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JPS53101275A - Resin seal-type semiconductor device - Google Patents

Resin seal-type semiconductor device

Info

Publication number
JPS53101275A
JPS53101275A JP1409578A JP1409578A JPS53101275A JP S53101275 A JPS53101275 A JP S53101275A JP 1409578 A JP1409578 A JP 1409578A JP 1409578 A JP1409578 A JP 1409578A JP S53101275 A JPS53101275 A JP S53101275A
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
resin seal
fin
protruded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1409578A
Other languages
Japanese (ja)
Inventor
Masayoshi Yoshimura
Keizo Otsuki
Senji Shoji
Tomio Yamada
Kazuo Shimizu
Yuji Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1409578A priority Critical patent/JPS53101275A/en
Publication of JPS53101275A publication Critical patent/JPS53101275A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To reduce the length of the protruded fin part to realize a compact structure, by making protruded the radiation fin attachment plate over the side surface of the concave resin body and sealing one edge part of the fin to the attachment plate at the concave part and then overlapping the remaining part on the resin body.
COPYRIGHT: (C)1978,JPO&Japio
JP1409578A 1978-02-13 1978-02-13 Resin seal-type semiconductor device Pending JPS53101275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1409578A JPS53101275A (en) 1978-02-13 1978-02-13 Resin seal-type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1409578A JPS53101275A (en) 1978-02-13 1978-02-13 Resin seal-type semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP50142794A Division JPS5266376A (en) 1975-11-29 1975-11-29 Device and manufacture of resin body type semiconductor

Publications (1)

Publication Number Publication Date
JPS53101275A true JPS53101275A (en) 1978-09-04

Family

ID=11851544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1409578A Pending JPS53101275A (en) 1978-02-13 1978-02-13 Resin seal-type semiconductor device

Country Status (1)

Country Link
JP (1) JPS53101275A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014112590A (en) * 2012-12-05 2014-06-19 Denso Corp Electronic apparatus
EP2503674B1 (en) * 2009-11-20 2022-08-10 Mitsubishi Electric Corporation Vehicle ac generator regulator

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2503674B1 (en) * 2009-11-20 2022-08-10 Mitsubishi Electric Corporation Vehicle ac generator regulator
JP2014112590A (en) * 2012-12-05 2014-06-19 Denso Corp Electronic apparatus

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