JPH10241995A - Cr element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce an element area by allowing a lower part electrode of a capacitor to have a continuity with the lower part electrode of a resistor with a conductive material provided in a through hole. SOLUTION: On one plate surface of an alumina substrate 1, a capacitor C comprising a lower part electrode 3B, dielectrics layer 3, and upper part electrode 3A is provided, and on the other plate surface, a resistor R comprising a lower part electrode 5B, resistance layer 5 and upper part electrode 5A is provided. The capacitor C and the resistor R are so provided that the lower part electrodes 3B and 5B contact to the plate surface of alumina substrate 1. The alumina substrate 1 is provided with a through hole 1A, and the lower part electrode 3B of the capacitor C and the lower part electrode 5A of the resistor R have a continuity with each other with the conductive material packed in the through hole 1A. The resistor R and the capacitor C are coated with protective glass layers 7A and 7B, respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a CR device having a capacitor function and a resistance function, and more particularly to a small CR device having a small mounting area.

[0002]

2. Description of the Related Art A CR element is inserted between an integrated circuit of a computer and ground to remove noise in a signal.

FIG. 2 is a sectional view showing a conventional CR element used for such a purpose. In this CR element, a lower electrode 2A as a capacitor, a dielectric layer 3 and an upper electrode 4 are laminated on one half of the alumina substrate 1, and the other half of the CR element is provided between the lower electrode 2A and the lower electrode 2B. To resistance layer 5
Are provided to form a resistor. Terminal electrodes 6A and 6B are provided on both end edges of the alumina substrate 1.
Then, the whole of the capacitor portion and the resistor portion is covered with the protective glass layer 7.

[0004]

The above-mentioned conventional CR element has a drawback that the capacitor and the resistor are juxtaposed on the substrate, so that the element area is large and therefore a large mounting area is required.

An object of the present invention is to solve the above conventional problems and to provide a CR element having a small element area.

[0006]

A CR element according to the present invention comprises: an insulating substrate; a capacitor comprising a lower electrode, a dielectric layer and an upper electrode laminated on one surface of the insulating substrate; A CR element having a lower electrode laminated on the other surface, a resistor composed of a resistive layer and an upper electrode, and a through-hole provided in the insulating substrate;
The lower electrode of the capacitor and the lower electrode of the resistor are electrically connected by a conductive material provided in the through hole.

The CR element of the present invention has a structure in which the capacitor and the resistor are laminated on the insulating substrate instead of the capacitor and the resistor arranged side by side on the insulating substrate. It is almost equal to one capacitor or one resistor, and the mounting area is about half that of the conventional product.

In the present invention, the capacitor and the resistor are preferably covered with a protective glass layer.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a CR device according to the present invention will be described in detail with reference to the drawings.

FIG. 1 is a view showing an embodiment of a CR element according to the present invention. FIG. 1A is a sectional view, and FIG. 1B is an equivalent circuit diagram. In FIG. 1, members having the same functions as those shown in FIG. 2 are denoted by the same reference numerals.

[0011] As shown in FIG.
A capacitor C and a resistor R are connected in series. A capacitor C composed of a lower electrode 3B, a dielectric layer 3 and an upper electrode 3A is provided on one plate surface of the alumina substrate 1, and is provided on the other plate surface. A resistor R composed of a lower electrode 5B, a resistance layer 5, and an upper electrode 5A is provided. Note that both the capacitor C and the resistor R are provided such that the lower electrodes 3B and 5B are in contact with the plate surface of the alumina substrate 1.

The alumina substrate 1 has a through hole 1A.
Is provided, and the lower electrode 3B of the capacitor C and the lower electrode 5A of the resistor R are electrically connected by the conductive material 8 filled in the through hole 1A.

The resistor R and the capacitor C are covered with protective glass layers 7A and 7B, respectively.

At both ends of the alumina substrate 1, there are provided terminal electrodes 6A which are connected to the upper electrode 3A of the capacitor C and terminal electrodes 6B which are connected to the upper electrode 5A of the resistor R. By connecting 6B to the circuit, a CR element as shown in FIG.

In order to manufacture such a CR element, first, Ag, Pd, P is printed on both surfaces of an alumina substrate 1 in which through holes 1A are previously formed by a laser beam or the like.
A conductive paste containing a noble metal such as t, Au, Ag / Pd, or a base metal powder such as Ni, Cu, etc.
By firing at 0 ° C., the lower electrodes 3B and 5B are baked. At this time, printing is performed so that the conductive paste enters the through holes 1A of the alumina substrate 1 so that the lower electrode 3B and the lower electrode 5B are electrically connected by the conductive material 8.

Next, the dielectric layer 3 and the resistance layer 5 are formed by printing a dielectric ceramic paste and a ceramic paste of a resistance material on the lower electrodes 3A and 3B, respectively, and firing at 800 to 900 ° C. .

