JPH10209192A - Method for molding hollow semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To raise the product accuracy by making a resin burr hardly formed at bonding areas. SOLUTION: A first and second resin moldings are formed in separate steps. The first step uses a first mold 34 having a cavity 38 for the tubular first molding, and the second mold 48 having a flat lead frame contact surface 46 without cavity, for forming the first molding. The second step uses a first mold 34 having a cavity 38 for the first resin molding, and second mold having a cavity for the second resin molding, for forming the second molding.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a CCD and an EPROM.
The present invention relates to a method for molding a hollow semiconductor package having a light irradiation window as described above.

[0002]

2. Description of the Related Art Conventionally, a hollow semiconductor package such as a CCD or an EPROM which irradiates a semiconductor with light from the outside through a transparent window has a structure as shown in FIGS.
For the lead frame 10, the hollow package part 1
2 is molded by a resin mold and integrally provided. This lead frame 10 has a die support (semiconductor element installation location) 14 at the center of each section, and a plurality of tips 18 of inner leads 16 disposed around the center. A bonding area 20 for connection is formed, and a number of outer leads 22 are arranged in a peripheral portion. At the time of manufacture, after the package portion 12 is provided on the lead frame 10, the semiconductor element 2 such as an IC chip is
4 are bonded, and each electrode of the element 24 is bonded to the distal end portion 18 of each corresponding inner lead 16 with a wire 26. Thereafter, a window is formed by attaching a transparent plate 30 made of glass or the like to the opening 28 of the package unit 12, and the vicinity of the bonding area 20 is sealed. Reference numeral 32 denotes a pinch lead extending left and right from the die support 14.

Further, when molding the package section 12, as shown in FIG. 9, a first and second molding dies 34, 36 are used by using a package molding apparatus which is disposed vertically. , 36, the lead frame 10 is arranged at a predetermined position on the parting line surface.
A molten resin material is injected and filled into the cavity portion 38 of the molding die 34 and the cavity portion 40 of the second molding die 36, respectively. Then, a cylindrical first resin molded body 42 is fixed on the upper surface side of the lead frame 10 so as to cover the periphery of the vicinity of the bonding area 20 in a ring shape, and is fixed on the lower surface side of the outer periphery of the first resin molded body 42. A block-shaped second resin molded body 44 projecting over the entire surface of the region opposed to the entire region included in the resin molded body 44 is fixed, and the vicinity of the bonding area 20 is exposed by the two resin molded bodies 42 and 44. The part 12 can be formed.

[0004]

However, when resin is injected during the molding of such a package portion 12,
The molten resin injected into the cavity 40 is the die support 1
It flows in the direction of the arrow through the gap between the inner mold 4 and the tip 18 of each inner lead 16, and easily flows between the first mold 36 and the bonding area 20. Further, the molten resin injected into the cavity 38 also flows through the gap formed between the first molding die 34 and each inner lead 16 in the direction of the arrow and easily enters, so that the die support 14 and the distal end 1 of each inner lead 16 are formed.
8 flaps up and down, and resin burrs are easily formed in the bonding area 20. This is because the resin injection pressure must be extremely large in order to increase the molding accuracy of the package portion 12, but the force for adhering the bonding area 20 to the first molding die 34 is weaker than the injection pressure. . If resin burrs are generated in the bonding area 20, it becomes impossible to bond the semiconductor element 24 to the die support 14 and to connect the element 24 to each of the inner leads 16 in a favorable manner, and it is easy to cause a disconnection accident.
Therefore, a burdensome resin deburring step is required.

