JPH1140293A - Laminated connector and adapter device for circuit board inspection - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily form a wiring part with high degrees of freedom through making a land small, by bonding at least one of short-circuit parts formed in an insulating layer to a conductor in a via hole part of a board. SOLUTION: A short-circuit part 33 is bonded to a via hole part 21 of a board 20 and/or a wiring part, and this short-circuit part 33 is connected to a connecting electrode 31 directly or via upper surface of a wiring part 32. Each of connecting electrodes 31 is connected electrically to a terminal electrode 61 via the short-circuit part 33, a lower surface of a wiring part 62 and a short- circuit part 23 on a board. The short-circuit parts 33, 63 can be provided by forming a drilled hole in an insulating layer 30, 60 and by forming a conductive body in it, and the depth of the drilled hole reaching a via hole part 21 on the board 20 and/or a wiring part and net penetrating through the board 20 is acceptable. Thereby, electrical connection between layers by the short circuit part 33, 63 can be made surely.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated connector and an adapter device for inspecting a circuit board provided with the laminated connector.

[0002]

2. Description of the Related Art Generally, in a circuit board such as a printed circuit board, as shown in FIG. 19, a functional element region 91 in which functional elements are formed with a high degree of integration is provided at the center of a circuit board 90. A lead electrode region 93 in which a large number of lead electrodes 92 for a functional element region 91 are arranged at the peripheral portion thereof is formed. At present, with the increase in the degree of integration of the functional element region 91, the number of lead electrodes in the lead electrode region 93 tends to increase and the density tends to increase.

In order to achieve electrical connection between such lead electrodes of a circuit board and other circuit terminals to be connected thereto, conventionally, an anisotropic conductive sheet is interposed on each lead electrode region. Let it be done. The anisotropic conductive sheet has conductivity only in the thickness direction, or has a large number of pressurized conductive portions that show conductivity only in the thickness direction when pressed. Are disclosed, for example, in JP-B-56-48951 and JP-A-51-481.
No. 93393, JP-A-53-147772,
This is known from JP-A-54-146873 and the like.

However, the above-described anisotropic conductive sheet is manufactured as a single product itself and is handled independently, and has a specific positional relationship with respect to a circuit board in an electrical connection operation. It is necessary to hold and fix. However, in the means for achieving the electrical connection of the circuit boards by using independent anisotropic conductive sheets, the arrangement pitch of the lead electrodes on the circuit board to be inspected (hereinafter referred to as “electrode pitch”), that is, each other. There is a problem that as the center-to-center distance between adjacent lead electrodes becomes smaller, it becomes more difficult to position and hold and fix the anisotropic conductive sheet.

[0005] Even if the desired alignment and holding and fixing have been realized, the degree of stress due to thermal expansion and thermal shrinkage is an object of inspection when a thermal history due to a temperature change is received. Because the material constituting the circuit board and the material constituting the anisotropic conductive sheet are different,
There is a problem that a stable connection state is not maintained due to a change in the electrical connection state.

Further, even if a stable connection state can be maintained with respect to a circuit board to be inspected, a circuit having a complicated and fine pattern of electrodes to be inspected, such as a printed circuit board having a high mounting density. Since it is difficult to reliably achieve electrical connection with each of the electrodes to be inspected on the substrate, there is a problem that required inspection cannot be performed sufficiently.

Conventionally, in order to solve the above-described problems, terminal electrodes are arranged on standardized standard grid points on the lower surface, and the electrodes to be inspected of the circuit board to be inspected are arranged on the upper surface. It has been proposed to form an adapter device for circuit board inspection by forming an adapter body provided with corresponding connection electrodes and integrally providing an anisotropic conductive elastomer layer on the upper surface of the adapter body. I have.

According to such a configuration, even when the electrodes to be inspected such as the lead electrodes on the circuit board to be inspected have a minute electrode pitch and a fine, high-density complex pattern. The required electrical connection can be reliably achieved for the circuit board, and a good electrical connection state can be stably maintained against environmental changes such as heat history due to temperature changes, and therefore connection reliability can be improved. Is high,
Thus, there is provided an adapter device for circuit board inspection which is very advantageous in this respect.

[0009]

In such an adapter device for inspecting a circuit board, a pattern corresponding to an electrode to be inspected on a circuit board to be inspected, that is, a complicated pattern having a small electrode pitch is connected. Electrode and, for example, an electrode pitch of 2.54 mm, 1.80 mm or 1.
Since it is necessary to electrically connect terminal electrodes arranged on a standard grid point of 27 mm, the adapter body is connected to a wiring portion of the substrate on a substrate having an appropriate wiring portion on the upper surface. There is used a laminated connector in which insulating layers having short circuits are stacked. For forming the short-circuit portion of the insulating layer in such a laminated connector, a laminated body for the connector of the substrate and the insulating layer is formed, and the laminated body for the connector is penetrated in the thickness direction by, for example, a drilling device. After a via hole is formed, means for filling the inside of the via hole with a copper deposit by, for example, a copper plating method is employed.

However, when the short-circuited portion of the insulating layer is formed only by means of the via hole penetrating in the thickness direction, the wiring portion of the substrate cannot be formed with a large degree of freedom, and is subject to inspection. In the case where the electrodes to be inspected on the circuit board are extremely high-density, it is necessary to increase the number of insulating layers in order to manufacture a corresponding laminated connector, and the time and cost required for wiring design, There is a problem that the time and cost required for manufacturing the adapter main body become enormous.

The present invention has been made in view of the above circumstances, and a first object of the present invention is to provide a multilayer connector for use in inspecting a circuit board, the connector being used for inspecting a circuit board to be inspected. The electrode to be inspected such as a lead electrode
Even when the electrode pitch is minute and the pattern is fine and has a complicated pattern of high density, the wiring portion can be easily formed with a large degree of freedom. It is an object of the present invention to provide a laminated connector that can reliably form a short-circuit portion connected to a connector. A second object of the present invention is that an electrode to be inspected such as a lead electrode on a circuit board to be inspected has a fine electrode pitch,
And even in the case of a fine and high-density complex pattern, it is possible to reliably achieve the required electrical connection for the circuit board, and to withstand environmental changes such as heat history due to temperature changes. It is an object of the present invention to provide a circuit board inspection adapter device which maintains a good electrical connection state stably and therefore has a high connection reliability and can be manufactured advantageously and reliably.

