JPH1154802A - Light emitting device and display device manufactured using the same - Google Patents
Light emitting device and display device manufactured using the sameInfo
- Publication number
- JPH1154802A JPH1154802A JP9204090A JP20409097A JPH1154802A JP H1154802 A JPH1154802 A JP H1154802A JP 9204090 A JP9204090 A JP 9204090A JP 20409097 A JP20409097 A JP 20409097A JP H1154802 A JPH1154802 A JP H1154802A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting element
- sealing body
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
(57)【要約】
【課題】 発光装置において、新規な封止体形状や発光
素子形状を必要とすることなく、封止体の長径方向にお
ける指向特性を改善することを目的とする。
【解決手段】 表面に発光面１ａが形成されて素子載置
部２に配置されたほぼ矩形状の発光素子１と、発光面１
ａを外側にして発光素子１を封止する光透過性樹脂から
なり、発光面１ａから見たときに楕円形状をなす封止体
６とを有し、発光面１ａの長手方向が楕円形状である封
止体６の長径方向とほぼ平行になるように発光素子１が
封止体６に対して配置された発光装置とする。
(57) [PROBLEMS] To improve the directional characteristics in the major axis direction of a sealing body without requiring a new sealing body shape or a new light emitting element shape in a light emitting device. SOLUTION: A substantially rectangular light emitting element 1 having a light emitting surface 1a formed on its surface and arranged on an element mounting portion 2, and a light emitting surface 1
a light-transmitting resin that seals the light-emitting element 1 with the light-emitting surface 1a facing outward, and has a sealing body 6 having an elliptical shape when viewed from the light-emitting surface 1a. A light emitting device in which the light emitting element 1 is arranged with respect to the sealing body 6 so as to be substantially parallel to the long diameter direction of a certain sealing body 6 is provided.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は発光装置およびそれ
を用いて作製されたディスプレイ装置に関するもので、
特に指向特性を改善した発光ダイオードランプに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device and a display device manufactured using the same.
In particular, the present invention relates to a light emitting diode lamp having improved directional characteristics.
【０００２】[0002]
【従来の技術】近年、可視光領域の発光ダイオードが高
輝度化され、屋外での視認性が高まったことにより、屋
外で使用されるディスプレイ装置に用いられる発光ダイ
オードランプに対する需要が高まっている。一般に、屋
外用ディスプレイ装置は数十から数百インチもの大型で
あり、広範囲の任意の地点から見られものである。この
ようなディスプレイ装置は、各々の観察者の視線の高さ
（身長差等）よりも、左右から見る位置の方が角度に与
える差が大きいので、上下方向よりも左右方向に広い指
向性が望まれている。このような要望に対し、ディスプ
レイ装置の横方向（水平方向）の指向特性を改善するた
めに、楕円形の樹脂形状を有する発光ダイオードランプ
が提案されている。2. Description of the Related Art In recent years, as the luminance of light emitting diodes in the visible light region has been increased and visibility outside has been increased, the demand for light emitting diode lamps used in display devices used outdoors has increased. In general, outdoor display devices are large, on the order of tens to hundreds of inches, and can be viewed from any point in a wide range. In such a display device, since the difference in the angle at the position viewed from the left and right is greater than the height of the line of sight of each observer (height difference or the like), the directivity is wider in the horizontal direction than in the vertical direction. Is desired. In response to such a demand, a light emitting diode lamp having an elliptical resin shape has been proposed in order to improve the directional characteristics of the display device in the horizontal direction (horizontal direction).
【０００３】ここで、図１０および図１１に従来の発光
ダイオードランプを示す。図１０において、矩形状の発
光素子１がリードフレーム５ａ先端部に設けられた凹面
反射鏡を有する素子載置部２に載置されている。発光素
子１の発光観測面側の電極３は、発光素子１の中心部か
ら金線４でワイヤーボンディングされて、リードフレー
ム５ａに電気的に接続されている。図示しないもう一方
の電極は発光素子１の基板とリードフレーム５ｂとを導
電性材料で接着することにより接続されている。さら
に、発光素子１が載置されたリードフレーム５ａ，５ｂ
は光透過性樹脂からなる封止体６で楕円形状に封止され
ている。Here, FIGS. 10 and 11 show a conventional light emitting diode lamp. In FIG. 10, a rectangular light emitting element 1 is mounted on an element mounting section 2 having a concave reflecting mirror provided at the tip of a lead frame 5a. The electrode 3 on the light emission observation surface side of the light emitting element 1 is wire-bonded with a gold wire 4 from the center of the light emitting element 1 and is electrically connected to the lead frame 5a. The other electrode (not shown) is connected by bonding the substrate of the light emitting element 1 and the lead frame 5b with a conductive material. Further, the lead frames 5a, 5b on which the light emitting element 1 is mounted
Is sealed in an elliptical shape by a sealing body 6 made of a light transmitting resin.
