JPH10223814A - Heat pipe type heat sink for cooling semiconductor elements - Google Patents

Abstract

(57) [Object] To provide a heat pipe type heat sink for cooling a semiconductor element, which has a small number of components and a small amount of solder, has good heat radiation performance, and does not have uneven heat distribution of a heat transfer block. The evaporating part of a heat pipe (2) is connected to a heat transfer block (1).
After being inserted into the heat pipe insertion holes 9 formed on the upper and side surfaces of the heat pipe, solder is filled into the gap between the heat pipe 2 and the heat transfer block 1 and fixed. The heat radiating fins 3 are attached to the straight portion of the heat pipe 2 in the direction or inward.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink for cooling a heating element, and more particularly to a heat pipe type heat sink for cooling a semiconductor element for controlling a semiconductor element such as a train.

[0002]

2. Description of the Related Art FIG. 7 shows a conventional heat pipe type heat sink for cooling semiconductor elements. FIG. 7A is a perspective view,
(B) is a front view of the heat transfer block 1, and (c) is a detailed cross-sectional view of a joint between the heat pipe 2 and the heat transfer block 1.
The heat sink further includes a radiation fin 3 and a stopper metal 4.

As shown in FIG. 7 (b), the heat transfer block 1 is provided with a heat pipe insertion hole 9 extending vertically downward from the upper surface, and a bent portion of the heat pipe 2 to be inserted is provided at the upper part of the block. A counterbore 10 is provided in the lateral longitudinal direction so as not to protrude from the upper side surface of the block 1.

[0004] The evaporating portions 2 ′ of the plurality of heat pipes 2 are inserted into the heat pipe insertion holes 9 of the heat transfer block 1, and the gap between the heat pipe 2 and the heat transfer block 1 is filled with solder 5. The rising portion from the second heat transfer block 1, that is, the root portion of the heat pipe 2 is covered with the epoxy resin 6. The heat pipe 2 to be inserted is previously bent at a predetermined angle so that the heat radiating portion 2 ″ is located at the front.

[0005] Thereafter, the radiation fins 3 are attached to the straight portion of the heat pipe 2, and finally, the radiation portions 2 ″ of the plurality of heat pipes 2 are fixed by the anti-vibration bracket 4. It can be cooled by bringing it into close contact.

FIG. 8 shows another example of a conventional heat pipe type heat sink for cooling a semiconductor device. 8A is a perspective view, FIG. 8B is a side view, and FIG. 8C is a front view of the heat transfer block 1. This heat sink is used when the heat transfer block 1 is vertically long, that is, when the object to be cooled is vertically long.

[0008] As shown in FIG. 8 (c), the plurality of heat pipes 2 are fitted into a plurality of vertically elongated heat pipe fitting counterbore 11 provided on the heat transfer block 1. The heat pipe 2 is previously bent at a predetermined angle so that the heat radiating portion 2 ″ is located in front. The counterbore 11 is provided by the number of heat pipes to be fitted.

FIG. 9 shows details of a joint between the heat pipe 2 and the heat transfer block 1. The plurality of fitted heat pipes 2 are fixed by support plates 7 and bolts 8. The gap between the bent portion of the heat pipe 2 and the heat transfer block 1 is filled with solder 5, and the root portion of the heat pipe 2 and the exposed portion on the outer surface of the solder 5 are covered with epoxy resin 6. .

The heat radiating fins 3 are attached to the linear portions of the plurality of heat pipes 2 fixed in this manner, and the heat radiating portions 2 ″ are formed.
Is fixed with the stopper 4. The object to be cooled is heat transfer block 1.
It is cooled by bringing it into close contact with the back side of the.

[0010]

The above prior art has the following problems.

The heat pipe type heat sink for cooling a semiconductor element shown in FIG. 7 requires a plurality of vertically mounted heat sinks when the object to be cooled is vertically long, which increases the cost.

To solve this problem even a little, FIG.
In this case, the number of parts required for the production increases due to the addition of the support plate 7 and the bolts 8 and the like, and the heat pipe 2 at the joint between the heat pipe 2 and the heat transfer block 1 is used. Bend and heat transfer block 1
Is large, the amount of solder 5 to be used becomes enormous.

Further, in these heat sinks, when heat is dissipated, wind is received from the lateral direction of the heat sink due to a running wind of a train or the like, so that the heat pipe heat radiating portion 2 ″ on the leeward side is radiated from the heat pipe heat radiating portion 2 ″ on the leeward side. It will be heated by heat. Therefore, the temperature of the heat pipe 2 on the leeward side becomes higher than that of the heat pipe 2 on the leeward side.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a heat pipe type heat sink for cooling a semiconductor element, which solves the above-mentioned drawbacks of the prior art, reduces the number of parts and the amount of solder, and does not cause uneven heat in the heat transfer block. is there.

