JPH09312238A - Laminated electronic device and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide means for verifying that a of an internal electrode of a laminated ceramic capacitor is formed in a length direction as specified, by observing only the appearance of the main body of device. SOLUTION: To obtain a mother laminate 13, inner electrodes 12 are formed on a mother sheet 11. To obtain main bodies of devices 16, the mother laminate 13 is divided along division planes 14. Deviation detecting marks 17 are provided at areas along the division plane within regions of the electrodes 12 and each has a relatively long and short parts as seen from the plane 14. The deviation extent of the division plane 14 is determined from the length of the mark 17 appearing at the end face of the main body 16 after division.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component and a method of manufacturing the same, and more particularly, to an improved laminated electronic component and an improved laminated electronic component for easily obtaining information on the position of an internal circuit element film such as an internal electrode. The present invention relates to a manufacturing method thereof.

[0002]

2. Description of the Related Art A monolithic ceramic capacitor, which is an example of a monolithic electronic component of interest to the present invention, is usually manufactured as follows.

As shown in FIG. 7, a plurality of mother sheets 2 made of ceramic green sheets in which internal electrodes 1 as internal circuit element films are distributed and formed at a plurality of locations are prepared. These mother sheets 2 are stacked to form a mother laminated body 3. At this time, each internal electrode 1 is positioned so that one internal electrode 1 is commonly opposed to two adjacent internal electrodes 1a, as shown by a broken line for the internal electrode 1a opposed to the internal electrode 1 via the mother sheet 2. To be done. In addition,
In FIG. 7, the internal electrode 1 and the internal electrode 1a are shown with a slight offset, but this is merely a schematic convenience for illustrating both the internal electrode 1 and the internal electrode 1a.
In practice, such a deviation is usually virtually nonexistent.

Next, the mother laminate 3 is divided along the dividing planes 4 and 5 indicated by the one-dot chain line, whereby
A plurality of component bodies 6 can be obtained. At this time, the split surface 4
In order to pass through the internal electrode 1 or 1a, in the obtained component body 6, the internal electrode 1 or 1a is exposed on the end face corresponding to the dividing surface 4. One end view of the component body 6 is shown in FIG. In addition, in FIG.
A cross-sectional view along line IX-IX is shown. The internal electrode 1 is exposed on the split surface 4 shown in FIG. 8, and the internal electrode 1a is exposed on the split surface 4 on the opposite side.

Next, after these component bodies 6 are fired, external electrodes 7 and 8 are formed so as to cover the respective end faces corresponding to the dividing faces 4, as shown by the imaginary lines in FIG. One external electrode 7 is electrically connected to the internal electrode 1, and the other external electrode 8 is electrically connected to the internal electrode 1a. In this way, the desired monolithic ceramic capacitor is obtained.

In such a monolithic ceramic capacitor, in order to secure the weather resistance, that is, the insulation resistance characteristic in a humid atmosphere to a desired level, the internal electrode 1 or 1a and the component body 6 as shown in FIG. The widthwise gap 9 between the side surface and the inner electrode 1 as shown in FIG.
Alternatively, each length of the longitudinal gap 10 between 1a and each end surface corresponding to the division surface 4 of the component body 6 must be maintained at a predetermined value or more.

[0007]

However, the gaps 9 and 10 shown in FIGS. 8 and 9 may not be properly formed due to some causes encountered in the above-described manufacturing process. For example, misalignment of stacking of the mother sheets 2, undesired deformation of the mother laminate 3 during pressing, misalignment of division positions along the division surfaces 4 and 5 and the like can be the causes.

Therefore, at the stage where the component body 6 is obtained by division, it is necessary to check whether the gaps 9 and 10 are formed as desired, and at this stage, the component body 6 having poor quality must be eliminated.

When the gaps 9 and 10 are to be checked as described above, as for the widthwise gap 9, as shown in FIG.
Alternatively, since 1a is exposed, its suitability can be determined by observing the appearance of the component body 6. However, the suitability of the lengthwise gap 10 cannot be determined by observing the appearance of the component body 6.

