloy and its manufacture
JP2010129455A (en) * 2008-11-28 2010-06-10 Sekisui Chem Co Ltd Conductive particle, anisotropic conductive material, connection structure, and manufacturing method of conductive particle

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102640154B1 (en) * 2021-08-19 2024-02-23 주식회사 시온 A reinforcing member for skid of steel packing

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58124254A (en) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor equipment
JPS6314056B2 (en) * 1982-01-20 1988-03-29 Nippon Mining Co
JPS58122980U (en) * 1982-02-16 1983-08-22 不二製油株式会社 Ohajiki-shaped Chiyokolate
JPS6213484Y2 (en) * 1982-02-16 1987-04-07
JPS6072791A (en) * 1983-09-29 1985-04-24 San Ei Chem Ind Ltd Printing of bean-jam wafer or other sweet cake
JPS62199742A (en) * 1986-02-27 1987-09-03 Ngk Insulators Ltd High strength copper alloy and its manufacture
JPH036214B2 (en) * 1986-02-27 1991-01-29 Ngk Insulators Ltd
JP2010129455A (en) * 2008-11-28 2010-06-10 Sekisui Chem Co Ltd Conductive particle, anisotropic conductive material, connection structure, and manufacturing method of conductive particle

Also Published As

Publication number Publication date
JPS6012421B2 (en) 1985-04-01

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