JPS4860290A - - Google Patents
Info
- Publication number
- JPS4860290A JPS4860290A JP47116732A JP11673272A JPS4860290A JP S4860290 A JPS4860290 A JP S4860290A JP 47116732 A JP47116732 A JP 47116732A JP 11673272 A JP11673272 A JP 11673272A JP S4860290 A JPS4860290 A JP S4860290A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Details Of Indoor Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB5427071A GB1409717A (en) | 1971-11-23 | 1971-11-23 | Method of mounting electric wiring arrangements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4860290A true JPS4860290A (en) | 1973-08-23 |
Family
ID=10470459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47116732A Pending JPS4860290A (en) | 1971-11-23 | 1972-11-22 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS4860290A (en) |
| DE (1) | DE2257232A1 (en) |
| FR (1) | FR2161121B1 (en) |
| GB (1) | GB1409717A (en) |
| IT (1) | IT971125B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59175785A (en) * | 1983-03-26 | 1984-10-04 | ソニー株式会社 | Circuit board |
| GB2209877B (en) * | 1986-02-07 | 1989-11-01 | Sperry Sun Inc | Assemblies for supporting electrical circuit boards within tubes |
| GB2186431B (en) * | 1986-02-07 | 1989-11-01 | Sperry Sun Inc | Assemblies for supporting electrical circuit boards within tubes |
| GB2197755B (en) * | 1986-08-20 | 1990-05-09 | Plessey Co Plc | Electronic circuit housing |
| DE19855076A1 (en) * | 1998-11-28 | 2000-06-08 | Daimler Chrysler Ag | DC/DC voltage converter e.g. for switching network, solar energy plant or electric vehicle drive, has metallic carrier supporting respective circuit boards for primary and secondary circuits and coupling transformer |
| JP3526291B2 (en) * | 2001-04-25 | 2004-05-10 | 三菱電機株式会社 | Capacitor module and semiconductor device using the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3141998A (en) * | 1960-02-24 | 1964-07-21 | Harry G Silkman | Cooled modular electronic package |
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1971
- 1971-11-23 GB GB5427071A patent/GB1409717A/en not_active Expired
-
1972
- 1972-11-22 JP JP47116732A patent/JPS4860290A/ja active Pending
- 1972-11-22 DE DE19722257232 patent/DE2257232A1/en active Pending
- 1972-11-22 IT IT3198272A patent/IT971125B/en active
- 1972-11-23 FR FR7242326A patent/FR2161121B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2257232A1 (en) | 1973-05-30 |
| GB1409717A (en) | 1975-10-15 |
| IT971125B (en) | 1974-04-30 |
| FR2161121A1 (en) | 1973-07-06 |
| FR2161121B1 (en) | 1975-03-28 |