JPH0950241A - Image forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a stable and high-definition image forming device capable of realizing stable support coping with the warpage and the waviness of a display panel, and uniform heat radiation, being safely set and having neither color slurring nor rupture. SOLUTION: This image forming device is provided with a rear plate on which an electron emission element is mounted, a face plate which is arranged to be opposed to the rear plate and on which an image forming member where an image is formed by the irradiation with an electron beam emitted from the electron emission element is mounted, and the display panel 11 where the face plate and the rear plate are formed, and the display panel 11 is constituted by providing a heat radiation member 14 through a supporting member A which can conduct heat and have an elongating and contracting function so as to support the display panel 11 by profiling the display panel 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image forming apparatus such as a display device and a recording device to which an electron source is applied, and more particularly to a heat dissipation device of a thin image forming apparatus.

[0002]

2. Description of the Related Art Conventionally, two types of electron emitting devices, a thermionic electron source and a cold cathode electron source, are known. The cold cathode electron source includes a field emission type (hereinafter abbreviated as FE type), a metal / insulating layer / metal type (hereinafter abbreviated as MIM type), and a surface conduction type electron emission element. As an example of the FE type, W. P. Dyke &
W. W. Dolan, "Field Emissio"
n ", Advance in Electron Ph
ysics, 8 89 (1956) or C.I.
A. Spindt, "Physical Proper
ties of thin-film field e
Mission cathodes with mol
ybdenium ", J. Appl. Phys., 47.
5248 (1976) and the like are known. Examples of the MIM type include C.I. A. Mead, "The tunnel
-Emission amplifier, J. App
l. Phys. , 32 646 (1961) and the like are known. As an example of the surface conduction electron-emitting device type, see,
I. Elinson, RadioEng. Elect
ron Phys. 10 (1965) and so on. The surface conduction electron-emitting device utilizes a phenomenon in which electron emission occurs when a current is applied to a thin film having a small area formed on a substrate in parallel with the film surface. Examples of the surface conduction electron-emitting device include a device using an SnO ₂ thin film by Elinson et al. And a device using an Au thin film [G. Dittm
er: “Thin Solid Films”, 93
17 (1972)], by In ₂ O ₃ / SnO ₂ thin film [M. Hartwell and C.M. G. FIG. Fon
stad: "IEEE Trans. ED Con
f. 519 (1975)], by a carbon thin film [Hiraki Araki et al .: Vacuum, Vol. 26, No. 1, p. 22 (1)
983)] has been reported. As a typical device configuration of these surface conduction electron-emitting devices, the aforementioned M.S. A conventional Hartwell device structure is shown in FIG. In FIG.
Reference numeral 81 is a substrate. Reference numeral 184 denotes a conductive thin film, which is made of a metal oxide thin film or the like formed by sputtering on an H-shaped pattern, and the electron emitting portion 185 is formed by an energization process called energization forming described later. The element electrode interval L in the figure is set to 0.5 to 1 mm, and W'is set to 0.1 mm. Since the position and shape of the electron emitting portion 185 are unknown, they are shown as a schematic diagram.

Conventionally, in these surface conduction electron-emitting devices, it has been general that the electron-emitting portion 185 is formed in advance by conducting a current called a conductive forming process on the conductive thin film 184 before emitting electrons. That is, energization forming means a DC voltage across the conductive thin film 184, or a very slow rising voltage, for example, 1 V /
This is to form an electron-emitting portion 185 in which the conductive thin film is locally destroyed, deformed, or altered so as to have an electrically high resistance by applying a current for about a minute. The electron emission unit 1
In 85, a crack is generated in a part of the conductive thin film 184, and electrons are emitted from the vicinity of the crack. The surface conduction electron-emitting device that has been subjected to the energization forming treatment is the above-mentioned conductive thin film 1
A voltage is applied to 84 and a current is passed through the element to cause electrons to be emitted from the electron emitting portion 185.
Since the surface conduction electron-emitting device described above has a simple structure and is easy to manufacture, it has an advantage that a large number of devices can be arrayed over a large area. Therefore, various applications that can make full use of this feature are being researched. For example, a charged beam source, a display device such as an image display device may be used.

An image display device using such an electron-emitting device is one in which a rear plate on which an electron-emitting portion is mounted, a face plate on which an image forming member is mounted, and both of which are vacuum-sealed via a support frame. Are known.

In such an image forming apparatus, in general, a face plate having an image forming member mounted thereon, a rear plate having an electron source substrate mounted thereon, and a supporting frame member formed by cutting a soda lime glass into a frit glass. Using the adhesive member, each member is adhered and manufactured by raising the temperature to a temperature at which the frit glass melts and solidifies and then cooling. At this time, in the heat process, it may be difficult to perform uniform temperature rise and temperature control over the entire apparatus, so that the entire apparatus may be non-linearly curved.

Although it is possible to manufacture a thin image forming apparatus having a large area by using the conventional electron-emitting device, it is difficult to maintain the plane accuracy of the formed face plate, rear plate and supporting frame member over a large area. Therefore, the image forming apparatus may have a warp or undulation.

Further, when the image forming apparatus is driven and displayed, a temperature difference occurs between the face plate, the rear plate and the support frame due to heat generation of the electron emitting portion on the rear plate and heat generation of the image forming member on the face plate. Due to the difference in thermal expansion, the image forming apparatus may be warped and the entire apparatus may be curved.

As a result, color misregistration, lowering of brightness, and screen distortion occur, and there is a risk of vacuum leak or device destruction if driven for a long time.

For this reason, there is a need for a uniform heat radiating means for stably supporting the warp and undulation of the image forming apparatus and suppressing the warp that occurs during driving.

[0010]

SUMMARY OF THE INVENTION The present invention provides a high-definition image forming apparatus which solves the above problems of the prior art, safely supports a large flat image forming apparatus, and is free from color shift due to uniform heat radiation. The purpose is to provide.

[0011]

The above object can be achieved by the following means. That is, the present invention provides a face on which a rear plate on which an electron-emitting device is mounted and an image forming member which is arranged to face the rear plate and on which an image is formed by irradiation of an electron beam emitted from the electron-emitting device is mounted. In an image forming apparatus having a plate, a display panel formed of the face plate and the rear plate,
An image forming apparatus, characterized in that the display panel is provided with a heat radiating member via a supporting member capable of conducting heat and having an expanding / contracting function, and the display panel is supported according to the shape of the display panel. It is proposed that the support member is composed of a plurality of elastic members, the elastic member is composed of a plurality of heat conduction members and a plurality of heat conduction spring members, the support member from a closed container having a fluid inside That is, the closed container is an elastic member, and the electron-emitting device mounted on the face plate of the display panel is a surface conduction electron-emitting device.