[0015]

According to the present invention, in order to achieve the above object, a plurality of evaporating portions of heat radiating heat pipes are provided in a heat transfer block, and an object to be cooled is brought into close contact with the heat transfer block. It is a heat pipe type heat sink to cool,
After inserting the evaporating portion of the heat pipe into a heat pipe insertion hole machined on the top and side surfaces of the heat transfer block, solder is filled and fixed in a gap between the heat pipe and the heat transfer block, and the heat pipe is fixed. A heat pipe type heat sink for cooling a semiconductor element, characterized in that a heat radiating portion is directed forward or inward of a heat transfer block and a heat radiating fin is attached to a straight portion of the heat pipe.

It is desirable to provide a heat pipe insertion hole from the top and side surfaces of the heat transfer block so that the bottom of the heat pipe faces downward.

[0017] A heat pipe insertion hole machined from the side of the heat transfer block has a groove formed by end milling along the insertion hole so that a bent portion of the heat pipe comes inside the heat transfer block. It is desirable to configure.

The heat pipe evaporator may be inserted and fixed from any side or a plurality of sides of the heat transfer block.

[0019]

FIG. 1 shows a first embodiment of a heat pipe type heat sink for cooling a semiconductor device according to the present invention. 1A is a perspective view, FIG. 1B is a side view, and FIG. 1C is a front view of the heat transfer block 1. The components are a heat pipe 2, a heat radiating fin 3, and a vibration damper 4 in addition to the heat transfer block 1.

The heat pipe type heat sink is characterized in that the heat pipe 2 and the heat transfer block 1 are joined and fixed.
The heat pipe 2 on the upper side of the heat transfer block 1 is the same as in FIG. That is, as shown in FIG. 1 (c), a heat pipe insertion hole 9 is provided vertically downward from the upper side surface of the heat transfer block 1, and a bent portion of the heat pipe 2 to be inserted is provided at the upper part of the block. A counterbore 10 is provided in the lateral longitudinal direction so as not to protrude from the upper side surface.

Heat pipe 2 at lower stage of heat transfer block 1
Is attached as follows. A heat pipe insertion hole 9 is provided obliquely downward from both sides of the heat transfer block 1, and the end mill groove 1 is formed along the insertion hole 9 to a predetermined position.
2 is provided. The insertion hole 9 is slightly larger than the outer diameter of the heat pipe 2 to be inserted, and the diameter of the end mill is slightly larger than the outer diameter of the heat pipe 2 so that the heat pipe 2
Is easy to pass through the end milling groove 12.

By bending the entrance of the heat pipe insertion hole 9 by end milling, the bent portion of the heat pipe can be arranged inside the heat transfer block 1. In addition, by making the diameter of the end mill close to the outer diameter of the heat pipe 2, this processing can be performed only once linearly for each end mill processing location.

All the heat pipes 2 are bent at a predetermined angle before the heat pipes are inserted into the heat pipe insertion holes 9 so that the heat radiating portion 2 ″ is located on the front side and inside the heat transfer block 1.

FIG. 2 shows the details of the joint between the heat pipe 2 and the heat transfer block 1 in the upper stage of the heat transfer block 1. The gap between the heat pipe 2 and the heat transfer block 1 is filled with solder 5, and the bent portion of the heat pipe 2 or the portion where the solder 5 is exposed on the outer surface is covered with the epoxy resin 6.

Heat pipe 2 at lower stage of heat transfer block 1
Is the same. That is, the gap between the heat pipe 2 and the heat transfer block 1 is filled with the solder 5, and the portion where the solder 5 is exposed on the outer surface is covered with the epoxy resin 6. In this embodiment, the solder 5 can be uniformly filled around the root of the heat pipe 2 during the filling operation of the solder 5 by arranging the bent portion of the heat pipe 2 in the circular portion formed after the end mill processing. It is.

These operations of inserting the upper and lower heat pipes 2 of the heat transfer block 1 into the insertion holes 9 and filling with the solder 5 can all be performed while the heat transfer block 1 is in a vertical position. Work efficiency is good.

After all the heat pipes 2 are embedded by the above-described method, the heat radiating fins 3 are attached to the straight portions of the heat pipe 2 and the heat pipe heat radiating portion 2 ″ is fixed by the vibration-absorbing bracket 4. Cooling by bringing it into close contact with the back side of the heat transfer block 1 is the same as in a conventional heat sink.

Heat pipe 2 on lower side of heat transfer block 1
Are arranged vertically, and when the heat sink operates, the traveling wind of the train hits from the lateral direction, so that all the heat pipes 2 can be efficiently cooled. On the lower side of the heat transfer block 1, the heat pipes 2 rise from both the left and right sides, and the space between the left and right heat pipes 2 is wide, and the left and right heat radiation fins 3 are separated. All of the radiated heat is not directly transmitted to the radiating fins 3 on the leeward side, but is radiated to the atmosphere on the way. Therefore,
The heat radiation efficiency of the heat sink is increased, and the heat transfer block can be prevented from being unbalanced.