【０００４】一般に、発光観測面側に一つの電極３を有
する矩形状の発光素子１は、その外形と発光面１ａの外
形がほぼ一致しており、矩形の一辺が楕円形状の封止体
６の長径方向とほぼ平行となるように載置されている。
このように発光素子１を楕円形状の封止体６で封止する
ことにより、封止体６の長径方向、すなわち水平方向の
視野角を広くすることが可能である。このような構造の
発光ダイオードランプは、例えば特開平５−２７５７５
１号公報にて開示されている。Generally, in a rectangular light emitting element 1 having one electrode 3 on the light emission observation surface side, the outer shape and the outer shape of the light emitting surface 1a substantially coincide, and one side of the rectangle has an elliptical shape. Is mounted so as to be substantially parallel to the major axis direction.
By sealing the light emitting element 1 with the elliptical sealing body 6 in this manner, it is possible to increase the viewing angle in the major axis direction of the sealing body 6, that is, the horizontal direction. A light emitting diode lamp having such a structure is disclosed in, for example, Japanese Patent Application Laid-Open No. Hei 5-27575.
No. 1 discloses this.
【０００５】また、図１１において、矩形状の発光素子
１は発光観測面側に二つの電極３を有し、斜線部で示さ
れる発光面１ａを有する。二つの電極３は、それぞれ金
線４でワイヤーボンディングされてリードフレーム５
ａ，５ｂに電気的に接続されている。この発光ダイオー
ドランプにおいて、矩形状の発光素子１の表面の発光面
１ａの長手方向は、楕円形状の封止体６の短径方向と平
行となるようにされている。In FIG. 11, a rectangular light emitting element 1 has two electrodes 3 on a light emission observing surface side, and has a light emitting surface 1a indicated by oblique lines. Each of the two electrodes 3 is wire-bonded with a gold wire 4 to form a lead frame 5.
a, 5b. In this light-emitting diode lamp, the longitudinal direction of the light-emitting surface 1a on the surface of the rectangular light-emitting element 1 is parallel to the minor axis direction of the elliptical sealing body 6.
【０００６】この構成により、発光ダイオードの指向特
性を左右均一にし、楕円形状の封止体６の短径方向の指
向特性を改善し、視野角を広くすることが可能となる。
このような構造の発光ダイオードランプは、特開平８−
２７４３７７号公報において提案されている。With this configuration, the directional characteristics of the light-emitting diode can be made uniform left and right, the directional characteristics of the elliptical sealing body 6 in the short diameter direction can be improved, and the viewing angle can be widened.
A light emitting diode lamp having such a structure is disclosed in
It is proposed in Japanese Patent Publication No. 274377.
【０００７】[0007]
【発明が解決しようとする課題】このように、楕円形状
の光透過性樹脂からなる封止体を有する従来の発光ダイ
オードランプは、水平方向、すなわち楕円形状の長径方
向における指向特性を改善して視野角を拡大するもので
ある。As described above, the conventional light emitting diode lamp having the sealing body made of the elliptical light-transmitting resin has improved the directivity in the horizontal direction, that is, the major axis direction of the elliptical shape. This is to increase the viewing angle.
【０００８】しかしながら、上述の従来の発光ダイオー
ドランプを用いても、ディスプレイ装置の横方向の視野
角は未だ十分に拡大されたとはいえず、さらなる改善が
求められている。However, even if the above-mentioned conventional light emitting diode lamp is used, the horizontal viewing angle of the display device cannot be said to be sufficiently widened yet, and further improvement is required.
【０００９】また、発光ダイオードランプの光学設計に
おいては、一般に封止体の形状や発光素子の発光面の大
きさ等が重要な要素となるが、従来、発光ダイオードラ
ンプの指向特性を改善するために、光透過性樹脂で構成
される封止体の形状を整えるモールド形状や発光素子の
形状を新規に設計試作する必要があることが多く、製品
開発に時間やコストがかかるという問題がある。In the optical design of a light emitting diode lamp, the shape of a sealing body and the size of a light emitting surface of a light emitting element are generally important factors. In addition, it is often necessary to newly design and prototype a mold shape and a light-emitting element shape for adjusting the shape of a sealing body made of a light-transmitting resin, so that there is a problem that time and cost are required for product development.
【００１０】そこで、本発明は、新規な封止体形状や発
光素子形状を必要とすることなく、封止体の長径方向に
おける指向特性が改善されてより視野角の拡大された発
光装置およびそれを用いて作製されたディスプレイ装置
を提供することを目的とする。Accordingly, the present invention provides a light-emitting device having an improved directional characteristic in the major axis direction of a sealed body and a wider viewing angle without requiring a new shape of a sealed body or a light-emitting element. An object of the present invention is to provide a display device manufactured by using the method.
【００１１】[0011]
【課題を解決するための手段】この課題を解決するため
に、本発明の発光装置は、表面に発光面が形成されて素
子載置部に配置されたほぼ矩形状の発光素子と、発光面
を外側にして発光素子を封止する光透過性樹脂からな
り、発光面から見たときに楕円形状をなす封止体とを有
し、発光面の長手方向が楕円形状である封止体の長径方
向とほぼ平行になるように発光素子が封止体に対して配
置されているものである。According to an aspect of the present invention, there is provided a light-emitting device according to the present invention, comprising a light-emitting surface having a light-emitting surface formed on a surface thereof and being disposed on an element mounting portion; A light-transmitting resin for sealing the light-emitting element with the outside facing, and a sealing body having an elliptical shape when viewed from the light-emitting surface, wherein the longitudinal direction of the light-emitting surface is an elliptical shape. The light emitting element is arranged on the sealing body so as to be substantially parallel to the major axis direction.
