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JPS52127765A - Plasma etching method - Google Patents

Plasma etching method

Info

Publication number
JPS52127765A
JPS52127765A JP4461076A JP4461076A JPS52127765A JP S52127765 A JPS52127765 A JP S52127765A JP 4461076 A JP4461076 A JP 4461076A JP 4461076 A JP4461076 A JP 4461076A JP S52127765 A JPS52127765 A JP S52127765A
Authority
JP
Japan
Prior art keywords
plasma etching
etching method
plasma
increment
sio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4461076A
Other languages
Japanese (ja)
Inventor
Moritaka Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4461076A priority Critical patent/JPS52127765A/en
Publication of JPS52127765A publication Critical patent/JPS52127765A/en
Pending legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE: To etch plasma with increment of relative etching speed of SiO2 on Si by applying lazer beam to plasma.
COPYRIGHT: (C)1977,JPO&Japio
JP4461076A 1976-04-19 1976-04-19 Plasma etching method Pending JPS52127765A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4461076A JPS52127765A (en) 1976-04-19 1976-04-19 Plasma etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4461076A JPS52127765A (en) 1976-04-19 1976-04-19 Plasma etching method

Publications (1)

Publication Number Publication Date
JPS52127765A true JPS52127765A (en) 1977-10-26

Family

ID=12696203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4461076A Pending JPS52127765A (en) 1976-04-19 1976-04-19 Plasma etching method

Country Status (1)

Country Link
JP (1) JPS52127765A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4668337A (en) * 1984-09-21 1987-05-26 Kabushiki Kaisha Toshiba Dry-etching method and apparatus therefor
JPS63238289A (en) * 1987-03-26 1988-10-04 Mikio Takai Method and device for working by using simultaneously plasma and laser irradiation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4668337A (en) * 1984-09-21 1987-05-26 Kabushiki Kaisha Toshiba Dry-etching method and apparatus therefor
JPS63238289A (en) * 1987-03-26 1988-10-04 Mikio Takai Method and device for working by using simultaneously plasma and laser irradiation

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