JPH10209688A - Component mounting equipment - Google Patents

Abstract

(57) Abstract: An object of the present invention is to provide a component mounting apparatus capable of improving processing efficiency when components are mounted on a small circuit board without increasing a movement stroke of an XY mechanism. It is. SOLUTION: There is provided supply means for supplying a component, a head mechanism for holding and releasing the component, and an XY mechanism for moving the head mechanism in the XY directions. This is a component mounting apparatus that mounts the component on a board by releasing after moving to a position.
The supply means supplies a plurality of components, and the head mechanism confirms a plurality of head units for individually holding and releasing the plurality of supplied components, and positions of the plurality of supplied components. Imaging means for imaging the plurality of parts or the supply points of the plurality of parts, respectively, and two sets of the imaging means are provided, and these two sets of imaging means are provided on both sides of the plurality of head units, respectively. Are located.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for holding a component supplied from a supply unit by a head mechanism, moving the head mechanism to a predetermined position, and releasing the held component. The present invention relates to a component mounting apparatus that mounts a component on a substrate.

[0002]

FIG. 3 is a perspective view showing a general example of a conventional component mounting apparatus P20. Generally, the component mounting device P20
Is used after being connected to another circuit board processing apparatus before and after, carrying in the circuit board sent from the near side in the X direction in the figure, mounting electronic components on the circuit board, and then mounting the circuit board. Is carried out to the back in the X direction in the figure.

In FIG. 3, P1 is a reel containing electronic components, P2 is a supply device (hereinafter referred to as a feeder) for supplying electronic components one by one from the reels P1, and P3 is mounted with electronic components. P4 is a head mechanism that holds electronic components, and P5 is an XY robot device that moves the head mechanism P4 in the XY directions. The reels P1 ...
Electronic components are housed in paper or plastic holes and wound into reels. A plurality of sets of the reels P1 and the feeders P2 are provided so that a plurality of electronic components are supplied in a line in the X direction (the flow direction of the circuit board) in the drawing.

FIG. 4 shows a detailed view of the head mechanism P4. In the figure, P6 and P6 are vacuum-sucked electronic components, and P7 and P6.
7 is a suction nozzle as a head for sucking electronic components;
P8 and P8 are motors for rotating the suction nozzles P7 and P7, P9 is a bracket for holding the suction nozzle P7 and the motor P8, and P10a and P10b are brackets P
9, a ball screw and a nut for moving the bracket P9 up and down, P11 is a motor for moving the bracket P9 up and down by operating the ball screw P10a, P12 is a linear guide for moving the bracket P10 up and down, and P14a and P14b are position detection of the electronic component P6. P13 is a structural member that holds the position detectors P14a and P14b, and P15 is an imaging camera as imaging means.

[0005] As shown in FIG.
Two or three sets of a plurality of suction nozzles P7, P7
And an associated operating mechanism (such as a rotating motor P8 and a vertical moving motor P11). This is because when the electronic components P6 are sucked from the feeders P2, the plurality of nozzles P7, P7 descend simultaneously or individually, and the plurality of electronic components P6 are sucked simultaneously or individually to suck and mount the components. This is because there is a purpose of shortening the cycle time and improving the efficiency of production.

As shown in FIG. 4, the head mechanism P4 is provided with a set of imaging cameras P15. The imaging camera P15 recognizes the target by, for example, capturing the target from directly above. The purpose of the imaging camera P15 is as follows. An image of the mark provided on the circuit board P3 is taken, and the position of the circuit board P3 is recognized. In order to confirm the position of the component to be supplied, the position of the feeders P2 is recognized, and correction is performed when there is a deviation from the reference position. The position and orientation of the electronic component P6 mounted on the circuit board P3 are checked and corrected.

As described above, the conventional component mounting apparatus P20
In general, the head mechanism P4 is provided with a plurality of head units (suction nozzles P7, P7) as described above and a set of imaging means (imaging camera P15). And
The imaging means (imaging camera P15) is installed at substantially the center of the head mechanism P4, between a plurality of head portions (suction nozzles P7, P7).

