JPH11333732A - Abrasive tape, coating liquid for the abrasive tape, and manufacture of the abrasive tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an abrasive tape which is free from any grinding flaws during the grinding work, durable and suitable for final finishing in the abrasive tape for precise parts, and its manufacturing method. SOLUTION: An abrasive tape 4 is provided with an abrasive layer 7 of 0.005-1.0 μm in the surface center line mean roughness Ra of non-crack parts 30 of the abrasive layer 7 provided on one side of a backing film 5, and having net-like cracks 20 of 5-200 μm in pitch. The abrasive particles 20 of the abrasive layer 7 consists of silica particles of 0.005-0.03 μm in mean grain size, and a binder consisting of vinyl chloride/vinyl acetate copolymer having siloxane bond, or pre-polymer, or oligomer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to precision optical connector ferrules, semiconductor wafers, ceramics, color filters for liquid crystal displays, plasma displays, optical glasses, optical lenses, magnetic disks or optical disk substrates, magnetic heads, optical read heads, and the like. The present invention belongs to a polishing tape, a coating liquid for a polishing tape, a method for adjusting and manufacturing a coating liquid for a polishing tape, and a method for manufacturing a polishing tape used for performing a final finish on a surface or an end surface of a part.

[0002]

2. Description of the Related Art Precision parts, such as optical fibers and semiconductor wafers, are processed through a plurality of polishing steps.
The quality depends on the accuracy of the polishing process for the final mirror finish. Then, final polishing is performed by using a polishing liquid called mechanical polishing and a polishing cloth in combination. Also, the method using the above polishing liquid,
Since the polishing process becomes complicated, a method using a polishing tape has been considered as an alternative method. This polishing tape is mainly composed of a plastic and is formed of a binder film for a polishing tape and a binder film (a binder for fixing the polishing agent particles to the base film. Synthetic / natural resin, plasticizer, lubricant And an antistatic agent.)
Is applied to a varnish dissolved in a solvent suitable for the coating process, and then applied and dried to accelerate or complete a reaction such as curing, if necessary, to form a polishing layer.

[0003] As the abrasive particles used in the polishing tape for precision parts, those using fine silica particles of 0.01 to 0.02 µm and having a flat surface as smooth as possible have been studied. However, there is a problem in that a polishing tape whose surface has been smoothed using fine particles cannot obtain a sufficient grinding force. Further, if the particle size of the abrasive is reduced, the content that can be blended in the coating liquid is large, and the content needs to be reduced as the particle size increases. When it is smaller than 0.001 μm, the grinding effect cannot be improved, and when it is larger than 0.7 μm, the abrasive may be scratched. Therefore, 0.001
Particles of .about.0.7 .mu.m have been preferably used. However, when fine particles of 0.7 μm or more are used for a polishing tape for precision parts that require a finer surface finish in “nm units”, grinding flaws on the surface become disadvantages, and the finishing accuracy, for example, optical connector ferrule, is reduced. When polished, the signal attenuation characteristics may be significantly reduced.

[0004]

As the abrasive particles of the polishing tape, a polishing tape using fine silica having an average particle diameter of 0.005 to 0.03 μm and having a flat surface has been considered. However, a polishing tape using only these ultrafine silica particles as an abrasive cannot obtain a satisfactory grinding force, and the conventional polishing tape has a problem that the ground debris scratches the surface of the layer to be polished. In some cases, grinding power could not be maintained for a long time.

[0005] In consideration of the above-mentioned drawbacks and problems, the polishing tape of the present invention does not cause grinding scratches,
It is an object of the present invention to accurately perform mirror finishing of precision parts such as an end face of an optical connector ferrule having a high grinding efficiency and a semiconductor wafer surface by using ultrafine silica particles of 0.03 μm. A polishing tape having a net crack on the surface of the polishing layer so as to reduce the signal attenuating characteristic, and providing a net-like crack on the surface of the polishing layer so that grinding dust can be collected by the tape, and having improved wettability, a coating liquid for the polishing tape, and polishing An object of the present invention is to provide a method for manufacturing a tape.