[0012]

According to the present invention, there is provided a substrate having wiring portions on upper and lower surfaces and having a via hole in a thickness direction, and at least two substrates provided vertically above and below the substrate including the wiring portion. And a short-circuit portion formed of a conductor connected to the wiring portion of the substrate and extending through the insulating layer in the thickness direction thereof, the insulating layer having: At least one of the short-circuit portions is provided to provide a laminated connector, wherein the short-circuit portion is joined to a conductor in a via-hole portion of the substrate.

[0013] In the above-mentioned laminated connector, for example, a first step of forming a via hole in a substrate and then forming a wiring portion and a via hole land portion on the surface of the substrate; A second step of forming an insulating layer above and below the substrate, and forming a hole having a depth reaching the via hole and / or the wiring portion at a position where the via hole and / or the wiring portion is formed in the insulating layer; Forming a conductor inside the hole to form a short-circuit portion connected to the via hole portion and / or the wiring portion and extending through the insulating layer in the thickness direction thereof. Can be manufactured.

The adapter device for circuit board inspection according to the present invention is a circuit interposed between a circuit board to be inspected and an electrical inspection device for electrically connecting an electrode to be inspected of the circuit board to the electrical inspection device. An adapter device for inspecting a board, comprising: an adapter body having terminal electrodes arranged on lattice points on a lower surface and having connection electrodes corresponding to electrodes to be inspected on a circuit board to be inspected on an upper surface; The adapter body includes the anisotropic conductive elastomer layer provided integrally on the upper surface, and the adapter body includes the multilayer connector according to claim 1, wherein the short-circuit portion formed in the insulating layer is It is characterized by being electrically connected to the connection electrode and the terminal electrode.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. FIG. 1 is an explanatory sectional view showing a configuration of an example of the laminated connector of the present invention, FIG. 2 is a partially broken plan view showing an arrangement state of each part of the laminated connector, and FIG. It is explanatory sectional drawing which expands and shows a part of main body. As shown in FIG. 1, this laminated connector is composed of a laminate of a substrate 20 and insulating layers 30 and 60 provided on the upper and lower surfaces of the substrate 20 in a stacked manner. The material of the substrate 20 is preferably a plate-like body made of a heat-resistant material having high dimensional stability, and various insulating resins can be used. In particular, a glass fiber reinforced epoxy resin is most suitable. The insulating layers 30 and 60 are formed of, for example, a thermosetting resin sheet provided by thermocompression bonding. This thermosetting resin sheet is preferably made of a heat-resistant resin having high dimensional stability, and various resin sheets can be used, but a glass fiber reinforced epoxy prepreg resin sheet, a polyimide prepreg resin sheet, an epoxy prepreg resin Sheets are preferred.

On the lower surface of the insulating layer 60 forming the lower surface of the multilayer connector, a terminal electrode 6 electrically connected to an electrical inspection apparatus, that is, an inspection tester by appropriate means.
1 are arranged and provided on the grid points, and
The upper and lower surfaces of the substrate wiring portions 22 and 6 of an appropriate pattern
2 are formed, and the terminal electrode 61 and the substrate wiring portions 62 and 22 are electrically connected by the substrate short-circuit portions 63 and 23 extending through the insulating layer 60 and the substrate 20 in the thickness direction thereof. The distance between the lattice points of the terminal electrode 61, that is, the electrode pitch of the terminal electrode 61 is not particularly limited, and may be an appropriate size according to various conditions. .8 mm or 1.27
mm.

An insulating layer 30 is formed on the upper surface of the substrate 20 including the substrate wiring portions 22 and 62. On the upper surface of the insulating layer 30, the connection electrode 31 is placed at a position corresponding to the pattern of the electrode to be inspected (not shown) on the circuit board to be inspected.
Are formed so as to protrude from the upper surface, and the upper surface wiring portion 32 of an appropriate pattern is formed. A short-circuit portion 33 extending through the insulating layer 30 in the thickness direction thereof is provided. The short-circuit portion 33 is connected to the connection electrode 31 directly or via the upper surface wiring portion 32. Reference numeral 31 is electrically connected to the substrate wiring section 22. It is needless to say that the substrate wiring portions 22 and 62 and the upper surface wiring portion 32 can be formed so as to extend in a direction intersecting the paper surface in FIG.
Shows such a state.

As shown in FIG. 3, the short-circuit portion 33 is
The short-circuit portion 33 is connected to the connection electrode 31 directly or via the upper-surface wiring portion 32. Each of the connection electrodes 31 has a short-circuit portion 33,
It is electrically connected to the terminal electrode 61 via the substrate wiring portions 22 and 62 and the substrate short-circuit portion 23.

In an actual configuration, the electrical connection between the connection electrode 31 and the terminal electrode 61 may be achieved in a manner corresponding to the purpose of inspecting the circuit board. Therefore, it is not always necessary to connect all the connection electrodes 31 and the terminal electrodes 61 in a one-to-one correspondence, and various requests are made for the terminal electrodes 31, the substrate wiring portions 22 and 62, and the connection electrodes 31. A connection state can be realized. For example, top wiring section 3
2, connecting the connection electrodes 31 to each other, connecting the plurality of connection electrodes 31 to one substrate wiring part 32 in common, and connecting one connection electrode 31 to the plurality of substrate wiring parts 3
2 can be connected simultaneously, and so on.