[0012]

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described in detail below with reference to the drawings. FIG. 1 is a sectional view of an essential part of an image forming apparatus showing an example of the present invention, and FIG. 13 is a schematic configuration diagram showing an example of the image forming apparatus of the present invention. In FIG. 1, 11 is a display panel, 12 is a heat conducting member, 13 is a spring member which is a supporting member having an expanding and contracting function, and 14 is a heat radiating member. As shown in FIG. 13, the display panel 11 has a rear plate 131 on which a pair of device electrodes of an electron-emitting device are connected by an X-direction wiring 122 and a Y-direction wiring 123, and an electron source substrate 121 mounted on the substrate and the rear plate 131. The plate 131 includes a face plate 136 that is arranged to face the plate 131 and has an image forming member on which an image is formed by irradiation with an electron beam emitted from an electron-emitting device, and a support frame 132 that is arranged between the plates 131 and 136. ing. Face plate 13
The image forming member mounted on No. 6 is configured by sequentially stacking a fluorescent film 134 and a metal back 135 on a glass substrate 133. The image forming apparatus of the present invention is an image forming apparatus having the display panel as described above, and as shown in FIG. 1, the heat conducting member 12 is provided between the display panel 11 and the heat radiating member 14.
And a plurality of supporting members A composed of a stretchable spring member 13 are integrated. The heat conducting member 12 and the spring member 13 may be made of the same material or different materials. It is particularly important that the support member A is attached so that it can expand and contract according to the change in the shape of the display panel 11, and the heat conduction members 12 of the support member A are
It is preferable to provide them at intervals of about 100 mm. With the above configuration, the spring member 13 and the display panel 11 can be connected to each other even if the display panel 11 is non-linearly warped.
Since the interval between them can be self-adjusted by the expansion and contraction of the spring member 13, the display panel 11 can be supported very stably without causing the display panel 11 to warp. The heat generated by driving the display panel 11 is generated by the heat conducting member 12
And the heat is transmitted through the spring member 13, and finally the heat dissipation member 1
Since the heat is dissipated at 4, the warp of the display panel 11 can be prevented from expanding. In this case, it is preferable that the spring member 13 is made of a heat conductive material because heat conduction can be performed more smoothly. Aluminum as the heat conducting member 12,
Plate materials such as copper and heat conductive rubber may be used. Spring member 13
Examples of the material include elastic materials such as stainless steel and steel. As the shape, a spiral shape, a cantilever shape, or any other suitable known shape that can exhibit a spring effect can be selected. Display panel 11 and heat conducting member 12
The fixing means for fixing the heat conducting member 12, the fixing means for fixing the heat conducting member 12 and the spring member 13, and the fixing means for fixing the heat radiating member 14 and the spring member 13 are welded, bonded with a heat conductive tape, and electrically conductive bonded in consideration of a combination of both materials. It can be appropriately selected from known means such as adhesive bonding. FIG. 3 shows another example of the image forming apparatus of the present invention. In this example, as the supporting member A, one in which the end portions of the heat conducting member 12 are connected in series via the spring member 13 is used. There is. The heat conducting member 12 of the supporting member A is fixedly attached to the back surface of the display panel 11 as shown in FIG. 3, and the opening of the heat dissipation member 14 formed in a shallow box shape by the display panel 11 is closed. The display panel 11 to which the support member A is fixed is attached to the heat dissipation member 14 via the spring members 13 at both ends of the support member A. With the above configuration, even if the display panel 11 is warped, it is self-adjusted by the expansion and contraction of the spring member 13 and is extremely stably supported. Further, even if the display panel 11 is driven in this state, the heat generated by the driving is conducted through the heat conducting member 12 and the spring member 13, and finally the display panel 1 of the heat radiating member 14 is driven.
The warp of 1 is not enlarged. Further, FIG. 5 is a cross-sectional view showing another example of the present invention. In this example, the display panel 11 is shown.
The heat conducting support member 51, which is a sealed bag in which a heat conducting fluid such as water is hermetically sealed, is sandwiched between the heat dissipating member 14 and the heat dissipating member 14. With the above-mentioned structure, the same effect as that of the example of FIGS. 1 and 3 can be obtained.

The cold cathode electron source used in the present invention is preferably a surface conduction electron-emitting device which has a simple structure and is easy to manufacture. There are basically two types of surface conduction electron-emitting devices that can be used in the present invention: a planar surface conduction electron-emitting device and a vertical surface conduction electron-emitting device. FIG. 7 is a schematic plan view and a sectional view showing the structure of a basic surface conduction electron-emitting device. In FIG. 7, 71 is a substrate,
Reference numerals 72 and 73 are element electrodes, 74 is a conductive thin film, and 75 is an electron emitting portion. As the substrate 71, quartz glass, glass with a low content of impurities such as Na, soda lime glass, SiO ₂
A glass substrate and a ceramics substrate made of alumina or the like, on the surface of which are used. A general conductor is used as a material for the device electrodes 72 and 73. For example, Ni, Cr, A
Metals or alloys of u, Mo, W, Pt, Ti, Al, Cu, Pd, etc. and Pd, Ag, Au, RuO ₂ , Pd-Ag.
And the like, or a printed conductor composed of a metal or metal oxide and glass, a transparent conductor such as In ₂ O ₃ —SnO ₂ and a semiconductor material such as polysilicon. The device electrode spacing L is preferably several hundreds of angstroms to several hundreds of micrometers. In addition, it is desirable that the voltage applied between the device electrodes is low, and it is required to produce it with good reproducibility. Therefore, the particularly preferred device electrode interval is several micrometers to several tens of micrometers. The device electrode length W is preferably several micrometers to several hundreds of micrometers in view of the resistance value of the electrodes and electron emission characteristics, and the film thickness of the device electrodes 72, 73 is preferably several micrometers to several micrometers.