The present invention has been made in view of such a conventional problem. First, a method of molding a hollow semiconductor package which is less likely to cause resin burrs in a bonding area and which can improve the precision of a product. The purpose is to provide. Second, it is another object of the present invention to provide a method of forming a hollow semiconductor package, which makes it difficult for resin burrs to be generated in a bonding area and firmly couples a package portion to a lead frame to further improve the accuracy of a product. And

[0006]

In order to achieve the above object, a method of molding a hollow semiconductor package according to a first object of the present invention uses a molding apparatus for molding a package having first and second molds. Using, the lead frame is arranged at a predetermined position on the parting line surface of both molds, the molten resin material is injected and filled in the cavity, and the outer periphery near the bonding area is covered in a ring shape on one side of the lead frame. A first cylindrical resin molded body projecting is fixedly attached,
On the other surface side, a block-shaped second resin molded body that covers and projects over the entire surface of the area opposed to the entire area included in the outer periphery of the first resin molded body is fixed. Is formed to form a hollow package portion.

The first and second resin moldings are formed separately from each other. The first molding die having a cavity for the first resin molding and the flat lead frame contact surface having no cavity are provided. The second resin mold is used to mold the first resin molded body, and then the first mold having a cavity for the first resin molded body and the second mold having a cavity for the second resin molded body. The second resin molded body is molded using a molding die.

In the method of molding a hollow semiconductor package corresponding to the second object, when the first resin molded body is molded, it is replaced with a second molding die having a flat lead frame contact surface without a cavity. A second mold having a cavity for molding a resin part for coupling, which is integrally coupled to the first resin molded body and fixed to the other surface side of the lead frame, is used.

[0009]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a longitudinal sectional view of a main part showing an arrangement state of a lead frame in a mold of a package molding apparatus in a first resin molded body molding step by a hollow semiconductor package molding method to which the present invention is applied. This package molding apparatus uses a conventional first molding die 34 as an upper mold and a second molding die 48 having a flat lead frame contact surface 46 without a cavity below. Then, at the time of molding, the conventional lead frame 10 is arranged at a predetermined position on the parting line surface of both molds 34 and 48. In addition, 5
Reference numeral 0 denotes a gate for injecting the molten resin material into the cavity portion 38 of the first molding die 34.

When the second mold 48 is used as described above, when the mold is closed, the entire lead frame 10 is satisfactorily removed from below with the flat lead frame contact surface 46 having no cavity of the second mold 48. By supporting, the bonding area 20 of the lead frame 10 can be firmly adhered to the lead frame contact surface (lower surface) 52 of the first molding die 34 and fixed. Therefore, even if a thermosetting resin, such as an epoxy resin, melted from the gate 50 of the first mold 34 is injected into the cavity 38 with a very high pressure, the molten resin may enter the bonding area 20. Absent. In addition, since the second mold 48 does not have a cavity and does not perform resin injection, the resin does not enter the bonding area 20 from the second mold 48 naturally.

Then, when the mold is opened, a one-side molded product as shown in FIG. 2, that is, a cylindrical first resin protruding from the upper surface side of the lead frame 10 by covering the outer periphery near the bonding area 20 in a ring shape. Molded product 5 to which molded body 54 is fixed
6 is obtained. Then, no resin burr is generated in the bonding area 20 of the molded product 56. Also, the molded product 56
Since the connection between the lead frame 10 and the first resin molded body 54 is strong and the equi-joined state is good, and the arrangement relationship between them is accurate, the accuracy is also excellent.

Next, in order to form such a molded article 56 on both sides, a conventional package molding apparatus having first and second molding dies 34 and 36 is used, and as shown in FIG. The molded product 56 is arranged at the location and the mold is closed.
Then, an epoxy resin is injected from the gate 58 of the second mold 36 into the cavity 40 as a thermosetting resin which has also been melted. At this time, even if the injection pressure is extremely increased, the molten resin does not enter the bonding area 20 and solidifies inside the cavity 40. This is because the one-sided molded product 56 has a strong bond between the lead frame 10 and the first resin molded body 54 and has a precise positional relationship. Without fluttering with the tip 18 of the 16
This is because the bonding area 20 comes into contact with the lead frame contact surface 52 of the first molding die 34 in a state of being in close contact with the lead frame.