[0006]

Means for Solving the Problems In order to solve the above-mentioned problems, the surface center line average roughness Ra in the non-crack portion of the polishing layer provided on one side of the base film is 0.005 to 0.005.
A polishing tape provided with a polishing layer of a network crack having a pitch of 1.0 μm and a pitch of 5 to 200 μm, wherein the polishing layer has silica particles having an average particle diameter of 0.005 to 0.03 μm, and vinyl chloride having a siloxane bond. A polishing tape composed of a vinyl acetate copolymer or a binder made of a prepolymer or oligomer. And claim 2
The invention according to the above (1), wherein the abrasive of the coating liquid for forming the above-mentioned polishing layer is 0.1.
005-0.03 μm organosilica sol, and a vinyl chloride / vinyl acetate copolymer having a siloxane bond having an average molecular weight of a binder of 500-1500 or
This is a polishing tape coating liquid that is a prepolymer or oligomer. The invention according to claim 3 is a method for producing a coating liquid for a polishing tape, wherein the weight ratio between the abrasive particles and the binder is 1:99 to 99: 1. The invention according to claim 4 is the polishing layer provided on one side of the substrate film, wherein the surface center line average roughness Ra of the non-cracked portion is 0.005 to 1.
A polishing tape having a polishing layer provided with network cracks of 0 μm and a pitch of 5 to 200 μm, wherein the polishing layer has silica particles having an average particle diameter of 0.005 to 0.03 μm and siloxane bonds. A polishing agent for a coating liquid for forming a polishing layer of a polishing tape composed of a vinyl chloride / vinyl acetate copolymer or a binder composed of a prepolymer or an oligomer is an organosilica sol of 0.005 to 0.03 μm. And a binder is a vinyl chloride / vinyl acetate copolymer or a prepolymer or oligomer having a siloxane bond, and a weight ratio of the abrasive particles to the binder is 1:99 to 99:10. Was adjusted to 15 to 85% by weight, and 3 g was applied to the substrate film by a gravure reverse coating method or a kiss reverse coating method. 8 g / m ² (solids) was applied, heated immediately thereafter, after evaporation of the solvent, is a method for producing the abrasive tape to form an abrasive layer to complete the generation of the curing reaction and cracking of the binder . Then, the coating liquid for the polishing layer is filtered through a 1 to 10 μm filter, and then filtered.
After coating and drying on the base film in the coating part under the atmosphere of 40 ° C. and the relative humidity of 20 to 60% at the same temperature, 4
This is a method for producing a polishing tape in which the curing reaction is completed by a heat treatment exceeding 0 ° C. for 300 hours. The invention according to claim 6 is a method for manufacturing a polishing tape, wherein the polishing layer is further formed on the primer layer provided on the base material film.

[0007]

DETAILED DESCRIPTION OF THE INVENTION A polishing tape 4 according to the present invention is shown in FIG.
As shown in (A) and (B), the surface center line average roughness Ra of the non-cracked portion 30 of the polishing layer 7 provided on one side of the base film 5 is 0.005 to 1.0 μm, and ~
Polishing layer 7 provided with 200 μm pitch network cracks 70
Is a polishing tape 4 having The polishing layer 7 has an average particle diameter of the abrasive fine particles 20 of 0.005 to 0.03 μm.
m silica particles and vinyl chloride with siloxane bonds.
The polishing tape 4 comprises a vinyl acetate copolymer or a prepolymer or oligomer and a low molecular weight binder.

The abrasive fine particles 20 of the coating liquid for forming the above-mentioned polishing layer 7 are organosilica sol of 0.005 to 0.03 μm, and the binder has a low molecular weight of 500 to 1500 and an average molecular weight of 500 to 1500. This is a polishing tape coating liquid composed of a vinyl chloride / vinyl acetate copolymer having a siloxane bond, or a prepolymer or oligomer. Further, the coating liquid for the polishing tape contains the abrasive particles 2 described above.
This is a method for producing a coating liquid for a polishing tape, wherein the weight ratio of 0 to the binder is 1:99 to 99: 1, preferably 10:90 to 90:10.