10 and 11 show typical examples of improper formation of the longitudinal gap 10.
In FIG. 10, the longitudinal gap 10a is insufficient.
This improper state is brought about by, for example, an undesired deformation of the mother laminate 3 during pressing, a shift of the dividing position along the dividing surfaces 4 and 5. On the other hand, in FIG.
There are some gaps in which the lengthwise gap 10 largely varies and are insufficient, and some gaps are not formed at all. Such an improper state is mainly caused by stacking deviation of the mother sheets 2 and the like.

As to the longitudinal gap 10 as described above, the suitability cannot be determined by observing the appearance of the component body 6 as described above.
Must be cut along the line IX-IX in FIG. 8, the internal electrodes 1 and 1a are exposed on the cut surface, and the suitability of the longitudinal gap 10 must be determined. It takes a relatively long time to reduce the productivity.

Therefore, an object of the present invention is to check the suitability of a gap provided by an internal circuit element film such as an internal electrode not only for the widthwise gap but also for the lengthwise gap by observing the appearance of the component body. It is an object of the present invention to provide a laminated electronic component and a method for manufacturing the same, which can be efficiently determined.

[0013]

According to the present invention, first, a plurality of mother sheets each having an internal circuit element film distributed and distributed at a plurality of locations are prepared, and the plurality of mother sheets are stacked to form a mother laminate. Then, the mother laminated body is divided along the dividing surface that passes through the specific internal circuit element film to obtain a component body in which the internal circuit element film is exposed on the dividing surface, and the internal circuit element film exposed on the dividing surface is obtained. An external electrode is formed on the outer surface of a component body so as to be electrically connected to The step of preparing the mother sheet includes a step of providing a shift detection mark at a position where the division surface is expected to pass within the area of the internal circuit element film formed on the mother sheet,
The misalignment detection mark has a relatively long portion and a relatively short portion when viewed in a direction parallel to the dividing surface, and these relatively long portion and relatively short portion are perpendicular to the dividing surface. The feature is that they are arranged in the direction.

In the present invention, preferably, the shift detection mark is formed by providing a portion where the internal circuit element film is not formed in the area of the internal circuit element film.

Further, in the present invention, it is preferable that the shift detection mark has a symmetrical shape with respect to a predetermined dividing surface.

The relatively long portion and the relatively short portion of the shift detection mark described above may be connected by a contour extending stepwise or by a contour having a gradient.

The present invention is also directed to the structure of the laminated electronic component obtained by the above manufacturing method. This laminated electronic component is provided with a component body in which an internal circuit element film is formed inside and one end edge of the internal circuit element film is exposed, and a central portion of the exposed edge of the internal circuit element film is provided. The misalignment detection mark is located at the position of the misalignment detection mark, and the misalignment detection mark has a relatively long portion and a relatively short portion when viewed in a direction parallel to the edge and is relatively long and relatively long. The short portions are arranged in a direction perpendicular to the edges.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a part of a mother sheet 11 used in a method of manufacturing a laminated electronic component according to an embodiment of the present invention. This embodiment is
The present invention is directed to manufacturing a laminated ceramic capacitor as an example of a laminated electronic component.

As shown in FIG. 1, a plurality of mother sheets 11 made of ceramic green sheets having internal electrodes 12 as internal circuit element films distributed and formed at a plurality of locations are prepared. These mother sheets 11 are stacked,
It is a mother laminated body 13. At this time, each internal electrode 12
Although not shown, two internal electrodes 1 that are adjacent to each other via the mother sheet 11 and are adjacent to each other are shown.
The two are commonly aligned so as to face each other.

Next, the mother laminated body 13 is divided along the dividing planes 14 and 15 shown by the one-dot chain line, whereby a plurality of component bodies 16 are obtained. At this time, the dividing surface 14 passes through either the illustrated internal electrode 12 or the internal electrode 12 facing the internal electrode 12 via the mother sheet 11, so that in the obtained component body 16, the dividing surface 1
The internal electrode 12 is exposed on the end surface corresponding to 4.