In addition to the structure shown in FIG. 7, the conductive thin film 74 and the device electrodes 72 and 73 may be formed in this order on the substrate 71. The conductive thin film 74 is particularly preferably a fine particle film composed of fine particles in order to obtain good electron emission characteristics. The thickness of the conductive thin film 74 is step coverage to the device electrodes 72 and 73, the resistance value between the device electrodes 72 and 73, and It is appropriately set depending on the energization forming conditions and the like, but is preferably several angstroms to several thousand angstroms, particularly preferably 10 angstroms to 5 angstroms.
00 angstroms. The sheet resistance is 10
3 to 10 7 ohms / square. The material forming the conductive thin film 74 is Pd, Pt, Ru, Ag, A.
u, Ti, In, Cu, Cr, Fe, Zn, Sn, T
a, W, Pb and other metals, PdO, SnO ₂ , In ₂ O
₃ , oxides such as PbO and Sb ₂ O ₃ , HfB ₂ , ZrB
_{2, LaB 6, CeB 6,} YB 4, GdB borides such as _{4, TiC, ZrC, HfC,} TaC, SiC, and WC, etc., TiN, ZrN, nitrides such as HfN, Si,
Examples include semiconductors such as Ge and carbon. Incidentally, the fine particle film described here is a film in which a plurality of fine particles are aggregated,
As its fine structure, not only the state where the fine particles are individually dispersed and arranged, but also the film where the fine particles are adjacent to each other or overlap each other (including the island shape), the particle size of the fine particles is from several angstroms to several thousand angstroms. Yes, and preferably from 200 Å to 10 Å. The electron emitting portion 75 is a high-resistance crack formed in a part of the conductive thin film 74, and is formed by energization forming or the like. Further, the cracks may have conductive fine particles having a particle diameter of several angstroms to several hundred angstroms. The conductive fine particles are the conductive thin film 74.
It contains at least a part of the elements constituting the.
Further, the electron emitting portion 75 and the conductive thin film 74 in the vicinity thereof may contain carbon and a carbon compound.

FIG. 8 is a schematic drawing showing the structure of a basic vertical surface conduction electron-emitting device. In FIG.
The same members are designated by the same reference numerals. 80
Is a step forming portion. Substrate 71, device electrodes 72 and 73,
The conductive thin film 74 and the electron emitting portion 75 can be made of the same material as the above-mentioned planar surface conduction electron-emitting device, and the step forming portion 80 is made of an insulating material. Corresponds to the device electrode distance L of the planar surface conduction electron-emitting device described above. The spacing is tens of micrometers rather than hundreds of angstroms. The distance can be controlled by the manufacturing method of the step forming portion and the voltage applied between the device electrodes, but it is preferably several hundred angstroms to several micrometers. Since the conductive thin film 74 is formed after the device electrodes 72 and 73 and the step forming portion 80 are formed, it is laminated on the device electrodes 72 and 73.
In FIG. 8, the electron emitting portion 75 is shown to be linearly formed on the step forming portion 80, but the shape and position are not limited to this, depending on the preparation conditions, energization forming conditions, and the like. Absent. Various methods can be considered as a method of manufacturing the above-mentioned surface conduction electron-emitting device, and one example thereof is shown in FIG. Hereinafter, a method of manufacturing the electron source substrate will be described with reference to FIGS. 7 and 9. The same members as those in FIG. 7 are designated by the same reference numerals.

1) After thoroughly washing the substrate with a detergent, pure water and an organic solvent, a device electrode material is deposited by a vacuum deposition method, a sputtering method or the like. After that, the device electrodes 72 and 73 are formed on the substrate by the photolithography technique (FIG. 9A).

2) Substrate 71 provided with device electrodes 72 and 73
Then, an organic metal solution is applied and left standing to form an organic metal thin film. The organometallic solution mentioned here is a solution of an organometallic compound containing a metal forming the conductive film 74 as a main element. After that, the organic metal thin film is heated and baked, and patterned by lift-off, etching or the like to form the conductive thin film 74 (FIG. 9B). Although the organic metal solution coating method has been described here, the present invention is not limited to this and may be formed by a vacuum vapor deposition method, a sputtering method, a chemical vapor deposition method, a dispersion coating method, a dipping method, a spinner method, or the like. There is also.

3) Subsequently, energization processing called energization forming is performed. The energization forming is performed by the device electrodes 72, 73.
An electric power is supplied from a power source (not shown) in the meantime to locally break, deform or alter the conductive thin film 74 to form a portion having a changed structure. The part where the structure is locally changed is called an electron emitting part 75 (FIG. 9C). FIG. 10 shows an example of the voltage waveform of the energization forming. The voltage waveform is particularly preferably a pulse waveform, and there are a case where a voltage pulse having a constant pulse peak value is continuously applied (FIG. 10a) and a case where a voltage pulse is applied while increasing the pulse peak value (FIG. 10b). . First, the case where the pulse peak value is a constant voltage (FIG. 10A) will be described. T1 and T2 in FIG. 10a are the pulse width and pulse interval of the voltage waveform, where T1 is 1 microsecond to 10 milliseconds, T2 is 10 microseconds to 100 milliseconds, and the peak value of the triangular wave (peak voltage during energization forming) ) Is appropriately selected according to the form of the surface conduction electron-emitting device, and has an appropriate degree of vacuum, for example, 1
It is applied for several seconds to several tens of minutes in a vacuum atmosphere of 0 −5 torr. The waveform applied between the electrodes of the element is not limited to a triangular wave, and a desired waveform such as a rectangular wave may be used. T1 and T2 in FIG. 10b correspond to those in FIG.
Similarly, the peak value of the triangular wave (peak voltage during energization forming) is increased in steps of, for example, about 0.1 V and applied in an appropriate vacuum atmosphere.

In the energization forming process in this case, the element current is measured at a voltage that does not locally break or deform the conductive thin film 74 during the pulse interval T2, for example, a voltage of about 0.1 V, and the resistance is measured. The value is obtained, and when the resistance is 1 M ohm or more, the energization forming is completed.

4) Next, it is desirable to perform a treatment called an activation treatment step on the element which has finished the energization forming. The activation step is, for example, 10 −4 to 10 −5 to t.
Similar to energization forming, this is a process of repeatedly applying a voltage pulse with a constant pulse peak value at a vacuum degree of about orr. Carbon and carbon compounds derived from organic substances existing in vacuum are deposited on a conductive thin film. This is a process of remarkably changing the device current If and the emission current Ie. The activation process is completed, for example, when the emission current Ie is saturated while measuring the device current If and the emission current Ie. Further, it is preferable that the applied voltage pulse is an operation drive voltage.