[0008]

By the way, as described above, if the imaging means is installed between a plurality of heads,
Inevitably, the distance (center-to-center) between the plurality of head units is increased. In recent years, the size of the circuit board has a strong tendency to be reduced in size, and if the center of the plurality of heads is long as described above,
For example, when two electronic components are mounted at two places with a short interval, there has been a problem that the efficiency of the mounting process is not improved. That is, after the first electronic component is mounted on the first head unit, the moving distance of the head mechanism P4 becomes longer until the second electronic component is mounted on the second head unit. Processing efficiency is not improved.

On the other hand, the image pickup means is connected to a head mechanism P4.
It is easy to devise a method of shortening the distance between the heads by disposing them on the left or right side of the plurality of heads without attaching them to the center of the head. However, the imaging means
For the purpose of recognizing the position of the feeders P2, it is necessary to move the upper part over all the feeders P2, and if the imaging means is arranged on one side of the head mechanism P4, the misalignment of the arrangement may occur. Therefore, the moving stroke of the XY robot P5, particularly, the moving stroke in the direction in which the feeders P2 are arranged (in FIG. 3, the flow direction of the circuit board in the X direction) has to be increased.

The increase in the movement stroke of the XY robot P5 increases the installation area of the component mounting apparatus P20, particularly, the length of the board in the flow direction (X direction in FIG. 3).
The component mounting device P20 is rarely used alone, and usually starts with a substrate supply device, and includes a solder printing machine, an adhesive application machine, a plurality of component mounting devices, a solder curing tank, a board collecting device, and a plurality of components. Different devices are connected in a row,
It can range from a few meters to over a dozen meters in length.
Therefore, the fact that the length of the component mounting apparatus P20 to be connected to a plurality of units is short is an important factor. For this reason, there has been a problem in the method of arranging the imaging means on the left or right side of the plurality of head units.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and the components are mounted on a small circuit board by disposing a plurality of heads close to each other without increasing the moving stroke of the XY mechanism. It is an object of the present invention to provide a component mounting apparatus that can improve processing efficiency in such cases.

[0012]

In order to solve the above-mentioned problems, the invention according to claim 1 comprises a supply means for supplying a component, a head mechanism for holding and releasing the component, and a head mechanism for moving the head mechanism in the XY directions. A moving XY mechanism, wherein the supplied component is held by a head mechanism, moved to a predetermined position, and then released, so that the supplying unit includes a plurality of supplying units. A plurality of head units for supplying and supplying the components, the plurality of head units individually holding and releasing the plurality of components to be supplied, and the plurality of components or the plurality of components to confirm the positions of the plurality of components to be supplied. Image pickup means for picking up an image of a supply position of a component, wherein two sets of the image pickup means are provided, and these two sets of image pickup means are arranged on both sides of the plurality of head units, respectively.

According to the first aspect of the present invention, since the imaging means is arranged on both sides of the plurality of heads, it is possible to shorten the distance between the plurality of heads. Therefore, even when components are mounted on a small substrate, the efficiency of the mounting process can be improved. For example, when two components are to be mounted on two locations on a substrate with a short interval, after mounting the first component on the first head of the plurality of heads, two components are mounted on the second head. Until the components of the eye are mounted, the moving distance of the head mechanism is short, and as a result, the efficiency of the mounting process is improved.

Further, since two sets of image pickup means are provided in the head mechanism, and these two sets of image pickup means are arranged on both sides of the plurality of head portions, the moving stroke of the XY mechanism required for the processing performed by the image pickup means is provided. Can be reduced. That is, when each of the plurality of components or the supply locations of the plurality of components is imaged to confirm the positions of the plurality of components to be supplied, if the imaging unit is one set as in the related art, the plurality of components or the plurality of However, according to the configuration of the present invention, one of the imaging units performs imaging on one side, and the other imaging unit performs imaging on the other side. Thus, the movement stroke of the XY mechanism can be reduced by the distance between the two imaging units.