【００１２】これにより、従来と同一の封止体形状や発
光素子形状を用いても、楕円形状を有する封止体の長径
方向の指向特性が改善され、より視野角の拡大された発
光装置を得ることができる。Thus, even when the same sealing body shape and light emitting element shape as those of the prior art are used, the directional characteristics of the elliptical sealing body in the major axis direction are improved, and a light emitting device with a wider viewing angle is provided. Obtainable.
【００１３】[0013]
【発明の実施の形態】本発明の請求項１に記載の発明
は、表面に発光面が形成されて素子載置部に配置された
ほぼ矩形状の発光素子と、発光面を外側にして発光素子
を封止する光透過性樹脂からなり、発光面から見たとき
に楕円形状をなす封止体とを有し、発光面の長手方向が
楕円形状である封止体の長径方向とほぼ平行になるよう
に発光素子が封止体に対して配置された発光装置であ
り、楕円形状を有する封止体の長径方向の指向特性が改
善されるという作用を有する。DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, a substantially rectangular light emitting element having a light emitting surface formed on a surface and arranged on an element mounting portion, and a light emitting element having a light emitting surface outside. A light-transmitting resin for encapsulating the element, and a sealing body having an elliptical shape when viewed from the light-emitting surface, wherein the longitudinal direction of the light-emitting surface is substantially parallel to the major axis direction of the sealing body having the elliptical shape. This is a light emitting device in which the light emitting element is arranged with respect to the sealing body so that the directional characteristics in the major axis direction of the sealing body having an elliptical shape are improved.
【００１４】また、本発明の請求項２に記載の発明は、
請求項１記載の発明において、発光素子が、正方形状、
長方形状または平行四辺形状である発光装置であり、発
光素子の発光面の長手方向の発光を楕円体形状を有する
封止体の長手方向の指向特性に有効に反映させることが
できるという作用を有する。[0014] The invention described in claim 2 of the present invention provides:
In the invention according to claim 1, the light emitting element has a square shape,
A light emitting device having a rectangular shape or a parallelogram shape, and has an effect that light emitted in the longitudinal direction of the light emitting surface of the light emitting element can be effectively reflected on the directional characteristics in the longitudinal direction of the sealing body having an elliptical shape. .
【００１５】本発明の請求項３に記載の発明は、請求項
１または２記載の発光装置を用いて作製されたディスプ
レイ装置であり、従来と同一形状の封止体と従来と同一
形状の発光素子を用いることができるので、低コストで
指向特性を改善することができるという作用を有する。According to a third aspect of the present invention, there is provided a display device manufactured using the light emitting device according to the first or second aspect, wherein a sealing body having the same shape as the conventional one and a light emitting device having the same shape as the conventional one are provided. Since an element can be used, the directional characteristic can be improved at low cost.
【００１６】以下、本発明の実施の形態について、図１
から図９を用いて説明する。なお、これらの図面におい
て同一の部材には同一の符号を付しており、また、重複
した説明は省略されている。Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. In these drawings, the same members are denoted by the same reference numerals, and duplicate description is omitted.
【００１７】（実施の形態１）図１は本発明の実施の形
態１に係る発光装置を発光観測面側から見た平面図であ
る。(Embodiment 1) FIG. 1 is a plan view of a light emitting device according to Embodiment 1 of the present invention as viewed from a light emission observation surface side.
【００１８】ディスプレイ装置を構成するこの発光装置
において、矩形状の発光素子１は、リードフレーム５ａ
の先端部に設けられた凹面反射鏡を有する素子載置部２
に載置されており、発光素子１の一方の電極３は発光素
子１の中心部から金線４でワイヤーボンディングされ
て、リードフレーム５ａに電気的に接続されている。ま
た、もう一方の電極（図示せず）は発光素子１の基板と
リードフレーム５ｂとを導電性材料で接着することによ
り電気的に接続されている。さらに、発光素子１が載置
されたリードフレーム５ａ，５ｂは光透過性樹脂からな
る封止体６で楕円形状に封止されている。なお、本明細
書において「楕円」とは、全て曲線で構成される一般的
な意味での楕円のみならず、円が押しつぶされたような
形状で曲線と直線とで構成される長円も含まれる。ま
た、発光素子１は厳密な意味で矩形となっている必要は
ない。In this light-emitting device constituting a display device, a rectangular light-emitting element 1 has a lead frame 5a.
Mounting part 2 having a concave reflecting mirror provided at the tip of the device
And one electrode 3 of the light emitting element 1 is wire-bonded with a gold wire 4 from the center of the light emitting element 1 and is electrically connected to the lead frame 5a. The other electrode (not shown) is electrically connected by bonding the substrate of the light emitting element 1 and the lead frame 5b with a conductive material. Further, the lead frames 5a and 5b on which the light emitting elements 1 are mounted are sealed in an elliptical shape by a sealing body 6 made of a light transmitting resin. In this specification, the term “ellipse” includes not only an ellipse in a general sense composed entirely of curves but also an ellipse composed of curves and straight lines in a shape like a crushed circle. It is. Further, the light emitting element 1 does not need to be strictly rectangular.