The carbon or carbon compound is graphite (which refers to both single and polycrystalline) and amorphous carbon (which refers to a mixture of amorphous carbon and polycrystalline graphite), and its thickness is 500. It is preferably angstrom or less, more preferably 300 angstrom or less.

5) Energize the electron-emitting device thus created
Higher than the vacuum level in the forming and activation processes
It is better to place it in a high vacuum atmosphere and drive it.
In an atmosphere with a higher degree of vacuum, 80 ° C to 150 ° C
It is desirable to drive after heating. The energizing four
The vacuum degree is higher than that of the
Is, for example, a vacuum degree of about 10 −6 or higher, and is more preferable.
More preferably, it is an ultra-high vacuum system, and new carbon and carbon compounds
Is the degree of vacuum that hardly deposits on the conductive thin film. like this
Stabilizes the device current If and the emission current Ie by
It is possible to let FIG. 11 shows the configuration shown in FIG.
Evaluation for measuring electron emission characteristics of devices with
It is a schematic block diagram of an apparatus. In FIG. 11, similar to FIG.
The reference symbols indicate the same things. Further, 111 is an electron emission
A power source for applying a device voltage Vf to the output device, 110
Device current I flowing through the conductive thin film 74 between the device electrodes 2 and 3
ammeter for measuring f, 114 denotes electron emission of the device
For capturing the emission current Ie emitted from the part
The negative electrode 113 applies a voltage to the anode electrode 114.
Is a high voltage power supply for
Ammeter for measuring the emission current Ie emitted by
Reference numeral 15 is a vacuum device, and 116 is an exhaust pump. next
The image forming apparatus of the present invention will be described. For image forming device
The electron source substrate used is a plurality of surface conduction electron-emitting devices.
Are arranged on the substrate. Surface conduction type
A surface conduction electron-emitting device is used as the arrangement method of the electron-emitting devices.
Are arranged in parallel, and both ends of each element are connected by wiring.
Ladder layout (hereinafter referred to as ladder layout electron source substrate),
X is applied to each of the pair of device electrodes of the surface conduction electron-emitting device.
Simple matrix layout with directional wiring and Y-directional wiring connected
(Hereinafter referred to as matrix type electron source substrate)
You. An image forming apparatus having a ladder type electron source substrate
Is an electrode that controls the flight of electrons from the electron-emitting device.
Control electrode (grid electrode) is required. Hereafter this
For the configuration of the electron source constructed based on the
Will be described. 121 is an electron source substrate, and 122 is an X-direction arrangement.
Line, 123 is Y-direction wiring, and 124 is surface conduction electron emission.
The element 125 is a wire connection. In addition, the surface conduction electron-emitting device
The child 124 is either the flat type or the vertical type described above.
May be. A substrate used for the electron source substrate 121 in FIG.
Is the above-mentioned glass substrate, etc., and the shape is suitable depending on the application.
Is set accordingly. The m X-direction wirings 122 are Dx1 and Dx.
x2, ... Dxm, and the Y-direction wiring 123 is Dy
It consists of n wirings of 1, Dy2, ..., Dyn. Also
Make sure that a large number of surface conduction elements are supplied with a substantially uniform voltage.
The material, the film thickness, and the wiring width are set appropriately. Of these m
The X-direction wiring 122 and the n Y-direction wirings 123 are not shown.
Are electrically separated by the interlayer insulating layer of
Make up a line. (M and n are both positive integers) The interlayer insulating layer (not shown) is a substrate on which the X-direction wiring 122 is formed.
It is formed in a desired region on the whole surface or a part of 121. X direction
The external wiring 122 and the Y-directional wiring 123 are external terminals, respectively.
Withdrawn through. Further, the surface conduction electron-emitting device 124
The device electrodes (not shown) include m X-direction wirings 122 and n
It is electrically connected by the Y-direction wiring 123 and the connection 125.
Have been. The surface conduction electron-emitting device is a substrate or
It may be formed either on the interlayer insulating layer (not shown). Also
As will be described later in detail, the X-direction wiring 122 has
The array of surface conduction electron-emitting devices 124 is arranged to respond to an input signal.
(Not shown) for applying a scanning signal for simultaneously scanning
It is electrically connected to the scanning signal generating means. On the other hand, Y
The surface wiring type emission elements arranged in the Y direction are included in the direction wiring 123.
To modulate each of the rows of child 124 in response to an input signal
Modulation signal generating means (not shown) for applying the modulation signal of
Is electrically connected to. Furthermore, surface conduction electron-emitting devices
The drive voltage applied to each element of the child is not applied to that element.
Is supplied as the difference voltage between the scanning signal and the modulation signal.
is there. In the above configuration, with simple matrix wiring
Individual elements can be selected and driven independently. Next
Matrix type electron source substrate created as above
Regarding the image forming apparatus used, FIG. 13, FIG. 14 and FIG.
This will be described using 5. FIG. 13 shows the basic structure of the image forming apparatus.
FIG. 14 is a diagram, FIG. 14 is a phosphor screen, and FIG. 15 is an NTSC system test.
Block of drive circuit for displaying according to rev signal
The figure shows the image forming apparatus including the driving circuit. Figure
In No. 13, 121 is an electron-emitting device formed on a substrate.
An electron source substrate 131 is a rear to which the electron source substrate 121 is fixed.
The plate 136 is a fluorescent film 1 on the inner surface of the glass substrate 133.
34 with a metal back 135 and the like
, 132 is a support frame, 131 is a rear plate,
The envelope 138 is configured by these members. FIG.
Reference numeral 124 corresponds to the electron emitting portion in FIG.
122 and 123 are a pair of surface conduction electron-emitting devices.
The X-direction wiring and the Y-direction wiring connected to the electrodes. Outside
The envelope 138 includes the face plate 136 and the support as described above.
The envelope 138 is configured by the holding frame 132 and the rear plate 131.
However, the rear plate 131 is mainly used for the electron source substrate 121.
Since it is provided for the purpose of reinforcing the strength, the electron source substrate 12
Separate rear plate 1 if 1 itself has sufficient strength
31 is unnecessary, and the support frame 13 is directly attached to the electron source substrate 121.
2, the face plate 136, the support frame 132,
The envelope 138 may be configured by the sub-source substrate 121. Figure
142 out of 14 is a phosphor. The phosphor 142 is monochrome
In the case of the dome, it consists only of the phosphor, but of the color phosphor film
In some cases, black stripes or
A black conductive material 141 called a black matrix
And a phosphor 142. Black stripe
The purpose of the rack matrix is to display color.
Coating between the phosphors 142 of the three primary color phosphors required
By making the division part black, it makes the color mixture inconspicuous
Low contrast due to external light reflection on the fluorescent film 134
To suppress the bottom. With black stripe material
Is a material whose main component is graphite, which is commonly used.
It is not only a material, but also conductive and has little light transmission and reflection.
If it is a good material, it is not limited to this. Glass substrate 1
The method of applying phosphor to 33 is monochrome or color
Regardless, a precipitation method or a printing method is used. Also, the fluorescent film 134
A metal back 135 (see FIG. 1) is provided on the inner surface side of FIG.
3) is provided. The purpose of metal back is to emit phosphor
Of the light on the inner surface side is mirrored to the face plate 136 side
The brightness is improved by reflection, and the electron beam is added.
Acting as an electrode for applying fast voltage,
Fireflies from damage due to collision of negative ions generated inside the vessel
For example, to protect the light body. Metal back is made of fluorescent film
After manufacturing, smooth the inner surface of the fluorescent film (normal film
), And then depositing Al by vacuum deposition.
It can be made by stacking. On the face plate 136
In order to further increase the conductivity of the fluorescent film 134.
A transparent electrode (not shown) may be provided on the outer surface side of 4. Circumference
The container 138 is connected to an exhaust pipe (not shown) through the exhaust pipe 10^-7about torr
The vacuum degree is set and the sealing is performed. Also, the envelope 13
Getter processing is performed to maintain the degree of vacuum after the sealing of item 8.
In some cases This is just before the enclosure 138 is sealed.
Heating method such as resistance heating or high frequency heating after sealing
Is placed at a predetermined position (not shown) in the envelope 138.
It is a process of heating the obtained getter and forming a vapor deposition film.
You. The getter usually has Ba as a main component, and
Due to the adsorption action, for example, 1 × 10 ^-Fivetorr or 1x
10^-7The degree of vacuum of torr is maintained. The table
Process after forming of surface conduction electron-emitting device is appropriate
Is set. Next, using a matrix type arrangement electron source substrate
The image forming apparatus configured as
Schematic structure of a drive circuit for performing television display based on
The composition will be described with reference to the block diagram of FIG. 151 is the front
Is a display panel, 152 is a scanning circuit, and 153 is
A control circuit, 154 is a shift register, and 155 is a line memory.
Memory, 156 is a sync signal separation circuit, and 157 is a modulation signal output.
The genitals, Vx and Va, are DC voltage sources.

