JPH0210800A - heat sink - Google Patents

Abstract

PURPOSE:To improve efficiency of heat radiation from a radiating fins by providing a heat pipe inside a plate part. CONSTITUTION:Plural heat pipes 20 extending from near a heat generating part 12 toward the end fringe of a plate part 13 are provided inside the plate part 13. The pipe 20 is arranged below the base of each radiating fin 14 and extending in parallel with the fin 14. The pipe 20 is press-fitted into a heat pipe insertion hole 13a. The bore diameter dimension D1 of the insertion hole 13a is so made that it may be a little smaller than the outside diameter dimension D2 of the pipe 20. Furthermore, a slit 13b is formed in the insertion hole 13a to facilitate the press-fitting of the pipe. In a radiator like this, the heat generated from the heat generating part can be transmitted to the end line of the plate by the heat pipe 20. Accordingly, the temperature of the plate part and the radiating fin become uniform without increasing the thickness of the plate part, and heat can be radiated efficiently from all the fins.

Description

[Detailed Description of the Invention] [Summary] Regarding a heat radiator including a flat plate portion on which a heat generating component is mounted and a radiation fin provided integrally on the flat plate portion, heat generated from the heat generating component is transferred to the flat plate portion. The aim is to provide a lightweight heat radiator that can efficiently dissipate heat from all the heat radiating fins, and has a configuration in which a heat pipe is provided inside the flat plate part extending from the vicinity of the heat generating component toward the edge of the flat plate part. [Industrial Application Field] The present invention relates to the structure of a heat sink for efficiently dissipating heat generated from heat generating components such as power semiconductor devices.

Generally, power semiconductor devices generate a large amount of heat because they handle large amounts of electric power. Therefore, in order to protect power semiconductor elements from destruction due to heat generation, it is necessary to efficiently dissipate a large amount of heat generated from the power semiconductor elements to the surroundings.

[Conventional technology]

Conventionally, heat-generating components such as power semiconductor devices have been mounted on a heat sink (heat sink) made of a copper-based or aluminum-based material with excellent thermal conductivity.

Referring to FIGS. 7 and 8, the conventional heat sink 1 includes a flat plate part 3 on which a heat generating component 2 such as a power semiconductor element is mounted, and a heat radiation fin integrally formed on the flat plate part 3. 4. The heat generating component 2 is attached onto the flat plate part 3 by a screw 6 that is screwed into a connecting fitting 5. On the other hand, the flat plate part 3 is attached to a printed wiring board 8 via a fixing metal fitting 7 attached to a proper position on the back surface thereof. The heat generated from the heat generating component 2 is transferred to the heat dissipation fin 4 via the flat plate part 3.
and is radiated to the surroundings from the heat radiation fins 4. In order to efficiently dissipate the heat generated from the heat generating component 2 through the radiation fins 4, the heat generating component 2 is normally arranged approximately at the center of the flat plate portion 3.

[Problem to be solved by the invention]

In the heat sink 1 having the conventional structure described above, heat cannot be sufficiently conducted to a position away from the heat generating component 2 due to the internal thermal resistance of the flat plate part 3.
A problem has arisen in that the temperature distribution becomes non-uniform, making it impossible to sufficiently dissipate heat from the heat dissipating fins 4 located away from the heat generating component 2. Furthermore, when the thickness of the flat plate part 3 is increased in order to reduce the thermal resistance within the flat plate part 3, the overall weight of the heat sink 1 increases, resulting in a problem that the printed wiring board 8 is deformed.

For this reason, a secondary problem occurred in that a metal fitting for preventing deformation had to be mounted on the printed wiring board 8.

Therefore, an object of the present invention is to provide a lightweight heat radiator that can efficiently dissipate heat generated from heat generating components from all the heat radiating fins on the flat plate part.

[Means to solve the problem]

In order to achieve the above object, the present invention provides a heat radiator including a flat plate part on which a heat generating component is mounted and a heat radiating fin provided integrally on the flat plate part. A heat vibrator is provided extending toward the edge of the flat plate portion.

[For production]

In the heat radiator having the above configuration, a heat vibrator having better thermal conductivity than the flat plate part is provided inside the flat plate part, so the heat generated from the heat generating components is efficiently transferred to the edge of the flat plate part by the heat vibrator inside the flat plate part. This means that you can communicate well. Therefore, it is possible to make the temperature distribution of the entire flat plate part and the radiation fins uniform without increasing the thickness of the flat plate part, and the heat generated from the heat generating parts can be efficiently transferred from all the radiation fins on the flat plate part. In addition to being able to dissipate heat, it is also possible to reduce the weight of the heat sink.

〔Example〕

Hereinafter, the present invention will be described in detail with reference to the drawings.

