JPS5146072A - Denshibuhinseizohoho - Google Patents

Denshibuhinseizohoho

Info

Publication number: JPS5146072A
Authority: JP; Japan
Prior art keywords: denshibuhinseizohoho
Prior art date: 1974-10-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP12050574A

Other languages

English (en)

Other versions

JPS609343B2 (ja

Inventor

Manabu Bonshihara

Yoshio Ito

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NEC Corp

Original Assignee

Nippon Electric Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1974-10-18

Filing date

1974-10-18

Publication date

1976-04-20

1974-10-18 Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd

1974-10-18 Priority to JP49120505A priority Critical patent/JPS609343B2/ja

1976-04-20 Publication of JPS5146072A publication Critical patent/JPS5146072A/ja

1985-03-09 Publication of JPS609343B2 publication Critical patent/JPS609343B2/ja

Status Expired legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

Wire Bonding (AREA)

JP49120505A 1974-10-18 1974-10-18 電子部品製造法 Expired JPS609343B2 (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP49120505A JPS609343B2 (ja)	1974-10-18	1974-10-18	電子部品製造法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP49120505A JPS609343B2 (ja)	1974-10-18	1974-10-18	電子部品製造法

Related Child Applications (1)

Application Number	Title	Priority Date	Filing Date
JP60263373A Division JPS61190954A (ja)	1985-11-22	1985-11-22	半導体装置の製造方法

Publications (2)

Publication Number	Publication Date
JPS5146072A true JPS5146072A (ja)	1976-04-20
JPS609343B2 JPS609343B2 (ja)	1985-03-09

Family

ID=14787845

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP49120505A Expired JPS609343B2 (ja)	1974-10-18	1974-10-18	電子部品製造法

Country Status (1)

Country	Link
JP (1)	JPS609343B2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2356140A1 (de) *	1972-11-09	1974-05-22	Cii Honeywell Bull	Vorrichtung zum anloeten von integrierten schaltungsplaettchen an einem substrat
JPS49133867A (ja) *	1972-11-09	1974-12-23

1974
- 1974-10-18 JP JP49120505A patent/JPS609343B2/ja not_active Expired

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2356140A1 (de) *	1972-11-09	1974-05-22	Cii Honeywell Bull	Vorrichtung zum anloeten von integrierten schaltungsplaettchen an einem substrat
JPS49133867A (ja) *	1972-11-09	1974-12-23

Also Published As

Publication number	Publication date
JPS609343B2 (ja)	1985-03-09

Publication	Publication Date	Title
BE824255A (fr)	1975-07-09	Aryloxyphenylpropylamines
DK446775A (da)	1976-04-08	Sebedispenser
ATA277375A (de)	1976-02-15	Deodorantien
ATA277475A (de)	1976-02-15	Deodorantien
BE824920A (fr)	1975-05-15	Servo-distributeur
BE827298A (fr)	1975-09-29	Acylurfidocephalosporines
BE827404A (fr)	1975-09-29	Automatische c02 - gehaltemeter
BE826270A (fr)	1975-09-04	Brandkraan
ATA557575A (de)	1976-11-15	Handmuhle
ATA613675A (de)	1976-11-15	Samaschine
ATA962675A (de)	1977-03-15	Samaschine
JPS5113938A (ja)	1976-02-03	Koryuyorodenshadankino chokuryukoshodenryukenshutsuyofukasochi
BE828211A (fr)	1975-10-22	Vincadioline
AT345679B (de)	1978-09-25	Kettenschloss
AT335386B (de)	1977-03-10	Kettbaum
BE824358R (fr)	1975-05-02	Phenolethanolamine acylff
AT342532B (de)	1978-04-10	Sparkerze
BE823015A (fr)	1975-04-01	Sorbetiere
BE827338A (fr)	1975-09-29	Trifluoroethylanilines
AT337487B (de)	1977-07-11	Pfeifenreiber
ATA461175A (de)	1977-02-15	Mullcontainer
BE828179A (fr)	1975-08-18	Snijmachine
BE829863A (fr)	1975-10-01	Petard
BE826873A (fr)	1975-09-19	Alkylsulfonylphenoxypropanolamines
BE825385A (fr)	1975-08-11	Elektrofotografisch filmdeel