The polishing layer 7 contains 15 to 85% by weight, preferably 25 to 75% by weight of a non-volatile component of the coating liquid for the polishing layer.
% By weight, and applied to the base film 5 by the gravure reverse coating method or the kiss reverse coating method, and immediately thereafter, heating is performed to evaporate the solvent, and then drying and reaction of the binder to form a network crack 70. Things. In addition, after the above-mentioned coating liquid is filtered through a 1 to 10 μm filter,
15-40 ° C, relative humidity at the same temperature is 20-60%
After coating and drying the base film in the coating section under the atmosphere of
Further, a method of manufacturing the polishing tape 4 in which the reaction of the polishing layer is finished by a heat treatment exceeding 40 ° C. for 300 hours, and at the same time, the distortion of the polishing layer caused by the generation of cracks is removed to form the polishing layer 7.

Then, as shown in FIG. 3, there is provided a method for manufacturing a polishing tape 4 in which the above-mentioned polishing layer is further formed on the primer layer 6 provided on the base film 5.

As shown in FIG. 1, the polishing tape 7 can directly form the polishing layer 7 on the base film 5 made of a plastic film such as polyester having a thickness of 50 to 100 μm. It is preferable to form the polishing layer 7 after providing the primer layer 6 on the base film 5 for the purpose of firmly and stably bonding the base film 5 to the base film 5.

The base film used in the polishing tape of the present invention is appropriately selected from a film which is sufficiently resistant to polishing operation, a film which is resistant to application and drying of an abrasive, and which has little dimensional change. it can. For example, high-density polyethylene, polyolefin-based resin such as polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, ethylene-vinyl alcohol copolymer, polyacrylonitrile, polyamide, acrylate or methacrylate as a main component Stretched or unstretched films made of acrylic resins, polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, cellulose derivatives such as polyacetal, di- or tri-cellulose acetate, and polycarbonate.

The base film used in the polishing tape of the present invention preferably contains an antistatic agent in order to prevent dust from adhering. As the antistatic agent, ordinary nonionic surfactants, anionic surfactants, cationic surfactants and the like, and polyamide derivatives and acrylic acid derivatives can be appropriately selected and added.

The base film is selected from polyethylene terephthalate, a biaxially stretched nylon 6 film and a polyimide film having a thickness of 25 to 200 μm, which are excellent in coating suitability of a polishing layer, suitability for post-processing and handling in a polishing machine. It is. Then, it is preferable to apply an easy adhesion treatment such as a corona discharge treatment or an ozone gas treatment to the side on which the primer layer or the polishing layer is applied. A preferred base film is a polyester having many kinds of raw materials and easily modified, particularly a heat-resistant, rigid biaxially stretched film of polyethylene terephthalate and a 20-200 μm film provided with another polyester as a primer layer. .

The primer layer applied to the polishing tape of the present invention varies depending on the type of the base film, but includes a vinyl chloride-vinyl acetate copolymer, a polyvinyl acetal resin, a polyalkyl acrylate and a polyalkyl methacrylate. Such as acrylic resins or their copolymers, ethylene copolymers, rubber derivatives, polyester resins, polyamide resins, phenolic resins, epoxy resins, aminoplasts, polyurethane resins, cellulose derivatives, etc. After applying the varnish as a component to an unstretched film or a uniaxially stretched film, or further applying a biaxial stretching process to strengthen the adhesive strength between the base film and the primer layer, or simply It can be formed by coating a stretched film.

The primer layer is applied to an unstretched film or a uniaxially stretched film and then stretched, whereby the primer layer is heat-welded to the film, and the adhesion between the base film and the primer layer can be strengthened. The primer layer can be formed not only by coating but also by stretching a co-extruded film. For example, polyethylene terephthalate and linear polyester (for example, second order transition point T
g is a polyester at 40 to 130 ° C.) or a resin serving as a primer layer having a different (lower) crystallization temperature than a resin serving as a base film as seen in polypropylene and an ethylene / vinyl acetate copolymer. By stretching after forming the film by co-extrusion, a base film having good thickness accuracy and stable adhesion to the polishing layer can be formed.

