JPS4895783A - - Google Patents

Info

Publication number: JPS4895783A
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP2656572A

Other languages

Other versions

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1972-03-17

Filing date

1972-03-17

Publication date

1973-12-07

1972-03-17 Application filed filed Critical

1972-03-17 Priority to JP2656572A priority Critical patent/JPS5432318B2/ja

1973-12-07 Publication of JPS4895783A publication Critical patent/JPS4895783A/ja

1979-10-13 Publication of JPS5432318B2 publication Critical patent/JPS5432318B2/ja

Status Expired legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation

Landscapes

Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Optical Integrated Circuits (AREA)
Led Device Packages (AREA)
Led Devices (AREA)
Dot-Matrix Printers And Others (AREA)

JP2656572A 1972-03-17 1972-03-17 Expired JPS5432318B2 (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP2656572A JPS5432318B2 (en)	1972-03-17	1972-03-17

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2656572A JPS5432318B2 (en)	1972-03-17	1972-03-17

Publications (2)

Publication Number	Publication Date
JPS4895783A true JPS4895783A (en)	1973-12-07
JPS5432318B2 JPS5432318B2 (en)	1979-10-13

Family

ID=12197049

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2656572A Expired JPS5432318B2 (en)	1972-03-17	1972-03-17

Country Status (1)

Country	Link
JP (1)	JPS5432318B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5141975U (en) *	1974-09-25	1976-03-29
JPS52128087A (en) *	1976-04-20	1977-10-27	Matsushita Electric Ind Co Ltd	Semiconductor display unit
JPS55157277A (en) *	1979-05-25	1980-12-06	Fujitsu Ltd	Optical semiconductor device

1972
- 1972-03-17 JP JP2656572A patent/JPS5432318B2/ja not_active Expired

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5141975U (en) *	1974-09-25	1976-03-29
JPS5419829Y2 (en) *	1974-09-25	1979-07-20
JPS52128087A (en) *	1976-04-20	1977-10-27	Matsushita Electric Ind Co Ltd	Semiconductor display unit
JPS5837997B2 (en) *	1976-04-20	1983-08-19	松下電器産業株式会社	semiconductor display device
JPS55157277A (en) *	1979-05-25	1980-12-06	Fujitsu Ltd	Optical semiconductor device

Also Published As

Publication number	Publication date
JPS5432318B2 (en)	1979-10-13

Publication	Publication Date	Title
JPS4939506U (en)	1974-04-08
JPS4939738U (en)	1974-04-08
CH560463A5 (en)	1975-03-27
BG18206A1 (en)	1974-10-25
BG18370A1 (en)	1974-10-25
BG18519A1 (en)	1975-02-25
BG20968A1 (en)	1976-01-20
BG21763A1 (en)	1976-09-20
BG26664A4 (en)	1979-05-15
CH1470373A4 (en)	1975-06-30
CH545919A (en)	1974-02-15
CH555446A (en)	1974-10-31
CH560639A5 (en)	1975-04-15
CH560800A (en)	1975-04-15
CH560961A5 (en)	1975-04-15
CH560965A5 (en)	1975-04-15
CH561444A (en)	1975-04-30
CH561938A5 (en)	1975-05-15
CH563047A5 (en)	1975-06-13
CH564163A5 (en)	1975-07-15
CH565015A5 (en)	1975-08-15
CH565562A5 (en)	1975-08-29
CH566252A5 (en)	1975-09-15
CH567794A5 (en)	1975-10-15
CH568066A5 (en)	1975-10-31