[go: up one dir, main page]

JPH09283877A - Printed conducting sheet - Google Patents

Printed conducting sheet

Info

Publication number
JPH09283877A
JPH09283877A JP11119196A JP11119196A JPH09283877A JP H09283877 A JPH09283877 A JP H09283877A JP 11119196 A JP11119196 A JP 11119196A JP 11119196 A JP11119196 A JP 11119196A JP H09283877 A JPH09283877 A JP H09283877A
Authority
JP
Japan
Prior art keywords
sheet
pattern
fiber
printed
mesh sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11119196A
Other languages
Japanese (ja)
Other versions
JP2799411B2 (en
Inventor
Katsuya Hiroshige
勝也 広繁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP8111191A priority Critical patent/JP2799411B2/en
Publication of JPH09283877A publication Critical patent/JPH09283877A/en
Application granted granted Critical
Publication of JP2799411B2 publication Critical patent/JP2799411B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain a simple and strong double-sided electric conduction pattern switch, by forming a pattern on a mesh sheet wherein chemical fiber, metal fiber, natural fiber, etc., are knitted, or a porous sheet, by using electrically conducting members. SOLUTION: Carbon ink and metal paste 2 are printed with a squeegee by using a screen printing method, on a mesh sheet wherein chemical fiber such as polyester and nylon, or soluble fiber whose material is protein, or natural fiber such as silk and cotton is knitted in a sheet, or on a porous sheet 1 wherein many holes are formed on a thin board with a punching drill, laser, etc., and a printed conducting sheet 3 is formed. Thereby electrically conducting members penetrate into the mesh sheet or the porous sheet, and a strong double- sided electric conduction pattern.switch which is hard to be separated can be obtained. When several numbers of sheets are stacked, complex processes in the conventional case wherein holes are made and plating is performed are unnecessary. The holes are aligned, and metal paste is buried, so that processes are very simple.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、各種繊維を編んだ
メッシュシート又は薄い多孔性シートをベースにしたプ
リント導電シートに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed conductive sheet based on a mesh sheet or a thin porous sheet woven with various fibers.

【0002】[0002]

【従来の技術】従来のプリント基板は樹脂基板の表面に
薄い銅板を接着し、その表面に感光乳剤を塗布し、露光
・現像エッチングしてパターンを形成した。そして、表
裏面パターンを導通するためにドリルでパターン部分に
孔を開け内面にメッキを施して導通していた。
2. Description of the Related Art In a conventional printed circuit board, a thin copper plate is adhered to the surface of a resin substrate, a photosensitive emulsion is coated on the surface, and exposure and development etching is performed to form a pattern. Then, in order to conduct the front and back patterns, a hole was made in the pattern portion with a drill to plate the inner surface for conduction.

【0003】[0003]

【発明が解決しようとする課題】上記従来技術は樹脂基
板に接着した薄銅板が剥がれ易く、それを防止するため
接着剤を強固にすると導電性が悪くなり、又、ドリルで
孔を開けメッキして導通する作業が極めて面倒で時間を
要するという問題点があった。
In the above-mentioned prior art, the thin copper plate adhered to the resin substrate is easily peeled off, and if the adhesive is made strong to prevent it, the conductivity is deteriorated, and a hole is drilled for plating. There is a problem in that the work of conducting electricity is extremely troublesome and takes time.

【0004】[0004]

【課題を解決するための手段】本発明は上記問題点を解
決することを目的とし、化学繊維、金属繊維、天然繊維
等を編んだメッシュシート又は多孔性シートに電気導通
性部材でパターンを形成したプリント導電シートを特徴
とする。
SUMMARY OF THE INVENTION The present invention is intended to solve the above problems and forms a pattern on a mesh sheet or porous sheet woven with chemical fibers, metal fibers, natural fibers or the like with an electrically conductive member. It features a printed conductive sheet.