After that, when the mold is opened, a molded product molded on both sides as shown in FIG.
A second resin molded body 60 having a trapezoidal cross section is fixed to the lower surface side of the first resin molded body 54 so as to cover and project over the entire area opposed to the entire area included in the outer periphery of the first resin molded body 54. A molded product 64 provided with a hollow package portion 62 including the first and second resin molded bodies 54 and 60 is obtained. Then, no resin burr is generated in the bonding area 20 of the molded product 64. In the molded product 64, the connection between the lead frame 10 and the second resin molded body 54 is strong and the state of equi-bonding is good, and the positional relationship between them is also accurate, so that the precision is naturally excellent.

As described above, if the molding process of the first and second resin molded bodies 54 and 60 constituting the package portion 62 is a separate process, resin burrs generated in the bonding area 20 can be suppressed to no or very little. . Therefore, it is possible to move to the next step while minimizing the burden on removing resin burrs. Therefore, the semiconductor element such as an IC chip is bonded to the bonding surface of the die support 14 by following the conventional steps.
Each electrode of the element is wire-bonded to the corresponding distal end portion 18 of each inner lead 16, and the vicinity of the exposed bonding area 20 of the first resin molded body 5 is
When a glass plate or the like is fitted into the opening of No. 4 for sealing, a hollow semiconductor package is completed.

In the above embodiment, when the first resin molded body 54 is molded, the first molding die 34 having the cavity 38 for the first resin molded body and the flat lead frame contact surface 46 having no cavity are formed. Although the second molding die 48 is used, a second molding die 66 as shown in FIG. 5 can be used instead of the second molding die 48. In the second molding die 66, a plurality of small recesses are provided in the lead frame contact surface 68, and these are used as small cavity portions 72.

Therefore, the molten resin is supplied to the cavity portions 38, 7
When the resin is injected into the mold, the one-side molded product as shown in FIG. 6, that is, the first resin molded body 54 is fixed to the upper surface side of the lead frame 10, and a plurality of small resin parts 72 are fixed to the lower surface side. A molded product 74 in which the first resin molded body 54 and the respective resin portions 72 are integrally joined is obtained. Then, the lead frame 10 is sandwiched between the first resin molded body 54 and each of the coupling resin parts 72, and the lead frame 10 and the first resin molded body 5 are sandwiched.
4 can be more firmly connected, and their positional relationship can be made more accurate to improve the accuracy. The position of each coupling resin portion 72 does not necessarily need to be provided at a position facing the first resin molded body 54, and the position can be changed inward.

[0017]

According to the present invention described above, claim 1
In the described invention, the molding process of the first and second resin molded bodies constituting the hollow package portion is a separate process, and
In order to mold a cylindrical first resin molded body by using a first mold having a cavity for a resin molded body and a second mold having a flat lead frame contact surface having no cavity, The bonding area of the lead frame can be firmly adhered to the lead frame contact surface of the first molding die and fixed. Therefore, even if the injection pressure of the molten resin injected into the cavity of the first mold is extremely increased, the resin does not enter the bonding area.

In a subsequent step, a first molding die having a cavity portion for a first resin molded body and a second molding die having a cavity portion for a second resin molded body are used. When placing a molded product on one side in
The bonding area of the lead frame can be firmly adhered to the lead frame contact surface of the first molding die and fixed. Therefore, even if the injection pressure of the molten resin injected into the cavity of the second mold is increased, the resin does not enter the bonding area. Therefore, resin burrs do not occur in the bonding area of the molded product molded on both sides, the connection between the lead frame and the package portion is strengthened, and the arrangement relationship between them is also accurate, and the accuracy of the molded product is improved.