【００１９】図１において、斜線部で示される発光素子
１の表面の発光面１ａは、その形状が発光素子１を平面
から見た形状とほぼ一致しており、矩形状の発光素子１
の対角線の方向、すなわち発光面１ａの長手方向が発光
面１ａの発光観測面側から見た楕円形状の封止体６の長
径方向とほぼ平行となるように配置されている。In FIG. 1, the light-emitting surface 1a of the surface of the light-emitting element 1 indicated by a hatched portion substantially matches the shape of the light-emitting element 1 when viewed from a plane, and has a rectangular shape.
, That is, the longitudinal direction of the light emitting surface 1a is substantially parallel to the major axis direction of the elliptical sealing body 6 viewed from the light emission observing surface side of the light emitting surface 1a.
【００２０】ここで、図７において、本発明の実施の形
態１に係る発光装置の長径方向の指向特性を示すグラフ
である。また、比較のために、図１０に示される従来の
発光装置の長径方向の指向特性を示すグラフを図７の破
線で示す。Here, FIG. 7 is a graph showing the directional characteristics of the light emitting device according to Embodiment 1 of the present invention in the major diameter direction. For comparison, a dashed line in FIG. 7 is a graph showing the directivity of the conventional light emitting device shown in FIG.
【００２１】この図７からわかるように、矩形状の発光
素子の一辺が楕円の封止体の長径方向と平行となるよう
に配置された従来の発光装置では、その指向特性の半値
幅が約６５度である。これに対し、発光素子の発光面の
長手方向が楕円形状の封止体の長径方向と平行となるよ
うに配置された本実施の形態の発光装置では、その半値
幅は約７５度と従来の発光装置に比べて約１０度も広く
なっており、大きな差が認められる。As can be seen from FIG. 7, in the conventional light emitting device in which one side of the rectangular light emitting element is arranged in parallel with the major axis direction of the elliptical sealing body, the half value width of the directivity characteristic is about 65 degrees. On the other hand, in the light emitting device of the present embodiment, in which the longitudinal direction of the light emitting surface of the light emitting element is arranged in parallel with the major axis direction of the elliptical sealing body, the half width is about 75 degrees, which is the conventional value. It is about 10 degrees wider than the light emitting device, and a large difference is recognized.
【００２２】図８および図９に、矩形状の発光素子の発
光面とニアフィールドパターンを示す。ここで、図８
（ｂ）は図８（ａ）に示す矩形状の発光素子の対角線で
ある発光面の長手方向Ａ−Ａ’に沿ったニアフィールド
パターンである。また、図９（ｂ）は図９（ａ）に示す
発光素子の一辺に平行な線Ｂ−Ｂ’に沿ったニアフィー
ルドパターンである。FIGS. 8 and 9 show a light emitting surface and a near field pattern of a rectangular light emitting element. Here, FIG.
(B) is a near-field pattern along the longitudinal direction AA ′ of the light emitting surface which is a diagonal line of the rectangular light emitting element shown in FIG. 8 (a). FIG. 9B shows a near-field pattern along a line BB ′ parallel to one side of the light-emitting element shown in FIG. 9A.
【００２３】これらの図からわかるように、矩形状の発
光素子の発光面においては、矩形状発光素子の一辺に平
行な方向よりも長手方向に発光面の長さを大きくとるこ
とができる。As can be seen from these figures, the length of the light emitting surface of the rectangular light emitting element can be longer in the longitudinal direction than in the direction parallel to one side of the rectangular light emitting element.
【００２４】このように、本実施の形態の発光装置によ
れば、発光素子１の発光面１ａの長手方向（本実施の形
態においては、矩形状の発光素子１の対角線方向）が楕
円形状の封止体６の長径方向とほぼ平行となるように発
光素子１を配置することにより、新規な封止体形状や発
光素子形状を採用することなく、発光装置の封止体６の
長径方向における指向特性を改善させることができて、
視野角の拡大を図ることが可能になる。As described above, according to the light emitting device of the present embodiment, the longitudinal direction of the light emitting surface 1a of the light emitting element 1 (in this embodiment, the diagonal direction of the rectangular light emitting element 1) is elliptical. By arranging the light emitting element 1 so as to be substantially parallel to the major axis direction of the sealing body 6, the light emitting element 1 in the major axis direction of the sealing body 6 of the light emitting device can be used without adopting a new sealing body shape or a new light emitting element shape. Can improve directional characteristics,
It is possible to increase the viewing angle.
【００２５】そして、このような発光装置を用いてディ
スプレイ装置を作製することにより、従来と同一形状の
封止体と従来と同一形状の発光素子を用いることがで
き、低コストでディスプレイ装置の指向特性を改善する
ことが可能になる。By manufacturing a display device using such a light emitting device, it is possible to use a sealing member having the same shape as the conventional one and a light emitting element having the same shape as the conventional one. The characteristics can be improved.
【００２６】（実施の形態２）図２は本発明の実施の形
態２に係る発光装置を発光観測面側から見た平面図であ
る。(Embodiment 2) FIG. 2 is a plan view of a light emitting device according to Embodiment 2 of the present invention as viewed from a light emission observation surface side.
