JPH098453A - Ultrasonic connection of insulating substrate with flexible substrate - Google Patents

Abstract

PURPOSE: To provide a method of connecting an insulating substrate, which is generally used for an electronic equipment, with a flexible substrate, which aims the connection of the insulating substrate with the flexible substrate by possible ultrasonic waves in a very short time and does not deteriorate the characteristics of a high-molecular diaphragm. CONSTITUTION: A flexible substrate 5 has a thermoplastic resin 5a and an insulating substrate 1 has a thermoplastic resin 6a. In this constitution, a pressure and ultrasonic waves are applied by a horn 3 to melt the thermoplastic resins so that the substrates 5 may be connected with the substrate 6, whereby a method of connecting the substrate 5 with the substrate 6, which can connect the substrate 5 with the substrate 6 in a short time and does not deteriorate the characteristic of a high-molecular diaphragm, can be provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for ultrasonically connecting an insulating substrate and a flexible substrate used in general electronic equipment.

[0002]

2. Description of the Related Art Conventional connection between an insulating substrate and a flexible substrate and electrical connection of wiring patterns are shown in FIGS.
This will be described below.

In FIG. 4, reference numeral 8 is a press, a heater 9 is attached to the lower portion of the press, and a head 10 provided with a heat press rubber 10a which moves up and down by the press is attached to the lower portion thereof. A flexible substrate 5 and an insulating substrate 6 described later are placed on the pedestal 11.

A method of connecting an insulating substrate and a flexible substrate will be described with reference to FIG. 5, 5 is a flexible substrate having a thermoplastic resin 5a, and 6 is a thermoplastic resin 6a.
It is an insulating substrate having. The head 10 is lowered by the press 8, and the pressure and heat of the heat press rubber 10a causes
Thermoplastic resin 5 between the flexible substrate 5 and the insulating substrate 6
After pressing and melting a and 6a, the head 10 is lifted by the press 8 to release the pressure and heat, and the thermoplastic resin 5a,
The flexible substrate 5 and the insulating substrate 6 are connected by solidifying and fixing 6a.

Next, the electrical connection of the pattern formed on the insulating substrate and the flexible substrate so as to face each other will be described with reference to FIG. 5b is a pattern wired on the flexible substrate 5, 6b is a pattern wired on the insulating substrate 6, and 7 is an anisotropically conductive thermoplastic resin. The thermoplastic resin melts due to the pressure and heat of the heat-pressed rubber, the gap is narrowed, 5b and 6b are electrically connected, and then the thermoplastic resin is solidified and fixed, so that the flexible substrate 5 and the insulating substrate 6 are connected.

[0006]

However, in the above method, since the thermoplastic resin is melted and connected by applying pressure and heat, it takes a long time for the heat to be transmitted, and the characteristics of the flexible substrate are deteriorated. There was a problem of being lost.

In particular, in a structure in which a convex diaphragm is formed on the flexible substrate side and the diaphragm is pressed between the insulating substrate and the opposing insulating substrate to form a switch with a feeling of moderation, The deterioration was remarkable.

In view of the above points, the present invention provides a connection method capable of melting and connecting a thermoplastic resin in a short time without deteriorating the characteristics of a flexible substrate which is a polymer.

[0009]

In order to solve the above problems, the present invention provides a method of melting and connecting a thermoplastic resin printed on an insulating substrate and a flexible substrate by applying pressure and ultrasonic waves. It is a thing.

[0010]

By the above method, it is possible to provide a connecting method for connecting the insulating substrate and the flexible substrate in a short time without deteriorating the characteristics.

[0011]

Embodiments of the present invention will be described below with reference to FIGS.

In FIG. 2, reference numeral 1 is a press, an oscillator 2 is attached below the press, and a horn 3 which is moved up and down by the press is attached below the oscillator. The horn 3 is knurled. A flexible substrate 5 and an insulating substrate 6 described later are placed on the cradle 4.

The connection between the insulating substrate and the flexible substrate made of a polymer film will be described with reference to FIG. Reference numeral 5 is a flexible substrate having a thermoplastic resin 5a, and 6 is an insulating substrate having a thermoplastic resin 6a. When the horn 3 is lowered by the press 1 and the horn 3 is vibrated by the oscillating device 2, the thermoplastic resin 5a, 6 between the flexible substrate 5 and the insulating substrate 6 is generated by the pressure of the horn 3 and ultrasonic waves.
After pressing and melting a, the ultrasonic wave is released, the horn 3 is raised by the press 1 to release the pressure, and the flexible substrate 5 and the insulating substrate 6 are connected by solidifying and fixing the thermoplastic resins 5a and 6a. It is a thing.

Next, the electrical connection between the insulating substrate and the pattern formed on the flexible substrate so as to face each other will be described with reference to FIG. 3. 5b is a conductive pattern wired on the flexible substrate 5, and 6b is on the insulating substrate 6. The wiring is a conductive pattern, and 7 is an anisotropic conductive thermoplastic resin. By the pressure of the horn and the ultrasonic waves, the thermoplastic resin is melted and the gap is narrowed, 5b and 6b are electrically connected, and then
By solidifying and fixing, both patterns and the flexible substrate 5 and the insulating substrate 6 are connected.

It should be noted that although the shape of the flexible substrate is not described in both of the above-described embodiments, a pressure switch (for example, a panel switch) is formed by contacting and separating the electrodes of the insulating substrate and the flexible substrate. , There is a flexible diaphragm provided with a convex diaphragm and pressing this diaphragm to obtain a feeling of moderation at the same time as switching, but in such a case, the effect on the diaphragm is particularly suppressed to provide a feeling of moderation. It has the effect of preventing the deterioration of the characteristics.

[0016]

As described above, in the connection between the insulating substrate and the flexible substrate of the present invention, the thermoplastic resin printed on the insulating substrate and the flexible substrate is melted and connected by applying pressure and ultrasonic waves. Thus, it is possible to provide a connection method that can be connected in a short time and can be connected without deteriorating the characteristics of the flexible substrate.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a flexible substrate and an insulating substrate connected by an ultrasonic connecting method of the insulating substrate and the flexible substrate of the present invention.

FIG. 2 is a schematic side view of an ultrasonic welding machine used in the method for ultrasonically connecting an insulating substrate and a flexible substrate of the present invention.

FIG. 3 is a cross-sectional view of the conductive patterns connected together.

FIG. 4 is a schematic side view of a conventional heat press machine.

FIG. 5 is a cross-sectional view of a flexible substrate and an insulating substrate connected by a conventional heat press.

FIG. 6 is a cross-sectional view of a wiring pattern connected by a conventional heat press.

[Explanation of symbols]

 3 Horn 5 Flexible substrate 5a Thermoplastic resin 5b Conductive pattern 6 Insulating substrate 6a Thermoplastic resin 6b Conductive pattern

Claims (2)

[Claims] 1. An insulating substrate, characterized in that an insulating substrate and a flexible substrate are opposed to each other, and a thermoplastic resin printed on the opposing surface is melted by applying pressure and ultrasonic waves to connect the insulating substrate and the flexible substrate. And flexible board ultrasonic connection method. 2. An insulating substrate provided with a conductive pattern and a flexible substrate are opposed to each other, and a thermoplastic resin printed on the facing surface side is electrically connected to each other by applying pressure and ultrasonic waves to the conductive patterns. A method for ultrasonically connecting an insulating substrate and a flexible substrate, comprising: connecting the insulating substrate and the flexible substrate.