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JPS5271184A - Semiconductor photosensitive light emitting element - Google Patents

Semiconductor photosensitive light emitting element

Info

Publication number
JPS5271184A
JPS5271184A JP14703275A JP14703275A JPS5271184A JP S5271184 A JPS5271184 A JP S5271184A JP 14703275 A JP14703275 A JP 14703275A JP 14703275 A JP14703275 A JP 14703275A JP S5271184 A JPS5271184 A JP S5271184A
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
photosensitive light
semiconductor photosensitive
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14703275A
Other languages
Japanese (ja)
Inventor
Kotaro Mitsui
Josuke Nakada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14703275A priority Critical patent/JPS5271184A/en
Publication of JPS5271184A publication Critical patent/JPS5271184A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Abstract

PURPOSE: To obtain a display element whose light emission is optically controlled by ambinet light by connecting a semiconductor light emitting element in series to a photoelectric element which switches at a predetermined illuminance and placing these in the same package.
COPYRIGHT: (C)1977,JPO&Japio
JP14703275A 1975-12-10 1975-12-10 Semiconductor photosensitive light emitting element Pending JPS5271184A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14703275A JPS5271184A (en) 1975-12-10 1975-12-10 Semiconductor photosensitive light emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14703275A JPS5271184A (en) 1975-12-10 1975-12-10 Semiconductor photosensitive light emitting element

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP57120879A Division JPS606112B2 (en) 1982-07-12 1982-07-12 Semiconductor photosensitive light emitting device

Publications (1)

Publication Number Publication Date
JPS5271184A true JPS5271184A (en) 1977-06-14

Family

ID=15420981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14703275A Pending JPS5271184A (en) 1975-12-10 1975-12-10 Semiconductor photosensitive light emitting element

Country Status (1)

Country Link
JP (1) JPS5271184A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6151764U (en) * 1985-08-24 1986-04-07
US5647034A (en) * 1994-10-03 1997-07-08 Matsushita Electric Works, Ltd. Operation displaying semiconductor switch
JP2001308375A (en) * 2000-04-24 2001-11-02 Nippon Sheet Glass Co Ltd Light-emitting element and light-emitting element array
JP2001308385A (en) * 2000-04-24 2001-11-02 Nippon Sheet Glass Co Ltd Self-scanning light emitting device
JP2013197410A (en) * 2012-03-21 2013-09-30 Casio Comput Co Ltd Light-emitting element, light source device and projection apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6151764U (en) * 1985-08-24 1986-04-07
US5647034A (en) * 1994-10-03 1997-07-08 Matsushita Electric Works, Ltd. Operation displaying semiconductor switch
JP2001308375A (en) * 2000-04-24 2001-11-02 Nippon Sheet Glass Co Ltd Light-emitting element and light-emitting element array
JP2001308385A (en) * 2000-04-24 2001-11-02 Nippon Sheet Glass Co Ltd Self-scanning light emitting device
JP2013197410A (en) * 2012-03-21 2013-09-30 Casio Comput Co Ltd Light-emitting element, light source device and projection apparatus

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