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JPS522275A - Device of forming semiconductor substrates - Google Patents

Device of forming semiconductor substrates

Info

Publication number
JPS522275A
JPS522275A JP7684775A JP7684775A JPS522275A JP S522275 A JPS522275 A JP S522275A JP 7684775 A JP7684775 A JP 7684775A JP 7684775 A JP7684775 A JP 7684775A JP S522275 A JPS522275 A JP S522275A
Authority
JP
Japan
Prior art keywords
semiconductor substrates
forming semiconductor
formation liquid
submerging
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7684775A
Other languages
Japanese (ja)
Inventor
Takayuki Kadaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iwatsu Electric Co Ltd
Iwasaki Tsushinki KK
Original Assignee
Iwatsu Electric Co Ltd
Iwasaki Tsushinki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iwatsu Electric Co Ltd, Iwasaki Tsushinki KK filed Critical Iwatsu Electric Co Ltd
Priority to JP7684775A priority Critical patent/JPS522275A/en
Publication of JPS522275A publication Critical patent/JPS522275A/en
Pending legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE: A device which uniformly forms semiconductor substrates eliminating bubbles formed on the surfaces, by exposing semiconductor substrates to be formed from a formation liquid to a gas and then submerging them again in the formation liquid.
COPYRIGHT: (C)1977,JPO&Japio
JP7684775A 1975-06-24 1975-06-24 Device of forming semiconductor substrates Pending JPS522275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7684775A JPS522275A (en) 1975-06-24 1975-06-24 Device of forming semiconductor substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7684775A JPS522275A (en) 1975-06-24 1975-06-24 Device of forming semiconductor substrates

Publications (1)

Publication Number Publication Date
JPS522275A true JPS522275A (en) 1977-01-08

Family

ID=13617039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7684775A Pending JPS522275A (en) 1975-06-24 1975-06-24 Device of forming semiconductor substrates

Country Status (1)

Country Link
JP (1) JPS522275A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59195734U (en) * 1983-06-13 1984-12-26 クラリオン株式会社 Oxide film formation equipment
JPH0613366A (en) * 1992-04-03 1994-01-21 Internatl Business Mach Corp <Ibm> Immersion scanning method and system for making porous silicon films and devices
KR20200060379A (en) * 2017-09-29 2020-05-29 세키스이가가쿠 고교가부시키가이샤 Foamed resin molded product

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59195734U (en) * 1983-06-13 1984-12-26 クラリオン株式会社 Oxide film formation equipment
JPH0613366A (en) * 1992-04-03 1994-01-21 Internatl Business Mach Corp <Ibm> Immersion scanning method and system for making porous silicon films and devices
KR20200060379A (en) * 2017-09-29 2020-05-29 세키스이가가쿠 고교가부시키가이샤 Foamed resin molded product

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