According to the second aspect of the present invention, when the cylindrical first resin molded body is molded, the first molding die having a cavity for the first resin molded body and the first resin molded body are integrally formed. By using a second mold having a cavity for molding a resin part for coupling, which is coupled to and fixed to the other surface side of the lead frame,
To provide a coupling resin part on the other side of the lead frame,
The lead frame is sandwiched between the first resin molded body and the coupling resin portion, and the lead frame and the first resin molded body are more firmly connected to each other.
It is possible to improve the accuracy of a molded product formed on one side.
Therefore, even in a molded product molded on both sides, resin burrs are not generated in the bonding area, the connection between the lead frame and the package portion is further strengthened, and the arrangement relationship thereof is more accurate, and the precision of the molded product is further improved. improves.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a main part showing an arrangement state of a lead frame in a mold of a package molding apparatus in a first resin molded body molding step by a hollow semiconductor package molding method to which the present invention is applied.

FIG. 2 shows a first side of the lead frame after the same molding process.
It is a longitudinal cross-sectional view of the one-side molded article provided with the resin molded body.

FIG. 3 shows a second example of the hollow semiconductor package molding method.
It is a principal part longitudinal cross-sectional view which shows the arrangement | positioning state of the one-side molded part in the metal mold | die of the package molding mold device in a resin molded object molding process.

FIG. 4 is a cross-sectional view of a second side of the lead frame after the molding process.
It is a longitudinal cross-sectional view of the molded product which is provided with the resin molded body and is molded on both sides and forms a package portion.

FIG. 5 is a vertical sectional view of a main part showing an arrangement state of a lead frame in a mold of a package molding apparatus in a first resin molded body molding step by another hollow semiconductor package molding method to which the present invention is applied. .

FIG. 6 is a view showing a state in which a first side of a lead frame is formed through the same molding process;
It is a longitudinal cross-sectional view of the molded article which was provided with the resin molded body and was molded on one side and provided with a coupling resin portion on the other side.

FIG. 7 is a plan view showing an example of a hollow semiconductor package.

FIG. 8 is a sectional view taken along line AA of FIG. 7;

FIG. 9 is a vertical cross-sectional view of a main part showing a flow of a molten resin that enters a bonding area of a lead frame arranged in a mold of a package molding apparatus during molding by a conventional hollow semiconductor package molding method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Lead frame 14 ... Die support 16 ... Inner lead 18 ... Tip part 20 ... Bonding area 22 ... Outer lead 34 ... 1st shaping | molding die 36,48,66 ... 2nd shaping | molding die 38,40,70 ... Cavity part 46, 52, 68 ... Lead frame contact surface 50, 58 ... Gate 54 ... First resin molded body 56, 74 ... One-side molded product 60 ... Second resin molded product 62 ... Package part 64 ... Both-side molded product 72 ... Joining Resin part

Claims (2)

[Claims] 1. A lead frame is arranged at a predetermined position on a parting line surface of both molds using a package molding mold device having first and second molds, and a molten resin material is filled in a cavity portion. Injecting and filling, a cylindrical first resin molded body is fixed to one surface side of the lead frame so as to cover the outer periphery near the bonding area in a ring shape and protrude,
On the other surface side, a block-shaped second resin molded body that covers and projects over the entire surface of the area opposed to the entire area included in the outer periphery of the first resin molded body is fixed. In the method of molding a hollow semiconductor package for forming a hollow-shaped package portion exposing the first and second resin molded products, the molding process of the first and second resin molded products is performed separately, and the first and second resin molded products have a cavity portion for the first resin molded product. A first resin molding is molded using a molding die and a second molding die having a flat lead frame contact surface without a cavity, and then a first molding die having a cavity for the first resin molding. A method of molding a hollow semiconductor package, comprising molding a second resin molded body using a second mold having a cavity for the second resin molded body. 2. A method for molding a first resin molded body, comprising: forming a second lead having a flat lead frame contact surface without a cavity;
Instead of a molding die, it is integrated with the first resin molded body,
2. The method of molding a hollow semiconductor package according to claim 1, wherein a second molding die having a cavity portion for molding a coupling resin portion fixed to the other surface side of the lead frame is used.