Since the movement stroke of the XY mechanism required for the processing of the image pickup means is reduced, the movement stroke of the XY mechanism is not increased even when viewed comprehensively. Therefore, the installation area of the component mounting machine is increased. Not useful. In particular, when the supply of a plurality of components by the supply unit is performed in the flow direction of the substrate, the length of the substrate in the flow direction is not increased. In a case where the processing is performed by connecting the substrates in a row and flowing the substrates along the rows of these apparatuses, it is particularly useful without increasing the length of the rows.

Here, the arrangement of a plurality of heads and two sets of imaging means is generally illustrated as a specific example in which a plurality of heads are arranged in a line and the imaging means are arranged at both ends. (FIG. 2). However, the arrangement is not limited to this arrangement. For example, a plurality of heads may be arranged in a zigzag or a plurality of rows. It may be arranged at a position shifted from the row of the section. In addition, two sets of imaging means are arranged on both sides of the plurality of heads, and further, the heads are arranged more laterally than the two sets of imaging means.
As long as two sets of image pickup means are arranged on both sides of the plurality of head units, it goes without saying that any arrangement is included in the scope of the claims of the present invention.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG.
1 is a perspective view illustrating an overview of a component mounting apparatus 1 according to an embodiment of the present invention.

The component mounting apparatus 1 of this embodiment automatically mounts predetermined electronic components on a circuit board 20.
Reels 2, 2,... As housing means for housing electronic components
, As a supply means, a suction head mechanism 4 as a head mechanism, and an XY robot 5 as an XY mechanism for moving the suction head mechanism 4 in the XY directions.

The component mounting apparatus 1 usually starts with a board supply apparatus, and includes a solder printing machine, an adhesive application machine, a plurality of component mounting apparatuses, a solder curing tank, a board collecting apparatus, and a plurality of various board processing apparatuses. It is used in a state where it is connected in a row,
The circuit boards 20 are subjected to various processes by each substrate processing apparatus while being transported from an apparatus upstream of the substrate processing apparatuses connected in a row to a downstream apparatus. The X direction in the drawing is the direction in which the circuit board 20 is connected to another substrate processing apparatus. In the component mounting apparatus 1, the circuit board 20 is carried in from the carry-in port 7a, and the circuit board 20 is carried out from the carry-out port 7b. I have.

The reels 2, 2,... Are provided with electronic components housed in holes of paper or plastic, and are wound in a reel shape.
Each of the plurality of reels 2, 2,... Accommodates a different type of electronic component.

The feeders 3, 3,... Are provided corresponding to the plurality of reels 2, 2, respectively, and take out electronic components one by one from the corresponding reels 2,.
3. Conveyed and supplied to a predetermined upper position.

The reels 2, 2,... And the feeders 3, 3,... Are sequentially arranged in the transport direction of the circuit board 20 (the X direction in the illustrated example). It is arranged along the position.
With this arrangement, all the feeders 3... And the circuit board 20
, And the processing efficiency of mounting the supplied electronic components on a circuit board can be improved.

FIG. 2 is an enlarged perspective view of the suction head mechanism 4 which is a feature of the present invention. The X direction in the figure and the X direction shown in FIG. 1 indicate the same direction.

The suction head mechanism 4 includes a mounting base 4a.
Are attached with suction nozzles 13A and 13B as a head unit and imaging cameras 11A and 11B as imaging means. The suction nozzles 13A and 13B are mounted via movement mechanisms 15A and 15B that enable the suction nozzles 13A and 13B to move in the vertical and rotational directions.

