JPH1079489A - Method for manufacturing semiconductor memory device having capacitor - Google Patents

Abstract

(57) Abstract: Provided is a method of manufacturing a semiconductor memory device having a tree-type capacitor structure capable of increasing a charge storage area. A first insulating layer is formed on a substrate so as to cover a transfer transistor. A first conductive layer is formed so as to penetrate at least the first insulating layer and be electrically connected to a source / drain region of the transfer transistor.
A second insulating layer and a stacked layer are formed, and a third insulating layer is formed on a side wall of the stacked layer. Next, a fourth insulating layer is formed, and an opening is formed.
Part of the first conductive layer is exposed. A second conductive layer is formed over the entire stacking layer and the second insulating layer to fill the opening. Next, a second conductive layer is defined, wherein the stacked layers are:
The second insulating layer below the stacked layer is removed.
Further, first and second conductive layers are defined, forming a storage electrode of the charge storage capacitor. Next, the second insulating layer is removed, and a dielectric layer is formed on the entire exposed surfaces of the first and second conductive layers. Thereafter, a third conductive layer is formed on the entire surface of the dielectric layer and serves as a counter electrode of the charge storage capacitor.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method of manufacturing a semiconductor memory device, and more particularly to a method of manufacturing a structure of a dynamic random access memory (DRAM) cell having a transfer transistor and a tree-type charge storage capacitor. Things.

[0002]

2. Description of the Related Art FIG. 1 is a circuit diagram of a memory cell of a DRAM device. As shown in the figure, the DRAM cell includes a transfer transistor T and a charge storage capacitor C. The source of the transfer transistor T is connected to the corresponding bit line BL, and the drain of the transfer transistor T is
It is connected to the storage electrode 6 of the charge storage capacitor C.
The gate of the transfer transistor T is connected to the corresponding word line WL, and the counter electrode 8 of the capacitor C is connected to a constant power supply. Further, a dielectric film 7 is connected between the storage electrode 6 and the counter electrode 8.

In a DRAM manufacturing process, a storage capacity of 1
For a conventional DRAM that is less than Mb (megabytes),
A substantially two-dimensional capacitor called a planar capacitor is mainly used. In the case of a DRAM having a storage cell using a planar capacitor, electric charges are accumulated on the main surface of the semiconductor substrate.
The area must be large. Therefore, this type of storage cell is not suitable for a highly integrated DRAM. Highly integrated DR such as DRAM with 4Mb or more memory
For AM, three-dimensional capacitors called stack type or trench type capacitors have been introduced so far.

[0004] This stack or trench capacitor has made it possible to obtain larger memories of similar size, but more highly integrated semiconductors such as very large scale integrated circuits (VLSI) with a storage capacity of 64 Mb. It has been found that a capacitor having a simple three-dimensional structure such as a conventional stack type or trench type is not enough to realize the device.

One way to improve the capacitance of a capacitor is to use a so-called fin-type stacked capacitor, which is disclosed in Emma et al.
3D stacked capacitor cell for mega DRAM (3
-Dimensional Stacked Capac
itor Cell for 16M and 64M
DRAMs) "(International Electronic Device Conference (Inter)
nationalElectron Devices
Meeting), 592-595, December 1988.
Month issue). The fin-type stacked capacitor includes a plurality of stacked layers having fin-shaped horizontally extending electrodes and a dielectric film to increase the surface area of the electrodes. DRA with Finned Stacked Capacitor
M is also disclosed in U.S. Pat. Nos. 5,071,783 and 5,12.
No. 6,810 and 5,206,787.

[0006] Another measure for improving the capacitance of a capacitor is to use a so-called cylinder-type stacked capacitor, which is disclosed in Wakamiya et al.
New stacked capacitor cell for M (Novel S
tracked Capacitor Cell for
64-Mb DRAM) "(VLSI Technical Document 1989 Symposium on Technology Digest (1
989 Symposium on VLSI Tec
hinology Digest of Technc
al Papers), pp. 69-70). This cylinder-type stacked capacitor includes an electrode and a dielectric film extending perpendicularly to the cylinder, so that the surface area of the electrode is large. A DRAM with a stacked cylinder capacitor is also disclosed in U.S. Pat. No. 5,077,688.

[0007]

As the degree of integration increases, the size of DRAM cells on a plane (the area occupying the plane) must be further reduced. In general, a decrease in cell size leads to a decrease in charge storage capacity (capacitance), and as the capacitance decreases,
The possibility of occurrence of a soft error due to the generation of α rays increases. Therefore, there is still a need in the art for the design of new structures for storage capacitors that have the same capacitance and at the same time occupy less area on a plane, and for a suitable method of making that structure.

Accordingly, an object of the present invention is to provide a method of manufacturing a semiconductor memory device having a tree-type capacitor structure capable of increasing a charge storage area.

[0009]

According to a first preferred embodiment of the present invention, a method of manufacturing a semiconductor memory device having a capacitor is provided. This semiconductor storage device includes a substrate, a transfer transistor formed on the substrate, and a charge storage capacitor electrically connected to one of the source / drain regions of the transfer transistor. The method includes forming a first insulating layer on a substrate;
Covering the transfer transistor and forming a first conductive layer, wherein the first conductive layer penetrates at least the first insulating layer and is electrically connected to one of the source / drain regions of the transfer transistor. ing. Next, a second insulating layer is formed, and a deposition layer is formed on the second insulating layer.
A third insulating layer is formed on sidewalls of the deposited layer, and a fourth insulating layer is formed on surfaces of the second and third insulating layers. The opening is formed by removing the third and fourth insulating layers and the insulating layer below the third insulating layer until the surface of the first conductive layer is exposed. A second layer on the surface of the deposition layer and the second insulating layer
A conductive layer is formed and the opening is filled. A portion of the second conductive layer on top of the deposited layer is removed, and then the second layer below the deposited layer and the deposited layer until the surface of the first conductive layer is exposed.
Part of the insulating layer is removed. The range of the first and second conductive layers is such that one end of the second conductive layer is connected to the upper surface of the first conductive layer, the first conductive layer forms a trunk-shaped conductive layer, and the second conductive layer is a branch-shaped conductive layer. The first conductive layer and the second conductive layer are combined to form a storage electrode of the charge storage capacitor. The dielectric layer comprises a first
And on the exposed surface of the second conductive layer. By forming the third conductive layer over the entire surface of the dielectric layer,
A counter electrode of the charge storage capacitor is formed.

According to one aspect of the present invention, the trunk-like conductive layer is electrically connected to one of the source / drain regions of the transfer transistor and can have a T-shaped or U-shaped cross section. The branch-like conductive layer has a generally hollow cylindrical shape having an L-shaped cross section.

According to another aspect of the present invention, an etching protection layer is formed above the first insulating layer, and further, a fifth insulating layer is formed on the etching protection layer, and then the etching protection layer is formed. A first conductive layer is formed so as to penetrate the protection layer. This fifth insulating layer is removed together with the second insulating layer.

In accordance with yet another aspect of the present invention, multiple insulating, deposited, and conductive layers are formed to define an additional branch-like conductive layer. As described above, the trunk-like conductive layer is formed by the first conductive layer, and at least two branch-like conductive layers are formed by the other conductive layer, and the respective branch-like conductive layers are arranged substantially in parallel with each other. And one end of each is connected to the upper surface of the first conductive layer. Any remaining insulating layer beyond the first insulating layer is removed, and a dielectric layer is formed on the entire exposed surfaces of the trunk-like conductive layer and the branch-like conductive layer.

According to yet another aspect of the present invention, a portion of the second conductive layer located above the deposition layer is removed by chemical mechanical polishing (CMP) or etching.

