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JPS5261982A - Semiconductor light emitting device - Google Patents

Semiconductor light emitting device

Info

Publication number
JPS5261982A
JPS5261982A JP50138454A JP13845475A JPS5261982A JP S5261982 A JPS5261982 A JP S5261982A JP 50138454 A JP50138454 A JP 50138454A JP 13845475 A JP13845475 A JP 13845475A JP S5261982 A JPS5261982 A JP S5261982A
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
semiconductor light
enclosure
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50138454A
Other languages
Japanese (ja)
Inventor
Hiroshi Kaneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP50138454A priority Critical patent/JPS5261982A/en
Publication of JPS5261982A publication Critical patent/JPS5261982A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)

Abstract

PURPOSE: To provide protection against overvoltage applied undesirably during use by connecting a diode in parallel to a light emitting pellet, connecting a resistor in series thereto and mounting these within one enclosure.
COPYRIGHT: (C)1977,JPO&Japio
JP50138454A 1975-11-18 1975-11-18 Semiconductor light emitting device Pending JPS5261982A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50138454A JPS5261982A (en) 1975-11-18 1975-11-18 Semiconductor light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50138454A JPS5261982A (en) 1975-11-18 1975-11-18 Semiconductor light emitting device

Publications (1)

Publication Number Publication Date
JPS5261982A true JPS5261982A (en) 1977-05-21

Family

ID=15222378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50138454A Pending JPS5261982A (en) 1975-11-18 1975-11-18 Semiconductor light emitting device

Country Status (1)

Country Link
JP (1) JPS5261982A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07326772A (en) * 1995-05-25 1995-12-12 Rohm Co Ltd Discrete diode device
JPH088446A (en) * 1995-05-25 1996-01-12 Rohm Co Ltd Discrete diode
JPH0832092A (en) * 1995-05-25 1996-02-02 Rohm Co Ltd Discrete diode
JPH0832091A (en) * 1995-05-25 1996-02-02 Rohm Co Ltd Discrete diode
JP2000077718A (en) * 1998-08-27 2000-03-14 Hewlett Packard Co <Hp> Light emitting diode assembly
WO2001033680A1 (en) * 1999-11-01 2001-05-10 The Furukawa Electric Co., Ltd. Semiconductor laser module and method of driving semiconductor laser module
US6385222B1 (en) 1998-11-19 2002-05-07 The Furukawa Electric Co., Ltd. Semiconductor laser module, and method for driving the semiconductor laser module
US6996145B2 (en) 1999-11-01 2006-02-07 The Furukawa Electric Co., Ltd. Semiconductor laser module, and method for driving the semiconductor laser module
JP2009021643A (en) * 1997-01-31 2009-01-29 Panasonic Corp Light emitting device and manufacturing method thereof
US7863630B2 (en) 2005-07-05 2011-01-04 Showa Denko K.K. Light-emitting diode and method for fabrication thereof
US8071991B2 (en) 2005-08-05 2011-12-06 Showa Denko K.K. Light-emitting diode and light-emitting diode lamp
US8134176B2 (en) 2005-07-28 2012-03-13 Showa Denko K.K. Light-emitting diode and light-emitting diode lamp

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07326772A (en) * 1995-05-25 1995-12-12 Rohm Co Ltd Discrete diode device
JPH088446A (en) * 1995-05-25 1996-01-12 Rohm Co Ltd Discrete diode
JPH0832092A (en) * 1995-05-25 1996-02-02 Rohm Co Ltd Discrete diode
JPH0832091A (en) * 1995-05-25 1996-02-02 Rohm Co Ltd Discrete diode
JP2009021643A (en) * 1997-01-31 2009-01-29 Panasonic Corp Light emitting device and manufacturing method thereof
JP2000077718A (en) * 1998-08-27 2000-03-14 Hewlett Packard Co <Hp> Light emitting diode assembly
US6385222B1 (en) 1998-11-19 2002-05-07 The Furukawa Electric Co., Ltd. Semiconductor laser module, and method for driving the semiconductor laser module
US6996145B2 (en) 1999-11-01 2006-02-07 The Furukawa Electric Co., Ltd. Semiconductor laser module, and method for driving the semiconductor laser module
WO2001033680A1 (en) * 1999-11-01 2001-05-10 The Furukawa Electric Co., Ltd. Semiconductor laser module and method of driving semiconductor laser module
US7863630B2 (en) 2005-07-05 2011-01-04 Showa Denko K.K. Light-emitting diode and method for fabrication thereof
US8217405B2 (en) 2005-07-05 2012-07-10 Showa Denko K.K. Light-emitting diode and method for fabrication thereof
US8134176B2 (en) 2005-07-28 2012-03-13 Showa Denko K.K. Light-emitting diode and light-emitting diode lamp
US8071991B2 (en) 2005-08-05 2011-12-06 Showa Denko K.K. Light-emitting diode and light-emitting diode lamp

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