The laminated connector having such a configuration can be manufactured, for example, by the following steps. (1) Via holes are formed in the thickness direction of the substrate 20, and the substrate wiring portion 22 and the via hole land 64 are formed on the upper surface of the substrate 20, and the substrate wiring portion 62 and the via hole land 21 are formed on the lower surface of the substrate 20. First step (see FIGS. 4 to 6)
(2) a second step of forming an insulating layer 30 thin metal layer 31A and an insulating layer 60 thin metal layer 61A above and below the substrate 20 (see FIGS. 7 and 8); and (3) an insulating layer 30 thin metal layer. 31A, a hole is formed at a position where the wiring portion 22 and / or the via hole 34 is formed at a depth reaching the wiring portion 22 and / or the via hole 34, and then the wiring portion 6 in the insulating layer 60 is formed.
2 and / or a hole having a depth reaching the via hole 34 is formed at a position where the via hole 34 is formed, and a conductor is formed inside the hole to form the substrate wiring portion 22.
Connected to the terminal electrode 61 and the short-circuit portion 33 extending through the insulating layer 30 in the thickness direction.
And a third step (see FIGS. 10 and 11) of forming a short-circuit portion 63 extending through the substrate in the thickness direction.

The details of the first to third steps are as follows. First step: In the first step, finally, as shown in FIG. 6, the substrate wiring portion 22 and the via hole land portion 64 are formed on the via hole portion 23 and the upper surface, and the substrate wiring portion 62 and the via hole land are formed on the lower surface. This is a step of manufacturing the substrate 20 on which the hole land portions 21 are formed. Specifically, as shown in FIG. 4, thin metal layers 62A and 62A made of, for example, copper or the like.
A plate-shaped insulating substrate 20 made of a hard resin and provided with two layers laminated on both sides is prepared. Via holes are formed through the substrate 20 in the thickness direction. By performing a photolithography and etching process on 22A and removing a part thereof, as shown in FIG. 5, the substrate wiring portions 22 and 62 are formed by the remaining thin metal layer according to a pattern according to a desired mode. Here, the inner diameter of the via hole is not particularly limited as long as the required electrical connection of the intermediary conductor to be formed is achieved, but preferably 0.02.
~ 0.5mm, more preferably 0.03 ~ 0.3mm
It is.

Second step: This second step is to form an insulating layer 30 on the upper surface of the substrate 20 including the substrate wiring portion 22 and the via hole portion 34, as shown in FIG. A thin metal layer 31A for forming a connection electrode and an upper wiring portion is formed on the upper surface of the insulating layer 30, and an insulating layer 60 is formed on the lower surface of the substrate 20 including the substrate wiring portion 62 and the via hole portion. And the insulating layer 60
In this step, a thin metal layer 61A for forming a connection electrode and a lower wiring portion is formed on the lower surface of the substrate.

Specifically, as shown in FIG. 7, a metal foil 31C is overlaid on the upper surface of the thermosetting resin sheet 30A,
At the same time, the thermosetting resin sheet 60A is disposed under the lower surface of the substrate 20, and the metal foil 61C is further disposed on the lower surface of the thermosetting resin sheet 60A. In this state, thermocompression bonding is performed by, for example, a vacuum press method. As a result, the thermosetting resin sheets 30A and 60A are cured, and are integrally attached with the upper and lower surfaces of the substrate 20 including the substrate wiring portions 22 and 62 via hole lands 64 and 21 (not shown) as the attachment surfaces. At the same time, the metal foil 31B is further attached to the upper surface of the thermosetting resin sheet 30A, and the metal foil 61B is integrally attached to the lower surface of the thermosetting resin sheet 60A.
As shown in FIG. 8, a pressure-bonded laminate 10A in which the thin metal layer 31A, the insulating layer 30, the substrate 20, the insulating layer 60, and the thin metal layer 61A are stacked in this order is formed.

In the above, as a means for forming the insulating layer 60, a thermocompression bonding means for pressing the thermosetting resin sheet 30A to the surface to be adhered under heating is used. But this
For example, a required insulating layer having a uniform thickness can be formed very easily as compared with a method of applying and drying an insulating resin layer forming liquid.

For the thermosetting resin sheets 30A and 60A, the thickness of the formed insulating layer is, for example, 20 to 100 μm.
Is preferably used. The thickness of the metal foil 31B for forming the thin metal layer 31A by thermocompression bonding is preferably, for example, 5 to 35 μm. Further, it is also possible to use a sheet in which a thermosetting resin sheet and a metal foil are integrated in advance.

The temperature for thermocompression bonding of the thermosetting resin sheets 30A and 60A and the metal foils 31B and 61B depends on the material of the thermosetting resin sheets 30A and 60A.
It is necessary that the temperature is not lower than the temperature at which the thermosetting resin sheet softens and becomes adhesive, and is usually 80 to 250 ° C.
Preferably, it can be set to about 140 to 200 ° C.
The pressing pressure in this thermocompression bonding step is, for example, at most 5
About 50 kg / cm ² , preferably 20 to 40 k
g / cm ² . In this thermocompression bonding step, thermocompression bonding can be performed under an atmosphere of normal pressure.
It is preferable to use a so-called vacuum press method in a reduced pressure atmosphere of about 100 Pa, preferably about 10 to 50 Pa. In this case, it is effectively prevented that air bubbles are trapped between the thermosetting resin sheet and the adherend surface. Is done.

Third step: In this third step, as shown in FIG. 11, finally, short-circuit portions 33 and 63 penetrating the insulating layers 30 and 60 in the thickness direction are formed, thereby forming the insulating layer 3.
0 is electrically connected to the thin metal layer 31A formed on the upper surface of the substrate 20 and the substrate wiring portion 22, and is electrically connected to the thin metal layer 61A and the substrate wiring portion 62 formed on the lower surface of the substrate 20. is there. Specifically, as shown in FIG. 10, the wiring portion 22 and / or the via hole portion 23 are formed on the above-mentioned pressure-bonded laminated body 10A at a position where the wiring portion 22 and / or the via-hole portion 23 are formed by, for example, a numerically controlled drilling device. And / or a hole having a depth reaching the via hole portion 23 is formed, and then the wiring portion 62 and / or
Alternatively, a drill hole 33H / 63 for forming a short-circuit portion having a depth reaching the land at a position where the via-hole portion 23 is formed.
H is formed.