The configuration described so far is the same as that of the above-mentioned conventional example.

As a characteristic configuration of this embodiment, a shift detection mark 17 is provided in the area of the internal electrode 12 at a position where the dividing surface 14 is scheduled to pass. The shift detection mark 17 is shown enlarged in FIG. The shift detection mark 17 has a relatively long portion and a relatively short portion when viewed in a direction parallel to the dividing surface 14. In this embodiment, the shift detection mark 17 has a longest part 18, a middle part 19 and a shortest part 20 which are connected by a contour extending in a stepwise manner. The longest part 18, the middle part 19 and the shortest part 20 are arranged in a direction perpendicular to the dividing surface 14.

Further, in this embodiment, the displacement detection mark 17 has a symmetrical shape with respect to the predetermined dividing surface 14, and has the intermediate portions 19 on both sides of the longest portion 18 and the shortest outside thereof. The parts 20 are located respectively.

Further, in this embodiment, the shift detection mark 17 is formed by providing a portion where the internal electrode 12 is not formed in the area of the internal electrode 12. Therefore, when the internal electrodes 12 are formed on the mother sheet 11 by, for example, printing, by providing the printing plate with a pattern for forming the deviation detection marks 17, the deviation detection marks 17 can be formed at the same time.

As described above, the mother laminated body 13 is
When a plurality of component bodies 16 are obtained by dividing along the dividing planes 14 and 15 shown by the dotted line, in the obtained component bodies 16 as shown in FIGS. 3 (a) to 3 (d), The internal electrode 12 is exposed on the end face corresponding to the dividing surface 14, and the exposed central portion of the internal electrode 12 has a structure shown in FIG.
As shown in (a) to (c), the deviation detection mark 17
Exposed certain parts of.

More specifically, as shown in FIG. 2, when the divided surface 14 passes through the longest portion 18 of the deviation detection mark 17, the deviation detection mark 17 has the longest dimension as shown in FIG. 3A. Exposed.

Further, in FIG. 2, the dividing surface 14 has an intermediate portion 1 of the misalignment detection mark 17 as indicated by a chain line 14a.
When passing 9, the shift detection mark 17 is exposed with an intermediate length, as shown in FIG.

Further, in FIG. 2, as shown by a chain line 14b, the dividing surface 14 has the shortest portion 2 of the displacement detection mark 17.
When passing 0, as shown in FIG. 3C, the shift detection mark 17 is exposed with the shortest dimension.

Further, in FIG. 2, when the dividing surface 14 does not pass through the deviation detection mark 17 as indicated by a chain line 14c, as shown in FIG.
Does not appear on the end face of the component body 16.

As described above, by changing the position where the dividing surface 14 passes in relation to the deviation detection mark 17, the length of the deviation detection mark 17 appearing on the end face of the component body 16 changes, or the deviation detection mark 17 changes. Since 17 does not appear, by observing the end surface of the component main body 16 and grasping the state of the deviation detection mark 17, it is possible to determine the suitability of the longitudinal gap.

Further, since the internal electrode 12 is exposed on the end surface of the component body 16, by observing the internal electrode 12 itself, it is possible to simultaneously determine whether or not the widthwise gap of the internal electrode 12 is appropriate. .

As an example, when the target value of the longitudinal gap of the internal electrodes 12 is set to 300 μm, the gap 21 when two adjacent internal electrodes 12 shown in FIG. It is doubled to 600 μm. In such a case, the division surface 14 of the deviation detection mark 17 shown in FIG.
It is assumed that the dimension 22 in the direction perpendicular to is set to 300 μm, for example. At this time, for example, the dimension of the longest part 18 in the same direction is 100 μm, and the dimension of each intermediate part 19 in the same direction is 5 μm.
0 μm, and the dimension of each shortest portion 20 in the same direction is set to 50 μm.