1 to 5 show an embodiment of the present invention. First, referring to FIGS. 1 to 4, the heat radiator 11 includes a flat plate part 13 for mounting a heat generating component 12 such as a power semiconductor element, and a plurality of heat radiators integrally formed on the flat plate part 13. fins 14. Heat sink 11
is made of a material that is a good thermal conductor, such as a copper-based or aluminum-based material. The heat generating component 12 is mounted on the flat plate portion 13 by a screw 16 that is screwed into a connecting fitting 15. Flat plate part 13
A fixing metal fitting 17 is attached to a proper position on the back side of the board, for example, by a rivet 19, and the flat plate part 13 is attached onto a printed wiring board 18 via the fixing metal fitting 17. Heat generating parts 1
In order to efficiently dissipate the heat generated from the heat dissipation fins 14 from the heat dissipation fins 14, the heat generating component 12 is normally arranged approximately at the center of the flat plate portion 13.

Inside the flat plate part 13, from the vicinity of the heat generating component 12, the flat plate part 1
A plurality of heat vibrators 20 are provided extending toward the edges of 3. As can be seen from Figures 1 to 3,
In this embodiment, the base of each radiation fin 14 of the heat vibrator 20 is disposed below the root and extends parallel to the radiation fin 14 . Therefore, heat transfer from the heat vibrator 20 to the radiation fins 14 is improved.

As shown in detail in FIG. 5, in this embodiment, each radiation fin 14 has a plurality of attachments extending parallel to each other from the vicinity of the heat generating component 12 to both end surfaces of the flat plate part 13 in the flat plate part 13 below the root. Heat pipe insertion holes 13a are formed, and a heat pipe 20 is inserted into each heat pipe insertion hole 13a. Heat pipe insertion hole 1
3a is formed so that its inner diameter DI is slightly smaller than the outer diameter D2 of the heat pipe 20, and the heat pipe 20 is press-fitted into the heat pipe insertion hole 13a. The sleeve 13b formed along the heat pipe insertion hole 13a is for facilitating insertion of the heat pipe 20 during press-fitting.

In the heat sink 11 having the above configuration, the heat generating component 12
Since the heat generated from the flat plate part 13 can be efficiently transmitted to the edge of the flat plate part 13 by the heat pipe 20 in the flat plate part 13, the temperature distribution of the whole flat plate part 13 and the radiation fins 14 can be made uniform. Therefore, the heat generating component 12
All the heat radiation fins 14 on the flat plate part 13
can be efficiently dissipated from In addition, the flat plate part 1
Since the heat pipe 20, which has better thermal conductivity than the flat plate part 13, is provided inside the flat plate part 13, the thickness T of the flat plate part 13 (Fig. 5)
There is no need to increase the size. Therefore, the heat sink 11
The weight can be reduced. Furthermore, the heat radiator 11 having the above configuration can efficiently radiate heat from all the heat radiating fins 14, so it can be made smaller than a conventional heat radiator for a heat generating component with the same amount of heat generation.

In the above embodiment, since the heat radiation fins 14 are formed parallel to the longitudinal direction of the heat pipe 20, the heat radiation efficiency is maximized when the flat plate portion 13 is mounted horizontally (horizontally mounted). In addition, when the flat plate part 14 is mounted vertically (vertical mounting), it is preferable to form each radiation fin 14 in the direction orthogonal to the longitudinal direction of the heat pipe 20, as shown in FIG. In FIG. 6, the same reference numerals are given to the same constituent elements as in the above embodiment. The heat sink 11 shown in FIG. 6 can also be used for horizontal mounting, but if the flat plate part 13 is mounted upright so that the heat pipe 20 extends horizontally, the spaces between the adjacent heat sink fins 14 and 14 in the vertical direction Since an air passage is formed, high heat dissipation efficiency can be obtained even when mounted vertically.

Although the illustrated embodiments have been described above, the present invention is not limited to the embodiments shown in the figures. It may be attached to.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, the heat generated from the heat generating components can be efficiently transmitted to the edge of the flat plate part by the heat pipe inside the flat plate part, so that the plate thickness of the flat plate part can be increased. It is possible to make the temperature distribution of the entire flat plate part and the radiation fins uniform without any heat dissipation. Therefore, it is possible to provide a lightweight heat radiator that can efficiently dissipate heat generated from the heat generating components from all the heat radiating fins on the flat plate part.

[Brief explanation of the drawing]

1 is a longitudinal sectional view of a heat sink showing an embodiment of the present invention, FIG. 2 is a plan view of the heat sink shown in FIG. 1, FIG. 3 is a side view of the heat sink shown in FIG. 1, and FIG. 4 is an exploded perspective view of the heat sink shown in FIG. 1, FIG. 5 is an enlarged perspective view of the main parts of the heat sink shown in FIG. 1, and FIG. 6 is a cross-sectional view of the heat sink showing another embodiment of the present invention. 7 is a plan view of a conventional heat sink, and FIG. 8 is a side view of the pot shown in FIG. 7. In the figure, 11 is a heat sink, 12 is a heat generating component, 13 is a flat plate part, 14 is a heat sink, and 20 is a heat pipe.

Claims (1)

[Claims] 1. In a heat sink (11) comprising a flat plate part (13) on which a heat generating component (12) is mounted and a radiation fin (14) integrally provided on the flat plate part (13), the inside of the flat plate part (13) A heat sink characterized in that a heat pipe (20) is provided extending from the vicinity of the heat generating component (12) toward the edge of the flat plate part (13).