In the above, the conductor forming drill hole 33
H · 63H is the wiring portion 22 in the insulating layer 30 and / or
Or, reaching the wiring portion 62 and / or the via hole portion 23 in the via hole portion 23 and the insulating layer 60,
Further, it is sufficient that the hole has a depth that does not penetrate the substrate 20 and a depth that does not reach another via hole that must not be connected, and the diameter of the hole that reaches the via hole is the hole of the via hole 23. The diameter may be larger than the diameter. As a result, the electrical connection between the layers by the short-circuit portions 33 and 63 can be reliably formed. In addition, a drill hole 3 for forming a short-circuit portion
The inner diameter of 5H is not particularly limited as long as required electrical connection of the formed short-circuit portion is achieved, but is, for example, 0.02 to 0.5 mm, and preferably 0.03 to 0.5 mm.
It is about 0.3 mm. The inner diameter of the short hole forming drill hole 63H is, for example, 0.1 to 0.15 mm.

Next, the above crimped laminate 10A is subjected to a plating treatment such as an electroless copper plating method or an electrolytic copper plating method, so that the inner surface of the short hole forming drill hole 33H is formed as shown in FIG. Copper plating layers 33A and 63A (not shown) are formed on the inner surface of the short hole forming drill hole 63H.

In order to put the laminated connector of the present invention into practical use, it is preferable to add the following fourth step to the first to third steps. Fourth step: In the fourth step, as shown in FIG. 13, the connection step is performed on the upper surface of the insulating layer 30 so as to be electrically connected to the substrate wiring portion 22 and / or the substrate short-circuit portion 23. This is a process in which the electrode 31 is formed and the terminal electrode 61 electrically connected to the substrate wiring portion 62 and / or the via hole portion 23 is formed on the lower surface of the substrate 20 to manufacture a multilayer connector. . Specifically, as shown in FIG. 12, the metal thin layer 31A on the upper surface of the crimped laminate 10A
Is subjected to photolithography and etching to remove a part thereof, thereby forming a connection electrode base layer 31B and an upper surface wiring portion (not shown) having a pattern corresponding to an electrode to be inspected on a circuit board to be inspected. Is done.
The connection electrode base layer 31B is in a state of being electrically connected to the substrate wiring portion 22 via the short-circuit portion 33 or the upper wiring portion 32. Then, as shown in FIG. 13, a required connection electrode 31 is formed by depositing a metal on the upper surface of the connection electrode base layer 31B by, for example, a plating method to increase the thickness of the metal layer. .

The thin metal layer 61A on the lower surface of the substrate 20 is subjected to photolithography and etching, so that the terminal electrodes 61 arranged on the lattice points are formed.
Are formed in a state of being connected to the substrate short-circuit portion 63, respectively.
The electrode pitch of the terminal electrode 61 is, for example, 2.54 m.
m, 1.8 mm, 1.27 mm, etc.

In the above, it may be desired to individually increase the thickness of the metal layer forming the connection electrode 31. For example, the connection electrode 31 is further separated from the surface wiring layer by a distance of 2 from the function of the elastomer layer 40 described later.
It is preferable that it protrudes by 0 μm or more. In such a case, for example, a photoresist film having a thickness corresponding to the thickness to be increased is formed, and the same patterning is performed on the photoresist film to form a hole exposing the surface of the metal layer. Then, a metal is filled and deposited on the surface of the metal layer by a plating method or the like, and then the photoresist film may be removed. By such a method, for example, it is easy to form the connection electrode 31 in an expected state protruding from the surface.

The fourth step, that is, the step of forming the connection electrodes 31 on the upper surface of the insulating layer 30 and the step of forming the terminal electrodes 61 on the lower surface of the substrate 20 does not need to be provided independently. Alternatively, all of them can be performed in an appropriate step of the first to third steps.

Thus, the substrate 20 and the substrate 2
And a connection electrode 31 on the upper surface and the lower surface, respectively.
And the terminal electrode 61, and the connection electrode 3
1 is electrically connected to the terminal electrode 61 via the short-circuit portion 33, the substrate wiring portions 22 and 62, and the substrate short-circuit portions 23 and 63, thereby producing a laminated connector.

According to such a laminated connector, the short-circuit portions 33 and 63 of the insulating layers 30 and 60 are formed by joining to the via holes and / or the wiring portions of the substrate 20, and the substrate wiring portion 22 is formed. It can be formed easily with a large degree of freedom. In addition, the short-circuit portions 33 and 63 can be provided by forming the short-circuit portion drill holes 33H and 63H in the insulating layers 30 and 60 and forming a conductor therein. Reaches the via hole portion and / or the wiring portion of the substrate 20 and the substrate 2
0, or a depth that does not reach another via hole that must not be connected, and the diameter of the hole that reaches the target via hole is via hole 2
It is sufficient that the diameter is larger than the hole diameter of No. 3. As a result, the electrical connection between the layers by the short-circuit portions 33 and 63 can be reliably formed.

Next, the adapter device for circuit board inspection of the present invention will be described. FIG. 14 is an explanatory sectional view showing the configuration of an example of the adapter device for circuit board inspection of the present invention. The adapter device for circuit board inspection includes an adapter body 10 and an anisotropic conductive elastomer layer (hereinafter, simply referred to as “elastomer layer”) 40 provided on an upper surface of the adapter body 10.

More specifically, the adapter body 10
Is composed of a laminated connector having the configuration shown in FIG. 1, and an elastomer layer 40 is integrally formed on the surface of the adapter body 10 in a state of being adhered or adhered thereto. As shown in FIG. 15, the elastomer layer 40 has a state in which a large number of conductive portions 41 in which conductive particles P are densely filled in an insulating elastic polymer substance E are located on the connection electrode 31. And the adjacent conductive portions 41 are insulated from each other by the insulating portion 42. In each conductive portion 41, the conductive particles P are oriented so as to be arranged in the thickness direction, and a conductive path extending in the thickness direction is formed. The conductive portion 41 may be a pressurized conductive portion in which a conductive path is formed by reducing the resistance value when compressed in the thickness direction and compressed. On the other hand, the insulating portion 42 does not form a conductive path in the thickness direction even when pressed.

