JPH11268124A - Laminator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminator equipped with a mechanism eliminating the effect caused by the winding shift of a film and capable of obtaining high laminating accuracy. SOLUTION: A laminator is equipped with a lamination part A for laminating a film F to a substrate and a conveyor B feeding the substrate G in the lamination part A. In this case, a sensor 10 for monitoring the end part of the film F is provided to the lamination part A and the lamination part A is made movable, in the direction crossing the substrate feed direction at right angle on the basis of the signal from the sensor 10. By monitoring the end part of the film F by the sensor F and moving the lamination part A by the shift quantity of the film, the effect caused by the winding shift of the film F is eliminated to laminate the film F highly accurately.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention belongs to the technical field of a laminator used for bonding a resin film to a substrate such as a glass plate.

[0002]

In using this type of laminator, it is sometimes necessary to bond a film to a substrate with high positional accuracy. For example, when bonding a resist material such as a dry film resist to be patterned by exposure and development in a later step to a substrate, the bonding accuracy between the film and the substrate is not so required, but when bonding an unpatterned material to the substrate. In such a case, since the bonding accuracy is the final accuracy, high bonding accuracy is required. In this way, in order to bond the film to the substrate with high positional accuracy, the positional accuracy of the substrate must be high with respect to the transport line (center of the machine), and the position of the film to be bonded with high precision based on the transport line. There is a need to.

In a conventional laminator, a laminating section is fixed to a substrate when the apparatus is operating, and a film is laminated on the substrate while maintaining a fixed positional relationship. On the other hand, the laminated film is usually slit to a required width, and is used by being set on a laminator while being wound on a paper tube or the like. There is a case where a so-called misalignment occurs in which the film is gradually shifted with respect to the paper tube. Therefore, when a film is laminated on a large number of substrates, the bonding position of the film is shifted due to a winding deviation, and it is difficult to bond the film with high positional accuracy using a conventional laminator.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a laminator provided with a mechanism capable of obtaining high bonding accuracy.

[0005]

In order to solve the above problems, the present invention relates to a laminator having a laminating section for attaching a film to a substrate, and a conveyor for carrying the substrate into the laminating section. A sensor for monitoring the edge of the film is provided in the section, and the laminating section can be moved in a direction orthogonal to the substrate transport direction by a signal from the sensor.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic structural view showing an entire laminator. In the figure, A is a laminating section for bonding a film F to a substrate G, B is a conveyor for carrying the substrate G into the laminating section A, and is usually a substrate G heated to a laminating temperature in a preheating furnace (not shown). Is carried into the laminating section A, and the film F is laminated and carried out of the laminating section A.

In the laminating section A, the bonding film F is fed out from the supply roll 1 and the protective film f is wound up and removed before reaching the guide roll 2. Then, the film F from which the protective film f has been removed
Is transferred from the guide roll 4 to the laminating roll portion via the dancer roll 3, and the film G is bonded to the substrate G conveyed by the conveyor B by the first roll 5 and the second roll 6. While this bonding is being performed, the film F is cut into a predetermined length by the automatic cutter 7. The auto cutter 7 cuts the film F in a right angle direction by moving the cutter blade 7a in the horizontal direction while moving downward together with the film F. At this time, the holding member 8 moves downward together with the auto cutter 7 while holding the film. The cut film F
The vicinity of the cut rear end is suction-held by the vacuum shoe 9, and the vicinity of the rear end of the film F is bonded along the substrate G. Then, the bonded substrate G is carried out by a delivery conveyor (not shown).

In addition to the basic structure described above, in the illustrated example, the line sensor 10 is attached to the holding member 8 in the positional relationship shown in FIG.
The light source 11 is attached to the auto cutter 7 correspondingly. And the laminating part A
Can be moved in a direction orthogonal to the direction in which the substrate G is transported by a signal from the line sensor 10. By adding this configuration, the end of the film F is monitored by the line sensor 10, and the laminating unit A is moved in the left-right direction, that is, in the direction orthogonal to the substrate transport direction, in accordance with the amount of the film F being displaced. The film can be bonded to the substrate G with high accuracy.

The line sensor 10 for monitoring the end of the film F may be placed anywhere between the film holding section and the laminating roll section, but is preferably near the cutting end of the film F. Also, the movement of the laminating unit A corresponding to the sensor signal may be performed during the lamination,
Normally, the length of the substrate G is about 1 to 2 m at the maximum, and since the influence of the winding deviation does not greatly affect, it is sufficient to perform the position correction of the film F using the time during which no lamination is performed. It is.

[0010]

As described above, according to the laminator of the present invention, the end of the film is monitored by the sensor, and the laminating part is moved by the amount of displacement, thereby eliminating the influence of the film displacement. Film can be bonded with high precision.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing the entire laminator.

FIG. 2 is an explanatory diagram showing an example of an arrangement of sensors provided in the laminator of FIG. 1;

[Explanation of symbols]

 Reference Signs List A laminating section B conveyor F film f protective film G substrate 1 supply roll 2 guide roll 3 dancer roll 4 guide roll 5 first roll 6 second roll 7 auto cutter 7a cutter blade 8 holding member 9 vacuum shoe 10 line sensor 11 light source

Claims (1)

[Claims] 1. A laminator comprising: a laminating unit for laminating a film on a substrate; and a conveyer for carrying the substrate into the laminating unit, wherein the laminating unit is provided with a sensor for monitoring an end of the film. A laminator characterized in that the laminating section can be moved in a direction orthogonal to the substrate transport direction by the signal of (1).