【0005】[0005]

【発明の実施の形態】本発明の実施の形態を図示した実
施例に基づいて詳細に説明する。図1は本発明プリント
配線シート成形の第1実施例である。1はポリエステル
・ナイロン等の化学繊維、蛋白質を原料とした溶解性繊
維、絹・木綿等の天然繊維を編んでシート状にしたメッ
シュシート、又は薄板にパンチングドリル・レーザー等
で多孔を形成した多孔性シートで、この上にスクリーン
印刷方法によりカーボンインクや金属ペースト2をスキ
ージーで刷り込みプリント導電シート3を形成してい
る。金属ペースト2上にメッキを施して型くずれを防止
し、電気導通性を良くする様にしてもよい。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described in detail with reference to the illustrated embodiments. FIG. 1 is a first embodiment of the printed wiring sheet molding of the present invention. 1 is a mesh sheet formed by knitting synthetic fibers such as polyester / nylon and the like, soluble fibers made of proteins, natural fibers such as silk and cotton, or a thin plate having a perforation formed by punching drill / laser etc. A conductive sheet, on which a carbon ink or a metal paste 2 is imprinted with a squeegee by a screen printing method, to form a printed conductive sheet 3. The metal paste 2 may be plated to prevent mold collapse and improve electrical conductivity.

【0006】図2は本発明プリント導電シート成形の第
2実施例である。4は上記第1実施例と同様のメッシュ
シート又は多孔性シートで、両面より包みこむように感
光乳剤5を塗布し、パターンを露光・現像し、光の当た
らなかったパターン部分6の感光乳剤を洗って除去し、
その部分に金属ペースト7を埋込み、他の感光乳剤5を
溶解除去し、メッキ8を施してかため、導電パターンが
形成されたプリント導電シート9を形成する。
FIG. 2 shows a second embodiment of the molding of the printed conductive sheet of the present invention. 4 is a mesh sheet or a porous sheet similar to that of the first embodiment, coated with photosensitive emulsion 5 so as to wrap it from both sides, exposed and developed the pattern, and washed the photosensitive emulsion of pattern portion 6 which was not exposed to light. Removed,
A metal paste 7 is embedded in the portion, the other photosensitive emulsion 5 is dissolved and removed, and plating 8 is performed to form a printed conductive sheet 9 having a conductive pattern formed thereon.

【0007】又、図5の如く第1実施例と同様メッシュ
シート又は多孔性シート1に感光乳剤を塗布し、パター
ンを露光・現像してパターン10を形成し、この上に図
6の如き装置により金属電気メッキ11を施して、図7
の如く電気導通性部材のパターンを有するプリント導電
シート12を形成する。又、第1実施例と同様のメッシ
ュシート又は多孔性シートに金属入り感光性ペーストを
塗布し、露光・現像してパターンを形成し、更に、金属
メッキを施しても良い。
Further, as shown in FIG. 5, a mesh sheet or porous sheet 1 is coated with a photosensitive emulsion as in the first embodiment, and a pattern is exposed and developed to form a pattern 10, and an apparatus as shown in FIG. 6 is formed thereon. 7 by applying metal electroplating 11 by
As described above, the printed conductive sheet 12 having the pattern of the electrically conductive member is formed. Further, the same mesh sheet or porous sheet as in the first embodiment may be coated with a photosensitive paste containing metal, exposed and developed to form a pattern, and further metal plated.

【0008】[0008]

【発明の効果】本発明によると、化学繊維、金属繊維、
天然繊維等を編んだメッシュシート又は多孔性シートに
電気導通性部材でパターンを形成しているので、メッシ
ュシート又は多孔性シートに電気導通性部材が入り込み
離れ難く強度な両面導通パターン・スイッチが得られ、
数枚重合した場合、従来のように孔開けしてメッキする
ような複雑な手数を必要とせず、プリント導電シート自
体が通気性なので図3の如く、孔の位置合せをして金属
ペースト13を埋め込めばよく極めて簡単である。又、
本発明プリント導電シートは柔軟であるので、従来のよ
うに配設場所の形状に応じてプリント基板を形成する必
要なく、図4の如く配線場所の形状に応じて丸めて配線
できるので配線のためのスペースも極めて少く配線が容
易である。
According to the present invention, chemical fibers, metal fibers,
Since the pattern is formed on the mesh sheet or porous sheet woven with natural fibers etc. by the electrically conductive member, the electrically conductive member will not enter into the mesh sheet or the porous sheet to obtain a strong double-sided conductive pattern switch. The
When several sheets are polymerized, unlike the conventional case, there is no need for complicated steps such as perforating and plating, and since the printed conductive sheet itself is breathable, the holes are aligned and the metal paste 13 is applied as shown in FIG. It is easy to embed and very easy. or,
Since the printed conductive sheet of the present invention is flexible, it is not necessary to form a printed circuit board according to the shape of the installation place as in the prior art, and the wiring can be performed by rolling it according to the shape of the wiring place as shown in FIG. The space is very small and wiring is easy.