Thereafter, the upper electrodes 3A and 5A are printed and baked on the dielectric layer 3 and the resistance layer 5, respectively, in the same manner as the method of forming the lower electrodes 3B and 5B, and then a paste of protective glass is printed. By baking at 600 to 850 ° C., protective glass layers 7A and 7B are formed.

Finally, the terminal electrodes 6A and 6B are printed and baked in the same manner as in the method of forming the lower electrodes 3B and 5B, and then Ni plating and solder plating are performed.
Obtain the element.

In the present invention, a ceramic substrate such as mullite can be used as an insulating substrate in addition to an alumina substrate. In general, such an insulating substrate has a thickness of about 0.4 to 0.6 mm. You.

The through hole provided in the insulating substrate has a diameter of 0.2 to 0.2 from the viewpoint of securing conduction and preventing a reduction in the strength of the substrate.
It is preferably about 0.5 mm.

The upper electrodes 3A, 5A and the lower electrodes 3B, 5
The conductive paste used for forming B is preferably a conductive paste suitable for thick-film printing including metal powder and glass frit.

Upper electrodes 3A, 5A, lower electrodes 3B, 5B
Is preferably formed with such a conductive paste to a thickness of about 5 to 15 μm. Further, the thickness of the dielectric layer 3 is 20 to 50 μm, the thickness of the resistance layer 5 is 5 to 15 μm,
The thickness of the protective glass layers 7A, 7B is preferably about 15 to 40 μm.

The dielectric ceramic material, the resistance material, and the protective glass material are not particularly limited, and those used in general CR devices can be used.

Such a CR device of the present invention can be easily connected to a circuit simply by wiring the terminal electrode layers 6A and 6B at both ends. The area of the CR element itself is about the size of one capacitor C or one resistor R, which is about half that of a conventional CR element in which a capacitor and a resistor are arranged side by side on an insulating substrate. It can be large.

[0025]

The present invention will be described more specifically with reference to the following examples.

Example 1 A CR device of the present invention shown in FIG. 1 was produced.

First, a through hole 1A having a diameter of 0.3 mm is formed on the alumina substrate 1 with a laser beam, and then a conductive paste (“5424” manufactured by DuPont) is printed on both sides and baked at 850 ° C. for 10 minutes. As a result, the lower electrode 3B,
5B was formed.

Next, a dielectric ceramic paste (“5530” manufactured by DuPont) and a resistive material paste (“7541, 7512 or 7513” manufactured by Sumitomo Metal) having the following composition
Was printed and baked at 850 ° C. for 10 minutes to form a dielectric layer 3 and a resistance layer 5.

Next, after the upper electrodes 3A and 5A are formed in the same manner as the lower electrodes, a protective glass paste is printed and baked at 800 ° C. to form the protective glass layers 7A and 7A.
B was formed.

Finally, terminal electrodes 6A and 6B were formed in the same manner as the lower electrode, and Ni plating and solder plating were performed to obtain a CR element.

The dimensions of each part of the CR element are as follows.

Size of alumina substrate: 2.0 mm × 1.
5 mm Thickness of upper electrode 3A, 5A and lower electrode 3B, 5B: 1
0 μm Thickness of the dielectric layer 3: 30 μm Thickness of the resistance layer 5: 10 μm The obtained CR device has a capacitance of 68 pF and a resistance value of 200Ω, and a required mounting area is about 1.6 mm × 2.1 m.
m.

As shown in FIG. 2, when a CR element having the same performance as this CR element is manufactured by arranging a capacitor and a resistor side by side on an alumina substrate, the substrate is 3.1.
mm × 1.5 mm is required, and the mounting area is about 3.2 mm × 1.6 mm. Therefore, in the case of the CR element according to the present invention, the mounting area is about 60% of the conventional product.

[0034]

As described in detail above, according to the CR element of the present invention, a CR element having a small element area, a small mounting area is sufficient, and a circuit can be miniaturized is provided.

[Brief description of the drawings]

FIG. 1 is a view showing an embodiment of a CR element of the present invention, wherein FIG. 1 (a) is a sectional view and FIG. 1 (b) is an equivalent circuit diagram.

FIG. 2 is a cross-sectional view showing a conventional CR element.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Alumina substrate 1A Through hole 3 Dielectric layer 3A, 5A Upper electrode 3B, 5B Lower electrode 5 Resistance layer 6A, 6B Terminal electrode 7A, 7B Protective glass layer 8 Conductive material C Capacitor R Resistor

Claims (2)

[Claims] A capacitor comprising an insulating substrate, a lower electrode laminated on one surface of the insulating substrate, a dielectric layer and an upper electrode; a lower electrode laminated on the other surface of the insulating substrate; A CR element comprising: a resistive element comprising a resistive layer and an upper electrode, wherein the insulating substrate is provided with a through hole, and the lower electrode of the capacitor and the lower electrode of the resister are formed in the through hole. Characterized in that the CR element is electrically connected by the conductive material provided in the CR element. 2. The CR element according to claim 1, wherein the capacitor and the resistor are covered with a protective glass layer.