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JPS5276872A - Cutting method of semiconductor wafer - Google Patents

Cutting method of semiconductor wafer

Info

Publication number
JPS5276872A
JPS5276872A JP15276375A JP15276375A JPS5276872A JP S5276872 A JPS5276872 A JP S5276872A JP 15276375 A JP15276375 A JP 15276375A JP 15276375 A JP15276375 A JP 15276375A JP S5276872 A JPS5276872 A JP S5276872A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
cutting method
wafer
blocks
adsorbing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15276375A
Other languages
Japanese (ja)
Inventor
Isao Arakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15276375A priority Critical patent/JPS5276872A/en
Publication of JPS5276872A publication Critical patent/JPS5276872A/en
Pending legal-status Critical Current

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  • Dicing (AREA)

Abstract

PURPOSE: To cut out wafer by aligning scribed line on the upper hem of the adjacent blocks and adsorbing the wafer and by bending the blocks.
COPYRIGHT: (C)1977,JPO&Japio
JP15276375A 1975-12-23 1975-12-23 Cutting method of semiconductor wafer Pending JPS5276872A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15276375A JPS5276872A (en) 1975-12-23 1975-12-23 Cutting method of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15276375A JPS5276872A (en) 1975-12-23 1975-12-23 Cutting method of semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5276872A true JPS5276872A (en) 1977-06-28

Family

ID=15547606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15276375A Pending JPS5276872A (en) 1975-12-23 1975-12-23 Cutting method of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5276872A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012109358A (en) * 2010-11-16 2012-06-07 Tokyo Seimitsu Co Ltd Cutting method and cutting device of semiconductor substrate
JP2012146897A (en) * 2011-01-14 2012-08-02 Tokyo Seimitsu Co Ltd Cutting method for semiconductor wafer and cutting apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012109358A (en) * 2010-11-16 2012-06-07 Tokyo Seimitsu Co Ltd Cutting method and cutting device of semiconductor substrate
JP2012146897A (en) * 2011-01-14 2012-08-02 Tokyo Seimitsu Co Ltd Cutting method for semiconductor wafer and cutting apparatus

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