【００２７】本実施の形態の発光装置においては、発光
素子１の形状が長方形状であること以外は、前述の実施
の形態１における発光装置と同様の構成となっている。
なお、斜線部で示された発光素子１の表面が発光面１ａ
となる。The light emitting device of the present embodiment has the same configuration as that of the light emitting device of the first embodiment except that the shape of the light emitting element 1 is rectangular.
Note that the surface of the light emitting element 1 indicated by the hatched portion is the light emitting surface 1a.
Becomes
【００２８】本実施の形態においても、実施の形態１と
同様に、長方形状の発光素子１の対角線方向である発光
面１ａの長手方向が楕円形状の封止体６の長径方向とほ
ぼ平行となるように配置することにより、新規な封止体
形状や発光素子形状を採用することなく、発光装置の封
止体６の長径方向における指向特性を改善することが可
能になる。Also in the present embodiment, as in the first embodiment, the longitudinal direction of the light emitting surface 1a, which is the diagonal direction of the rectangular light emitting element 1, is substantially parallel to the major axis direction of the elliptical sealing body 6. By arranging in such a manner, it is possible to improve the directional characteristics in the major axis direction of the sealing body 6 of the light emitting device without employing a new sealing body shape or a new light emitting element shape.
【００２９】（実施の形態３）図３は本発明の実施の形
態３に係る発光装置を発光観測面側から見た平面図であ
る。(Embodiment 3) FIG. 3 is a plan view of a light emitting device according to Embodiment 3 of the present invention as viewed from a light emission observation surface side.
【００３０】この発光装置において、正方形状の発光素
子１の表面には正方形の一方の対角線上に二つの電極３
が形成されており、それぞれ金線４でワイヤーボンディ
ングされて、リードフレーム５ａおよび５ｂに電気的に
接続されている。なお、発光素子１の表面の発光面１ａ
は斜線部で示されている。In this light emitting device, the surface of the square light emitting element 1 has two electrodes 3 on one diagonal of the square.
Are formed and wire-bonded with gold wires 4 to be electrically connected to the lead frames 5a and 5b. The light emitting surface 1a of the light emitting element 1
Is indicated by hatching.
【００３１】また、本実施の形態において、発光素子１
における電極が形成されていない方の対角線方向である
発光面１ａの長手方向を楕円形状の封止体６の長径方向
とほぼ平行となるように配置されている。In this embodiment, the light emitting element 1
Are arranged so that the longitudinal direction of the light emitting surface 1a, which is the diagonal direction on which no electrode is formed, is substantially parallel to the major axis direction of the elliptical sealing body 6.
【００３２】発光素子１をこのように配置することによ
り、図１１に示される従来の発光装置のように電極が形
成されていない方の対角線方向を楕円の封止体６の短径
方向と平行になるように配置させた場合や、矩形状の発
光素子１の一辺を楕円の封止体６の長径方向と平行にな
るように配置した場合に比べて、発光装置の封止体６の
長径方向における指向特性を改善させることが可能にな
る。By arranging the light emitting element 1 in this manner, the diagonal direction where no electrode is formed is parallel to the minor axis direction of the elliptical sealing body 6 as in the conventional light emitting device shown in FIG. , Or the longer diameter of the sealing body 6 of the light emitting device, as compared with the case where the rectangular light emitting element 1 is arranged so that one side thereof is parallel to the major axis direction of the elliptical sealing body 6. It is possible to improve the directional characteristics in the direction.
【００３３】（実施の形態４）図４は本発明の実施の形
態４に係る発光装置を発光観測面側から見た平面図であ
る。(Embodiment 4) FIG. 4 is a plan view of a light emitting device according to Embodiment 4 of the present invention as viewed from a light emission observation surface side.
【００３４】この発光装置において、長方形状の発光素
子１の表面には長方形の発光素子１の一方の対角線上
に、前述した実施の形態３と同様に二つの電極３が形成
されており、それぞれ金線４でワイヤーボンディングさ
れて、リードフレーム５ａ，５ｂに電気的に接続されて
いる。なお、斜線部で示された発光素子１の表面が発光
面１ａとなる。In this light emitting device, two electrodes 3 are formed on the surface of the rectangular light emitting element 1 on one diagonal line of the rectangular light emitting element 1 in the same manner as in the third embodiment. It is wire-bonded with a gold wire 4 and is electrically connected to the lead frames 5a and 5b. Note that the surface of the light emitting element 1 indicated by the hatched portion becomes the light emitting surface 1a.
【００３５】本実施の形態に示すように、発光素子１に
おける電極３が形成されていない方の対角線方向、すな
わち発光面１ａの長手方向を楕円形状の封止体６の長径
方向とほぼ平行となるように配置させることにより、電
極３が形成されていない方の対角線方向を楕円の封止体
６の短径方向と平行になるように配置した場合や、発光
素子１の矩形状の一辺を楕円の封止体６の長径方向と平
行になるように配置した場合に比べて、発光装置の封止
体６の長径方向における指向特性を改善させることが可
能になる。As shown in this embodiment, the diagonal direction of the light emitting element 1 where the electrode 3 is not formed, that is, the longitudinal direction of the light emitting surface 1a is substantially parallel to the major axis direction of the elliptical sealing body 6. In such a case, the diagonal direction where the electrode 3 is not formed is arranged so as to be parallel to the minor axis direction of the elliptical sealing body 6, or one side of the rectangular shape of the light emitting element 1 is Compared to the case where the elliptical sealing body 6 is arranged so as to be parallel to the major axis direction, it is possible to improve the directional characteristics in the major axis direction of the sealing body 6 of the light emitting device.