【0009】又、蛋白質繊維等の酸・アルカリ溶液で溶
ける繊維からなるメッシュ体を使用すれば、光透過を必
要とする部分の繊維を溶かすことができるので、ガラス
板に貼着するだけでパターンのガラス基板が形成でき、
ファックス等に用いると光透過性基板を簡単に製作でき
るという効果を有する。又、パターン以外の部分は通気
性があるので放熱性がよくプリント導電シートに取り付
けた部品を冷却し損傷を防止できる。又、メッシュシー
ト、多孔性シートなので液が通り抜けできるので片面か
らの電気接点で両面のメッキができる。又、銅板を使用
していないのでエッチングを使用する必要がなく作業が
簡単である。又、孔開け工程がなく、多層の導通が金属
ペーストの埋込みででき、又、導通ペーストで多層の導
通ができるので1000×2000mmという大判サイ
ズのプリント導電シートの製作が可能である。
If a mesh body made of fibers such as protein fibers which can be dissolved in an acid / alkali solution is used, the fibers in the portion requiring light transmission can be melted. Glass substrate can be formed,
When used in a fax machine or the like, it has an effect that a light-transmissive substrate can be easily manufactured. In addition, since the portion other than the pattern has air permeability, the heat dissipation is good and the parts attached to the printed conductive sheet can be cooled to prevent damage. In addition, since it is a mesh sheet or a porous sheet, liquid can pass through it, so both sides can be plated with electrical contacts from one side. Further, since no copper plate is used, there is no need to use etching and the work is simple. In addition, since there is no perforation step, multi-layered conduction can be achieved by embedding a metal paste, and since multi-layered conduction can be performed with the conduction paste, it is possible to manufacture a large-sized printed conductive sheet of 1000 × 2000 mm.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のプリント導電シート成形方法の第1実
施例である。
FIG. 1 is a first embodiment of the method for forming a printed conductive sheet of the present invention.

【図2】本発明のプリント導電シート成形方法の第2実
施例である。
FIG. 2 is a second embodiment of the method for forming a printed conductive sheet of the present invention.

【図3】本発明のプリント導電シートを多層重合し、金
属ペーストを埋込んで導通した正断面図である。
FIG. 3 is a front cross-sectional view in which a printed conductive sheet of the present invention is multilayer-polymerized and a metal paste is embedded to conduct electricity.

【図4】本発明のプリント導電シートを巻回した斜視図
である。
FIG. 4 is a perspective view in which the printed conductive sheet of the present invention is wound.

【図5】メッシュシートに感光乳剤のパターンを形成し
た断面図である。
FIG. 5 is a cross-sectional view in which a photosensitive emulsion pattern is formed on a mesh sheet.

【図6】図5のパターンに金属電気メッキを施す装置の
要部切断正面図である。
FIG. 6 is a cutaway front view of an essential part of an apparatus for performing metal electroplating on the pattern of FIG.

【図7】図6により成形されたプリント導電シートの断
面図である。
FIG. 7 is a cross-sectional view of the printed conductive sheet formed according to FIG.

【符号の説明】[Explanation of symbols]

1,4 メッシュシート又は多孔性シート 2,7,10 金属ペースト 3,9,12 プリント導電シート 5 感光乳剤 8,11 金属電気メッキ 1,4 Mesh sheet or porous sheet 2,7,10 Metal paste 3,9,12 Printed conductive sheet 5 Photosensitive emulsion 8,11 Metal electroplating