When such conditions are set, FIG.
When the deviation detection mark 17 appears in the manner shown in (a),
The lengthwise gap can be determined to be in the range of 300 μm ± 50 μm. Further, when the displacement detection mark 17 appears in the manner shown in FIG. 3B, it can be determined that the shorter lengthwise gap is in the range of 200 μm to 250 μm. In addition, the deviation detection mark 1 in the mode shown in FIG.
When 7 appears, the shorter longitudinal gap is 1
It can be determined that the thickness is in the range of 50 μm to 200 μm. Further, when the displacement detection mark 17 does not appear as shown in FIG. 3D, the shorter lengthwise gap is 150 μm.
It can be determined that it is m or less.

As described above, the size of the longitudinal gap can be immediately determined by observing the end face of the component body 16. Therefore, for example, the relationship between the occurrence status of insulation resistance failure and the longitudinal gap in an accelerated test in the wet condition is preliminarily determined. By investigating and determining the allowable range of the longitudinal gap, the quality of the longitudinal gap can be determined efficiently. For example, the allowable range of the longitudinal gap is 300μ
Assuming m ± 150 μm, when the deviation detection mark 17 appears as shown in FIGS.
It is judged as a non-defective product, and as shown in FIG.
It should be determined that the product is defective only when does not appear. The allowable range of the longitudinal gap is 300 μm ± 50 μ
If it is m, it is determined as a non-defective product only when the displacement detection mark 17 appears as shown in FIG. 3A, and otherwise,
It may be judged as a defective product.

The above-mentioned respective states shown in FIG. 3 are similar to each other in the lengthwise direction with respect to the plurality of internal electrodes 12, and in a sense, they are special states.
There are various kinds of states that are determined to be defective products. For example, as shown in FIG. 4, each internal electrode 12 often shifts in the length direction in a manner different from each other. In this case,
The modes shown in FIGS. 3A to 3D are mixed in one component body 6. Therefore,
In this case, if at least one internal electrode 12 forms an inappropriate gap, it is determined as a defective product.

The component body 1 which is determined to be a good product as described above
6 is a state in which, after being fired, external electrodes are respectively formed so as to cover the end faces corresponding to the divided surfaces 14 and each external electrode is electrically connected to the related internal electrode, as in the conventional case. To be done. In this way, the desired monolithic ceramic capacitor is obtained. In the monolithic ceramic capacitor thus obtained, the portion of the internal electrode 12 removed by the formation of the deviation detection mark 17 is usually
Since it is a portion that does not substantially contribute to the formation of capacitance,
It should be noted that the presence of such a shift detection mark 17 does not cause a disadvantage that the electrostatic capacitance is substantially reduced.

The shape of the shift detection mark, which is a feature of the present invention, is not limited to that shown in FIG. 2 and can be variously changed. 5 and 6 show other examples of the shape of the deviation detection mark.

In the displacement detection mark 23 shown in FIG. 5, the positional relationship among the longest part, the middle part and the shortest part is opposite to that of the displacement detection mark 17 shown in FIG. Therefore, as the dividing surface 14 gradually shifts from the planned position,
The exposed state of the shift detection mark 23 on the end surface of the component body 16 changes in the order of FIGS. 3C, 3B, 3A, and 3D.

The displacement detection marks 17 or 23 shown in FIG. 2 or 5 have three different lengths when viewed in the direction parallel to the dividing surface 14, but have two different lengths. Also, it may be different in four or more stages.

The displacement detection mark 24 shown in FIG. 6 has a relatively long portion and a relatively short portion arranged in a direction perpendicular to the division surface 14 when viewed in a direction parallel to the division surface 14.
It has a substantially rhombic shape as a whole. In the shift detection mark 17 shown in FIG. 2, the longest part 18, the middle part 19 and the shortest part 20 are connected by a contour extending in a stepwise manner.
In the shift detection mark 24, a relatively long portion and a relatively short portion are connected by a contour having a gradient.

According to the shift detection mark 24 shown in FIG. 6, as the dividing surface 14 gradually shifts from the planned position,
The exposed state of the shift detection mark 24 on the end surface of the component body 16 changes in a so-called analog manner.

Although the present invention has been described with reference to the illustrated embodiments, various other embodiments are possible within the scope of the present invention.

