JPH11288997A - Ic suction collet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC suction collet which is capable of chucking an IC chip without causing damages to it and possessed of a suction surface that is improved in durability. SOLUTION: An IC suction collet 1 is equipped with a collect main body 2 of conductive rubber, wherein the collet main body 2 is formed like a cylindrical body with a tapered head. A center hole 2b is bored in the one edge face 2a of the collect main body 2, and a mounting part of an IC mounter is inserted into the center hole 2b and fixed. A center hole 2c smaller than the center hole 2b is provided to the other edge face 2d of the collet main body 2. A cylindrical suction part 3 of conductive resin has a flange 3d, and the axial part 3c of the chucking part 3 is fitted and fixed in the hole 2c provided to the collet main body 2, bringing the flange 3d into close contact with the edge face 2b of the collet main body 2. A center hole 3a is provided which penetrates through the suction part 3 and communicates with an air hole provided to the mounting part of the IC mounter. The edge face 3b of the chucking part 3 is made to serve as the chucking face which chucks an IC chip.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a collet for IC suction used in an IC mounting machine.

[0002]

2. Description of the Related Art Conventionally, an IC mounting machine that mounts an IC chip on a circuit board has been used for manufacturing a semiconductor device. In such an IC mounting machine, the IC chip for wire bonding is mounted face down, and the IC chip for flip chip is mounted face up.
In addition, IC-equipped machines are required to have high productivity and are operated at high speed. The IC mounting machine picks up the IC chip attached to the wafer sheet and transfers the IC chip to the positioning stage while mounting the IC chip on the circuit board. A collet is used. Also, the surface of the IC chip to be sucked may be an active surface or a back surface.

[0003] Such conventional IC suction collets include:
For example, JP-A-4-152645 and JP-A-7-42
133 is disclosed. The former one is
While the tip is made of hard wear-resistant material, the shank is made of lightweight metal or resin material, which greatly extends the life of the collet and makes it compatible with high-speed bonding by reducing the weight. Things. The latter is an improved version of the conventional hard material where the tip is easy to damage the IC chip.The material of the suction cup at the tip is made of rubber, and the elasticity is applied to the tube that hits the shank. This is the one that has been fitted, without damaging the IC chip during high-speed bonding and without any suction error.

[0004]

However, in the conventional rubber suction disk, especially when the bump side of the flip chip is sucked, a dent is formed on the end face of the rubber with which the bump comes into contact, resulting in insufficient wear resistance. Met. As described above, in the case of a collet using a material having a soft suction surface, the IC chip easily adheres to the collet, and since the IC chip operates at high speed, there is a problem that the IC chip is brought back without leaving the collet at the mounting position. Even if a positive vacuum break is attempted to prevent this, a minute IC chip is blown off, which is inconvenient. In addition, a collet made of a material with a hard suction surface may damage the IC chip in the case of a wire bonding IC chip, or a soft solder bump may be crushed in a flip chip, resulting in poor connection or a gap between the chip and the circuit board after mounting the chip. A defect has occurred.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems. In particular, it is an object of the present invention to provide a durable IC suction collet which does not bring back an IC chip or crush a bump in flip chip IC mounting. With the goal.

[0006]

In order to solve the above-mentioned problems, the invention according to claim 1 of the present invention is used in an IC mounting machine, and has a suction surface having an IC chip suction opening at the center of the tip. The IC suction collet is characterized in that the collet main body is made of a rubber material, and a suction portion made of a resin material is fixed to the tip of the collet main body.

According to a second aspect of the present invention, in the first aspect of the present invention, the suction portion has a shaft portion inserted and fixed to the collet body.