In the conductive portion 41 of the elastomer layer 40, the filling rate of the conductive particles P is preferably 10% by volume or more, particularly preferably 15% by volume or more. In the case where the conductive portion is a pressurized conductive portion, when the filling rate of the conductive particles is high, it is preferable in that the intended electrical connection can be reliably achieved even when the pressing force is small. However, when the electrode pitch of the connection electrode 31 is reduced, sufficient insulation between adjacent conductive portions may not be ensured. Therefore, the filling rate of the conductive particles P in the conductive portion 41 is 40% by volume or less. It is preferred that

In the adapter device for circuit board inspection having such a structure, the elastomer layer 40 is integrally formed on the upper surface thereof, and the connection electrode 3 on the upper surface is formed.
Since the conductive portion 41 of the elastomer layer 40 is disposed on the first electrode 1, there is no need to perform positioning and holding and fixing of the elastomer layer 40 at the time of an electrical connection operation, so that the electrode pitch in the lead electrode region is very small. In some cases, the required electrical connections can be reliably achieved.
In addition, since the elastomer layer 40 is integral with the adapter body 10, a good electrical connection state is stably maintained even with environmental changes such as heat history due to a temperature change, and therefore always high connection reliability is obtained. be able to.

In the illustrated example, the elastomer layer 40
, The conductive portion 41 forms a protruding portion that protrudes from the surface of the insulating portion 42. According to such an example,
Since the degree of compression by pressurization is larger in the conductive portion 41 than in the insulating portion 42, a conductive path having a sufficiently low resistance value is reliably formed in the conductive portion 41. Can be reduced, and as a result, even if the pressing force applied to the elastomer layer 40 is not uniform, it is possible to prevent the occurrence of variations in conductivity between the conductive portions 41.

When the conductive portion 41 forms a protrusion as described above, the protrusion height h of the protrusion is the total thickness t of the elastomer layer 40 (t = h + d, where d is the thickness of the insulating portion 42). Is preferably 8% or more. Further, the total thickness t of the elastomer layer 40 is preferably 300% or less of the electrode pitch p defined as the distance between the centers of the connection electrodes 31, that is, t ≦ 3p. When such a condition is satisfied, even when the pressure applied to the elastomer layer 40 changes, the change in the conductivity of the conductive portion 41 due to the change is sufficiently small.

When the conductive portion 41 forms a projecting portion, it is not always necessary that the entire surface of the projecting portion has conductivity. A road non-forming portion may be present. Further, it is preferable that the minimum value of the separation distance r between the adjacent conductive portions 41 is 10% or more of the width R of the conductive portion 41. By satisfying such conditions, it is possible to sufficiently avoid the possibility that the adjacent conductive portions 41 electrically contact each other due to lateral displacement when the protrusion is deformed by being pressed. Can be. In the above example, the planar shape of the conductive portion 41 can be a rectangular shape having the same width as the connection electrode 31, but can be a circular shape having a necessary area, or any other appropriate shape.

The conductive particles of the conductive portion 41 include, for example, particles of a metal exhibiting magnetism such as nickel, iron, and cobalt, or particles of an alloy thereof, or gold,
Those plated with silver, palladium, rhodium, etc.
Inorganic particles such as non-magnetic metal particles or glass beads or polymer particles plated with a conductive magnetic material such as nickel or cobalt can be used. In the method described below, nickel, iron, or conductive magnetic particles made of an alloy thereof are used,
Further, gold-plated particles can be preferably used in terms of electrical characteristics such as low contact resistance. Further, particles composed of a conductive superparamagnetic material can be preferably used because they do not show magnetic hysteresis.

The particle size of the conductive particles is preferably 3 to 200 μm so that the conductive portion 41 can be easily deformed under pressure and sufficient electrical contact can be obtained between the conductive particles in the conductive portion 41. Preferably, it is particularly preferably 10 to 100 μm.

As the insulating and elastic polymer constituting the conductive portion 41, a polymer having a crosslinked structure is preferable. Examples of curable polymer materials that can be used to obtain a crosslinked polymer include silicone rubber, polybutadiene, natural rubber, polyisoprene, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene copolymer rubber. , Ethylene-propylene copolymer rubber, urethane rubber, polyester rubber, chloroprene rubber, epichlorohydrin rubber, and soft liquid epoxy resin. Specifically, a material for a polymer substance which is in a liquid state before the curing treatment and is integrated with the upper surface of the adapter body 10 while keeping the adhesion state or the adhesion state after the curing treatment is preferable. From such a viewpoint, examples of the material for a polymer substance suitable for the present invention include liquid silicone rubber, liquid urethane rubber, and soft liquid epoxy resin. Materials for polymer substances include
Additives such as a silane coupling agent and a titanium coupling agent can be added to improve the adhesion to the upper surface of the adapter body 10.

As the material forming the insulating portion 42, the same or different polymer material as the conductive portion 41 can be used. One that is integrated with the adapter body 10 while maintaining the adhesive state is used.

By forming such an insulating portion,
Since the integrality of the elastomer layer itself and its integrality with the adapter main body are reliably increased, the strength of the entire adapter device is increased, and therefore, excellent durability against repeated compression can be obtained.

In the adapter device for circuit board inspection having the above-described configuration, the circuit board to be inspected is disposed on the upper surface, the electrode to be inspected of the circuit board is brought into contact with the connection electrode 31, and the lower surface of the lower surface is connected. The terminal electrode 21 is connected to the tester via an appropriate connection means, and is further pressurized so as to be compressed in the thickness direction. In this state,
The conductive portion 41 of the elastomer layer 40 of the adapter device is brought into a conductive state, whereby a required electrical connection between the electrode under test and the tester is achieved.