For example, the shift detection mark is formed by providing a portion where the internal electrode is not formed.
Another material may be formed on the internal electrodes. In this case, if a material that undergoes thermal decomposition or the like is used in the subsequent firing step, such a material can be prevented from adversely affecting the electrical characteristics of the monolithic ceramic capacitor.

Further, it is sufficient to check the suitability of the gap by the displacement detection mark only for at least one component body obtained from one mother laminated body. This is because it is possible to presume that a plurality of component bodies obtained from one mother laminated body have the same gap condition with each other.

Further, in the above-described embodiment, as shown in FIG. 1, the division is performed by the division surface 14 passing through the center of each of the patterns to be the internal electrodes 12, and each divided portion of this pattern is an internal electrode. Although used as 12, one internal electrode may be provided by division of one pattern to be an internal electrode. That is, a pattern for the internal electrode may be adopted in which only one divided portion of the pattern which becomes the internal electrode is used as the internal electrode and the other portion is not used as the internal electrode.

Although the above-described embodiments have been described with reference to a monolithic ceramic capacitor, the present invention is not limited to monolithic ceramic capacitors, and other monolithic ceramic electronic components and monolithic electronic components that are not ceramic electronic components. It can also be applied to parts. Similarly, the internal circuit element film is not limited to the internal electrode, and may be another conductive film or an internal circuit element film having another electric function such as a resistance film or a magnetic film. obtain.

[0047]

As described above, according to the present invention, since the shift detection mark is provided at the position where the dividing surface in the region of the internal circuit element film is supposed to pass, it is obtained by dividing the mother laminated body. By observing the divided surface of the component body from the outside, first, it is possible to confirm the exposure / non-exposure of the deviation detection mark. If the deviation detection mark is in the unexposed state, it is immediately determined that the internal circuit element film has a gap defect. You can judge.

Further, the shift detection mark has a relatively long portion and a relatively short portion when viewed in a direction parallel to the dividing surface, and divides the relatively long portion and the relatively short portion. Since they are arranged in the direction perpendicular to the surface, when the misalignment detection mark is exposed on the split surface of the component body, the misalignment detection mark will be changed depending on the positional relationship between the misalignment detection mark and the split surface in the direction perpendicular to the split surface. The exposed length changes. Therefore, by determining the exposed length of the shift detection mark, it is possible to determine the suitability of the gap of the internal circuit element film in the direction perpendicular to the dividing surface.

Further, since the internal circuit element film is exposed on the dividing surface, the suitability of the gap of the internal circuit element film in the direction parallel to the dividing surface is determined by observing the internal circuit element film itself. be able to. That is, just by observing the divided surface, the suitability of the gap of the internal circuit element film in both the direction perpendicular to the divided surface and the direction parallel to the divided surface can be determined all at once.

Therefore, according to the present invention, the suitability of the gap of the internal circuit element film can be efficiently determined with high reliability, and the productivity of the laminated electronic component can be improved.

In the present invention, when the deviation detection mark is formed by providing a portion where the internal circuit element film is not formed in the area of the internal circuit element film, the deviation detection mark is formed simultaneously with the formation of the internal circuit element film. It can be formed, the positional accuracy of the deviation detection mark with respect to the internal circuit element film is improved, and a special process and material for forming the deviation detection mark are not required. When a special material is used to form the deviation detection mark, the effect on the electrical characteristics of this material must be taken into consideration. However, by providing such a portion where the internal circuit element film is not formed, Once the misalignment detection mark is formed, such consideration is completely unnecessary.

Further, in the present invention, when the deviation detection mark has a symmetrical shape with respect to the planned divided surface, the actual divided surface is displaced in any direction with respect to the planned divided surface. Even if it occurs, a certain relationship is established between the degree of deviation and the exposed length of the deviation detection mark, which makes it easier to judge the suitability of the gap of the internal circuit element film and also causes a mistake in the judgment. Can be hardened.