The functions of the respective parts will be described below. First, the display panel 151 has terminals Dox1 to Doxm and a terminal D.
It is connected to an external electric circuit via oy1 to Doyn and the high voltage terminal Hv. Of these, the terminals Dox1 to Doxm sequentially drive electron sources provided in the image forming apparatus, that is, surface conduction electron-emitting device groups arranged in a matrix of M rows and N columns matrix by row (N elements). A scanning signal for application is applied. On the other hand, terminal D
A modulation signal for controlling the output electron beam of each element of the surface conduction electron-emitting devices of one row selected by the scanning signal is applied to y1 to Dyn. In addition, high voltage terminal H
A direct current voltage of, for example, 10 [kV] is supplied to v from a direct current voltage source Va, which imparts sufficient energy to excite the phosphor to the electron beam output from the surface conduction electron-emitting device. This is the acceleration voltage for Next, the scanning circuit 152 will be described. The circuit is provided with M switching elements inside (S1 to Sm are schematically shown in the figure), and each switching element is the output voltage of the DC voltage source Vx or 0 [V] (ground level).
Either one of them is selected and the terminal Dx of the display panel 151 is selected.
1 to Dxm are electrically connected. Each of the switching elements S1 to Sm operates based on the control signal Tscan output from the control circuit 153, but can actually be configured by combining switching elements such as FETs. It should be noted that the DC voltage source Vx is such that the drive voltage applied to an unscanned element is equal to or lower than the electron emission threshold voltage based on the characteristics of the surface conduction electron-emitting element (electron emission threshold voltage). It is set to output a constant voltage. Further, the control circuit 153 has a function of matching the operation of each part so that an appropriate display is performed based on an image signal input from the outside. Sync signal separation circuit 15 described next
The control signals Tscan, Tsft, and Tmry are generated for each unit based on the synchronization signal Tsync sent from S6. The sync signal separation circuit 156 is a circuit for separating a sync signal component and a luminance signal component from an NTSC system television signal input from the outside, and can be constructed by using a frequency separation (filter) circuit. The sync signal separated by the sync signal separation circuit 156 is composed of a vertical sync signal and a horizontal sync signal, as is well known, but is shown here as a Tsync signal for convenience of description. on the other hand,
The luminance signal component of the image separated from the television signal is referred to as a DATA signal for the sake of convenience.
4 is input. The shift register 154 performs serial / parallel conversion of the DATA signal serially input in time series for each line of the image, and operates based on the control signal Tsft sent from the control circuit 153. (That is, the control signal Tsft may be rephrased as the shift clock of the shift register 154.) The data of one line of the serial / parallel-converted image (corresponding to the drive data of N electron-emitting devices) is I.
The shift register 154 outputs N parallel signals d1 to Idn. The line memory 155 is a storage device for storing data for one line of an image only for a required time, and a control signal T sent from the control circuit 153.
The contents of Id1 to Idn are stored according to mry. The stored contents are output as Idl to Idn and input to the modulation signal generator 157. The modulation signal generator 157 is a signal source for appropriately driving and modulating each of the surface conduction electron-emitting devices according to each of the image data Id1 to Idn, and its output signal is output from the terminals Doy1 to Doyn in the display panel 151. Applied to the surface conduction electron-emitting device. The electron-emitting device according to the present invention has the following basic characteristics with respect to the emission current Ie.
That is, there is a clear threshold voltage Vth for electron emission, and V
Electron emission occurs only when a voltage greater than th is applied.