The suction nozzles 13A and 13B are capable of sucking electronic components 30 and 30 by vacuum suction.
A set is provided. The imaging cameras 11 </ b> A and 11 </ b> B enable recognition of an object by imaging the object from directly above, and are provided in two sets. These imaging cameras 1
1A, 11B image all the feeders 3, 3... To confirm the positions of the electronic components supplied to the feeders 3, 3,.
In order to confirm the position of the electronic component, the mark provided on the circuit board 20 is imaged and recognized, and in order to confirm the mounting position of the electronic component, the position and orientation of the electronic component mounted on the circuit board 20 are imaged and recognized. Or

The suction nozzles 13A and 13B and the imaging cameras 11A and 11B are arranged substantially in a line in the direction in which the circuit board 20 is transported.
B is disposed on each side of the two suction nozzles 13A and 13B. Since the suction nozzles 13A and 13B are arranged side by side, the length between the centers of the suction nozzles 13A and 13B is short. Thus, the suction nozzles 13A and 13B and the imaging camera 11
Since A and 11B are arranged in a line in the X direction, the XY robot 5 only needs to move in the X direction to move to pick up the electronic component after confirming the supply position of the electronic component. Since the movement is unnecessary, the processing efficiency and the movement accuracy can be improved accordingly.

Of the two imaging cameras 11A and 11B, the first imaging camera 11A arranged on one side is assigned an imaging process on one side of the circuit board 20 or the feeders 3, 3. Second imaging camera 1 arranged
1B is assigned an imaging process on the remaining side of the circuit board 20 and the feeders 3, 3,.... The assignment of these imaging processes is controlled based on, for example, the movement position of the XY robot 5 in the X direction.

The movement mechanisms 15A and 15B are provided in association with the respective suction nozzles 13A and 13B, and move the respective suction nozzles 13A and 13B separately in the vertical and rotational directions. Specifically, the exercise mechanism 15A
(15B) is a motor 15a for rotating the suction nozzle 13A (13B) and the suction nozzle 13A (13B).
B) and a bracket 15b for holding the motor 15a,
And a ball screw 1 for moving the bracket 15b up and down.
5c, a nut 15d, and a motor 15e that moves the bracket 15b up and down by operating the ball screw 15c, and a linear guide 1 for moving the bracket 15b up and down.
5f, position detectors 15g, 15g for detecting the positions of the motor 15e and the electronic component 30, and position detectors 15g, 15g
And the like.

The component mounting apparatus 1 of this embodiment is configured as described above, and is supplied after being subjected to the following processing by the suction head mechanism 4 equipped with two sets of imaging cameras 11A and 11B. Electronic components are sucked and mounted on the circuit board 20.

That is, first, the circuit board 20 is carried in from the upstream device connected to the component mounting apparatus 1 through the carry-in port 7a, and the circuit board 20 is stopped at a predetermined position. Also,
The electronic components are taken out one by one from the reels 2, 2,... By the feeders 3, 3,... And are stopped at predetermined positions on the feeders 3, 3,.

The positions of the circuit board 20 and the electronic components are stored in advance by a control device (not shown), and when the electronic components are supplied onto the feeders 3, 3,... Then, the suction head mechanism 4 is moved above the electronic component on the feeder. Thereafter, the movement mechanisms 15A and 15B of the suction head mechanism 4 operate to lower the two suction nozzles 13A and 13B simultaneously or individually, and the lowered suction nozzles 13A and 13B
Makes contact with the electronic components on the two feeders 3 and 3 and is further suctioned by vacuum to suck those electronic components. And
The movement mechanisms 15A and 15B operate again, and the suction nozzles 13A and 13B that have sucked the electronic component are returned to the original height.

When the electronic components are sucked and held by the suction head mechanism 4, the XY robot 5 operates under the control of the above-mentioned control device, and moves the suction head mechanism 4 to a position above the component mounting portion of the circuit board 20. Then, the movement mechanisms 15A (15B) of the suction head mechanism 4 individually operate to lower the suction nozzles 13A (13B) and rotate them by the amount of displacement, thereby mounting the electronic components on the mounting positions of the circuit board 20. After the mounting, the vacuum suction is released, the suction of the electronic component is released, and the movement mechanism 15A (15B) operates to return the suction nozzle 13A (13B) to its original height.