【００３６】（実施の形態５）図５は本発明の実施の形
態５に係る発光装置を発光観測面側から見た平面図であ
る。(Embodiment 5) FIG. 5 is a plan view of a light emitting device according to Embodiment 5 of the present invention as viewed from a light emission observation surface side.
【００３７】この発光装置において、平行四辺形状に形
成された発光素子１の表面には、その一方の対角線上
に、上記実施の形態３と同様に二つの電極３が形成され
ており、それぞれ金線４でワイヤーボンディングされ
て、リードフレーム５ａ，５ｂに電気的に接続されてい
る。なお、斜線部で示された発光素子１の表面が発光面
１ａとなる。In this light-emitting device, two electrodes 3 are formed on one diagonal line on the surface of the light-emitting element 1 formed in a parallelogram shape in the same manner as in the third embodiment. The wires 4 are wire-bonded and electrically connected to the lead frames 5a and 5b. Note that the surface of the light emitting element 1 indicated by the hatched portion becomes the light emitting surface 1a.
【００３８】本実施の形態においても、上記実施の形態
３と同様に、発光素子１の電極３が形成されていない方
の対角線方向である発光面１ａの長手方向を楕円形状の
封止体６の長径方向とほぼ平行となるように配置してい
るので、発光素子１の電極３が形成されていない方の対
角線方向を楕円の封止体６の短径方向と平行になるよう
に配置した場合や、発光素子１の矩形状の一辺を楕円の
封止体６の長径方向と平行になるように配置した場合に
比べて、発光装置の封止体６の長径方向における指向特
性を改善させることが可能になる。In this embodiment, as in Embodiment 3, the longitudinal direction of the light emitting surface 1a, which is the diagonal direction of the light emitting element 1 where the electrode 3 is not formed, is set to an elliptical sealing member 6. Are arranged so as to be substantially parallel to the major axis direction, so that the diagonal direction of the light emitting element 1 where the electrode 3 is not formed is parallel to the minor axis direction of the elliptical sealing body 6. The directional characteristics in the major axis direction of the sealing body 6 of the light emitting device are improved as compared with the case or the case where one rectangular side of the light emitting element 1 is arranged so as to be parallel to the major axis direction of the elliptical sealing body 6. It becomes possible.
【００３９】（実施の形態６）図６は本発明の実施の形
態６に係る発光装置を発光観測面側から見た平面図であ
る。(Embodiment 6) FIG. 6 is a plan view of a light emitting device according to Embodiment 6 of the present invention as viewed from a light emission observation surface side.
【００４０】この発光装置における発光素子１は、いわ
ゆるフリップチップ型である。すなわち、素子載置部２
に配置された台座部材７の表面には、矩形状の発光素子
１の裏面に形成された図示しない二つの電極と対向する
位置にそれぞれの補助電極８が形成されており、発光素
子１の電極と台座部材７の補助電極８とが電気的に接続
されている。また、発光素子１は、前記補助電極に金線
４でワイヤーボンディングすることにより、リードフレ
ーム５ａ，５ｂと電気的に接続されている。なお、斜線
部で示された発光素子１の表面が発光面１ａとなる。The light emitting element 1 in this light emitting device is of a so-called flip chip type. That is, the element mounting part 2
Auxiliary electrodes 8 are formed on the front surface of the pedestal member 7 disposed at positions opposite to two electrodes (not shown) formed on the back surface of the rectangular light emitting element 1. And the auxiliary electrode 8 of the pedestal member 7 are electrically connected. Further, the light emitting element 1 is electrically connected to the lead frames 5a and 5b by wire bonding to the auxiliary electrode with a gold wire 4. Note that the surface of the light emitting element 1 indicated by the hatched portion becomes the light emitting surface 1a.
【００４１】本実施の形態において、矩形状の発光素子
１の対角線方向である発光面１ａの長手方向を楕円形状
の封止体６の長径方向とほぼ平行となるように配置する
ことにより、発光素子１の矩形状の一辺を楕円の封止体
６の長径方向と平行になるように配置した場合に比べ
て、発光装置の封止体６の長径方向における指向特性を
改善させることが可能になる。In this embodiment, light emission is achieved by arranging the light emitting surface 1a, which is the diagonal direction of the rectangular light emitting element 1, in a longitudinal direction substantially parallel to the major diameter direction of the elliptical sealing body 6. Compared to a case where one side of the rectangular shape of the element 1 is arranged so as to be parallel to the major axis direction of the elliptical sealing body 6, it is possible to improve the directional characteristics in the major axis direction of the sealing body 6 of the light emitting device. Become.
【００４２】なお、本発明においては、素子載置部２に
発光色の異なる複数の発光素子１を載置した発光装置に
も適用することが可能である。The present invention is also applicable to a light emitting device in which a plurality of light emitting elements 1 having different emission colors are mounted on the element mounting portion 2.
