JPH11204954A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus where fixing strength of the electronic apparatus arranged on a mother board or the like can be improved, and mechanical strength of fixing legs of a frame member can be improved. SOLUTION: A frame member 1 composed of metal capable of soldering and fixing legs 1b which are formed protruding from side walls 1a of the frame member 1 are installed, and protruding parts 1d having penetrating holes in the direction perpendicular to soldering surfaces 1e of the fixing legs 1b are arranged. In the state that the protruding parts 1d are positioned above root parts of the fixing legs 1b connected with the side walls 1a of the frame member 1, the protruding parts 1d extend over the fixing legs 1b and the side walls 1a of the frame member 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic equipment.

[0002]

2. Description of the Related Art FIG. 5 is a perspective view of a frame of a conventional electronic device.
FIG. 6 is an enlarged view of a main part of a conventional electronic device, FIG. 7 is an enlarged view of a main part when the conventional electronic device is mounted on a motherboard,
FIG. 8 is a sectional view taken along line 8-8 in FIG. A frame 11 of a conventional electronic device includes four side plates 11a made of a metal plate. Of the two side plates 11a opposed to each other, a part of each side plate 11a extends and protrudes below the frame 11. Two mounting legs 11b are provided on each side plate 11a. The distal ends of these mounting legs 11b are attached to the mounting legs 11b.
The shoulder portion 11c is configured to be narrower than the root portion A, which is a connection portion between the first portion and the side plate 11a, and has a stepped shape.
Then, at a position where the mounting leg 11b straddles the mounting leg 11b and the side plate 11a on the root portion A connected to the side plate 11a,
A hole 11d having an outer diameter smaller than the width of the mounting leg 11b is provided.

A circuit board 1 on which printed wiring is provided
An electric circuit is formed by mounting circuit components and the like (not shown) on 2, and is fixed inside the frame 11 by an appropriate method. One end of the terminal 13 is electrically connected to an electric circuit formed on the circuit board 12, and the other end is connected to the frame 1.
1 protrudes outside.

The conventional electronic equipment is used by disposing the electronic equipment on a motherboard 14 such as a television receiver as shown in FIGS. In the process of disposing the electronic device, first, a part of the tip of the mounting leg 11b is inserted into a mounting hole 14a provided in the mother board 14 corresponding to the shape of the mounting leg 11b, so that the shoulder 11c Locked on the substrate 14. Next, the soldering surface 11e of the mounting leg 11b
Is melted, and the mounting legs 11b are soldered to the soldering lands 16 provided on the mother board 14. The hole 11 provided in the mounting leg 11b
Due to the presence of d, the melted solder 15 goes around the back side of the soldering surface 11e of the mounting leg 11b, and the electronic device is securely soldered and fixed on the mother board 14.

[0005]

However, in the above-mentioned conventional electronic device, the mechanical strength of the mounting leg 11b is low at the periphery of the hole 11d of the mounting leg 11b due to the small thickness of the hole. When an impact due to a collision or drop is given to the mounting leg 11b, the side plate 1
There is a possibility that it may be bent along the root A, which is the connection between the mounting leg 1a and the mounting leg 11b integrated therewith. When the mounting leg 11b is bent, the distal end of the mounting leg 11b cannot be inserted into the mounting hole 14a provided in the mother board 14 on which the electronic device is provided.

[0006] In addition, due to the presence of the hole 11d, the mounting leg 11
The contact area (soldering area) between b and the solder 15 to be soldered thereto is reduced, and the mounting strength of the electronic device to the mother board is reduced.

[0007] An object of the present invention is to improve the mounting strength of an electronic device provided on a mother board or the like, and to improve the mechanical strength of mounting legs of a frame. It is to provide.

[0008]

According to a first aspect of the present invention, there is provided an electronic apparatus according to the present invention, comprising: a frame made of a metal which can be soldered; and a projection formed on a side plate of the frame. And a projection having a through hole in a direction perpendicular to the soldering surface of the mounting leg.

According to a second aspect of the present invention, there is provided an electronic apparatus according to the present invention, wherein the protrusion is located on a base of the mounting leg connected to a side plate of the frame, and the mounting leg is connected to the mounting leg. The structure was formed so as to straddle the side plate of the frame.

[0010]

Embodiments of the present invention will be described below. FIG. 1 is a perspective view of an electronic device according to an embodiment of the present invention, FIG. 2 is an enlarged view of a main part of the electronic device of the present invention, and FIG. 3 is an enlarged view of a main portion when the electronic device of the present invention is mounted on a mother board. FIG. 4 is a sectional view taken along line 4-4 in FIG. The frame 1 of the electronic device of the present invention includes four side plates 1a made of a metal plate that can be soldered, and of the two side plates 1a facing each other, a part of each side plate 1a is extended to form a frame. Two mounting legs 1b are provided on each side plate 1a. The distal end portions of these mounting legs 1b are formed narrower than the root portion A, which is the connecting portion between the mounting legs 1b and the side plate 1a, and the shoulder portion 1c has a stepped shape.
Is provided.