The primer layer provided on the base film for firmly stabilizing the adhesion between the polishing layer and the base film is formed of a varnish made of the same material as the binder described above.
Even if the primer layer has some tackiness, blocking can be prevented by coating in the same step as the polishing layer. Therefore, it is also possible to select a material having an affinity for the base film and having a low glass transition point having a strong adhesive force, apply the polishing layer, and then heat-cur simultaneously with the polishing layer. Further, the primer layer that maintains the adhesiveness can have a function of adsorbing and holding the abrasive powder collected by the cracks.
Depending on the type of these varnishes, the adhesion can be strengthened by adding a curing agent such as isocyanate.

The abrasive particles used in the polishing layer of the present invention include:
An organosilica sol which is fine particles having an average particle diameter of 0.005 to 0.03 μm is used. Generally, the abrasive particles used in abrasive tapes suitable for precision parts are from 0,1.
Primary spherical particles of 01-0.7 μm are used. The smaller the particle size of the abrasive, the larger the content that can be blended in the coating liquid, and the larger the particle size, the smaller the content. When it is smaller than 0.001 μm, the grinding effect cannot be improved, and when it is larger than 0.7 μm, the abrasive material may be scratched. Therefore, particles of 0.01 to 0.7 μm have been preferably used. However, a polishing tape for precision parts requiring a finer surface finish is 0.001 to 0.00.
Attempts have also been made to use fine particles of 2 μm. Usually, when such ultrafine particles are used, there is a drawback that the grindability is not sufficient and satisfactory polishing properties cannot be obtained. The present invention constitutes a polishing tape for finishing a precision part by using this drawback in synergy with a network crack formed in a binder of a polishing layer.

The weight ratio of the ultrafine silica particles to the binder in the coating liquid is 1:99 to 99: 1, preferably 10:90 to
90:10. If the proportion of the particles exceeds 99% by weight, the particles are likely to fall off, and if less than 1% by weight, the grinding effect cannot be exerted.

In order to uniformly disperse fine particles having an average particle size of 0.005 to 0.03 μm with a viscous varnish,
For example, the ultrafine silica particles may be wetted with a solvent such as isopropyl alcohol, or a mixture of a nonionic surfactant and an anionic surfactant may be added thereto to prepare a coating liquid, and the above ultrafine particles may be prepared. Fine particles can be dispersed in the coating solution without aggregation. Preferably, the slurry is sufficiently dispersed and dispersed uniformly while adding the solvent little by little to the abrasive fine particles wet and sufficiently dispersed in the solvent, and further sufficiently stirred until uniform while adding the binder dissolved in the solvent little by little. A coating liquid having a good dispersion state is prepared using ultrasonic waves. The coating solution thus adjusted is preferably subjected to filtration with a filter having a size of 1 to 10 μm to remove the abrasive particles secondary aggregated by precipitation or the like, and then subjected to coating.

The binder of the present invention uses an organic / inorganic composite resin, or a prepolymer, oligomer, or polymer having a siloxane bond [siloxane bond: (—Si—O—) n] in the structure thereof. Can be. Then, it is used as a polysiloxane, a derivative or modified product thereof, or a blend thereof.

Specifically, the monomer, prepolymer or oligomer or polymer constituting polysiloxane is combined with, for example, an acrylic resin, a polyethylene resin, a polyvinyl chloride resin, a polyvinyl acetate resin, a polyvinyl alcohol resin, Mix or react with monomers, prepolymers or oligomers or polymers such as polyvinyl acetal resins, rubbery polymers, polyester resins, polyamide resins, phenolic resins, aminoplasts, epoxy resins, polyurethane resins, cellulose derivatives, etc. And a blend or a reaction product thereof can be used.

In particular, in the present invention, a vinyl chloride-vinyl acetate copolymer, a polyethylene resin, a polyvinyl chloride resin, a polyvinyl acetate resin, an acrylic resin,
A prepolymer or oligomer or polymer such as a polyurethane resin or polyester resin is used as a main chain, and a polysiloxane prepolymer, oligomer or polymer is reacted with the side chain by, for example, graft polymerization, and the main chain is composed of an organic compound. It is preferable to use a polymer having a siloxane bond in the side chain, or a prepolymer or oligomer thereof. By using the above silicone-based polymer as a binder for the polishing layer, the abrasive particles can be uniformly applied without being partially aggregated in the coating liquid or the polishing layer, enabling ultra-fine polishing for precision parts. It is a suitable polishing tape.