Further, when the voltage is equal to or higher than the electron emission threshold value, the emission current also changes according to the change in the voltage applied to the device. The value of the electron emission threshold voltage Vth and the degree of change of the emission current with respect to the applied voltage may change by changing the material, configuration, and manufacturing method of the electron emitting element. I can say. That is, when a pulsed voltage is applied to this element, for example, electron emission does not occur even if a voltage below the electron emission threshold is applied, but an electron beam is output when a voltage above the electron emission threshold is applied. . At that time, first, it is possible to control the intensity of the output electron beam by changing the peak value Vm of the pulse. Second, it is possible to control the total amount of charges of the electron beam output by changing the pulse width Pw. Therefore, as a method of modulating the electron-emitting device according to the input signal, there are a voltage modulation method, a pulse width modulation method, and the like. To implement the voltage modulation method, the modulation signal generator 157 has a fixed length. A circuit of a voltage modulation system is used that generates a voltage pulse but appropriately modulates the peak value of the pulse according to the input data. Further, in order to implement the pulse width modulation method, the modulation signal generator 157 is a pulse width modulation method that generates a voltage pulse having a constant peak value but appropriately modulates the width of the voltage pulse according to the input data. The circuit of is used. Through the series of operations described above, the image forming apparatus of the present invention can display a television using the display panel 151. still,
Although not particularly described in the above description, the shift register 154
The line memory 155 may be of a digital signal type or an analog signal type, and the point is that the serial / parallel conversion and storage of the image signal may be performed at a predetermined speed. When the digital signal type is used, the output signal DATA of the sync signal separation circuit 156 needs to be converted into a digital signal, which can be achieved by providing an A / D converter at the output section of 156. Further, in connection with this, the circuit used for the modulation signal generator 157 is slightly different depending on whether the output signal of the line memory 155 is a digital signal or an analog signal.

First, the case of a digital signal will be described.
In the voltage modulation method, for example, a well-known D / A conversion circuit may be used as the modulation signal generator 157, and an amplification circuit or the like may be added if necessary. In the case of the pulse width modulation method, the modulation signal generator 157 includes, for example, a high-speed oscillator, a counter for counting the number of waves output from the oscillator, and a comparator for comparing the output value of the counter with the output value of the memory. It can be configured by using a circuit in which (comparators) are combined. If necessary, an amplifier for voltage-amplifying the pulse-width-modulated modulation signal output from the comparator up to the drive voltage of the surface conduction electron-emitting device may be added.

Next, the case of an analog signal will be described.
In the voltage modulation method, for the modulation signal generator 157, for example, an amplifier circuit using a well-known operational amplifier may be used, and a level shift circuit or the like may be added if necessary. In the case of the pulse width modulation method, for example, a well-known voltage controlled oscillation circuit (VCO) may be used, and an amplifier for amplifying the voltage to the drive voltage of the surface conduction electron-emitting device may be added if necessary. May be.
In the image forming apparatus completed as described above, each of the electron-emitting devices has terminals outside the container Dox1 to Doxm, Dox.
Electrons are emitted by applying a voltage through y1 to Doyn, and a high voltage is applied to the metal back 135 or the transparent electrode (not shown) through the high voltage terminal Hv.
The electron beam is accelerated and collided with the fluorescent film 134 to excite
An image can be displayed by emitting light. The configuration described above is a schematic configuration necessary for manufacturing a suitable image forming apparatus used for display, etc., for example, the material of each member, the detailed portion is not limited to the above description,
The selection is appropriately made to suit the application of the image forming apparatus. Also,
Although the NTSC system is given as an example of the input signal, it is not limited to this, and various systems such as PAL and SECAM systems may be used, and a TV having a larger number of scanning lines than this may be used.
Signal (for example, high-quality T including MUSE method)
V) method may be used.

Next, the ladder type electron source substrate and the image forming apparatus using the same will be described with reference to FIGS. 16 and 17. In FIG. 16, 160 is an electron source substrate, 1
Reference numeral 61 is an electron-emitting device, and Dx1 to Dx10 of 162 are common wirings connected to the electron-emitting device. A plurality of electron-emitting devices 161 are arranged on the substrate 160 in parallel in the X direction. (This is called an element row). A plurality of this element row is arranged on the substrate to form a ladder type electron source substrate. By appropriately applying a drive voltage between the common wirings of each element row, each element row can be independently driven. That is, a voltage equal to or higher than the electron emission threshold may be applied to an element row that emits an electron beam, and a voltage equal to or lower than the electron emission threshold may be applied to an element row that does not emit an electron beam. Further, the common wirings Dx2 to Dx9 between the element rows, for example, Dx2 and Dx3 may be the same wiring. FIG. 17 is a diagram showing the structure of an image forming apparatus provided with a ladder-type electron source. 1
70 is a grid electrode, 171 is a hole through which electrons pass, 172 is an outer container terminal made of Dox1, Dox2 ... Doxm, and 173 is G1, G2, ... Gn connected to the grid electrode 170. Outer container terminal, 16
Reference numeral 0 is an electron source substrate in which the common wiring between each element row is the same wiring as described above. The same reference numerals as those in FIGS. 13 and 16 denote the same members. A difference from the image forming apparatus having the simple matrix arrangement (FIG. 13) described above is that the grid electrode 170 is provided between the electron source substrate 160 and the face plate 136. A grid electrode 170 is provided between the substrate 160 and the face plate 136. The grid electrode 170 is capable of modulating the electron beam emitted from the surface conduction electron-emitting device, and passes the electron beam through a striped electrode provided orthogonally to the ladder-shaped element rows, One circular hole 171 is provided corresponding to each element. The shape and installation position of the grid do not necessarily have to be as shown in FIG. 17, and a large number of passage openings may be provided in the form of a mesh as openings, and may be provided, for example, around or near the surface conduction electron-emitting device. . The outside-container terminal 172 and the grid outside-container terminal 173 are electrically connected to a control circuit (not shown).

In this image forming apparatus, a modulation signal for one image line is simultaneously applied to the grid electrode column in synchronization with the sequential driving (scanning) of the element rows one column at a time.
The irradiation of each electron beam to the phosphor can be controlled to display an image line by line. Further, according to the present invention, it is possible to provide an image forming apparatus suitable for not only a display device for television broadcasting but also a display device such as a video conference system and a computer. Further, it can be used as an image forming apparatus as an optical printer including a photosensitive drum or the like.

Further, not only surface conduction electron-emitting devices but also cold cathode electron sources such as MIM electron-emitting devices and field emission electron-emitting devices can be applied as electron-emitting devices.
Further, it can be applied to an image forming apparatus using a thermoelectron source.

Specific examples showing the features of the present invention are shown below. The above-mentioned surface conduction electron-emitting device was used as the electron-emitting device in the examples.

[0031]

【Example】

[Embodiment 1] A specific embodiment will be described below with reference to FIG.