【００４３】[0043]
【発明の効果】以上のように、本発明によれば、発光面
の長手方向が楕円形状の封止体の長径方向とほぼ平行に
なるように発光素子が封止体に対して配置されているの
で、従来と同一の封止体形状や発光素子形状を用いて
も、封止体の長径方向の指向特性が改善され、より視野
角の拡大された発光装置を得ることができるという有効
な効果が得られる。As described above, according to the present invention, the light emitting element is disposed with respect to the sealing body such that the longitudinal direction of the light emitting surface is substantially parallel to the major axis direction of the elliptical sealing body. Therefore, even if the same sealing body shape and light emitting element shape as those of the related art are used, the directional characteristics in the major axis direction of the sealing body are improved, and an effective light emitting device with a wider viewing angle can be obtained. The effect is obtained.
【００４４】また、本発明の発光装置を用いてディスプ
レイ装置を作製すると、従来と同一形状の封止体と従来
と同一形状の発光素子を用いることができるので、低コ
ストでディスプレイ装置の指向特性を改善することがで
きるという有効な効果が得られる。Further, when a display device is manufactured using the light emitting device of the present invention, a sealing body having the same shape as the conventional one and a light emitting element having the same shape as the conventional one can be used. Can be improved.
【図１】本発明の実施の形態１に係る発光装置を発光観
測面側から見た平面図FIG. 1 is a plan view of a light emitting device according to Embodiment 1 of the present invention when viewed from a light emission observation surface side.
【図２】本発明の実施の形態２に係る発光装置を発光観
測面側から見た平面図FIG. 2 is a plan view of a light emitting device according to a second embodiment of the present invention as viewed from a light emission observation surface side.
【図３】本発明の実施の形態３に係る発光装置を発光観
測面側から見た平面図FIG. 3 is a plan view of the light emitting device according to Embodiment 3 of the present invention when viewed from a light emission observation surface side.
【図４】本発明の実施の形態４に係る発光装置を発光観
測面側から見た平面図FIG. 4 is a plan view of a light emitting device according to Embodiment 4 of the present invention as viewed from a light emission observation surface side.
【図５】本発明の実施の形態５に係る発光装置を発光観
測面側から見た平面図FIG. 5 is a plan view of a light emitting device according to a fifth embodiment of the present invention as viewed from a light emission observation surface side.
【図６】本発明の実施の形態６に係る発光装置を発光観
測面側から見た平面図FIG. 6 is a plan view of a light emitting device according to a sixth embodiment of the present invention as viewed from a light emission observation surface side.
【図７】本発明の実施の形態１に係る発光装置の長径方
向の指向特性を示すグラフFIG. 7 is a graph showing the directional characteristics of the light emitting device according to Embodiment 1 of the present invention in the major diameter direction.
【図８】発光素子のニアフィールドパターンを示す説明
図FIG. 8 is an explanatory diagram showing a near-field pattern of a light-emitting element.
【図９】発光素子のニアフィールドパターンを示す説明
図FIG. 9 is an explanatory diagram showing a near-field pattern of a light-emitting element.
【図１０】従来の発光装置を発光観測面側から見た平面
図FIG. 10 is a plan view of a conventional light emitting device viewed from a light emission observation surface side.
【図１１】従来の発光装置を発光観測面側から見た平面
図FIG. 11 is a plan view of a conventional light emitting device viewed from a light emission observation surface side.
１ 発光素子 １ａ 発光面 ２ 素子載置部 ６ 封止体 DESCRIPTION OF SYMBOLS 1 Light emitting element 1a Light emitting surface 2 Element mounting part 6 Sealing body
Claims (3)
置されたほぼ矩形状の発光素子と、 前記発光面を外側にして前記発光素子を封止する光透過
性樹脂からなり、前記発光面から見たときに楕円形状を
なす封止体とを有し、 前記発光面の長手方向が楕円形状である前記封止体の長
径方向とほぼ平行になるように前記発光素子が前記封止
体に対して配置されていることを特徴とする発光装置。1. A substantially rectangular light-emitting element having a light-emitting surface formed on a surface and disposed on an element mounting portion, and a light-transmitting resin for sealing the light-emitting element with the light-emitting surface facing outward, A sealing body having an elliptical shape when viewed from the light emitting surface, wherein the light emitting element is configured such that a longitudinal direction of the light emitting surface is substantially parallel to a major axis direction of the sealing body having the elliptical shape. A light-emitting device which is arranged with respect to a sealing body.
は平行四辺形状であることを特徴とする請求項１記載の
発光装置。2. The light emitting device according to claim 1, wherein said light emitting element has a square shape, a rectangular shape, or a parallelogram shape.