The above-mentioned adapter device for circuit board inspection comprises:
For example, it is manufactured by providing the elastomer layer 40 on the upper surface of the adapter body 10 as follows. First, an elastomer material made of a fluid mixture is prepared by dispersing conductive magnetic particles in a polymer material material that becomes an insulating elastic polymer material by curing treatment, and as shown in FIG. The elastomer material is applied to the upper surface of the adapter body 10 to form an elastomer material layer 50, which is disposed in the mold cavity.

The dies are provided with upper dies 5 each constituting an electromagnet.
1 and a lower mold 52, and the upper mold 51 has a connection electrode 3
A magnetic pole plate 53 having a flat lower surface is provided, which is composed of a ferromagnetic portion M (shown by oblique lines) having a pattern corresponding to No. 1 and a nonmagnetic portion N other than the ferromagnetic portion. The flat lower surface of the plate 53 is separated from the surface of the elastomeric material layer 50 so that the gap G is formed. In addition,
16 and 17, details of the adapter main body 10 are omitted except for the connection electrode 31.

In this state, the electromagnets of the upper die 51 and the lower die 52 are operated, thereby applying a parallel magnetic field in the thickness direction of the adapter body 10. As a result, in the portion of the elastomer material layer 50 located on the connection electrode 31, a stronger parallel magnetic field is applied in the thickness direction than in the other portions. As shown in the drawing, the conductive magnetic particles in the elastomer material layer 50 are gathered in a portion located on the connection electrode 31 by the magnetic force of the ferromagnetic portion M and further oriented in the thickness direction.

However, at this time, the elastomer material layer 5
Since the gap G exists on the surface side of the polymer material 0, the polymer material also moves by the moving and gathering of the conductive magnetic particles. As a result, the portion of the polymer material material located on the connection electrode 31 Are raised, and a protruding conductive portion 41 is formed. Therefore, the thickness t1 of the formed insulating portion 42 is smaller than the initial thickness t0 of the elastomer material layer 50. Then, while the parallel magnetic field is applied or after removing the parallel magnetic field, a curing process is performed to integrate the elastomer layer 40 including the conductive portion 41 and the insulating portion 42 forming the protruding portion on the adapter body 10. The adapter device is manufactured.

As shown in FIG. 18, the upper die 51 is composed of a ferromagnetic portion M having a pattern corresponding to the connection electrode 31 and a non-magnetic portion N other than the upper die 51, as shown in FIG. The magnetic pole plate 55 in a state where the ferromagnetic portion M protrudes below the non-magnetic portion N on the lower surface of the magnetic head may be used. Further, it is also possible to use a magnetic pole plate which is entirely made of a ferromagnetic material and in which a portion of the pattern corresponding to the connection electrode 31 protrudes below other portions. Also in these cases, a stronger parallel magnetic field is applied to the elastomer material layer 50 in the region of the connection electrode 31.

Also, the upper mold 5 is kept under the parallel magnetic field.
A mold having a variable distance between the lower mold 1 and the lower mold 52 is used.
1 is disposed immediately above the elastomer material layer 50, and the gap between the upper mold 51 and the lower mold 52 is gradually widened while applying a parallel magnetic field, thereby causing the elastomer material layer 50 to protrude. You can do it too.

In the present invention, it is not essential that the conductive portion 41 of the elastomer layer 40 protrudes from the insulating portion 42, and the elastomer portion 40 may have a flat surface. In such a case, the processing may be performed without forming the gap G.

The thickness of the elastomer material layer 50 is, for example, 0.1 to 3 mm. This elastomer material layer 50
In order to facilitate the movement of the conductive magnetic particles, the material for a polymer substance has a viscosity at 25 ° C. of 10 ⁴ to 10 under the condition of a strain rate of 10 ¹ sec ^-1.
It is preferably about ⁷ centipoise. The curing treatment of the elastomer material layer 50 is preferably performed in a state where the parallel magnetic field is applied, but may be performed after stopping the operation of the parallel magnetic field.

The ferromagnetic portion M of the pole plate 53 is made of iron,
A ferromagnetic material such as nickel, and a non-magnetic material portion N
Can be formed of a nonmagnetic metal such as copper, a heat-resistant resin such as polyimide, or an air layer. The strength of the parallel magnetic field applied to the elastomer material layer 50 is preferably such that the average of the cavity of the mold is 200 to 20,000 gauss.

The curing treatment is appropriately selected depending on the material used, but is usually performed by heat treatment. The specific heating temperature and heating time depend on the elastomer material layer 50.
The material is appropriately selected in consideration of the type of the polymer material, the time required for the movement of the conductive magnetic particles, and the like. For example, when the polymer material is a room-temperature-curable silicone rubber, the curing treatment is performed at room temperature for about 24 hours, at 40 ° C. for about 10 hours, and at 80 ° C. for about 30 minutes.

As described above, according to the embodiment of the present invention,
In the present invention, a substrate having wiring portions on upper and lower surfaces, having via holes in the thickness direction, and at least two insulating layers provided vertically above and below the substrate including the wiring portion are provided. In the insulating layer, a short-circuit portion connected to a wiring portion of the substrate and extending through the insulating layer in a thickness direction thereof is formed, and the short-circuit portion includes a via hole portion of the substrate and And / or a conductor bonded to the wiring portion. Therefore, the above-described example is a case where two insulating layers are provided above and below the substrate constituting the adapter main body. However, in the present invention, three or more insulating layers may be provided. The adapter body can be manufactured by repeatedly performing the above-described first to third steps a number of times corresponding to the number of insulating layers.

[0060]

Hereinafter, embodiments of the present invention will be described.
The present invention is not limited to these examples.