Matrix-type arranged electronic substrate having the surface conduction electron-emitting device obtained as described above (FIG. 12)
121 was used to form an image forming apparatus. In the figure, a panel 11 is a face plate on which an image forming member is mounted, a rear plate on which an electron source substrate 121 is mounted, and a support frame member formed by cutting and processing soda lime glass using a frit glass adhesive member to frit. Each member was bonded and manufactured by raising the temperature to a temperature at which the glass melts and solidifies and then cooling. The face plate and the rear plate were used by cutting a glass material. As a result, the heat dissipation member 14 and the panel 1
The parallelism between 1 was not maintained. In this state, the heat conducting members 12 made of an aluminum plate material were spread over the back surface of the display panel 11 at intervals of 10 mm. The fixing was performed by using a heat conductive tape (not shown). Here, since the face plate and the rear plate used as the above-mentioned panel constituent parts are made of a glass material and have a size of 1 m or more, it is difficult to obtain a uniform flatness over the entire surface, and they are warped or undulated. It was Furthermore, the display panel 11 is non-linearly curved as shown in the figure due to the heat process (heating-cooling cycle) involved in the manufacturing process. This is because it is difficult to perform uniform temperature rise and temperature control over the entire display panel 11 in the heating process. Next, at least one of the spirally wound springs formed by using a stainless steel material was welded and fixed to at least the number of the heat conductive members 12 spread. Further, the aluminum plate having a size equal to or larger than that of the panel and the other of the spring members 13 were fixed by welding.

With this configuration, the spring member 13 can self-adjust the distance between the heat dissipation member 14 and the display panel 11 (due to the expansion and contraction of the spring) even if the display panel 11 has a non-linear warp, so that it can be stably supported. did it. It was also confirmed that this structure has a vibration isolation effect against external vibration because it is supported by a spring.

Further, in this state, the electron-emitting device (not shown) formed on the display panel 11 was driven by the above method. By this driving, the display panel 11 generates heat in the electron emitting portion on the rear plate and heat in the image forming member on the face plate. Due to this heat, the display panel 11 tends to warp due to a temperature difference between the face plate, the rear plate, and the support frame, which causes a warp due to a difference in thermal expansion. (Shown), heat conduction (moving from a high temperature portion to a low temperature portion) occurs through the heat conducting member 12 and the spring member 13, and finally most of the heat is sent to the heat radiating member 14 and is radiated into the air there. It
Part of the heat is also radiated from the heat conducting member 12 and the spring member 13. As a result, even if the display panel 11 is driven, uniform heat dissipation is performed, so that the display panel 11 can retain its initial shape and perform stable image display.

With the above structure and process, (1) the panel can be supported without affecting the warp. (2) Even if the panel is driven, stable driving display can be performed. (3) It is safe and has a long life without causing a vacuum leak due to the driving of the panel or device breakdown. An image forming apparatus having the advantage of being able to be presented.

The fixing means is not limited to the above tape. Although a spiral spring is used as the spring member 13, the present invention is not limited to this. [Embodiment 2] The structure of the spring member will be described with reference to FIG.
Reference numeral 21 is an elastic member in which a thin metal plate having a spring characteristic by itself is formed in a matrix shape in a cantilever structure using a well-known wet etching technique, and 22 is a heat dissipation member having a heat dissipation material such as an aluminum plate. The thin plate on which the elastic member 21 was formed was fixed on the surface thereof using a conductive adhesive (a place other than the cantilever portion arranged in the matrix in the figure). Further, in consideration of the warp of the display panel 11, a part of the cantilever (broken line portion) is bent to form the step portion 23. The display panel 11 was fixed using a conductive tape at a place excluding the step portion of the elastic member 21.

With the structure of this embodiment, even if the display panel 11 is warped, the elastic member 21 can absorb the amount of warping, so that the entire surface of the display panel 11 can be uniformly supported. Furthermore, even if the panel is driven in this state,
The heat generated by driving is conducted through the elastic member 21 and finally radiated by the heat radiating member 22, so that the warp of the display panel 11 is not enlarged.

According to the present embodiment, since the spring portion is thin and a simple structure can be formed, the width of the entire image forming apparatus is not increased, and a cost-effective configuration can be presented. [Embodiment 3] In FIG. 3, the heat conducting member 12 installed on the back surface of the display panel 11 is connected to the spring member 13 in the lateral direction (main plane direction of the display panel 11). The display panel 11 and the heat conducting member 12 were fixed by providing a member (not shown) to which an external force was applied in the X direction of the paper surface. Further, the heat conduction member 12 and the spring member 13 were connected by welding in the same manner as in Example 1. Further, as the structure of the spring member 13, a spiral spring member was used as in Example 1, and the material was stainless steel.

In the state where the display panel 11 is formed, the spring member 13 can be self-adjusted (by expansion and contraction) even if a non-linear warp is generated as shown in the figure, so that the shape of the display panel 11 can be transferred to the heat conduction. The member 12 was disposed. further,
Even if the panel is driven in this state, the heat generated by the driving is conducted through the heat conducting member 12 and the spring member 13 and finally radiated by the heat radiating member 14, so that the display panel 11
The warp was never magnified. [Embodiment 4] A thin metal plate is subjected to a well-known wet etching technique as shown in FIG.
2. The outer frame 45 was left. Stainless steel was used as the material of the metal plate. Reference numeral 44 denotes an etched portion, which was removed by etching. In this configuration, the heat conducting members 41 are arranged in a matrix, and the individual heat conducting members 41 are thinly etched and connected to the spring members 42 formed by four directions. The spring member 42 uses the ductility (elasticity) of a metal, and due to the shape effect, a structure having a spring property rather than a single continuous plate was formed. Next, one of the outer frames 45 of the produced etching plate, the heat dissipation portion 43, and the conductive adhesive are fixed. The display panel 11 was fixed to one of the heat conducting members 41 using a conductive tape.

With the configuration of this embodiment, even if the display panel 11 is warped, the spring member 42 can absorb the amount of warping, so that the entire surface of the display panel 11 can be uniformly supported. Furthermore, even if the panel is driven in this state,
The heat generated by driving is the heat conducting member 41 and the spring member 4.
2. Conducted through the outer frame 45 and finally the heat dissipation member 43
Since the heat is dissipated in, the warpage of the display panel 11 was not enlarged.