To harden the binder of the polishing layer, an organic metal compound such as a carboxylate such as zinc, manganese, zirconium, lanthanum, cobalt or tin, or an alkyl titanate such as tetrapropyl titanate or tetrabutyl titanate is added. It is preferable to prepare a coating liquid by using the above method. The amount of the curing agent is 0.0001 to 3.5 parts by weight, based on 100 parts by weight of the reactive resin contained in the binder, when the organometallic compound is converted to a metal. Is 0.1 to 0.5 parts by weight.

The coating liquid for the polishing tape is as shown in FIG.
For example, the thickness is 10 to 200 μm, preferably 50 to 100
On one side of a polyethylene terephthalate film (base film 5) of μm, a primer layer 6 mainly composed of an epoxy resin, an acrylic resin or polyester is provided on the base film as required.

Next, the coating amount is 0.5 to 10 g / m ^{2 by a} gravure reverse method using a gravure plate capable of uniformly and stably controlling the coating amount by a doctor action (in the present specification, the coating amount is a solid content: g / m ² )), preferably 3.
A polishing layer is applied, dried and solidified with a polishing layer of 10 to 10 g / m ² to form a network crack. Further, the binder of the present invention containing a siloxane bond undergoes a curing reaction at temperature and humidity. Therefore, the atmosphere at the time of coating is preferably as high as possible and high in humidity. However, when the high temperature and high humidity become extreme, the coating liquid hardens on the gravure plate surface, the curing reaction of the applied polishing layer becomes uneven, or the coating liquid before coating is applied. However, there is a problem that a gel-like substance is generated by a condensation reaction. Therefore, the relative humidity of 15 to 40 ° C. and the same temperature is 30 to 60%
Are preferred conditions.

Further, for the purpose of correcting crack distortion and completing the reaction, a heat treatment equivalent to 40 ° C. for 300 hours was performed.
By applying at 0 to 60 ° C., distortion of the polishing layer having a network crack is corrected and a stable polishing layer is formed.

The surface center line average roughness Ra of the non-crack portion in the polishing layer of the polishing tape thus prepared is in the range of 0.005 to 1.0 μm, and the pitch is 5 to 2 μm.
It is suitable as a polishing layer for precision parts having a network crack of 0 μm. In addition, a polishing tape for precision parts having high durability without increasing grinding scratches on the workpiece can be formed.

As shown in FIG. 4, the polishing tape 4 of the present invention is mounted on a support 9 made of a rotating metal plate via an elastic elastomer 8 as shown in FIG. The polishing operation is performed by polishing the end face of the optical connector ferrule on the polishing tape 4 excluding the covering portion 3 of the optical fiber 2 by about 60 r.
Polish for about 30 to 60 seconds at pm revolutions. The polishing tape of the present invention, which has a coated surface of ultrafine silica particles and fine cracks, can be polished efficiently without causing scratches on the surface to be polished. Then, the worn polishing powder 21 generated as the polishing layer is worn in the polishing step is sucked into the cracks 20 present in the polishing layer 7 as shown in FIG.
The purpose of the present invention is to maintain a state in which abrasion powder does not exist on the surface of the polishing layer, and prevent the occurrence of polishing scratches and polishing irregularities on the surface to be polished.

Hereinafter, the present invention will be described in more detail with reference to Examples.

EXAMPLES (Examples 1 to 6) A silicone resin-based varnish, which is a condensate of an organoalkoxysilane shown in Table 1, and abrasive fine particles (organosilica sol) wetted with isopropyl alcohol were subjected to ultrasonic dispersion, followed by filtration. Accuracy 3μ
Thus, a coating liquid for a polishing tape, which was subjected to m filtering, was prepared. Then, the above coating solution was applied to a primer-treated 75 μm-thick easily-adhesive treatment Melinex 542 (trade name of base film 5 polyethylene terephthalate film ICI Japan Co., Ltd.) (shaded intaglio 95 lines / 25 mm, A polishing layer 7 having a thickness of 5 g / m ² was applied by a gravure reverse coating method using a plate having a plate depth of 80 μm) and cured at 100 ° C. for 10 minutes to prepare a polishing tape 4 provided with the polishing layer 7.