The mounting process of the electronic components as described above is performed by the number of the suction nozzles, and the plurality of electronic components sucked and held by the suction head mechanism 4 are all mounted on the circuit board 20. At this time, even when the circuit board 20 is small and the mounting positions of the plurality of electronic components are close to each other, the plurality of suction nozzles 1
Since the interval between 3A and 13B is small, it is not necessary to move the XY robot 5 largely, and the efficiency of the mounting process is improved.

Further, when all the electronic components sucked and held by the suction head mechanism 4 are mounted, the feeders 3, 3.
Then, the process of sucking electronic components is repeated again, and these electronic components are mounted on the circuit board 20.

Then, all the predetermined electronic components are mounted on the circuit board 2.
0, the circuit board 20 is unloaded to the downstream device connected to the component mounting device 1 via the outlet 7b.
The electronic component mounting process (one-cycle component mounting process) on one circuit board 20 ends.

During the process of mounting the electronic components, the position of the supplied electronic components, the position of the circuit board 20, and the mounted electronic components are confirmed by the imaging cameras 11A and 11B of the suction head mechanism 4. The position and state of are checked.

The position of the supplied electronic components can be confirmed by, for example, all the feeders 3, 3 by the imaging cameras 11A and 11B before starting one cycle of component mounting processing.
.. Are captured and recognized.

That is, when the process of confirming the position of the supplied electronic component is started, first, the XY robot 5 is operated under the control of the control device, and the suction head mechanism 4 is moved to one end of the feeders 3, 3,. From above to the other end, and move above the feeders 3, 3,.... At this time, all the feeders 3, 3 ... are connected to the first and second imaging cameras 11A, 11A.
B, the imaging is performed by sharing the feeders 3, 3... Arranged over the whole with the imaging cameras 11A and 11B, so that the XY robot 5 required for the imaging is used.
Movement stroke is reduced.

After the imaging and recognition of all the feeders 3, 3... Are performed as described above, the positions of the feeders 3, 3.
If there is a deviation from the position of the Y robot 5),
By correcting the position data of the feeders 3, 3,... Stored in the control device by the amount of the shift, the supply position of the electronic components supplied on the feeders 3, 3,.

The position of the circuit board 20 is confirmed, for example, by picking up and recognizing marks provided on the circuit board 20 with the imaging cameras 11A and 11B when the circuit board 20 is transported and stopped. Regarding the imaging of the mark on the circuit board 20, when the mark is on one side in the feed direction of the circuit board 20, the imaging is performed by the imaging camera 11A (11B) disposed on the same one side, and the mark is captured. When it is on the other side, the image is taken by the imaging camera 11B (11A) arranged on the other side. Thereby, the movement stroke of the XY robot 5 can be reduced during the mark recognition.

The position and state of the mounted electronic components are checked, for example, every time an individual electronic component is mounted or after all the electronic components are mounted, the mounted electronic components are imaged by the imaging cameras 11A and 11B. It is done by recognizing. Regarding imaging of the electronic component, when the electronic component is mounted on one side in the feed direction of the circuit board 20, the imaging camera 11A (1
1B), an image is taken, and when the electronic component is mounted on the other side, the imaging camera 11 arranged on the other side
An image is taken at B (11A). Thus, the moving stroke of the XY robot 5 can be reduced even when the mounted electronic component is imaged. After the imaging of the electronic component, if there is a deviation between the angle or position of the electronic component stored in the control device and the actual angle or position, the electronic device stored in the control device is compensated for the deviation. By correcting the component angle and position data, the mounting position and state of the next electronic component are corrected.