FIG. 3 is a perspective view showing a heat pipe type heat sink for cooling a semiconductor element according to a second embodiment of the present invention. This heat sink differs from that of FIG. 1 in the arrangement of the heat pipes 2. The manufacturing method, effects, and the like are the same, and a description thereof will be omitted.

FIG. 4 is a perspective view showing a third embodiment of a heat pipe type heat sink for cooling a semiconductor element according to the present invention. The lower heat radiation fins 3 of the heat transfer block 1 are configured to connect the left and right heat pipes. The manufacturing method, effects, and the like are the same.

FIG. 5 is a perspective view showing a fourth embodiment of a heat pipe type heat sink for cooling a semiconductor element according to the present invention. The heat pipe 2 is inserted into the heat transfer block 1 only on both side surfaces, and there is no insertion point from the upper surface of the heat transfer block 1. The manufacturing method, effects, and the like are the same.

FIG. 6 is a perspective view showing a fifth embodiment of a heat pipe type heat sink for cooling a semiconductor element according to the present invention. The heat pipe 2 is inserted into the heat transfer block 1 only on one side. The manufacturing method, effects, and the like are the same.

[0033]

According to the present invention, the following excellent effects are exhibited.

By changing the method of fixing the heat pipe evaporator, the number of parts required for manufacturing the heat sink can be reduced.

Since the gap is reduced at the joint between the heat pipe and the heat transfer block, the amount of solder used can be greatly reduced. At the same time, the amount of heat required for melting the solder can be reduced, so that the melting time when manufacturing the heat sink is shortened and the number of work steps can be reduced.

Since the arrangement of the heat pipes is changed, the heat radiation efficiency is improved, and the heat transfer block can be free from uneven heat.

[Brief description of the drawings]

FIG. 1 is a first embodiment of a heat pipe type heat sink for cooling a semiconductor element according to the present invention, wherein (a) is a perspective view,
(B) is a side view, (c) is a front view of a heat transfer block.

FIG. 2 is a detailed cross-sectional view of a joint between a heat pipe and a heat transfer block according to the first embodiment of the present invention.

FIG. 3 is a perspective view showing a second embodiment of the present invention.

FIG. 4 is a perspective view showing a third embodiment of the present invention.

FIG. 5 is a perspective view showing a fourth embodiment of the present invention.

FIG. 6 is a perspective view showing a fifth embodiment of the present invention.

7 (a) is a perspective view, FIG. 7 (b) is a front view of a heat transfer block, and FIG. 7 (c) is a detail of a joint between the heat pipe and the heat transfer block. It is sectional drawing.

8A and 8B show another example of a conventional heat pipe type heat sink for cooling a semiconductor element, wherein FIG. 8A is a perspective view and FIG.
Is a side view, and (c) is a front view of the heat transfer block.

FIG. 9 is a detailed cross-sectional view of a heat pipe and a heat transfer block joining portion, relating to the heat sink of FIG. 8;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 heat transfer block 2 heat pipe 2 ′ heat pipe evaporator 2 ”heat pipe radiator 3 radiator fin 4 damper 5 solder 6 epoxy resin 7 support plate 8 bolt 9 heat pipe insertion hole 10 counterbore 11 heat pipe fitting Counterbore 12 End milling groove

Claims (4)

[Claims] 1. A heat pipe type heat sink for cooling a semiconductor element, wherein a plurality of evaporating portions of heat radiating heat pipes are provided in a heat transfer block, and a cooling target is cooled by closely contacting the heat transfer block. After the evaporating part of the pipe is inserted into the heat pipe insertion hole machined on the top and side surfaces of the heat transfer block, solder is filled and fixed in the gap between the heat pipe and the heat transfer block, and the heat radiating part of the heat pipe is fixed. A heat pipe type heat sink for cooling a semiconductor element, wherein a heat radiation fin is attached to a straight portion of the heat pipe toward the front or inside of the heat transfer block. 2. The heat pipe type heat sink for cooling a semiconductor element according to claim 1, wherein holes for inserting the heat pipe are provided from the upper surface and side surfaces of the heat transfer block so that the bottom of the heat pipe faces downward. 3. A heat pipe insertion hole machined from a side surface of a heat transfer block, wherein the heat pipe insertion hole has an end milled groove along the insertion hole, and a bent portion of the heat pipe is provided inside the heat transfer block. 3. The heat pipe type heat sink for cooling a semiconductor device according to claim 1, wherein the heat pipe type heat sink is provided with a heat pipe. 4. The heat pipe type heat sink for cooling a semiconductor element according to claim 1, wherein the heat pipe evaporator is inserted and fixed from an arbitrary side surface or a plurality of side surfaces of the heat transfer block.