According to a second preferred embodiment of the present invention,
A method for manufacturing a semiconductor memory device including a capacitor has been proposed. This semiconductor storage device includes a substrate, a transfer transistor formed on the substrate, and a charge storage capacitor electrically connected to one of the source / drain regions of the transfer transistor. On the substrate, the first
An insulating layer is formed and covers the transfer transistor. The first conductive layer is formed so as to penetrate at least the first insulating layer, and one of the source / drain regions of the transfer transistor.
And electrically connected to one another. The second insulating layer and the deposition layer are formed above the second insulating layer. A third insulating layer is formed on a sidewall of the deposition layer, and a fourth insulating layer is formed on surfaces of the second and third insulating layers. Further, the opening is formed by removing the third and fourth insulating layers and the insulating layer below the third insulating layer so that the surface of the first conductive layer is exposed. A second conductive layer is formed on the surfaces of the deposition layer and the second insulating layer, and the opening is further filled. This second conductive layer is
By removing the part located above the deposition layer,
The range is defined. Next, after the deposited layer is removed, a fifth insulating layer is formed on the surfaces of the second conductive layer and the second insulating layer. The second opening is formed by etching the fifth insulating layer until the surface of the first conductive layer is exposed. Next, a third conductive layer is formed on the surface of the fifth insulating layer and inside the second opening. Thereafter, a range of the third, second, and first conductive layers is defined such that each end of the third and second conductive layers is connected to an upper surface of the first conductive layer. Further, a trunk-like conductive layer is formed by the first conductive layer, a first branch-like conductive layer is formed by the second conductive layer, and a second branch-like conductive layer is formed by the third conductive layer. Thus, the storage electrode of the charge storage capacitor is formed by the entire first, second, and third conductive layers. Next, the fifth and second insulating layers are removed. Further, a dielectric layer is formed on the exposed surfaces of the first, second, and third conductive layers. Further, the counter electrode of the charge storage capacitor is formed by forming the fourth conductive layer on the surface of the dielectric layer.

According to yet another aspect of the present invention, the formation of the multiple insulating layers, the deposited layers, and the conductive layers further defines the extent of the branch-like conductive layers. Thus, while the trunk-like conductive layer is formed by the first conductive layer, another conductive layer forms at least two branch-like conductive layers, and each branch-like conductive layer is substantially parallel to each other;
One end is connected to the upper surface of the first conductive layer. All the remaining insulating layers exceeding the first insulating layer are removed, and a dielectric layer is formed on the exposed surfaces of the trunk-like conductive layer and the branch-like conductive layer.

[0016]

Other objects, features and advantages of the present invention will become apparent from the following detailed description of the preferred but non-limiting embodiments. The following description is made with reference to the accompanying drawings.

(Embodiment 1) A first embodiment of a semiconductor memory device having a tree-type charge storage capacitor according to the present invention will be described with reference to FIGS.

Referring to FIG. 2, the silicon substrate 1
0 is thermally oxidized by a LOCOS (silicon selective oxidation method) method, thereby forming a field oxide film 12 having a thickness of, for example, about 3000 angstroms. Next, by subjecting the silicon substrate 10 to a thermal oxidation process, a gate oxide film 14 having a thickness of, for example, about 150 Å is formed. Further, a polysilicon layer having a thickness of, for example, about 2000 Å is deposited on the entire surface of the silicon substrate 10 by chemical vapor deposition (CVD) or low pressure CVD (LPCVD). To achieve a low resistance polysilicon layer, for example, appropriate impurities such as phosphorus ions are implanted in the polysilicon layer. After the refractory metal layer is deposited on the polysilicon layer,
Preferably, the resistance of the polysilicon layer is further reduced by performing an annealing step to form polycide. This refractory metal may be tungsten (W),
The thickness is, for example, about 2000 angstroms.
Next, as shown in FIG. 2, the polycide is patterned to form gate electrodes (word lines) WL1 to WL4. Furthermore, for example, arsenic ions, for example, energy 70KeV and dose approximately 1 × 10 ¹⁵ atoms / cm
² implants into the silicon substrate 10. In this step, the word lines WL1 to WL4 are used as a mask layer. As a result, drain regions 16a and 16b and source regions 18a and 18b are formed on silicon substrate 10.

Next, FIG. 3 will be described. In the next step, an insulating layer 20 of, for example, borophosphosilicate glass (BPSG) is deposited by CVD to a thickness of, for example, about 7000 Å. Further, an etching protection layer 22 is formed by the same method,
For example, with a thickness of about 1000 Å,
A silicon nitride film may be used. After that, using the conventional photolithography and the etching method, the etching protection layer 2 is formed.
2, etching is performed on selected portions of the insulating layer 20 and the gate oxide film 14, and storage electrode contact holes 24a and 24b are formed from the upper surface of the etching protection layer 22 to the upper surfaces of the drain regions 16a and 16b. Next, a polysilicon layer 26 is deposited on the entire surface of the etching protection layer 22 by a CVD method. Polysilicon layer 26
For example, there is a method of implanting arsenic (As) ions into the polysilicon layer 26 to increase the conductivity of the polysilicon layer 26. As shown, the storage electrode contact holes 24a and 24a
b is filled with the polysilicon layer 26, and furthermore, the polysilicon layer 2 is formed so as to cover the surface of the etching protection layer 22.
6 are formed. Thereafter, over the entire surface of the polysilicon layer 26, a thick insulating layer 28 of, for example, silicon dioxide is deposited to a thickness of about 7000 Angstroms.

Referring now to FIG. 4, in the next step, an insulating layer and an anti-corrosion polysilicon layer are sequentially deposited by a CVD method. Thereafter, selected portions of the insulating layer and the anti-corrosion polysilicon layer are etched using conventional photolithography and etching methods, as shown in the figure, so that the integrated cylindrical insulating layers 30a and 30b and the anti-corrosion polysilicon layer are formed. 32a and 32b are formed. Insulating layers 30a and 30b may be, for example, silicon nitride layers deposited to a thickness of about 1000 angstroms.
In addition, the thickness of the anticorrosion polysilicon layers 32a and 32b may be, for example, about 1000 angstroms. Deposition layers 30a and 32a are formed by the combination of the insulating layer 30a and the anticorrosion polysilicon layer 32a, and this deposition layer is preferably located above the corresponding drain region 16a. Similarly, another deposited layer 30 is formed by the combination of the insulating layer 30b and the anticorrosion polysilicon layer 32b.
b and 32b are formed, and this deposition layer is also preferably located above the corresponding drain region 16b.

Referring now to FIG. 5, in the next step, silicon dioxide spacers 34a and 34b are formed on the sidewalls of the deposited layers 30a and 32a and 30b and 32b, respectively. In the present embodiment, the silicon dioxide spacers 34a and 34b can be formed through the following steps. First, a silicon dioxide layer,
For example, after depositing to a thickness of about 1000 angstroms, the silicon dioxide layer is etched back. Next, an insulating layer 36 such as a silicon nitride layer is deposited to a thickness of, for example, about 2000 angstroms by a CVD method. Further, the insulating layer 36 is polished by using a chemical mechanical polishing (CMP) method until the upper surfaces of the deposition layers 30a and 32a and 30b and 32b are exposed.

Referring now to FIG. 6, in the next step, the silicon dioxide spacers 34a and 34b are etched using the deposited layers 30a, 32a and 30b, 32b and the insulating layer 36 as a mask layer. Thereafter, the same deposition layers 30a, 32b and 30b, 32
b and the insulating layer 36 are used as a mask layer, and the insulating layer 28 is etched until the surface of the polysilicon layer 26 is exposed. Further, the anticorrosion polysilicon layer 32
a and 32b are used as mask layers, and the insulating layer 36 is removed. Thus, openings 38a and 38b
Is formed.

Referring to FIG. 7, in the next step,
Deposition layers 30a, 32a and 30b, 32b and insulating layer 2
8, a polysilicon layer 40, for example, about 100
It is deposited to a thickness of 0 Å and fills the openings 38a and 38b. In order to increase the conductivity of the polysilicon layer 40, for example, there is a method of implanting arsenic ions into the polysilicon layer 40. Next, the insulating layers 30a, 30
The polysilicon layer 40 and the anticorrosion polysilicon layer 32 are subjected to chemical mechanical polishing (CMP) until the upper surface of
a and 32b are polished.