As described above, according to the component mounting apparatus 1 of this embodiment, a plurality of electronic components to be supplied are individually suctioned and released to the suction head mechanism 4 for suctioning (holding) and releasing components. A plurality of suction nozzles 13A, 13B
In order to confirm the positions of the plurality of components to be supplied, imaging cameras 11A and 11B are provided for imaging the supply locations, respectively, and two sets of the imaging cameras 11A and 11B are provided. Since they are arranged on both sides of the plurality of suction nozzles 13A and 13B, it is possible to shorten the interval between the plurality of suction nozzles 13A and 13B. Therefore, even when components are mounted on a small substrate, The efficiency of the mounting process can be improved.

Further, the image pickup camera 11 is attached to the suction head mechanism 4.
A and 11B are provided, and the two sets of imaging cameras 1 are provided.
1A and 11B are arranged on both sides of the plurality of suction nozzles 13A and 13B, so that one imaging camera 11A (11
B) performs imaging on one side, and the other imaging camera 11B
By causing (11A) to perform imaging on the other side, it is possible to reduce the movement stroke of the XY robot 5 necessary for the imaging processing, particularly, the movement stroke in the X direction in which the imaging cameras 11A and 11B are arranged. This is useful without increasing the installation area of the component mounting apparatus 1, particularly the length in the substrate flow direction.

The present invention is not limited to the component mounting apparatus 1 of this embodiment. For example, the suction nozzles 13A and 13B are shown as heads for holding components. Needless to say, the format can be changed to various formats, and the number of heads is not limited to two. Further, the arrangement of the head unit and the image pickup means is not limited to those arranged in a line. For example, the same effect can be obtained even if the head units are arranged in a zigzag manner or the image pickup means is displaced from the line of the head unit. Is done. In addition, detailed structures and methods specifically shown, such as reels 2 for storing parts, feeders 3, 3... As supply means, and a method of confirming the supply position of the parts by the imaging means, are described in the present invention. It can be changed without departing from the spirit.

[0045]

According to the first aspect of the present invention, a head mechanism for holding and releasing components includes a plurality of head units for individually holding and releasing a plurality of supplied components, and a plurality of supplied head units for holding and releasing the supplied components. Imaging means for imaging each of the plurality of parts or the supply points of the plurality of parts to confirm the position of the parts, and two sets of the imaging means are provided, and the two sets of the imaging means are provided by the plurality of heads. Since it is arranged on both sides of the unit, the distance between the multiple head units can be shortened, and therefore, even when components are mounted on a small substrate, the efficiency of the mounting process is improved. Can be done.

Further, since two sets of image pickup means are provided in the head mechanism, and these two sets of image pickup means are arranged on both sides of the plurality of head units, one of the image pickup means performs image pickup on one side and the other image pickup means. By causing the imaging means to perform imaging on the other side, the movement stroke of the XY mechanism required for processing by the imaging means can be reduced. Since the movement stroke of the XY mechanism does not increase, it is useful without increasing the installation area of the component mounting machine, particularly, the length in the substrate flow direction.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is an enlarged perspective view showing details of a head mechanism of FIG. 1;

FIG. 3 is a perspective view showing an example of a conventional component mounting apparatus.

FIG. 4 is an enlarged perspective view showing details of a head mechanism shown in FIG. 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2, 2 ... Reel (component accommodation means) 3, 3 ... Feeder (supply means) 4 Suction head mechanism 5 XY robot 11A, 11B Imaging camera 13A, 13B Suction nozzle (head part)

Claims (1)

[Claims] A head mechanism for holding and releasing the component; and an XY mechanism for moving the head mechanism in the X and Y directions. The head mechanism holds the supplied component. In the component mounting apparatus that mounts the component on the substrate by releasing the component after moving to a predetermined position, the supply unit supplies a plurality of components, and the head mechanism individually separates the supplied components. A plurality of head units for holding and releasing the plurality of components, and an imaging unit for imaging each of the plurality of components or a supply location of the plurality of components in order to check the positions of the plurality of components to be supplied, wherein the imaging unit includes A component mounting apparatus, wherein two sets are provided, and the two sets of imaging means are arranged on both sides of the plurality of head units, respectively.