JPS5219971A - Shaping of leads sealed in lsi chip etc. - Google Patents
Shaping of leads sealed in lsi chip etc.Info
- Publication number
- JPS5219971A JPS5219971A JP9688475A JP9688475A JPS5219971A JP S5219971 A JPS5219971 A JP S5219971A JP 9688475 A JP9688475 A JP 9688475A JP 9688475 A JP9688475 A JP 9688475A JP S5219971 A JPS5219971 A JP S5219971A
- Authority
- JP
- Japan
- Prior art keywords
- shaping
- lsi chip
- chip etc
- leads sealed
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To provide leads zigzaging or meandering inside chips in the vettical dire direction and to thus achieve enhancement of resin seal air tight characteristics and simplification of lead patterns.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9688475A JPS5219971A (en) | 1975-08-08 | 1975-08-08 | Shaping of leads sealed in lsi chip etc. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9688475A JPS5219971A (en) | 1975-08-08 | 1975-08-08 | Shaping of leads sealed in lsi chip etc. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5219971A true JPS5219971A (en) | 1977-02-15 |
Family
ID=14176819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9688475A Pending JPS5219971A (en) | 1975-08-08 | 1975-08-08 | Shaping of leads sealed in lsi chip etc. |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5219971A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60123046A (en) * | 1983-12-07 | 1985-07-01 | Toshiba Corp | Semiconductor device |
| US5101263A (en) * | 1988-05-20 | 1992-03-31 | Hitachi, Ltd. | Semiconductor device and method for manufacturing the same |
| US5518684A (en) * | 1994-03-09 | 1996-05-21 | National Semiconductor Corporation | Method of making a molded lead frame |
| US5821615A (en) * | 1995-12-06 | 1998-10-13 | Lg Semicon Co., Ltd. | Semiconductor chip package having clip-type outlead and fabrication method of same |
| US6262482B1 (en) * | 1998-02-03 | 2001-07-17 | Oki Electric Industry Co., Ltd. | Semiconductor device |
| US6531769B2 (en) | 1998-11-20 | 2003-03-11 | Oki Electric Industry Co., Ltd. | Semiconductor integrated circuit package, semiconductor apparatus provided with a plurality of semiconductor integrated circuit packages, method of inspecting semiconductor integrated circuit package and method of fabricating semiconductor integrated circuit |
-
1975
- 1975-08-08 JP JP9688475A patent/JPS5219971A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60123046A (en) * | 1983-12-07 | 1985-07-01 | Toshiba Corp | Semiconductor device |
| JPH0433136B2 (en) * | 1983-12-07 | 1992-06-02 | Tokyo Shibaura Electric Co | |
| US5101263A (en) * | 1988-05-20 | 1992-03-31 | Hitachi, Ltd. | Semiconductor device and method for manufacturing the same |
| US5518684A (en) * | 1994-03-09 | 1996-05-21 | National Semiconductor Corporation | Method of making a molded lead frame |
| US6516516B1 (en) | 1995-06-12 | 2003-02-11 | Hyundai Electronics Industries Co., Ltd. | Semiconductor chip package having clip-type outlead and fabrication method of same |
| US5821615A (en) * | 1995-12-06 | 1998-10-13 | Lg Semicon Co., Ltd. | Semiconductor chip package having clip-type outlead and fabrication method of same |
| US6262482B1 (en) * | 1998-02-03 | 2001-07-17 | Oki Electric Industry Co., Ltd. | Semiconductor device |
| US6531769B2 (en) | 1998-11-20 | 2003-03-11 | Oki Electric Industry Co., Ltd. | Semiconductor integrated circuit package, semiconductor apparatus provided with a plurality of semiconductor integrated circuit packages, method of inspecting semiconductor integrated circuit package and method of fabricating semiconductor integrated circuit |
| US6939740B2 (en) | 1998-11-20 | 2005-09-06 | Oki Electric Industry Co., Ltd. | Method of fabricating an encapsulated semiconductor device with partly exposed leads |
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