Example 1 (1) Production of Laminated Connector First Step: Each of the copper metal thin layers (62A,
22A) is prepared by laminating on both sides of a substrate (20) made of a glass fiber reinforced epoxy resin having a thickness of 0.5 mm, which is cut into a rectangular shape having a length of 330 mm and a width of 500 mm. Drilling device "ND-2J-18"
(Hitachi Seiko Co., Ltd.), each inner diameter is 0.15mm
A via hole (23H) (not shown) was formed (see FIGS. 4 and 5). Next, a short-circuit portion (2) was formed in the via hole (23H) (not shown) by copper plating.
3), and by performing photolithography and etching on the thin metal layers (22A and 62A) on the upper and lower surfaces of the substrate 20, the wiring portions 22 and 62 are formed.
And via hole land portions 21 and 64 were formed (FIGS.
See FIG. 6).

Second step: 30 μm thick thermosetting resin sheet (glass fiber reinforced prepreg “GEPL-170”)
(Mitsubishi Gas Chemical Co., Ltd.) (30A) is superimposed on the surface of the substrate (20) including the wiring portion (22), and is formed on a 70 μm-thick supporting copper foil on the upper surface of the thermosetting resin sheet (30A). A 9 μm-thick peelable electrolytic copper foil “peelable copper foil” (made by Furukawa Electric) (31C) was placed. Next, a thermosetting resin sheet having a thickness of 30 μm (glass fiber reinforced prepreg “GEPL-170” manufactured by Mitsubishi Gas Chemical Company) (60)
A) is placed on the lower surface of the substrate (20) including the substrate wiring portion (62), and the lower surface of the thermosetting resin sheet (60A) is
9-μm-thick peelable electrolytic copper foil “Peelable copper-foil” formed on a 70-μm-thick supporting copper foil (Furukawa Electric)
(61C) was placed. These are vacuum press machines "MHP
CV-200-750 "(manufactured by Meiki Seisakusho Co., Ltd.)
Under a reduced pressure atmosphere of 0 Pa, the maximum press pressure is 40K
g / cm ^{2 at} a maximum temperature of 180 ° C. for 2 hours and thermocompression bonding to form an insulating layer (3) on the upper and lower surfaces of the substrate (20).
0.6) and a thin metal layer (31A and 61A) were laminated to form a pressure-bonded laminate (10A) (see FIGS. 7 to 9).

Third step: An insulating layer (30) and a thin metal layer (31) are applied to the above-mentioned crimped laminate (10A) by using a biaxial drilling machine “ND-2J-18” (manufactured by Hitachi Seiko).
In the position where the via hole portion 23 and / or the wiring portion 22 of the substrate 20 in FIG.
Drill hole (33
H), the insulating layer (60) and the thin metal layer (61).
At a position related to the via hole portion and / or the substrate wiring portion (62) of the substrate 20 in A), the substrate 20 is arranged on a grid point having a pitch of 1.27 mm.
A drill hole (63H) for forming a short-circuit portion having a depth of 170 μm and an inner diameter of 200 μm was formed in the insulating layer (60) of the crimped laminate 10A in the thickness direction (see FIG. 10).

Next, the above-mentioned crimped laminate 10A is subjected to electroless copper plating and then to electrolytic copper plating, thereby forming a copper plating layer on the inner surfaces of the short-circuit portion forming drill holes 33H and 63H. Parts 33 and 63 were formed. (Figure 1
1).

Fourth step: The thin metal layer (31A) on the upper surface of the pressure-bonded laminate (10A) is subjected to photolithography and etching to remove a part of the thin metal layer (31A). The connection electrode base layer (31B) and the upper surface wiring portion were formed in a pattern corresponding to the electrode to be inspected (see FIG. 12).

Further, a 50 μm-thick photoresist film “HK350” (manufactured by Hitachi Chemical Co., Ltd.) is provided on the upper surface of the pressure-bonded laminate (10A), and this is processed by photolithography to inspect the circuit board to be inspected. The connection electrode (31) having a protrusion height of 50 μm by removing according to a pattern corresponding to the electrode, filling the hole thus formed with copper metal by a copper plating method, and then peeling off the photoresist film. Is formed, and each connection electrode has a thickness of 2 μm.
m of gold plating. On the other hand, by performing photolithography and etching on the thin metal layer (61A) on the lower surface of the crimped laminate (10A), 1.27 m
The terminal electrodes 61 arranged on the m lattice points were formed, and the adapter body (10) was manufactured (see FIG. 13).

The connection electrodes of the laminated connector obtained by the above method had a size of each electrode of 0.25 mm.
And an electrode group having a 0.35 mm diameter circular electrode pitch of 0.3 mm, and each electrode having a diameter of 0.45 m.
m and an electrode group having an electrode pitch of 0.6 mm.

(2) Manufacture of Adapter Device Using the above-mentioned laminated connector as an adapter body,
An elastomer was formed on the upper surface of the adapter body as follows. Average particle size 2 for room temperature curable urethane rubber
An elastomer material was prepared by mixing conductive magnetic particles of 6 μm nickel at a ratio of 15% by volume, and this was applied to the surface of the adapter body. It processed according to the method using a metal mold. That is, a gap of 0.03 mm is formed between the lower surface of the ferromagnetic material portion M and the elastomer material layer using the magnetic pole plate 55 in which the ferromagnetic material portion M protrudes 0.1 mm from the nonmagnetic material portion N on the lower surface. In this state, the elastomer material layer is raised by applying a parallel magnetic field.
The elastomer layer having a thickness t of the conductive portion of 0.3 mm, a thickness d of the insulating portion of 0.27 mm, and a protrusion ratio (t−d) / t of the conductive portion of 10% is obtained. Was formed, thereby producing an adapter device for circuit board inspection.

Experimental Example 1 With respect to the above adapter device, a common conductive plate was arranged on the lower surface side of the substrate using a resistance measuring device “Milliohm Hi Tester” (manufactured by Hioki Electric Co., Ltd.), and all terminal electrodes were short-circuited. The electrical resistance between the conductive plate and each connection electrode was measured using a probe pin. As a result, it was confirmed that the electric resistance value of all the connection electrodes was as extremely small as 100 mΩ or less, and that the electric connection between the terminal electrode to be connected and the connection electrode was sufficiently achieved. Was.