As described above, the relatively long portion and the relatively short portion of the displacement detection mark may be connected by a stepwise extending contour or a gradient contour. Especially, if the contours are connected by a contour extending in a stepwise manner, the exposed length of the shift detection mark can be grasped in a so-called digital manner, and the determination of the suitability of the gap of the internal circuit element film can be made more deterministic. Will be able to do.

[Brief description of drawings]

FIG. 1 is a plan view showing a part of a mother laminated body 13 used in a method for manufacturing a monolithic ceramic capacitor according to an embodiment of the present invention.
The two main sheets 11 are shown with one main surface exposed.

FIG. 2 is an enlarged plan view showing a part of an internal electrode 12 shown in FIG.

FIG. 3 is an end view of a component body 16 obtained by dividing the mother laminated body 13 shown in FIG. 1, and FIGS.
The difference in the appearance of the deviation detection mark 17 due to the difference in the division position is shown in FIG.

FIG. 4 is a view corresponding to FIG. 3, showing a deviation detection mark 17;
Shows the state that appears in various modes.

FIG. 5 is a view corresponding to FIG. 2, showing another embodiment of the present invention.

FIG. 6 is a view corresponding to FIG. 2, showing still another embodiment of the present invention.

FIG. 7 is a plan view showing a mother laminated body 3 used in a conventional method for manufacturing a laminated ceramic capacitor, in which one main surface of one mother sheet 2 included in the mother laminated body 3 is exposed.

8 is an end view of a component body 6 obtained by dividing the mother laminated body 3 shown in FIG.

9 is a cross-sectional view taken along the line IX-IX in FIG.

FIG. 10 is a view corresponding to FIG. 9 and shows a state in which an improper lengthwise gap 10a is formed due to a shift in division position.

FIG. 11 is a view corresponding to FIG. 9 and shows a state in which an improper lengthwise gap is formed due to stacking deviation.

[Explanation of symbols]

 11 Mother Sheet 12 Internal Electrode 13 Mother Laminated Body 14, 15 Divided Surface 16 Component Main Body 17, 23, 24 Displacement Detection Mark 18 Longest Part 19 Intermediate Part 20 Shortest Part

Claims (6)

[Claims] 1. A plurality of mother sheets each having an internal circuit element film distributed and distributed at a plurality of locations are prepared, and the plurality of mother sheets are stacked to obtain a mother laminate. The mother laminated body is divided along a dividing surface that passes therethrough to obtain a component body in which the internal circuit element film is exposed on the dividing surface, and the component body is electrically connected to the internal circuit element film exposed on the dividing surface. Forming an external electrode on the outer surface of the component body, including the steps, in the method for manufacturing a laminated electronic component, the step of preparing the mother sheet, the internal circuit element formed on the mother sheet In the region of the film, including a step of providing a deviation detection mark at a position where the division surface is expected to pass, the deviation detection mark is a relatively long portion when viewed in a direction parallel to the division surface. Characterized in that it is arranged in a direction perpendicular to and a relatively short portion and said relatively long portion and said relatively short portion on the division surface, method of manufacturing a multilayer electronic component. 2. The method for manufacturing a laminated electronic component according to claim 1, wherein the shift detection mark is formed by providing a portion where the internal circuit element film is not formed in a region of the internal circuit element film. 3. The shift detection mark has a symmetrical shape with respect to the predetermined dividing surface.
A method for manufacturing the laminated electronic component according to. 4. The laminated electronic component according to claim 1, wherein the relatively long portion and the relatively short portion of the displacement detection mark are connected by a contour extending in a stepwise manner. Production method. 5. The manufacture of the laminated electronic component according to claim 1, wherein a relatively long portion and a relatively short portion of the displacement detection mark are connected by a contour having a gradient. Method. 6. A laminated electronic component, comprising a component body in which an internal circuit element film is formed and one end edge of the internal circuit element film is exposed, wherein an exposed edge of the internal circuit element film is provided. A shift detection mark is located in the central portion, and the shift detection mark has a relatively long portion and a relatively short portion when viewed in a direction parallel to the edge, and the relatively long portion. And the relatively short portion are arranged in a direction perpendicular to the edge, a laminated electronic component.