[0008]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows an IC according to an embodiment of the present invention.
It is sectional drawing of a suction collet. In FIG. 1, 1 is an IC
It is an adsorption collet. Reference numeral 2 denotes a collet body made of a conductive rubber material such as urethane rubber or silicon rubber, and is formed in a cylindrical shape having a tapered head. A hole 2b is opened in one end surface 2a of the collet body 2, and I
The mounting portion of the C-mounted machine is fitted and fixed. A hole 2c having a smaller diameter than the hole 2b is opened in the other end surface 2d of the collet body 2. 3 is, for example, nylon resin, polyacetal resin,
It is a suction part formed of a conductive resin material such as a vinyl chloride resin in a cylindrical shape with a flange, and is provided with a hole 2 in the collet body 2.
The shaft portion 3c is fitted to c, and the flange portion 3d is tightly fixed to the end surface 2d of the collet body 2. The suction hole 3 has a center hole 3a penetrating therethrough so as to communicate with the air hole of the mounting portion. The end surface 3b is a suction surface for sucking the IC chip.

Next, a method of manufacturing the IC suction collet 1 will be described. As shown in FIG. 2A, the collet main body 2 is molded in advance from the rubber material. Next, the collet body 2 is chucked to a grinding machine to finish the end face 2d perpendicular to the axial direction. Reference numeral 4 denotes a pin-shaped suction section blank with a flange formed in advance of the resin material. The shaft section 4a of the blank 4 is inserted into the hole 2c and fixed with an adhesive. Next, the outer shape of the flange portion 4b is ground according to the outer shape of the collet main body 2, and a center hole 4a having a diameter d is formed. The blank 4 is processed as described above to become the suction unit 3. The flange 4b is a flange 3d having a thickness t.

The dimensions of the IC suction collet 1 are set to appropriate values according to the size of the IC chip. For example, 1
When applied to a flip-chip IC of a square mm, the outer diameter of the collet body 2 is 4 mm, and the diameter d of the center hole of the suction part 3 is 0.1 mm.
6 mm, and the thickness t of the flange 3d is 0.3 mm.

Next, the operation of this embodiment will be described. IC
The mounting hole 2b of the IC suction collet 1 is fitted and fixed to the suction collet mounting portion of the mounting machine. When the IC mounting machine picks the IC chip, the end face 3b contacts the IC chip.
At that time, the impact is absorbed by the elasticity of the collet main body 2, so that the IC chip is not damaged. Moreover, the end face 3
Since b is a resin material harder than a rubber material, the abrasion resistance is also improved, and when mounted on a circuit board, the IC chip is easily peeled off and the chip take-back phenomenon is eliminated.
In addition, since the collet body 2 and the suction section 3 are made of a conductive material, the IC chip is not damaged by static electricity.

In the above embodiment, the cylindrical suction portion 3 is provided with a flange. However, the suction portion is formed of a resin plate material having no shaft portion, and is adhered to the end face of the head of the collet main body. It may be a collet. However, in order to accurately center the center hole, it is advantageous to have a shaft.
The thickness of the resin plate is preferably 0.2 mm or more from the viewpoint of workability. If the thickness is too large, the effect of absorbing shock is reduced.

[0013]

According to the present invention, the collet body of the IC suction collet is formed of a rubber material, and the suction portion made of a resin material is fixed to the end of the collet body, so that the IC chip is mounted on the circuit board. In addition to reducing the impact on the IC, the durability of the IC suction collet is improved. Also,
Since the suction portion has a structure inserted and fixed to the collet body, the fixing force of the suction portion to the collet body is increased. In flip-chip IC mounting, a durable IC suction collet can be provided without taking back the IC chip or crushing the bump.

[Brief description of the drawings]

FIG. 1 is a sectional view of an IC suction collet according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a method of manufacturing the IC suction collet of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC suction collet 2 Collet main body 3 Suction part 3a Center hole 3b Suction surface 3c Shaft part

Claims (2)

[Claims] 1. Used in an IC-equipped machine, and has an I
An IC suction collet having a suction surface having a C-chip suction opening, wherein the collet main body is made of a rubber material, and a suction portion made of a resin material is fixed to a tip end of the collet main body. 2. The IC suction collet according to claim 1, wherein said suction portion has a shaft portion fixedly inserted into said collet body.