JPS52103799A - Device for correcting lapping machine - Google Patents
Device for correcting lapping machineInfo
- Publication number
- JPS52103799A JPS52103799A JP2035576A JP2035576A JPS52103799A JP S52103799 A JPS52103799 A JP S52103799A JP 2035576 A JP2035576 A JP 2035576A JP 2035576 A JP2035576 A JP 2035576A JP S52103799 A JPS52103799 A JP S52103799A
- Authority
- JP
- Japan
- Prior art keywords
- correcting
- lapping machine
- lapping
- machine
- correcting lapping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2035576A JPS52103799A (en) | 1976-02-26 | 1976-02-26 | Device for correcting lapping machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2035576A JPS52103799A (en) | 1976-02-26 | 1976-02-26 | Device for correcting lapping machine |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10570079A Division JPS55101367A (en) | 1979-08-20 | 1979-08-20 | Method of automatically correcting lapping machine |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52103799A true JPS52103799A (en) | 1977-08-31 |
JPS6158270B2 JPS6158270B2 (en) | 1986-12-10 |
Family
ID=12024795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2035576A Granted JPS52103799A (en) | 1976-02-26 | 1976-02-26 | Device for correcting lapping machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52103799A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5360797A (en) * | 1976-11-13 | 1978-05-31 | Hamai Sangyo | Lapping machine |
JPS5531504A (en) * | 1978-08-15 | 1980-03-05 | Fujikoshi Kikai Kogyo Kk | Lapping method |
JPS5748061U (en) * | 1980-09-04 | 1982-03-17 | ||
JPS59129663A (en) * | 1983-01-18 | 1984-07-26 | Toshiba Corp | Wafer lapping device |
JP2012030353A (en) * | 2010-07-28 | 2012-02-16 | Siltronic Ag | Method for trimming two working layers, and trimming device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50120094A (en) * | 1974-03-04 | 1975-09-19 |
-
1976
- 1976-02-26 JP JP2035576A patent/JPS52103799A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50120094A (en) * | 1974-03-04 | 1975-09-19 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5360797A (en) * | 1976-11-13 | 1978-05-31 | Hamai Sangyo | Lapping machine |
JPS6154544B2 (en) * | 1976-11-13 | 1986-11-22 | Hamai Sangyo Kk | |
JPS5531504A (en) * | 1978-08-15 | 1980-03-05 | Fujikoshi Kikai Kogyo Kk | Lapping method |
JPS5748061U (en) * | 1980-09-04 | 1982-03-17 | ||
JPS59129663A (en) * | 1983-01-18 | 1984-07-26 | Toshiba Corp | Wafer lapping device |
JP2012030353A (en) * | 2010-07-28 | 2012-02-16 | Siltronic Ag | Method for trimming two working layers, and trimming device |
Also Published As
Publication number | Publication date |
---|---|
JPS6158270B2 (en) | 1986-12-10 |
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