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JPS53136885A - Measuring apparatus for thermal deformations of large size wafers - Google Patents

Measuring apparatus for thermal deformations of large size wafers

Info

Publication number
JPS53136885A
JPS53136885A JP5067877A JP5067877A JPS53136885A JP S53136885 A JPS53136885 A JP S53136885A JP 5067877 A JP5067877 A JP 5067877A JP 5067877 A JP5067877 A JP 5067877A JP S53136885 A JPS53136885 A JP S53136885A
Authority
JP
Japan
Prior art keywords
measuring apparatus
large size
thermal deformations
size wafers
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5067877A
Other languages
Japanese (ja)
Other versions
JPS5750241B2 (en
Inventor
Noboru Watanabe
Ken Ogiso
Yoshie Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP5067877A priority Critical patent/JPS53136885A/en
Publication of JPS53136885A publication Critical patent/JPS53136885A/en
Publication of JPS5750241B2 publication Critical patent/JPS5750241B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

PURPOSE: To achieve the reduction of measurement errors over a wide range by sufficiently heat-insulating portions other than the measured part thereby evenly heating the specimen.
COPYRIGHT: (C)1978,JPO&Japio
JP5067877A 1977-05-04 1977-05-04 Measuring apparatus for thermal deformations of large size wafers Granted JPS53136885A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5067877A JPS53136885A (en) 1977-05-04 1977-05-04 Measuring apparatus for thermal deformations of large size wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5067877A JPS53136885A (en) 1977-05-04 1977-05-04 Measuring apparatus for thermal deformations of large size wafers

Publications (2)

Publication Number Publication Date
JPS53136885A true JPS53136885A (en) 1978-11-29
JPS5750241B2 JPS5750241B2 (en) 1982-10-26

Family

ID=12865585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5067877A Granted JPS53136885A (en) 1977-05-04 1977-05-04 Measuring apparatus for thermal deformations of large size wafers

Country Status (1)

Country Link
JP (1) JPS53136885A (en)

Also Published As

Publication number Publication date
JPS5750241B2 (en) 1982-10-26

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