Experimental Example 2 Further, with respect to the adapter device, the electric resistance between adjacent connection electrodes to be insulated from each other was measured using a probe pin, using the same resistance measuring device as described above. In addition, the electric resistance value was as very large as 2 MΩ or more, and it was confirmed that a sufficient insulating state was achieved.

[0071]

According to the multilayer connector of the present invention, the interlayer can be connected by fine via holes and the land can be reduced, so that the wiring portion can be easily formed with a large degree of freedom.

In the adapter device for circuit board inspection of the present invention, in the basic configuration, connection electrodes arranged corresponding to the electrodes to be inspected of the circuit board to be inspected are formed on the upper surface of the adapter body. Terminal electrodes arranged at lattice points are formed on the lower surface, and the adapter body is provided with the above-mentioned laminated connector, and an anisotropic conductive elastomer layer is integrally formed on the upper surface of the adapter body. Since the electrode to be inspected of the circuit board to be inspected has a fine electrode pitch and a fine and high-density complicated pattern, the required An electrical connection can be reliably achieved, and a good electrical connection state is stably maintained against environmental changes such as a heat history due to a temperature change. -Reliability can be obtained, moreover, formation of the adapter body having a desired wiring configuration is extremely easy, thus it can be very advantageously and reliably produced.

[Brief description of the drawings]

FIG. 1 is an explanatory cross-sectional view showing a configuration of an example of a laminated connector of the present invention.

FIG. 2 is a partially broken plan view for explaining an arrangement state of each part in an example of the laminated connector of the present invention.

FIG. 3 is an enlarged cross-sectional view for explaining the multilayer connector in FIG.

FIG. 4 is a cross-sectional view for explaining a substrate material used in the method of manufacturing a multilayer connector according to the present invention.

FIG. 5 is an explanatory sectional view showing a state in which a via hole is formed in a thickness direction of a substrate, a substrate wiring portion is formed on an upper surface, and a substrate wiring portion is formed on a lower surface.

FIG. 6 is an enlarged sectional view for explaining the substrate in FIG. 5;

FIG. 7 is an explanatory cross-sectional view showing an arrangement state of members forming a pressure-bonded laminate.

FIG. 8 is an explanatory cross-sectional view showing a state where a pressure-bonded laminate is formed. .

FIG. 9 is an enlarged cross-sectional view for explaining the pressure-bonded laminate in FIG.

FIG. 10 is an explanatory cross-sectional view showing a state in which a short hole drill hole is formed in the pressure-bonded laminate.

FIG. 11 is an explanatory cross-sectional view showing a state where a plating layer is formed on an inner surface of a short-circuit portion drill hole.

FIG. 12 is an explanatory cross-sectional view showing a state in which a connection electrode base layer is formed on the upper surface of the pressure-bonded laminate.

FIG. 13 is an explanatory cross-sectional view of a completed laminated connector in which connection electrodes are formed and terminal electrodes are formed.

FIG. 14 is an explanatory cross-sectional view showing a configuration of an example of the adapter device for circuit board inspection of the present invention.

FIG. 15 is an enlarged sectional view for explaining an elastomer layer portion in an example of the adapter device for circuit board inspection of the present invention.

FIG. 16 is an explanatory cross-sectional view showing a state in which the adapter body on which the elastomer material layer is formed is set in a mold.

FIG. 17 is an explanatory cross-sectional view showing a state where a parallel magnetic field is applied in FIG. 18;

FIG. 18 is an explanatory sectional view showing another example of a mold used for forming an elastomer layer.

FIG. 19 is an explanatory diagram showing an arrangement of an example of a printed circuit board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Adapter main body 10A Compression laminated body 20 Substrate 21 Via hole land part 22 Substrate wiring part 23 Substrate short circuit part 23H Via hole hole 30 Insulating layer 30A Thermosetting resin sheet 31 Connection electrode 31A Metal thin layer 31B Connection electrode base layer 31C Metal foil 32 Upper surface wiring part 33 Short circuit part 33A Plating layer 33H Short hole drill hole 40 Anisotropic conductive elastomer layer 41 Conductive part 42 Insulating part E Elastic high molecular substance P Conductive particles 50 Elastomer material layer 51 Upper mold 52 Lower mold M Ferromagnetic material part N Non-magnetic material part 53 Magnetic pole plate G Gap 55 Magnetic pole plate 60 Insulating layer 60A Thermosetting resin sheet 61 Terminal electrode 61A Metal thin layer 61C Metal foil 62 Lower wiring portion 63 Short circuit portion 64 Via hole land portion 63A Plating layer 63H Drill hole for short circuit part 90 Circuit board 91 Capacity element region 92 lead electrodes 93 lead electrode region

Claims (2)

[Claims] 1. A substrate having a wiring portion on upper and lower surfaces and having a via hole in a thickness direction, and at least two insulating layers provided vertically above and below the substrate including the wiring portion. In the insulating layer, a short-circuit portion formed of a conductor connected to the wiring portion of the substrate and extending through the insulating layer in the thickness direction thereof is formed, and at least one of the short-circuit portions is A laminated connector which is joined to a conductor in a via hole of the substrate. 2. An adapter device for circuit board inspection, which is interposed between a circuit board to be inspected and an electrical inspection device and electrically connects an electrode to be inspected of the circuit board and the electrical inspection device, An adapter body having terminal electrodes arranged on lattice points on the lower surface and having connection electrodes corresponding to the electrodes to be inspected on the circuit board to be inspected on the upper surface, and integrally provided on the upper surface of the adapter body. The adapter main body comprises an anisotropic conductive elastomer layer, and the adapter main body includes the multilayer connector according to claim 1. The short-circuit portion formed in the insulating layer electrically connects the connection electrode and the terminal electrode. An adapter device for inspecting a circuit board, wherein the adapter device is connected to a circuit board.