Referring to FIG. 8, in the next step,
After removing the insulating layers 30a and 30b by wet etching using the polysilicon layer 40 as a mask layer,
The underlying insulating layer 28 is removed. Thereafter, the polysilicon layer 40, the insulating layer 28, and the polysilicon layer 26 are sequentially etched by conventional photolithography and etching to define the storage electrodes of the charge storage capacitors in each storage device. Through the above steps, the polysilicon layers 40 and 26 are formed in each section 4
0a, 40b and 26a, 26b. Next, wet etching is performed again on the wafer with the etching protection layer 22 as an etching end point, and the remaining portion of the insulating layer 28 is removed. The production of the storage electrode of the charge storage capacitor in the DRAM is completed as described above. FIG.
As shown in FIG. 5, each storage electrode includes a trunk-like polysilicon layer 26a / 26b and an L-shaped branch-like polysilicon layer 40a / 40b. Trunk-shaped polysilicon layers 26a and 26b are each formed of a DRAM.
Drain regions 16a and 16 of the transfer transistors
b, each having a T-shaped cross section. The branch-like polysilicon layers 40a, 40b
Although generally a hollow cylinder, the horizontal cross-section may be circular, rectangular, or any other shape, depending on the shape of each deposited layer 30a, 32a and 30b, 32b.

Branch-like polysilicon layers 40a and 4
0b is firstly a trunk-like polysilicon layer 26.
After extending a certain distance vertically upward from the upper surfaces of the a and 26b, they extend outward in the horizontal direction. Since the storage electrode of the capacitor of the present invention has such a specific shape, this storage electrode is hereinafter referred to as
The capacitor formed in this way is referred to as a “tree-type storage electrode”, and the capacitor thus formed is referred to as a “tree-type charge storage capacitor”.

Referring to FIG. 9, in the next step,
The dielectric films 42a and 42b respectively correspond to the storage electrodes 26.
a, 40a and 26b, 40b. The dielectric films 42a and 42b can be formed of, for example, silicon dioxide, silicon nitride, NO (silicon nitride / silicon dioxide), and ONO (silicon dioxide / silicon nitride / silicon dioxide).
Next, the polysilicon counter electrode 44 is
a, 42b are formed on the surface. The step of forming the counter electrode 44 includes a first step of depositing a polysilicon layer to a thickness of, for example, about 1000 angstroms by CVD, and a second step of diffusing N-type impurities into the polysilicon layer to increase the conductivity. And a third step of etching a selected portion of the polysilicon layer by a conventional photolithography and etching method. From the above,
The fabrication of the tree-type charge storage capacitor in the DRAM is completed.

Although not shown in FIG. 9, in order to complete the manufacture of the DRAM chip, the bit line manufacturing process, the pad bonding process, the interconnection process, the passivation process, and the package process are successively performed. Have to go through. However, since each of these steps includes only the prior art and deviates from the spirit and scope of the present invention, a detailed description thereof will be omitted here.

(Embodiment 2) In the above-described first embodiment, the trunk-like polysilicon layer has an integral structure having a T-shaped cross section. In the following embodiments, another manufacturing method is used to form a storage electrode having another structure in which the trunk-like polysilicon layer has a hollow structure, and increase the surface area of the storage electrode.

FIGS. 10 to 14 show a second embodiment of a semiconductor memory device having a tree type charge storage capacitor according to the present invention. The semiconductor memory device of the present embodiment can be manufactured by the second preferred manufacturing method of the semiconductor memory device according to the present invention.

The tree-type storage electrode according to the second embodiment comprises:
It is based on the wafer structure of FIG. 2, but uses another manufacturing method for making a DRAM storage electrode with another structure. Elements in FIGS. 10 to 14 that are the same as those in FIG. 2 have the same reference numerals.

FIG. 10 will be described with reference to FIG. CV
By the method D, for example, the insulating layer 46 such as BPSG is
Deposit to a thickness of 000 angstroms. Next, for example, an etching protection layer 48 of
Deposited to a thickness of 000 angstroms. afterwards,
Using a conventional photolithography and etching method, etching is sequentially performed on selected portions of the etching protection layer 48, the insulating layer 46, and the gate oxide film 14,
Storage electrode contact hole 50 extending from the upper surface of etching protection layer 48 to the upper surfaces of drain regions 16a and 16b.
a and 50b are formed. Next, the polysilicon layer 52
Is deposited on the etching protection layer 48. Further, a thick insulating layer 54, such as, for example, a silicon dioxide layer, is deposited on the surface of the polysilicon layer 52 to a thickness of about 7000 angstroms. Here, the insulating layer and the anticorrosion polysilicon layer are sequentially deposited on the insulating layer 54 again by the CVD method, and then the insulating layer and the anticorrosion polysilicon layer are formed by a conventional photolithography and etching method. Are formed, and as shown, an insulating layer 56 and an anti-corrosion polysilicon layer 58 are formed. The insulating layer 56
For example, it may be a silicon nitride layer, for example, deposited to a thickness of about 1000 angstroms. The combination of the insulating layer 56 and the anticorrosion polysilicon layer 58 allows the deposition layer 5
6, 58 are formed, this deposited layer is preferably located on top between two adjacent charge storage capacitors.

Referring to FIG. 11, in the next step, silicon dioxide spacers 60a and 60b are formed on the sidewalls of the deposition layers 56 and 58, respectively. In the present embodiment, first, a first step of depositing a silicon dioxide layer to a thickness of about 1000 angstroms, and then a second step of etching back the silicon dioxide layer,
Silicon dioxide spacers 60a and 60b can be formed. Thereafter, an insulating layer 62 such as a silicon nitride layer is deposited to a thickness of about 2000 Å by a CVD method. Further, the insulating layer 6 is removed by CMP until at least the upper surfaces of the deposition layers 56 and 58 are exposed.
Polish 2

Referring now to FIG. 12, in the next step, silicon dioxide spacers 60a and 60b are removed by etching by using deposited layers 56, 58 and insulating layer 62 as an etching mask layer. Thereafter, the deposited layers 56 and 58 and the insulating layer 62 are used again as an etching mask layer, and the polysilicon layer 5 is used.
Etching is performed on the insulating layer 54 until the surface of the insulating layer 54 is reached. Further, the insulating layer 62 is removed by etching using the anticorrosion polysilicon layer 58 as an etching mask layer. Thus, openings 64a and 64
b is formed.

Referring further to FIG. 13, for example, a polysilicon layer 66 having a thickness of about 1000 Å is deposited on the surfaces of the deposition layers 56, 58 and the insulating layer 54, and further fills the openings 64a and 64b. I do. Next, the polysilicon layer and the anticorrosion polysilicon layer 58 are polished by the CMP method until at least the upper surface of the insulating layer 56 is exposed, and the polysilicon layers 66a and 66 are polished.
b is formed. To increase the conductivity of the polysilicon layer, for example, arsenic ions can be implanted in the polysilicon layer.

Referring now to FIG. 14, in the next step, the polysilicon layers 66a and 66b are used as a mask layer, and a wet etching process is performed to form the insulating layer 56.
And the insulating layer 54 thereunder are sequentially removed. Thereafter, the polysilicon layers 66a and 66b and the polysilicon layer 52 are formed by a conventional photolithography and etching method.
To define the storage electrodes of the charge storage capacitors in each storage device. The polysilicon layers 66a and 66b are etched at portions above the respective drain regions 16a and 16b. In addition, the polysilicon layer 52 has the drain regions 16a, 16
The space between b is etched. Through the above steps, the polysilicon layers 66a, 66b, and 52 become the sections 66a, 6
6b and 52a, 52b. Further, the wet etching process is performed again on the wafer with the etching protection layer 48 as the etching end point, and the remaining portion of the insulating layer 54 is removed. Manufacturing of the storage electrode of the charge storage capacitor in the DRAM is completed as described above. As shown in FIG. 14, the storage electrode is a trunk-like polysilicon layer 52a.
/ 52b and a branch-like polysilicon layer 66a / 66b having an L-shaped cross section. Trunk-shaped polysilicon layers 52a and 52b are electrically connected to drain regions 16a and 16b of the transfer transistors in the DRAM, respectively, and have a U-shaped cross section. The branch-like polysilicon layers 66a, 66b are generally hollow cylinder shaped, but the horizontal cross-section may be circular, rectangular, or other shapes. Branch-like polysilicon layers 66a, 6
6b, first, a trunk-like polysilicon layer 52a,
After extending vertically from the upper peripheral surface of 52b by a certain distance, it extends horizontally inward. Subsequent processing steps are not different from the conventional steps, and thus are omitted here.

(Embodiment 3) In the above-described first and second embodiments, the branch-like electrode layer having an L-shaped cross section is provided. Two L-shaped branches are formed in the cross section of the branch-like electrode layer. However, the present invention is not limited to such a shape, and the number of L-shaped branches seen in the cross section of the branch electrode layer may be only one. In the following embodiments, a storage electrode including a branch-shaped electrode having only one L-shaped branch will be described.

FIG. 15 shows a third embodiment of the semiconductor memory device provided with the tree-type charge storage capacitor according to the present invention. The semiconductor memory device of the present embodiment can be manufactured by the third preferred method of manufacturing a semiconductor memory device according to the present invention.

The tree-type storage electrode according to the third embodiment comprises:
It is based on the wafer structure of FIG. 13, but uses another manufacturing method for making a DRAM storage electrode with another structure. Elements in FIG. 15 that are the same as those in FIG. 13 are given the same reference numerals.

Next, FIG. 13 will be described with reference to FIG. Using the polysilicon layers 66a and 66b as mask layers, the insulating layer 56 and the underlying insulating layer 54 are sequentially removed by wet etching. Thereafter, the polysilicon layers 66a, 66b and the polysilicon layer 52 are etched using conventional photolithography and etching techniques to define the storage electrodes of the charge storage capacitors in each storage device. Further, the polysilicon layers 66a and 66b are etched to remove the vertical ends of the respective layers. next,
The polysilicon layer 52 is etched to remove a portion between the drain regions 16a and 16b. Through the above steps, the polysilicon layer 52 is divided into sections 52a and 52b and the polysilicon layers 66a and 66
6b has a shape in which only one end is connected to the polysilicon layers 52a and 52b. Next, wet etching is performed again using the etching protection layer 48 as an etching end point, and the remaining insulating layer 54 is removed. Manufacturing of the storage electrode of the charge storage capacitor in the DRAM is completed as described above. As shown in FIG. 15, the storage electrode comprises a trunk-like polysilicon layer 52a / 52b and a branch-like polysilicon layer 66a / 66 having an L-shaped cross section.
b. A trunk-like polysilicon layer 52a,
52b is electrically connected to the drain regions 16a and 16b of the transfer transistors in the DRAM, respectively,
It has a letter-shaped cross section. Branched polysilicon layer 6
6a, 66b each have only one branch having an L-shaped cross-section and initially extend vertically upward a fixed distance from the upper peripheral edge of the trunk-like polysilicon layers 52a, 52b. After that, it extends horizontally toward another peripheral edge of each trunk-like polysilicon layer 52a, 52b. Subsequent processing steps are omitted here because they are not different from the conventional steps.

(Embodiment 4) In the first, second and third embodiments, the storage electrode has only one branch-like electrode layer having an L-shaped cross section. However, the number of branch-like electrode layers having an L-shaped cross section is not limited to one, and may be two, three, or more for each storage electrode. In the embodiment described below, a storage electrode including two branch-like electrode layers each having an L-shaped cross section will be described.

FIGS. 16 to 19 show a fourth embodiment of the semiconductor memory device provided with the tree-type charge storage capacitor according to the present invention. The semiconductor memory device of the present embodiment can be manufactured by the fourth preferred method of manufacturing a semiconductor memory device according to the present invention.

The tree-type storage electrode according to the fourth embodiment comprises:
It is based on the wafer structure of FIG. 7, but uses another manufacturing method for making a DRAM storage electrode with another structure. Elements in FIGS. 16 to 19 that are the same as those in FIG. 7 have the same reference numerals.

FIG. 7 will be described with reference to FIG. In the next step, the insulating layers 30a and 30b are removed by wet etching using the polysilicon layer 40 as a mask layer. Thereafter, an insulating layer 68 of, for example, silicon dioxide is deposited on the surfaces of the polysilicon layer 40 and the insulating layer 28. Next, on the surface of the insulating layer 68, an insulating layer and an anticorrosion polysilicon layer are sequentially deposited. Using conventional photolithography and etching techniques, the insulating layer and the anti-corrosion polysilicon layer are defined, and as shown, insulating layers 70a and 70b and anti-corrosion polysilicon layers 72a and 72b are formed. . Insulating layers 70a and 70b may be, for example, silicon nitride layers deposited to a thickness of about 1000 Angstroms. Anticorrosion polysilicon layers 72a and 72b
Is deposited, for example, to a thickness of about 1000 angstroms. Deposition layers 70a and 72a are formed by the insulating layer 70a and the anticorrosion polysilicon layer 72a, and this deposition layer is preferably located above the corresponding drain region 16a. Similarly, another deposition layer 70b, 72b is formed by the insulating layer 70b and the anticorrosion polysilicon layer 72b, and this deposition layer is preferably located above the corresponding drain region 16b. Next, the deposition layer 70a,
Silicon dioxide spacers 74a and 74b are formed on each side wall of 72a and 70b and 72b. In this embodiment, first, a silicon dioxide layer is formed, for example, by about 1 μm.
A first step of depositing to a thickness of 000 angstroms;
Next, a second step of performing an etching back process on the silicon dioxide layer allows the silicon dioxide spacer 74a to be formed.
And 74b can be formed.

Next, referring to FIG. 17, in the next step, an insulating layer 76 of, for example, silicon nitride is deposited to a thickness of about 2000 angstroms by the CVD method. Next, until at least the upper surfaces of the deposition layers 70a, 72a and 70b, 72b are exposed by the CMP method,
The insulating layer 76 is polished. Then, the deposition layers 70a and 72a
And 70b, 72b and insulating layer 76 as etching mask layers, and silicon dioxide spacers 74a and 7b.
4b is removed by etching. Further, the deposition layer 7
0a, 72a and 70b, 72b and the insulating layer 76 are again used as an etching mask layer, and the polysilicon layer 26
The insulating layers 68 and 28 are etched until they reach the surface of the substrate, and openings 78a and 78b are formed.

Referring to FIG. 18, in the next step, the insulating layer 76 is removed by etching using the anticorrosion polysilicon layers 72a and 72b as an etching mask layer. Next, the deposition layers 70a, 72a and 70
a polysilicon layer 80 is deposited to a thickness of, for example, about 1000 angstroms on the surfaces of the insulating layers 68 and 72b,
Openings 78a and 78b are also filled. In order to increase the conductivity of the polysilicon layer 80, for example, there is a method of implanting arsenic ions in the polysilicon layer 80. Further, C
By the MP method, the polysilicon layer 80 and the anticorrosion polysilicon layers 72a and 72b are polished until at least the upper surfaces of the insulating layers 70a and 70b are exposed. Next, using the polysilicon layer 80 as a mask layer, the insulating layers 70a and 70b and the underlying insulating layers 68 and 28 are sequentially removed by wet etching.

Referring to FIG. 19, in the next step, the polysilicon layer 80, the insulating layer 68, the polysilicon layer 40, the insulating layer 28, and the polysilicon layer 2 are formed by using the conventional photolithography and the etching method.
6 are sequentially etched to define the storage electrodes of the charge storage capacitors in each storage device. That is, through the above steps, the polysilicon layers 80, 40, and 26
Are, as shown, sections 80a, 80b, 40
a, 40b and 26a, 26b. Next, using the etching protection layer 22 as an etching end point, the remaining insulating layers 68 and 28 are removed by a wet etching method. Manufacturing of the storage electrode of the charge storage capacitor in the DRAM is completed as described above. As shown in FIG. 19, this storage electrode is
a / 26b and two branched polysilicon layers 80a / 80b and 40a / 40b each having an L-shaped cross section.
Is provided. Trunk-like polysilicon layers 26a, 2
6b is electrically connected to the drain regions 16a and 16b of the transfer transistors in the DRAM, respectively, and has a T-shaped cross section. The two branch-like polysilicon layers 80a, 80b and 40a, 40b are generally parallel to each other, have a hollow cylindrical shape, and may have a circular, rectangular or other horizontal cross section.
Branch-like polysilicon layers 80a, 80b, and 40
a and 40b are polysilicon layers 26a and 26, respectively.
b extends vertically upward by a certain distance from the upper surface of b, and then extends horizontally outward. Subsequent processing steps are omitted here because they are not different from the conventional steps. If more than one branch-like electrode layer is required, additional branches can be made by repeating the formation of the deposited layer according to the steps described in this embodiment.

(Embodiment 5) In the first to fourth embodiments, the cross sections of the branch electrode layers of the storage electrodes are all L-shaped. However, the invention is not limited to this shape. Various other cross-sectional shapes can be used for the branch electrode layer of the storage electrode. In the following embodiments, one of the branch electrode layers of the storage electrode has an L-shaped cross section, while the other branch electrode layer has a T-shaped cross section.

FIGS. 20 and 21 show a fifth embodiment of a semiconductor memory device having a tree-type charge storage capacitor according to the present invention. The semiconductor memory device of the present embodiment can be manufactured by the fifth preferred method of manufacturing a semiconductor memory device according to the present invention.

The tree-type storage electrode according to the fifth embodiment comprises:
It is based on the wafer structure of FIG. 7, but uses a different manufacturing method for making a DRAM storage electrode with a different structure. Elements of FIGS. 20 and 21 that are the same as those of FIG. 7 have the same reference numerals.

Referring to FIG. 7 together with FIG. 20, in the next step, the polysilicon layers 40 are used as mask layers, and the insulating layers 30a and 30a are formed by wet etching.
b is removed. Further, an insulating layer 82 such as a silicon dioxide layer is deposited on the surfaces of the insulating layer 28 and the polysilicon layer 40 by the CVD method. Thereafter, the insulating layer 82 is formed by conventional photolithography and etching until it reaches the surface of the polysilicon layer 26.
And a selected portion of the insulating layer 28 are sequentially etched, thereby forming openings 84a and 84b. Openings 84a and 84b are preferably located above corresponding drain regions 16a and 16b, respectively. Next, a polysilicon layer 86 is deposited on the surface of the insulating layer 82 to a thickness of, for example, about 1000 angstroms by the CVD method to fill the openings 84a and 84b. In order to increase the conductivity of the polysilicon layer 86, for example, there is a method of implanting arsenic ions in the polysilicon layer 86.

Referring now to FIG. 21, in the next step, the polysilicon layer 86, the insulating layer 82, the polysilicon layer 40, the insulating layer 28, and the polysilicon layer 26 are formed by the conventional photolithography and etching method.
Are sequentially etched to define the storage electrodes of the charge storage capacitors in each storage device. Through the above steps, as shown, the polysilicon layers 86, 40, and 26 are formed into sections 86a, 86b, 40a, 40
b, and 26a, 26b. Next, wet etching is performed using the etching protection layer 22 as an etching end point, and the insulating layers 82 and 28 are removed.
Thus, the manufacture of the storage electrode of the charge storage capacitor in the DRAM is completed. As shown in FIG. 21, the storage electrode includes a trunk-like polysilicon layer 26a / 26b, a branch-like polysilicon layer 40a / 40b having an L-shaped cross section, and another branch-like polysilicon layer 86a / having a T-shaped cross section. 80
b. Trunk-like polysilicon layer 26
a and 26b are electrically connected to the drain regions 16a and 16b of the transfer transistors in the DRAM, respectively, and have a T-shaped cross section. The L-shaped branch polysilicon layers 40a and 40b have a generally hollow cylindrical shape, but the horizontal cross section may be circular, rectangular, or other shapes. Branch-like polysilicon layer 40a
And 40b comprise trunk-like polysilicon layers 26a and 2b.
6b extends vertically upward by a certain distance from the upper surface, and then extends horizontally outward. The vertical sections of the branch-like polysilicon layers 86a and 86b are generally hollow cylinder shaped, but the horizontal cross section may be circular, rectangular, or other shapes. The branch-like polysilicon layers 86a and 86b extend vertically upward by a certain distance from the upper surfaces of the trunk-like polysilicon layers 26a and 26b, and then extend outward in the horizontal direction.

(Embodiment 6) In the following sixth embodiment, a storage electrode having another structure is formed by using another method. The structure of the storage electrode of this embodiment is very similar to that of the fifth embodiment. The difference lies in the branch-like polysilicon layer, which is similar to that of the fifth embodiment.
Instead of using a character-shaped cross section, a columnar structure is used in the present embodiment.

The tree-type storage electrode according to the sixth embodiment comprises:
Although based on the wafer structure of FIG. 20, a DRAM storage electrode having another structure is manufactured by another manufacturing method. Elements in FIG. 22 that are the same as those in FIG. 20 have the same reference numerals.

FIG. 20 will be described together with FIG. C
By the MP method, the polysilicon layer 86 is polished until at least the upper surface of the insulating layer 82 is exposed.
Columnar polysilicon layers 88a and 88b are formed. Next, wet etching is performed using the polysilicon layer 40 as a mask layer to remove exposed portions of the insulating layer 82 and the insulating layer 28. Further, selected portions of the polysilicon layer 40, the insulating layer 28, and the polysilicon layer 26 are sequentially etched by the conventional photolithography and etching until the surface of the etching protection layer 22 is exposed. This defines the storage electrodes of the charge storage capacitors in each storage device. Through the above steps,
As shown, the polysilicon layers 40 and 26
It is divided into sections 40a, 40b and 26a, 26b. Next, wet etching is performed again using the etching protection layer 22 as an etching end point, and the insulating layer 28 is removed. Manufacturing of the storage electrode of the charge storage capacitor in the DRAM is completed as described above. As shown in FIG. 22, the storage electrode is a trunk-like polysilicon layer 26a.
/ 26b, one branch-like polysilicon layer 40a / 40b having an L-shaped cross section, and a columnar branch-like polysilicon layer 88a / 88b. Trunk-shaped polysilicon layers 26a and 26b are electrically connected to drain regions 16a and 16b of transfer transistors in the DRAM. The branch-like polysilicon layers 40a and 40b with the L-shaped structure are generally hollow cylindrical, but the horizontal cross section may be circular, rectangular or other shapes. Branch-like polysilicon layers 40a and 40b form trunk-like polysilicon layers 26a and 26b.
After extending a certain distance vertically upward from the upper surface of b,
It extends horizontally outward. The columnar branch-like polysilicon layers 88a and 88b extend vertically upward from the upper surface of the trunk-like polysilicon layer 26a,
The horizontal cross section may be circular, rectangular, or other shapes.

(Embodiment 7) In the first to sixth embodiments, the bottom surface of the horizontal portion of the trunk-like polysilicon layer is in contact with the etching protection layer, and the CMP is performed.
The removal of the polysilicon layer above the deposition layer and the sectioning were performed. However, the present invention is not limited to this content. In the embodiments described below, the bottom surface of the horizontal portion of the trunk-like polysilicon layer is separated from the underlying etching protection layer, so that the storage electrode has a large surface area. In addition, alternative techniques are described herein, such as dividing the polysilicon layer overlying the deposition layer using conventional photolithography and etching techniques.

FIGS. 23 to 27 show a seventh embodiment of a semiconductor memory device provided with a tree-type charge storage capacitor according to the present invention. The semiconductor memory device of the present embodiment is manufactured by the seventh preferred method of manufacturing a semiconductor memory device according to the present invention.

The tree-type storage electrode according to the seventh embodiment comprises:
A DRAM storage electrode with a different structure, based on the wafer structure of FIG. 2 but with a different manufacturing method, is fabricated.
Elements in FIGS. 23 to 27 that are the same as those in FIG. 2 have the same reference numerals.

Referring to FIG. 2 together with FIG.
The insulating layer 90, the etching protection layer 92, and the insulating layer 94 are deposited by the VD method. For example, the insulating layer 90
BPS deposited to a thickness of about 7000 angstroms
It may be a G layer. For example, the etching protection layer 92
May be a silicon nitride layer deposited to a thickness of about 1000 angstroms. For example, the insulating layer 94 has a thickness of about 10
It may be a layer of silicon dioxide deposited to a thickness of 00 Angstroms. Thereafter, the insulating layer 94, the etching protection layer 92, the insulating layer 90, and the gate oxide film 14 are sequentially and selectively etched by conventional photolithography and etching. As a result, storage electrode contact holes 96a and 96b are formed. The storage electrode contact holes 96a and 96b are
From the top surface of the drain region 16a and 16b
Extending to the upper surface of. Next, a polysilicon layer is deposited on the surface of the insulating layer 94, and the storage electrode contact holes 96a and 96b are filled. Thereafter, a polysilicon layer is again defined by conventional photolithography and etching, and a polysilicon layer 98 is formed as shown. To increase the conductivity of the polysilicon layer, for example, arsenic ions are implanted in the polysilicon layer. As shown in FIG. 23, the storage electrode contact holes 96a and 96b are filled with the polysilicon layer 98, and the surface of the insulating layer 94 is further covered. next,
On the surface of the polysilicon layer 98, an insulating layer 100 such as, for example, silicon dioxide is deposited to a thickness of about 7000 angstroms.

Referring to FIG. 24, in the next step, an insulating layer and an anti-corrosion polysilicon layer are sequentially deposited on the surface of the insulating layer 100. Further, the insulating layer and the anticorrosion polysilicon layer are defined by conventional photolithography and etching methods, and as shown, integral cylinder type insulating layers 102a and 102b and anticorrosion polysilicon layers 104a and 104b are formed. . Insulating layers 102a and 102b and anticorrosion polysilicon layer 104
The horizontal cross-section of a and 104b may be circular, rectangular, or other shapes. The insulating layers 102a and 102b
For example, a silicon nitride layer deposited to a thickness of about 1000 angstroms. Anticorrosion polysilicon layer 10
4a and 104b are deposited, for example, to a thickness of about 1000 angstroms. The insulating layer 102a includes the deposition layers 102a, 104 together with the anticorrosion polysilicon layer 104a.
a, but this deposition layer is preferably located above the corresponding drain region 16a. Similarly, the insulating layer 102b forms the deposition layers 102b and 104b together with the anticorrosion polysilicon layer 104b.
Preferably, it is located above the corresponding drain region 16b. Next, the deposition layers 102a, 104a, and 10
Silicon dioxide spacers 106a and 106b are formed on the side walls of 2b and 104b, respectively. In this embodiment, the silicon dioxide spacers 106a and 106b are formed through a first step of depositing a silicon dioxide layer to a thickness of, for example, about 1000 angstroms and a second step of etching back the silicon dioxide layer. Can be formed. Thereafter, an insulating layer 108 such as a silicon nitride layer is deposited to a thickness of about 2000 Å by a CVD method. Further, the deposited layers 102a, 104a, and 102b,
The insulating layer 108 is polished until at least the upper surface of 4b is exposed.

Referring now to FIG. 25, in the next step, the deposited layers 102a, 104a and 102b, 1
04b and insulating layer 108 as etching mask layers, silicon dioxide spacers 106a and 106b
Is removed by etching. Further, using the same deposited layers 102a, 104a, and 102b, 104b and the insulating layer 108 as an etching mask, the insulating layer 100 is etched until reaching the surface of the polysilicon layer 98. Next, the anticorrosion polysilicon layer 10
The insulating layer 108 is removed by etching using 4a and 104b as an etching mask. Thus, openings 110a and 110b are formed.

Referring now to FIG. 26, in the next step, the deposited layers 102a, 104a and 102b,
104b and the polysilicon layer 1 on the surface of the insulating layer 100.
12 is deposited, for example, to a thickness of about 1000 angstroms, and further fills openings 100a and 110b. To increase the conductivity of the polysilicon layer 112,
For example, arsenic ions are implanted in the polysilicon layer 112. Thereafter, the polysilicon layer 112 and the anticorrosion polysilicon layers 104a and 104b are defined by conventional photolithography and etching. As a result, the upper portions of the insulating layers 102a and 102b are divided,
The structure as shown is formed.

Referring to FIG. 27, in the next step, the polysilicon layer 112 and the anticorrosion polysilicon layer 1 are formed.
Using the masks 04a and 104b as mask layers, the insulating layers 102a and 102b and the insulating layer 100 thereunder are sequentially removed by wet etching. Thereafter, the polysilicon layer 112, the insulating layer 100, and the polysilicon layer 98 are sequentially etched by conventional photolithography and etching to define the storage electrodes of the charge storage capacitors of each storage device. Through the above steps, the polysilicon layers 112 and 98 become the section 1
12a, 112b and 98a, 98b. Next, using the etching protection layer 92 as an etching end point, wet etching is performed again to remove the insulating layers 100 and 94. Manufacturing of the storage electrode of the charge storage capacitor in the DRAM is completed as described above. FIG.
As shown in FIG. 7, the storage electrode includes a trunk-like polysilicon layer 98a / 98b and a branch-like polysilicon layer 112a / 112b having a T-shaped cross section. Trunk-shaped polysilicon layers 98a and 98b are electrically connected to drain regions 16a and 16b of transfer transistors in the DRAM. A certain distance is maintained between the lower surface of the horizontal portion of the trunk-like polysilicon layer and the upper surface of the etching protection layer 92, thereby increasing the surface area of the storage electrode. Branch-like polysilicon layer 112
Although a and 112b are generally hollow cylinder shaped, their horizontal cross section may be circular, rectangular, or other shapes. Branch-like polysilicon layers 112a and 112a
12b extends vertically upward by a certain distance from the upper surfaces of the trunk-like polysilicon layers 98a and 98b, and further extends horizontally outward.

Although the embodiments disclosed above can be used alone, it is possible to form storage electrodes having various sizes and shapes in one DRAM chip by combining them. It will be clear to those skilled in the art. All such modifications are intended to be included within the scope of the present invention.

In the accompanying drawings, the drain of the transfer transistor of the present invention is based on the diffusion region of the silicon substrate, but other modifications, for example, a trench type drain region are also possible.

The components in the accompanying drawings are schematically illustrated for explanation, and do not indicate actual scales. The shapes, dimensions, and extension angles of the illustrated components of the invention are not limiting with respect to the scope of the invention.

Although the present invention has been described with reference to preferred embodiments and illustrations, it is clear that the invention is not limited to the disclosed embodiments. Rather, as will be apparent to those skilled in the art, the present invention is intended to cover within its scope a wide variety of modifications and similar variations.
Therefore, the appended claims should be interpreted in the broadest sense so as to cover all of the various modifications as well as similar variations.

[Brief description of the drawings]

FIG. 1 is a circuit diagram showing a memory cell of a DRAM device.

FIGS. 2A and 2B are cross-sectional views showing a first embodiment of a semiconductor memory device according to the present invention and a method of manufacturing the same according to the present invention (part 1).

FIG. 3 is a sectional view of the semiconductor memory device according to the first embodiment of the present invention and a method for manufacturing the same according to the present invention (part 2);

FIG. 4 is a sectional view of the semiconductor memory device according to the first embodiment of the present invention and the manufacturing method thereof according to the present invention (part 3);

FIG. 5 is a sectional view of the semiconductor memory device according to the first embodiment of the present invention and the manufacturing method thereof according to the present invention (part 4).

FIG. 6 is a sectional view of the semiconductor memory device according to the first embodiment of the present invention and the manufacturing method thereof according to the present invention (part 5).

FIG. 7 is a sectional view of the semiconductor memory device according to the first embodiment of the present invention and the manufacturing method thereof according to the present invention (part 6).

FIG. 8 is a sectional view of the semiconductor memory device according to the first embodiment of the present invention and the manufacturing method thereof according to the present invention (part 7).

FIG. 9 is a sectional view of the semiconductor memory device according to the first embodiment of the present invention and the manufacturing method thereof according to the present invention (step 8).

FIG. 10 is a sectional view of the semiconductor memory device according to the second embodiment of the present invention and the manufacturing method thereof according to the present invention (part 1).

FIG. 11 is a sectional view of the semiconductor memory device according to the second embodiment of the present invention and a manufacturing method thereof according to the present invention (part 2);

FIG. 12 is a sectional view of the semiconductor memory device according to the second embodiment of the present invention and a manufacturing method thereof according to the present invention (Part 3).

FIG. 13 is a sectional view showing the second embodiment of the semiconductor memory device according to the present invention and the manufacturing method thereof according to the present invention (part 4).

FIG. 14 is a sectional view of the semiconductor memory device according to the second embodiment of the present invention and the manufacturing method thereof according to the present invention (step 5).

FIG. 15 is a sectional view showing a third embodiment of the semiconductor memory device according to the present invention and a method for manufacturing the same according to the present invention.

FIG. 16 is a sectional view of the fourth embodiment of the semiconductor memory device according to the present invention and a step-by-step view showing the manufacturing method thereof according to the present invention (part 1).

FIG. 17 is a sectional view of a semiconductor memory device according to a fourth embodiment of the present invention and a manufacturing method thereof according to the present invention (part 2);

FIG. 18 is a sectional view of the semiconductor memory device according to the fourth embodiment of the present invention and a manufacturing method thereof according to the present invention (part 3).

FIG. 19 is a sectional view of the fourth embodiment of the semiconductor memory device according to the present invention and a step-by-step view showing the method of manufacturing the same according to the present invention (part 4).

FIG. 20 is a sectional view of the semiconductor memory device according to the fifth embodiment of the present invention and the manufacturing method thereof according to the present invention (step 1).

FIG. 21 is a sectional view showing the fifth embodiment of the semiconductor memory device according to the present invention and the manufacturing method thereof according to the present invention (part 2).

FIG. 22 is a sectional view showing a sixth embodiment of the semiconductor memory device according to the present invention and a method for manufacturing the same according to the present invention;

FIG. 23 is a sectional view of the seventh embodiment of the semiconductor memory device according to the present invention and a step-by-step view showing the manufacturing method thereof according to the present invention (part 1);

FIG. 24 is a sectional view showing the seventh embodiment of the semiconductor memory device according to the present invention and the manufacturing method thereof according to the present invention (part 2).

FIG. 25 is a sectional view showing the seventh embodiment of the semiconductor memory device according to the present invention and the manufacturing method thereof according to the present invention (part 3).

FIG. 26 is a sectional view showing the seventh embodiment of the semiconductor memory device according to the present invention and the manufacturing method thereof according to the present invention (part 4).

FIG. 27 is a sectional view showing the seventh embodiment of the semiconductor memory device according to the present invention and the manufacturing method thereof according to the present invention (part 5).

[Explanation of symbols]

 Reference Signs List 10 silicon substrate 16 drain region 20 insulating layer 22 etching protection layer 26 polysilicon layer 28 insulating layer 40 polysilicon layer 42 dielectric film 52 polysilicon layer 66 polysilicon layer 80 polysilicon layer 86 polysilicon layer 88 polysilicon layer 98 poly Silicon layer 112 Polysilicon layer

Claims (51)