The method of manufacturing the spring member and the number of springs presented in this embodiment are not limited. [Embodiment 5] In the fifth embodiment, the support member used is one in which a heat transfer fluid is contained in a sealed bag whose shape can be freely changed. Water (51 in FIG. 5) was used as the fluid, and carbon vinyl was used as the bag. The heat conduction support member 51 is sandwiched between the back surface of the display panel 11 and the heat dissipation plate member 14, and an external pressure 52 is applied so that a desired pressure is applied to the heat conduction support member 51.

With the structure of this embodiment, even if the display panel 11 is warped, the heat conduction support member 51 can change into an arbitrary shape with respect to the warp, so that the entire surface of the display panel 11 can be uniformly supported. It was Further, even if the panel is driven in this state, the heat generated by the driving is conducted through the heat conduction support member 51, and finally the heat dissipation member 1
Since the heat is dissipated in No. 4, the warp of the display panel 11 was not enlarged.

The heat conducting member 51 presented in this embodiment is used.
There is no limitation on the material composition of.

With the structure of this embodiment, it is possible to closely follow the local warp and undulation of the panel.
It enables more stable support and uniform heat dissipation. further,
Since this support member was able to have both compatibility of support and heat conduction, it led to simplification of the member. [Sixth Embodiment] A sixth embodiment is a supporting method in which the first and fifth embodiments are combined. The configuration is shown in FIG. Heat conduction support member 6 consisting of water and carbon vinyl bag
1 was arranged in the central portion between the panel 11 and the heat dissipation member 63.
Further, the heat conducting member 62 and the spring member 6 are provided in the peripheral portion between them.
Configured 4.

As in the case of the above-described embodiment, the display panel according to the present embodiment allows the heat conduction support member 61 and the spring member 64 to change into arbitrary shapes even if the display panel 11 is warped. It was possible to provide uniform support over the entire surface of No. 11. Further, even if the panel is driven in this state, the heat generated by the driving is still applied to the heat conduction support member 6
1 is conducted through the heat conducting member 62 and the spring member 64, and finally is dissipated by the heat dissipating member 63, so that the warp of the display panel 11 is not enlarged.

The structure of this embodiment is effective when the panel is largely warped in the peripheral portion.

[0047]

In the image forming apparatus of the present invention, stable support corresponding to the warp and undulation of the panel and uniform heat dissipation can be performed, so that the image forming apparatus can be installed safely and is stable and high-definition without color misregistration or destruction. The image forming apparatus can be provided.

[Brief description of drawings]

FIG. 1 is a cross-sectional view illustrating an example of an image forming apparatus of the present invention.

FIG. 2 is a perspective view of an embodiment of the image forming apparatus of the present invention.

FIG. 3 is a cross-sectional view showing another example of the image forming apparatus of the present invention.

FIG. 4 is a perspective view of another embodiment of the image forming apparatus of the present invention.

FIG. 5 is a sectional view showing still another embodiment of the image forming apparatus of the invention.

FIG. 6 is a cross-sectional view of another embodiment of the image forming apparatus of the present invention.

FIG. 7 is a schematic plan view showing a configuration example of a basic surface conduction electron-emitting device used in the present invention.

FIG. 8 is a schematic side view showing the configuration of a basic vertical surface conduction electron-emitting device used in the present invention.

9 (a), (b) and (c) are process drawings showing an example of a method of manufacturing a surface conduction electron-emitting device used in the present invention.

10 (a) and 10 (b) are graphs each showing an example of a voltage waveform of energization forming.

FIG. 11 is a schematic configuration diagram of a measurement / evaluation apparatus for measuring electron emission characteristics.

FIG. 12 is an explanatory diagram showing a configuration of an electron source having a simple matrix arrangement.

FIG. 13 is a schematic configuration diagram showing an example of an image forming apparatus of the present invention.

14 (a) and 14 (b) are explanatory views each showing a configuration of a fluorescent film.

FIG. 15 is a block diagram showing an example of an image forming apparatus incorporating a drive circuit for displaying in accordance with an NTSC television signal.

FIG. 16 is a plan view showing an example of the configuration of a ladder-arranged electron source used in the present invention.

FIG. 17 is a schematic configuration perspective view showing an example of an image forming apparatus of the present invention.

FIG. 18 is an explanatory diagram showing a configuration example of a conventional surface conduction electron-emitting device.

[Explanation of symbols]

 11 Display Panel 12, 41, 62 Heat Conducting Member 13, 42, 64 Spring Member 14, 43, 63 Heat Dissipating Member A Support Member 21 Elastic Member 22 Heat Dissipating Member 23 Stepped Part 24, 44 Etching Part 25, 45 Outer Frame 51, 61 Heat conduction support member 71 Substrate 72, 73 Element electrode 74 Conductive thin film 75 Electron emission part 80 Step forming part 110 Ammeter 111 Power supply 112 Ammeter 113 High voltage power supply 114 Anode electrode 115 Vacuum device 116 Exhaust pump 121 Electron source substrate 122 X direction Wiring 123 Y direction wiring 124 Surface conduction electron-emitting device 125 Connection 131 Rear plate 132 Support frame 133 Glass substrate 134 Fluorescent film 135 Metal back 136 Face plate 137 High voltage terminal 138 Envelope 141 Black conductive material 142 Phosphor 151 Display panel 15 Scanning circuit 153 Control circuit 154 Shift register 155 Line memory 156 Synchronous signal separation circuit 157 Modulation signal generator Vx and Va DC voltage source 160 Electron source substrate 161 Electron emission element 162 Common wiring 170 Grid electrode 171 Holes through which electrons pass 172 Terminal outside container 173 Terminal outside container

Claims (6)

[Claims] 1. A face plate on which a rear plate on which an electron-emitting device is mounted and an image-forming member which is arranged to face the rear plate and on which an image is formed by irradiation of an electron beam emitted from the electron-emitting device is mounted. And an image forming apparatus having a display panel formed of the face plate and the rear plate, wherein the display panel is provided with a heat radiating member via a supporting member capable of conducting heat and having a stretching function. An image forming apparatus having a shape to support the display panel. 2. The image forming apparatus according to claim 1, wherein the support member includes a plurality of elastic members. 3. The image forming apparatus according to claim 2, wherein the elastic member includes a plurality of heat conducting members and a plurality of heat conducting spring members. 4. The image forming apparatus according to claim 1, wherein the support member is a closed container having a fluid inside. 5. The closed container is an elastic member.
An image forming apparatus according to claim 1. 6. The image forming apparatus according to claim 1, wherein the electron-emitting device mounted on the face plate of the display panel is a surface conduction electron-emitting device.