At the position where the mounting leg 1b straddles the mounting leg 1b and the side plate 1a on the base A where the mounting leg 1b is connected to the side plate 1a, the mounting leg 1b extends outside the width of the mounting leg 1b so as to be orthogonal to the mounting leg 1b. A projection 1d having a through hole with a small diameter is provided.

Further, a circuit board 2 on which printed wiring is provided
A circuit component or the like (not shown) is mounted thereon to form an electric circuit, and is fixed inside the frame 1 by an appropriate method. One end of the terminal 3 is electrically connected to an electric circuit formed on the circuit board 2, and the other end protrudes outside the frame 1.

Also in the electronic apparatus of the present invention, in the step of disposing on the mother substrate 4 such as a television receiver, the electronic device is mounted on the mounting hole 4a provided in the mother substrate 4 corresponding to the shape of the mounting leg 1b. Part of the tip of the leg 1b is inserted, the shoulder 1c is locked on the mother board 4, and the molten solder 5 is poured into the soldering surface 1e of the mounting leg 1b.
Are soldered to the soldering lands 6 provided on the mother board 4. The presence of the projection 1d having a through hole provided in the mounting leg 1b allows the melted solder 5 to flow also to the back side of the soldering surface 1e of the mounting leg 1b, so that the electronic device can be securely placed on the mother board 4. Soldered and fixed.

Although there is a through hole inside the projection 1d, it functions as a reinforcing rib disposed in a direction perpendicular to the mounting leg 1b. The protrusion 1d is formed on the side plate 1a.
Is provided so as to straddle the mounting leg 1b and the side plate 1a on the base portion A, which is a connection portion between the mounting leg 1b and the mounting leg 1b integrated with the mounting leg 1b. Even when a causal impact is applied to the mounting leg 1b, the mounting leg 1b having no mechanical bend at the root A of the mounting leg 1b and the side plate 1a and having high mechanical strength can be obtained. The bending-free mounting leg 1b can be reliably inserted into the mounting hole 4a provided in the mother board 4 on which the electronic device is provided.

Further, the presence of the projection 1d allows the mounting leg 1
The contact area (soldering area) between b and the solder 5 to be soldered thereto is increased. Therefore, the mounting strength of the electronic device to the mother board 4 is increased.

As shown in this embodiment, the protrusion 1d
Even if it is not formed at a position over the mounting leg 1b and the side plate 1a on the base A, if it is provided in a direction orthogonal to the soldering surface of the mounting leg 1b, the mechanical strength of the mounting leg 1b Can be improved.

The shape of the mounting leg 1b is such that a part of the tip is narrow and a stepped shoulder 1c is provided, but is not limited to the mounting leg 1b having such a shape. Also,
The projection 1d may be a cylindrical projection 1d having a cross section of a triangle, a square, an ellipse, or the like, in addition to the cylindrical one shown in the figure. Further, when the mounting leg 1b is inserted into the mounting hole 4a provided in the mother board 4, the protrusion 1d
By providing a slight gap between the electronic device and the mother board 4, it is possible to further improve the wraparound of the solder 5 to the back side of the mounting leg 1b in the mounting process by soldering the electronic device to the mother board 4. it can.

[0018]

Since the present invention is configured as described above, it has the following excellent effects. According to the electronic device of the present invention, since the protrusion is provided so as to be orthogonal to the mounting leg, the mechanical strength of the mounting leg is improved, and the electronic device is mounted on the motherboard. In the soldering process, the contact area between the mounting leg and the solder increases,
The mounting strength of the electronic device to the motherboard is increased. By providing the projection on the base of the mounting leg so as to straddle the mounting leg and the side plate, even if an impact is applied to the mounting leg, the base does not bend.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic device according to an embodiment of the invention.

FIG. 2 is an enlarged view of a main part of the electronic device of the present invention.

FIG. 3 is an enlarged view of a main part when the electronic device of the present invention is mounted on a mother board.

FIG. 4 is a sectional view taken along line 4-4 in FIG. 3;

FIG. 5 is a perspective view of a frame of a conventional electronic device.

FIG. 6 is an enlarged view of a main part of a conventional electronic device.

FIG. 7 is an enlarged view of a main part when a conventional electronic device is mounted on a mother board.

8 is a sectional view taken along line 8-8 in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Frame 1a Side plate 1b Mounting leg 1c Shoulder 1d Projection 1e Soldering surface 2 Circuit board 3 Terminal 4 Mother board 4a Mounting hole 5 Solder 6 Soldering land A Root

Claims (2)

[Claims] 1. A projection comprising: a frame made of a solderable metal; and mounting legs formed to project from a side plate of the frame, and having a through hole in a direction perpendicular to a soldering surface of the mounting leg. Electronic equipment characterized by comprising a part. 2. In a state where the protrusion is located on a base of the mounting leg connected to the side plate of the frame, the protrusion is formed so as to straddle the mounting leg and the side plate of the frame. The electronic device according to claim 1, wherein: