JPH10299238A - Woody soundproof floor material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inhibit the quantity of free formaldehyde exhaled from a woody base material, to which a large number of slits are formed and which consists of plywood, by coating or impregnating a cushioning sheet with a formaldehyde absorbent. SOLUTION: The woody soundproof floor material 10 is formed in such a manner that a large number of slits 16 in parallel in width of approximately 1-2 mm, in depth of approximately 2-3 mm and at pitches of approximately 2-4 mm are formed to the lower section of plywood 11 in thickness of approximately 5-12 mm, male tongue sections 14 and female tongue sections 15 mutually connecting the adjacent soundproof materials 10 are formed to side faces, a sliced veneer 12 as a decorative sheet is stuck onto a top face and a cushioning sheet 13 in thickness of approximately 2-3 mm is pasted on the rear side. Since plywood 11 is manufactured by using a urea resin, etc., as adhesives, free formaldehyde is easy to be exhaled by the slits 16. Urea is dissolved into a proper binder and the cushioning sheet 13 is coated or impregnated with the binder as one example of a formaldehyde absorber as the countermeasure of the exhalation of free formaldehyde. Accordingly, the quantity of formaldehyde exhaled can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wood-based soundproof flooring material in which formaldehyde emission is suppressed.

[0002]

2. Description of the Related Art A wood-based sound-insulating floor material to be constructed in an apartment house or the like is made of plywood and has a wood base material having a large number of slits formed thereon and a buffer sheet adhered to the back side of the wood base material. And a decorative sheet such as a veneer attached to the surface side of the wooden base material, and the floor impact noise is diffused and attenuated by the slit and the buffer sheet.

[0003]

However, ordinary plywood is manufactured using an adhesive containing formaldehyde such as urea resin or melamine resin. Is easily emitted, and there is a problem that the amount of formaldehyde emitted is larger than that of a wooden flooring material that does not form a normal slit. The present invention has been made in view of such circumstances, and an object of the present invention is to provide a wood-based soundproof flooring material in which the emission amount of formaldehyde is suppressed.

[0004]

According to the present invention, there is provided a semiconductor device comprising:
The described wood-based sound-insulating flooring has a number of slits formed at the bottom of a wood base manufactured using an adhesive containing formaldehyde. In the flooring, the buffer sheet is coated or impregnated with a formaldehyde absorbent.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention. Here, FIG. 1 is a partially omitted perspective view of a wood-based sound-insulating floor material according to an embodiment of the present invention, and FIG. 2 is a partial sectional view of the same.

As shown in FIGS. 1 and 2, a wood-based sound-insulating flooring 10 according to an embodiment of the present invention is an example of a woody base material, and is a plywood 11 having a large number of slits 16 formed at a lower portion thereof.
And a veneer plate 12, which is an example of a decorative sheet attached to the upper portion of the plywood 11, and a buffer sheet 13 attached to the back side of the plywood 11. Hereinafter, these will be described in detail.

The plywood 11 is a conventional vertically long plywood having a thickness of about 5 to 12 mm and a thickness of about 3 to 5 plies, and a urea resin is used as an adhesive. Some free formaldehyde will be released in the state. On the side surface of the plywood 11, a male part 14 for joining and a female part 15 engaging with it are formed, and on the back side, that is, on the lower part of the plywood 11, a number of slits 16 orthogonal to the longitudinal direction are formed. ing.

The slit 16 has, for example, a width of 1
It is formed in a large number in parallel at a pitch of 2 to 4 mm with a thickness of about 2 mm and a depth of about 2 to 3 mm. On the back side of the plywood 11, a buffer sheet 13 having a thickness of, for example, about 2 to 3 mm is adhered. The buffer sheet 13 is made of a commonly used material such as a foamed synthetic resin such as polyethylene, foamed rubber, and a nonwoven fabric formed by needle punching. The buffer sheet 13 is impregnated or coated with urea, which is an example of a formaldehyde absorbent.

When the urea is applied to the buffer sheet 13, the urea is dissolved in a suitable binder and applied to the entire surface of the buffer sheet 13 or one of the bonding surfaces. In this case, it is preferable to mix an appropriate fixing agent such as starch into the binder in order to improve the adhesion of urea. Also, when urea is impregnated into the buffer sheet 13, the urea is dissolved in a suitable binder, the buffer sheet 13 is immersed in the binder, and if necessary, vacuum and / or pressure is applied to fill the buffer sheet 13. To increase. The bonding of the buffer sheet 13 to the plywood 11 is performed using, for example, a rubber-based adhesive. The amount of urea applied or impregnated is 50 to 1
About 00 g / m ² is preferable. If the amount is less than this, the effect is reduced, and even if the amount exceeds 100 g / m ² , the amount of formaldehyde absorbed is hardly changed. Also, a protruding plate 12 attached to the surface side of the plywood 11.
Are joined in a conventional manner to enhance the cosmetic effect of the surface.

As described above, since the wood-based sound-insulating floor member 10 is constructed, the sound-insulating effect is exerted by sticking the slit 16 and the buffer sheet 13, and furthermore, it is generated from urea resin or the like generated during the manufacturing process of the plywood 11. The major part of free formaldehyde is absorbed by the formaldehyde sorbent, thus reducing the amount of formaldehyde emitted.

In the above-described embodiment, the case where a relatively inexpensive urea resin is used as the formaldehyde-containing adhesive has been described. It goes without saying that the present invention is applied to the used wood substrate. Further, the formaldehyde absorbent is not limited to urea as described above, and the present invention is applicable to any other formaldehyde absorbent as long as it absorbs and retains formaldehyde that is emitted (eg, activated carbon). .

[0012]

According to the first aspect of the present invention, since a large number of slits are formed in the lower portion of the wooden base material, the surface area of the wooden base material increases, and the amount of formaldehyde emission increases. However, since a buffer sheet coated or impregnated with a formaldehyde absorbent is laminated on the back surface of the wooden base material, formaldehyde generated from a large number of slits is absorbed by the buffer sheet and is not easily diffused to the outside. Therefore, even if a wooden sound-insulating floor material is constructed using a wood base material such as plywood using an adhesive containing formaldehyde such as a urea resin generally used conventionally,
The amount of formaldehyde emission can be reduced without reducing the soundproofing effect.

[Brief description of the drawings]

FIG. 1 is a partially omitted perspective view of a wooden soundproof flooring material according to an embodiment of the present invention.

FIG. 2 is a partial sectional view of the same.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Wood-based sound insulation floor material 11 Plywood (wood base material) 12 Veneer board (decorative sheet) 13 Buffer sheet 14 Male part 15 Female part 16 Slit

Claims (1)

[Claims] 1. A wood-based sound-insulating flooring, in which a plurality of slits are formed in a lower portion of a woody base material manufactured using an adhesive containing formaldehyde, and further, a buffer sheet is laminated on a back surface thereof. A wood-based sound-insulating floor material, wherein the buffer sheet is coated or impregnated with a formaldehyde absorbent.