[0031]

[Table 1]

The resin varnish of Table 1 has the following characteristics.・ KR-9218 (silicone resin varnish) Shin-Etsu Chemical Co., Ltd. 15% methoxy group containing solid content 100% ・ KR-213 (Silicone resin varnish) Shin-Etsu Chemical Co., Ltd. 20% methoxy group containing solid content 100% ・ KR-211 (silicone resin varnish) manufactured by Shin-Etsu Chemical Co., Ltd. 4% hydroxyl content containing solids 70% ・ KR-212 (silicone resin varnish) Shin-Etsu Chemical Co., Ltd. 5% hydroxyl content solids 70% IPA-ST (isopropyl alcohol-dispersed organosilica sol) Average particle size 0.001 to 0.15 μm Solid content 30%, manufactured by Nissan Chemical Industries, Ltd.

Comparative Example 1 A coating liquid for a polishing tape of Comparative Example 1 having the following composition was prepared.・ Ceramic coating material Glaska HPC 7502 30% by weight (organic-inorganic composite silicone resin solution) Solid content 30%, manufactured by Nippon Synthetic Rubber Co., Ltd. ・ Organosilica sol 70% by weight Average particle diameter 0.10 to 0.15 μm, solid content 30% Isopropyl alcohol dispersion Nissan Chemical Industries, Ltd.

Comparative Example 2 A coating liquid for a polishing tape of Comparative Example 2 having the following composition was prepared.・ Ceramic coating material Glaska HPC 7502 30% by weight (organic-inorganic composite silicone resin solution) Solid content 30%, manufactured by Nippon Synthetic Rubber Co., Ltd. ・ Organosilica sol 70% by weight Average particle diameter 0.10 to 0.15 μm 5% by weight per 100 parts by weight of HPC404H (hardening agent) coating liquid manufactured by Chemical Industry Co., Ltd. Solid content 30%,

Comparative Example 3 A coating liquid for a polishing tape of Comparative Example 3 having the following composition was prepared. -Ceramic coating material Glaska HPC 7502 30% by weight (organic-inorganic composite silicone resin liquid) Solid content 30% manufactured by Nippon Synthetic Rubber Co., Ltd.-Organosilica sol 70% by weight Average particle size 0.10 to 0.15 µm Isopropyl alcohol dispersed Nissan Chemical 5% by weight of Nippon Synthetic Rubber Co., Ltd.

The coating liquid for polishing tape of Comparative Examples 1 to 3 was 5 μm
m, and the Melinex used in the examples was performed.
542 with the above-mentioned coating solution (shaded intaglio 95 lines / 25 m
m, plate depth 80 μm) using a gravure reverse coating method to apply 7 g / m ² and dry at 100 ° C.
A polishing tape 4 provided with a polishing layer 7 was prepared.

For the samples of Examples and Comparative Examples, the adhesive was removed with a polishing sheet using silicon carbide to form a spherical surface, and the surface was roughly polished with a diamond sheet in accordance with a normal polishing process. Then, using the polishing sheet of the present invention, as shown in FIG. 4, the polishing tape 4 is mounted on a polishing machine via a resilient elastomer to a polishing machine, and the optical connector ferrule end face 11 of the optical fiber 2 after the rough polishing is completed. Was finished at a revolution of 60 rpm for 30 seconds, and the following items were evaluated. The results are shown in Table 2.

[0038]

[Table 2] Evaluation results of Examples and Comparative Examples * Not recognized: No cracks were observed.・ Evaluation criteria ◎: Very good ○: Good △: There is some problem in practicality, but in use

FIG. 4 shows each of the samples of the examples and comparative examples.
Optical connector ferrule end face 11 of optical fiber 2 shown in FIG.
As a result of the final finishing, the ferrules polished with the samples of Examples 1 to 6 have a finishing accuracy with no polishing scratches, polishing spots, and the like, and can work efficiently with good durability of the polishing tape. The result is an optical connector ferrule with good signal attenuation characteristics. On the other hand, as a result of performing the final finishing of the optical connector ferrule end face 11 in the same manner as in the example using the comparative example, no polishing scratches or polishing spots were generated, but the boundary between the fiber and the ferrule was found. A small chip was generated in the part. The durability of the polishing tape was about 8 compared with that of the example.
It was 0%.

[0040]

As described in detail above, the polishing tape of the present invention using the linear crack and the fine particle abrasive of 0.005 to 0.03 μm has a finish in which the optical connector ferrule has no polishing scratches or polishing spots. Work can be done efficiently with good accuracy and durability. In addition, there is an effect that there is no polishing scratch or polishing unevenness even on a precision component such as an optical connector ferrule or an optical reading head, and it is possible to efficiently perform finishing with good signal attenuation characteristics.

[Brief description of the drawings]

FIG. 1A is a conceptual diagram showing cracks and uneven portions of a polishing layer of a polishing tape. (B) It is a key map showing the section of a polishing tape lamination.

FIG. 2 is a conceptual diagram showing a state in which grinding powder after using a polishing tape has adhered to a crack.

FIG. 3 is a schematic sectional view showing another configuration of the polishing tape.

FIG. 4 is a schematic cross-sectional view showing a polishing state in which a polishing tape is mounted on a pad.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Optical connector ferrule 2 Optical fiber 3 Coating part 4 Polishing tape 5 Polishing tape base film 6 Primer layer 7 Polishing layer 8 Elastic elastomer 9 Support 11 Optical connector ferrule end face 20 Abrasive particles 26 Worn abrasive powder 30 Non-crack part 35 Crack pitch 70 Mesh crack

Claims (6)

[Claims] 1. A non-crack portion of a polishing layer provided on one side of a base film has a surface center line average roughness Ra of 0.005.
A polishing tape having a polishing layer provided with a network crack having a mesh size of 1.0 to 1.0 μm and a pitch of 5 to 200 μm, wherein the polishing layer comprises silica particles having an average particle diameter of 0.005 to 0.03 μm and siloxane bonds. A polishing tape comprising: a vinyl chloride / vinyl acetate copolymer or a binder comprising a prepolymer or an oligomer having the following. 2. The polishing slurry of the coating liquid for forming the polishing layer is an organosilica sol having a thickness of 0.005 to 0.03 μm, and a binder or a vinyl chloride / vinyl acetate copolymer having a siloxane bond. A coating liquid for a polishing tape, which is a polymer or an oligomer. 3. The method according to claim 2, wherein the weight ratio between the abrasive particles and the binder is 1:99 to 99: 1.
The coating liquid for polishing tape according to 1. 4. The non-cracked portion of the polishing layer provided on one side of the base film has a surface center line average roughness Ra of 0.005.
A polishing tape having a polishing layer provided with network cracks having a pitch of 5 to 200 μm, wherein the polishing layer comprises silica particles having an average particle diameter of 0.005 to 0.03 μm, and siloxane. The abrasive of the coating liquid for forming the polishing layer of the polishing tape composed of a vinyl chloride / vinyl acetate copolymer having a bond or a binder made of a prepolymer or an oligomer is 0.005 to 0.03 μm.
And the binder is a vinyl chloride / vinyl acetate copolymer or prepolymer or oligomer having a siloxane bond, and the weight ratio of the abrasive particles to the binder is 1:99 to 99:10. The nonvolatile component of the coating solution for tape was adjusted to 15 to 85% by weight, and the base film was coated with 3 to 8 g / m ² (solid content) by a gravure reverse coating method or a kiss reverse coating method, and immediately thereafter. And heating the solvent to evaporate the solvent, and then completing the binder curing reaction and crack generation to form a polishing layer. 5. The polishing layer according to claim 4, wherein the coating solution is filtered through a 1 to 10 μm filter,
After coating and drying the substrate film in a coating section under an atmosphere of 0 ° C. and a relative humidity of 20 to 60% at the same temperature, the coating is further performed for 40 minutes.
The method for producing a polishing tape according to claim 4, wherein the reaction is completed by a heat treatment at 300C for more than 300 hours. 6. The polishing layer according to claim 4, wherein said polishing layer is further formed on a primer layer provided on a substrate film.
6. The method for producing a polishing tape according to any one of items 1 to 5.