[Claims] 1. A method for manufacturing a semiconductor memory device comprising: a substrate; a transfer transistor formed on the substrate; and a charge storage capacitor electrically connected to a source / drain region of the transfer transistor. Forming a first insulating layer on the substrate and covering the transfer transistor; and (b) a step of penetrating at least the first insulating layer and electrically connected to the source / drain region of the transfer transistor. (E) forming a first conductive layer; (c) forming a second insulating layer on the first conductive layer; (d) forming a deposited layer above the second conductive layer; Forming a third insulating layer on a side wall of the deposition layer; (f) forming a fourth insulating layer on exposed surfaces of the second and third insulating layers; and (g) the first conductive layer. Exposed part of the surface of In,
Forming an opening by removing the third and fourth insulating layers and a part of the second insulating layer below the third insulating layer; and (h) forming the opening layer and the second insulating layer. Forming a second conductive layer on the surface of the layer and filling the opening; (i) removing a portion of the second conductive layer above the deposited layer; and (j) the deposited layer. And (k) removing said second layer under an area where said deposited layer is located.
Exposing a surface of the first conductive layer by removing a part of an insulating layer; and (l) connecting a first end of the second conductive layer to an upper surface of the first conductive layer. Defining a range of the first and second conductive layers, a trunk-like conductive layer is formed by the first conductive layer, a branch-like conductive layer is formed by the second conductive layer, and further, the first conductive layer (C) removing the remaining portion of the second insulating layer; (n) removing the remaining portion of the second insulating layer; and (n) removing the remaining portion of the second insulating layer. (2) forming a dielectric layer on the exposed surface of the conductive layer; and (o) forming a third conductive layer on the surface of the dielectric layer and forming a counter electrode of the charge storage capacitor. A method for manufacturing a semiconductor memory device, comprising: 2. The method according to claim 1, wherein the trunk-like conductive layer has a T-shaped cross section. 3. The method according to claim 1, wherein the trunk-like conductive layer has a U-shaped cross section. 4. The method according to claim 1, wherein the branch-like conductive layer has a hollow cylindrical shape having an L-shaped cross section. 5. The branch-like conductive layer includes a first segment and a second segment, and the first segment extends vertically upward from an upper surface of the trunk-like conductive layer, and the second segment includes 5. The method according to claim 4, wherein the semiconductor memory device extends from an end of the first segment. 6. The semiconductor memory device according to claim 5, wherein said second segment of said branch-like conductive layer extends horizontally outward from said end of said first segment. Method. 7. The semiconductor memory device according to claim 5, wherein said second segment of said branch-like conductive layer extends horizontally inward from said end of said first segment. Production method. 8. The trunk-like conductive layer is connected to the first segment at a peripheral edge of the trunk-like conductive layer, and the second segment of the branch-like conductive layer is connected to the end of the first segment from the end of the first segment. 6. The method according to claim 5, wherein the trunk-like conductive layer extends horizontally toward a facing peripheral edge portion. 9. The method according to claim 3, wherein the step (b) forms a part of the first conductive layer having a U-shaped cross section. 10. The method according to claim 1, further comprising a step of forming an etching protection layer on the first insulating layer between the steps (a) and (b). A method for manufacturing a semiconductor storage device. 11. The method according to claim 1, wherein said step (i) comprises a chemical mechanical polishing (C
MP) method, the second
2. The method according to claim 1, further comprising a step of polishing and removing a part of the conductive layer. 12. The method according to claim 1, wherein the step (i) further includes a step of removing a part of the second conductive layer located above the deposition layer by etching.
6. The method for manufacturing a semiconductor memory device according to claim 1. 13. The step (d), in which a first film and a second film are sequentially formed on the second insulating layer, wherein the second film is made of a conductive material, and the first film is made of a conductive material. 2. The semiconductor memory device according to claim 1, comprising: a step of forming an insulating material; and a step of defining the first film and the second film and forming the deposition layer. Production method. 14. A step of forming an etching protection layer above the first insulating layer between the steps (a) and (b), and forming a fifth insulating layer over the entire etching protection layer. And the step (b).
Comprises a step of forming a first conductive layer penetrating the fifth insulating layer and the etching protection layer, and the step (m) further comprises a step of removing the fifth insulating layer. 2. The method for manufacturing a semiconductor memory device according to claim 1, wherein: 15. The method according to claim 15, wherein
2. The method of manufacturing a semiconductor memory device according to claim 1, wherein a method of manufacturing a predetermined branch-like conductive layer of the charge storage capacitor is defined. 3. ,
Further comprising fabricating at least one additional predetermined branch-like conductive layer, wherein the step (l) comprises connecting each first end of each predetermined branch-like conductive layer to the upper surface of the first conductive layer. Further defining each additional predetermined branch-like conductive layer such that an additional branch-like conductive layer is formed, wherein said step (m) includes removing any remaining portion of the insulating layer. 2. The method according to claim 1, further comprising the step of: forming a dielectric layer on an exposed surface of each of the additional branch-shaped conductive layers. . 16. The method according to claim 15, wherein the trunk-like conductive layer has a T-shaped cross section. 17. The method according to claim 15, wherein the trunk-like conductive layer has a U-shaped cross section. 18. The method according to claim 15, wherein the branch-like conductive layer has a hollow cylindrical shape having an L-shaped cross section. 19. The branch-like conductive layer includes a first segment and a second segment, wherein the first segment extends vertically upward from the top surface of the trunk-like conductive layer, and wherein the second segment is 19. The method according to claim 18, wherein the semiconductor memory device extends from an end of the first segment. 20. The method according to claim 19, wherein the second segment of the branch-like conductive layer extends horizontally outward from the end of the first segment. 21. The semiconductor memory device according to claim 19, wherein the second segment of the branch-like conductive layer extends horizontally inward from the end of the first segment. Method. 22. The first segment is connected to the trunk-like conductive layer at a peripheral edge of the trunk-like conductive layer, and the second segment of the branch-like conductive layer is connected to the end of the first segment. 20. The method of manufacturing a semiconductor memory device according to claim 19, wherein the semiconductor memory device extends horizontally from an edge of the trunk-like conductive layer toward an opposing peripheral edge. 23. The method according to claim 17, wherein the step (b) includes forming a part of the first conductive layer having a U-shaped cross section. . 24. The manufacturing of the semiconductor memory device according to claim 15, further comprising a step of forming an etching protection layer on the first insulating layer between the step (a) and the step (b). Method. 25. The method of claim 25, wherein the step (i) is performed by chemical mechanical polishing (C).
16. The method according to claim 15, further comprising a step of performing an MP) process to remove a portion of the second conductive layer located above the deposition layer by polishing. . 26. The method according to claim 1, wherein the step (i) further comprises a step of removing a part of the second conductive layer located above the deposition layer by etching.
6. The method for manufacturing a semiconductor memory device according to item 5. 27. A step of forming an etching protection layer above the first insulating layer between the steps (a) and (b), and forming a fifth insulating layer over the entire etching protection layer. And the step (b).
Comprises a step of forming a first conductive layer penetrating the fifth insulating layer and the etching protection layer, and the step (l) further comprises a step of removing the fifth insulating layer. The method of manufacturing a semiconductor memory device according to claim 15, wherein: 28. A method for manufacturing a semiconductor memory device comprising: a substrate; a transfer transistor formed on the substrate; and a charge storage capacitor electrically connected to a source / drain region of the transfer transistor. Forming a first insulating layer on the substrate and covering the transfer transistor; and (b) a step of penetrating at least the first insulating layer and electrically connected to the source / drain region of the transfer transistor. (E) forming a first conductive layer; (c) forming a second insulating layer on the first conductive layer; (d) forming a deposited layer above the second conductive layer; Forming a third insulating layer on a side wall of the deposition layer; (f) forming a fourth insulating layer on exposed surfaces of the second and third insulating layers; and (g) the first conductive layer. Part of the surface is exposed Until,
Forming an opening by removing the third and fourth insulating layers and a part of the insulating layer below the third insulating layer; and (h) forming an opening of the deposited layer and the second insulating layer. Forming a second conductive layer on the surface and filling the opening; (i) removing a portion of the second conductive layer above the deposited layer; and (j) removing the deposited layer. (K) forming a fifth insulating layer on the exposed surface of the second conductive layer and the second insulating layer; and (l) until a part of the surface of the first conductive layer is exposed. Forming a second opening by etching the fifth insulating layer; (m) forming a third conductive layer on the surface of the fifth insulating layer and in the second opening; (n) The third and first conductive layers are connected such that respective first ends of the third and second conductive layers are connected to the upper surface of the first conductive layer. Defining a range of layers, the trunk-like conductive layer is formed by the first conductive layer, the first by the second conductive layer 1
A branch-like conductive layer is formed, a second branch-like conductive layer is formed by the third conductive layer, and the first conductive layer, the second conductive layer, and the third conductive layer are combined to form the second conductive layer. A step of forming a storage electrode of a charge storage capacitor; (o) a step of removing a remaining portion of the fifth and second insulating layers; and (p) a first, second, and third conductive layers. (Q) forming a fourth conductive layer on the surface of the dielectric layer and forming a counter electrode of the charge storage capacitor. Of manufacturing a semiconductor memory device. 29. The method according to claim 28, wherein the trunk-like conductive layer has a T-shaped cross section. 30. The method according to claim 28, wherein the trunk-like conductive layer has a U-shaped cross section. 31. The method according to claim 28, wherein the branch-like conductive layer has a hollow cylindrical shape having an L-shaped cross section. 32. The branch-like conductive layer includes a first segment and a second segment, and the first segment extends vertically upward from an upper surface of the trunk-like conductive layer, and the second segment is 32. The method according to claim 31, wherein the method extends from an end of the first segment. 33. The second branch of the first branch-like conductive layer.
32. A segment extending horizontally outward from said end of said first segment.
6. The method for manufacturing a semiconductor memory device according to claim 1. 34. The second branch of the first branch-like conductive layer.
4. The segment of claim 1 wherein said segment extends horizontally inward from said end of said first segment.
2. The method for manufacturing a semiconductor memory device according to item 1. 35. The first segment is connected to the trunk-like conductive layer at a peripheral edge of the trunk-like conductive layer, and the second segment of the first branch-like conductive layer is connected to the end of the first segment. 32. The method of manufacturing a semiconductor memory device according to claim 31, wherein the semiconductor memory device extends horizontally from a portion toward an opposing peripheral edge of the trunk-shaped conductive layer. 36. The cross section of the second branch-like conductive layer is T
The method for manufacturing a semiconductor memory device according to claim 28, wherein the semiconductor memory device has a character shape. 37. The semiconductor memory device according to claim 28, wherein said second branch-like conductive layer has a columnar shape and extends vertically upward from said upper surface of said trunk-like conductive layer. Production method. 38. The method according to claim 30, wherein the step (b) includes forming a part of the first conductive layer having a U-shaped cross section. . 39. The method according to claim 28, further comprising a step of forming an etching protection layer on the first insulating layer between the steps (a) and (b). A method for manufacturing a semiconductor storage device. 40. In the step (i), a chemical mechanical polishing (C
MP) method, the second
29. The method of manufacturing a semiconductor memory device according to claim 28, further comprising a step of polishing and removing a part of the conductive layer. 41. The method according to claim 2, wherein the step (i) further includes a step of removing a part of the second conductive layer located above the deposition layer by etching.
9. The method for manufacturing a semiconductor memory device according to item 8. 42. In the step (d), in which a first film and a second film are sequentially formed on the second insulating layer, the second film is made of a conductive material, and the first film is made of a conductive material. 29. The semiconductor memory device according to claim 28, comprising: a step of forming an insulating material; and a step of defining the first film and the second film and forming the deposition layer. Production method. 43. A step of forming an etching protection layer above the first insulating layer between the steps (a) and (b), and forming a sixth insulating layer over the entire etching protection layer. And the step (b).
Comprises a step of forming a first conductive layer penetrating the sixth insulating layer and the etching protection layer, and the step (o) further comprises a step of removing the sixth insulating layer. The method for manufacturing a semiconductor memory device according to claim 28, wherein: 44. The method according to claim 44, wherein
2. The method of manufacturing a semiconductor memory device according to claim 1, wherein a method of manufacturing a predetermined branch-like conductive layer of the charge storage capacitor is defined. 3. ,
Further comprising fabricating at least one additional predetermined branch-like conductive layer, wherein said step (n) comprises connecting each first end of each predetermined branch-like conductive layer to said top surface of said first conductive layer. Further defining each additional predetermined branch-like conductive layer such that an additional branch-like conductive layer is formed, wherein said step (o) comprises removing any remaining portions of the insulating layer. 2. The method according to claim 1, further comprising: forming a dielectric layer on an exposed surface of each of the additional branch-like conductive layers. . 45. The method according to claim 44, wherein the first branch-like conductive layer has a hollow cylindrical shape having an L-shaped cross section. 46. The first branch-like conductive layer comprises a first segment and a second segment, wherein the first segment extends vertically upward from the upper surface of the trunk-like conductive layer, and wherein the second segment comprises the second segment. The method according to claim 45, wherein the semiconductor memory device extends from an end of the first segment. 47. The second branch of the first branch-like conductive layer.
The segment extends horizontally outward from the end of the first segment.
7. The method for manufacturing a semiconductor memory device according to item 6. 48. The second branch of the first branch-like conductive layer.
The segment extends horizontally inward from the end of the first segment.
7. The method for manufacturing a semiconductor memory device according to item 6. 49. The first segment is connected to the trunk-like conductive layer at a peripheral edge of the trunk-like conductive layer, and the second segment of the first branch-like conductive layer is formed by the second segment of the first segment. 47. The method according to claim 46, wherein the semiconductor memory device extends horizontally from an end to a peripheral edge of the trunk-shaped conductive layer facing the edge. 50. The cross section of the second branch-like conductive layer is T
The method of manufacturing a semiconductor memory device according to claim 44, wherein the semiconductor memory device has a character shape. 51. The manufacturing of a semiconductor memory device according to claim 44, wherein said second branch-like conductive layer is columnar and extends vertically upward from said upper surface of said trunk-like conductive layer. Method.