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JPS53107274A - Forming method of patterns - Google Patents

Forming method of patterns

Info

Publication number
JPS53107274A
JPS53107274A JP2154677A JP2154677A JPS53107274A JP S53107274 A JPS53107274 A JP S53107274A JP 2154677 A JP2154677 A JP 2154677A JP 2154677 A JP2154677 A JP 2154677A JP S53107274 A JPS53107274 A JP S53107274A
Authority
JP
Japan
Prior art keywords
patterns
forming method
depositing
substrate
coupling agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2154677A
Other languages
Japanese (ja)
Other versions
JPS6211496B2 (en
Inventor
Yoshio Honma
Ichisuke Yamanaka
Hisao Nozawa
Yukiyoshi Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2154677A priority Critical patent/JPS53107274A/en
Publication of JPS53107274A publication Critical patent/JPS53107274A/en
Publication of JPS6211496B2 publication Critical patent/JPS6211496B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Bipolar Transistors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To form fine patterns by depositing a photoresist film on a substrate by way of a silane coupling agent or its hydroxide layer.
COPYRIGHT: (C)1978,JPO&Japio
JP2154677A 1977-03-02 1977-03-02 Forming method of patterns Granted JPS53107274A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2154677A JPS53107274A (en) 1977-03-02 1977-03-02 Forming method of patterns

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2154677A JPS53107274A (en) 1977-03-02 1977-03-02 Forming method of patterns

Publications (2)

Publication Number Publication Date
JPS53107274A true JPS53107274A (en) 1978-09-19
JPS6211496B2 JPS6211496B2 (en) 1987-03-12

Family

ID=12057973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2154677A Granted JPS53107274A (en) 1977-03-02 1977-03-02 Forming method of patterns

Country Status (1)

Country Link
JP (1) JPS53107274A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5632729A (en) * 1979-08-23 1981-04-02 Sanyo Electric Co Ltd Etching method
JPS58188132A (en) * 1982-04-28 1983-11-02 Toyo Soda Mfg Co Ltd Method for increase in adhesive strength between resist and substrate
US20090162681A1 (en) * 2007-12-21 2009-06-25 Artur Kolics Activation solution for electroless plating on dielectric layers

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5632729A (en) * 1979-08-23 1981-04-02 Sanyo Electric Co Ltd Etching method
JPS58188132A (en) * 1982-04-28 1983-11-02 Toyo Soda Mfg Co Ltd Method for increase in adhesive strength between resist and substrate
US20090162681A1 (en) * 2007-12-21 2009-06-25 Artur Kolics Activation solution for electroless plating on dielectric layers

Also Published As

Publication number Publication date
JPS6211496B2 (en) 1987-03-12

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