JPS5183277U - - Google Patents

Info

Publication number: JPS5183277U
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP1975001459U

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1974-12-25

Filing date

1974-12-25

Publication date

1976-07-03

1974-12-25 Application filed filed Critical

1974-12-25 Priority to JP1975001459U priority Critical patent/JPS5183277U/ja

1976-07-03 Publication of JPS5183277U publication Critical patent/JPS5183277U/ja

Status Pending legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)

JP1975001459U 1974-12-25 1974-12-25 Pending JPS5183277U (fr)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1975001459U JPS5183277U (fr)	1974-12-25	1974-12-25

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1975001459U JPS5183277U (fr)	1974-12-25	1974-12-25

Publications (1)

Publication Number	Publication Date
JPS5183277U true JPS5183277U (fr)	1976-07-03

Family

ID=39468899

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1975001459U Pending JPS5183277U (fr)	1974-12-25	1974-12-25

Country Status (1)

Country	Link
JP (1)	JPS5183277U (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS587363U (ja) *	1981-07-06	1983-01-18	日本電信電話株式会社	光電式読取り用光源装置
JPS59209931A (ja) *	1983-04-30	1984-11-28	ロ−ベルト・ボツシユ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング	自動車用燈火装置
JP2012104538A (ja) *	2010-11-08	2012-05-31	Stanley Electric Co Ltd	半導体発光装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS4945456B1 (fr) *	1969-06-25	1974-12-04

1974
- 1974-12-25 JP JP1975001459U patent/JPS5183277U/ja active Pending

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS4945456B1 (fr) *	1969-06-25	1974-12-04

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS587363U (ja) *	1981-07-06	1983-01-18	日本電信電話株式会社	光電式読取り用光源装置
JPS59209931A (ja) *	1983-04-30	1984-11-28	ロ−ベルト・ボツシユ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング	自動車用燈火装置
JP2012104538A (ja) *	2010-11-08	2012-05-31	Stanley Electric Co Ltd	半導体発光装置

Publication	Publication Date	Title
FR2267509B3 (fr)	1977-12-16
FI752105A (fr)	1976-02-16
JPS5183277U (fr)	1976-07-03
FR2266279A1 (fr)	1975-10-24
FI752130A (fr)	1976-02-01
FI752079A (fr)	1976-03-06
AU7459074A (fr)	1976-04-29
FR2257881A1 (fr)	1975-08-08
DK38174A (fr)	1975-09-15
DE2442938A1 (fr)	1975-06-26
CS168419B1 (fr)	1976-06-29
BG21290A1 (fr)	1976-05-20
BG20743A1 (fr)	1975-12-20
CH591704A5 (fr)	1977-09-30
BG21810A1 (fr)	1976-09-20
BG21805A1 (fr)	1976-09-20
BG21781A1 (fr)	1976-09-20
BG21647A1 (fr)	1976-09-20
BG21628A1 (fr)	1976-09-20
BG21432A1 (fr)	1976-07-20
BG21427A1 (fr)	1976-07-20
BG21426A1 (fr)	1976-07-20
BG21423A1 (fr)	1976-07-20
BG21336A1 (fr)	1976-05-20
AU480143A (fr)	1976-02-12

JPS5183277U - - Google Patents

Info

Links

Classifications

Landscapes

Priority Applications (1)

Applications Claiming Priority (1)

Publications (1)

Family

ID=39468899

Family Applications (1)

Country Status (1)

Cited By (3)

Citations (1)

Patent Citations (1)

Cited By (3)

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