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JPS52146560A - Electrode plating apparatus for semiconductor devices - Google Patents

Electrode plating apparatus for semiconductor devices

Info

Publication number
JPS52146560A
JPS52146560A JP6385276A JP6385276A JPS52146560A JP S52146560 A JPS52146560 A JP S52146560A JP 6385276 A JP6385276 A JP 6385276A JP 6385276 A JP6385276 A JP 6385276A JP S52146560 A JPS52146560 A JP S52146560A
Authority
JP
Japan
Prior art keywords
semiconductor devices
plating apparatus
electrode plating
electrode
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6385276A
Other languages
Japanese (ja)
Other versions
JPS5750047B2 (en
Inventor
Masao Kachi
Hiroshi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP6385276A priority Critical patent/JPS52146560A/en
Publication of JPS52146560A publication Critical patent/JPS52146560A/en
Publication of JPS5750047B2 publication Critical patent/JPS5750047B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To make the current density of the surface to be plated constant by disposing an auxiliary electrode within a plating vessel, and controlling the current of a main power supply through the use of the change component of voltage drop which changes according to the change in the current flowing in said electrode.
COPYRIGHT: (C)1977,JPO&Japio
JP6385276A 1976-05-31 1976-05-31 Electrode plating apparatus for semiconductor devices Granted JPS52146560A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6385276A JPS52146560A (en) 1976-05-31 1976-05-31 Electrode plating apparatus for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6385276A JPS52146560A (en) 1976-05-31 1976-05-31 Electrode plating apparatus for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS52146560A true JPS52146560A (en) 1977-12-06
JPS5750047B2 JPS5750047B2 (en) 1982-10-25

Family

ID=13241269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6385276A Granted JPS52146560A (en) 1976-05-31 1976-05-31 Electrode plating apparatus for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS52146560A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54128670A (en) * 1978-03-29 1979-10-05 Nec Home Electronics Ltd Manufacture for semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58190738A (en) * 1982-04-30 1983-11-07 Sumitomo Electric Ind Ltd Pressure sensor using liquid lens

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54128670A (en) * 1978-03-29 1979-10-05 Nec Home Electronics Ltd Manufacture for semiconductor device
JPS5827651B2 (en) * 1978-03-29 1983-06-10 日本電気ホームエレクトロニクス株式会社 Manufacturing method of semiconductor device

Also Published As

Publication number Publication date
JPS5750047B2 (en) 1982-10-25

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