作製されていることを特徴とするディスプレイ装置。3. A display device manufactured using the light emitting device according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9204090A JPH1154802A (en) | 1997-07-30 | 1997-07-30 | Light emitting device and display device manufactured using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9204090A JPH1154802A (en) | 1997-07-30 | 1997-07-30 | Light emitting device and display device manufactured using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1154802A true JPH1154802A (en) | 1999-02-26 |
Family
ID=16484628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9204090A Pending JPH1154802A (en) | 1997-07-30 | 1997-07-30 | Light emitting device and display device manufactured using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1154802A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7244924B2 (en) | 2000-07-14 | 2007-07-17 | Omron Corporation | Transparent optical component for light emitting/receiving elements |
| JP2008123837A (en) * | 2006-11-13 | 2008-05-29 | Koito Mfg Co Ltd | Light emitting module for vehicular lamp |
| JP2009239116A (en) * | 2008-03-27 | 2009-10-15 | Sharp Corp | Light emitting device |
| US7645062B2 (en) | 2003-08-20 | 2010-01-12 | Stanley Electric Co., Ltd. | Light source and vehicle lamp |
| US20110042698A1 (en) * | 2006-04-24 | 2011-02-24 | Cree, Inc. | Emitter package with angled or vertical led |
| JP2015029120A (en) * | 2006-03-03 | 2015-02-12 | 株式会社半導体エネルギー研究所 | Light emitting device |
| US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
| US9035439B2 (en) | 2006-03-28 | 2015-05-19 | Cree Huizhou Solid State Lighting Company Limited | Apparatus, system and method for use in mounting electronic elements |
| US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
| US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
| US9722158B2 (en) | 2009-01-14 | 2017-08-01 | Cree Huizhou Solid State Lighting Company Limited | Aligned multiple emitter package |
| US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
-
1997
- 1997-07-30 JP JP9204090A patent/JPH1154802A/en active Pending
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7244924B2 (en) | 2000-07-14 | 2007-07-17 | Omron Corporation | Transparent optical component for light emitting/receiving elements |
| US7645062B2 (en) | 2003-08-20 | 2010-01-12 | Stanley Electric Co., Ltd. | Light source and vehicle lamp |
| US8506147B2 (en) | 2003-08-20 | 2013-08-13 | Stanley Electric Co., Ltd. | Light source and vehicle lamp |
| US10229940B2 (en) | 2006-03-03 | 2019-03-12 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US9793150B2 (en) | 2006-03-03 | 2017-10-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP2015029120A (en) * | 2006-03-03 | 2015-02-12 | 株式会社半導体エネルギー研究所 | Light emitting device |
| US9436036B2 (en) | 2006-03-03 | 2016-09-06 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US9035439B2 (en) | 2006-03-28 | 2015-05-19 | Cree Huizhou Solid State Lighting Company Limited | Apparatus, system and method for use in mounting electronic elements |
| US20110042698A1 (en) * | 2006-04-24 | 2011-02-24 | Cree, Inc. | Emitter package with angled or vertical led |
| US8748915B2 (en) * | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
| JP2008123837A (en) * | 2006-11-13 | 2008-05-29 | Koito Mfg Co Ltd | Light emitting module for vehicular lamp |
| US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
| US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| US10892383B2 (en) | 2007-10-31 | 2021-01-12 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US11791442B2 (en) | 2007-10-31 | 2023-10-17 | Creeled, Inc. | Light emitting diode package and method for fabricating same |
| JP2009239116A (en) * | 2008-03-27 | 2009-10-15 | Sharp Corp | Light emitting device |
| US9722158B2 (en) | 2009-01-14 | 2017-08-01 | Cree Huizhou Solid State Lighting Company Limited | Aligned multiple emitter package |
| US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
| TWI580076B (en) * | 2010-08-25 | 2017-04-21 | 科銳公司 | Emitter package with oblique or vertical LEDs |
| CN103180976A (en) * | 2010-08-25 | 2013-06-26 | 克利公司 | Emitter packages with angled or vertical LEDs |
| WO2012026966A1 (en) * | 2010-08-25 | 2012-03-01 | Cree, Inc. | Emitter package with angled or vertical led |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
| US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH1154802A (en) | Light emitting device and display device manufactured using the same | |
| US20060119250A1 (en) | Light-emitting diode, led light, and light apparatus | |
| US20040207999A1 (en) | LED package | |
| JPH1012926A (en) | Full color emission diode lamp and display | |
| JP3319392B2 (en) | Semiconductor light emitting device | |
| JPH06177424A (en) | Light emitting diode lamp and collective type light emitting diode display device | |
| JP2001250986A (en) | Dot matrix display device | |
| JP2000223751A (en) | Led lamp and display device using the led lamp | |
| JP3399266B2 (en) | All-color light-emitting diode lamp | |
| JP2006173271A (en) | Semiconductor light emitting device, lighting device, portable communication device, and camera | |
| JP2004342781A (en) | Light emitting device and display unit | |
| US11462887B2 (en) | Laser element | |
| US20160149098A1 (en) | Light emitting diode package and display device having the same | |
| JP2927202B2 (en) | LED lamp | |
| KR20040024747A (en) | A High brightness light emitting diode and its method of making | |
| JP2921451B2 (en) | Semiconductor light emitting module | |
| JP2002270902A (en) | Light emitting diode | |
| JPH1146013A (en) | Led lamp | |
| JP3845938B2 (en) | Display device | |
| JP2004193451A (en) | Light emitting diode | |
| TW201714328A (en) | Light emitting device and display apparatus | |
| JP2000089694A (en) | Dot matrix display | |
| JP2812614B2 (en) | Light emitting diode | |
| JP2951099B2 (en) | Light emitting diode | |
| JPS6364005B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20041207 |