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 化学繊維、金属繊維、天然繊維等を編ん
だメッシュシート又は多孔性シートに電気導通性部材で
パターンを形成したプリント導電シート。
1. A printed conductive sheet in which a pattern is formed by a conductive sheet on a mesh sheet or porous sheet woven of chemical fibers, metal fibers, natural fibers and the like.
JP8111191A 1996-04-08 1996-04-08 Printed conductive sheet Expired - Lifetime JP2799411B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8111191A JP2799411B2 (en) 1996-04-08 1996-04-08 Printed conductive sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8111191A JP2799411B2 (en) 1996-04-08 1996-04-08 Printed conductive sheet

Publications (2)

Publication Number Publication Date
JPH09283877A true JPH09283877A (en) 1997-10-31
JP2799411B2 JP2799411B2 (en) 1998-09-17

Family

ID=14554814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8111191A Expired - Lifetime JP2799411B2 (en) 1996-04-08 1996-04-08 Printed conductive sheet

Country Status (1)

Country Link
JP (1) JP2799411B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6465742B1 (en) 1999-09-16 2002-10-15 Kabushiki Kaisha Toshiba Three dimensional structure and method of manufacturing the same
JP2014135516A (en) * 2008-07-09 2014-07-24 Semiconductor Energy Lab Co Ltd Method of manufacturing semiconductor device
JP2022128555A (en) * 2021-02-23 2022-09-02 勝也 広繁 Conductive circuit board on which conductive connection is formed by pressure welding, and conductive connection method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080314623A1 (en) * 2005-02-28 2008-12-25 So-Ken Co., Ltd. Printed Circuit Board and Method for Manufacturing the Same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5453264A (en) * 1977-10-04 1979-04-26 Suwa Seikosha Kk Bilateral printed board
JPH01231212A (en) * 1988-03-09 1989-09-14 Nitto Denko Corp Dielectric base board and plane antenna using dielectric base board
JPH0683067A (en) * 1992-09-04 1994-03-25 Fujitsu Ltd Printing plate manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5453264A (en) * 1977-10-04 1979-04-26 Suwa Seikosha Kk Bilateral printed board
JPH01231212A (en) * 1988-03-09 1989-09-14 Nitto Denko Corp Dielectric base board and plane antenna using dielectric base board
JPH0683067A (en) * 1992-09-04 1994-03-25 Fujitsu Ltd Printing plate manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6465742B1 (en) 1999-09-16 2002-10-15 Kabushiki Kaisha Toshiba Three dimensional structure and method of manufacturing the same
JP2014135516A (en) * 2008-07-09 2014-07-24 Semiconductor Energy Lab Co Ltd Method of manufacturing semiconductor device
JP2022128555A (en) * 2021-02-23 2022-09-02 勝也 広繁 Conductive circuit board on which conductive connection is formed by pressure welding, and conductive connection method

Also Published As

Publication number Publication date
JP2799411B2 (en) 1998-09-17

Similar Documents

Publication Publication Date Title
ATE287198T1 (en) CIRCUIT BOARD ARRANGEMENT AND METHOD FOR PRODUCING SAME
KR920005070B1 (en) Method of manufacturing double sided wiring substrate
JPH09283877A (en) Printed conducting sheet
CA2387012A1 (en) Method of manufacturing printed wiring board
KR101201948B1 (en) The printed circuit board manufacturing method
JPH09275267A (en) Method for forming printed wiring sheet
CN213755111U (en) Circuit board
JP2841045B2 (en) Method of joining conductive substrate such as printed circuit board and multi-contact parts such as LSI
JPH09275268A (en) Method for forming printed wiring sheet
CN210042390U (en) Double-sided flexible circuit board of upper and lower layers of conductive silver paste
JP2010030135A (en) Screen with positioning mark for use in screen printing
JP2002151623A (en) Method for manufacturing two-metal layer tape bga(tbga) embedded in blind hole by plating
CN111901963A (en) Method for forming welding pad on LED carrier plate
JPH0728124B2 (en) Double-sided circuit board manufacturing method
CA2177708A1 (en) Method of making a printed circuit board
JP3520375B2 (en) Printing apparatus for flexible circuit board and method for manufacturing flexible circuit board using the same
JP2850186B2 (en) Manufacturing method of printed wiring board
JP2617692B2 (en) Multilayer printed wiring board and method of manufacturing the same
JP4150464B2 (en) Two-metal tape carrier package and its manufacturing method
JPH05218598A (en) Printed-wiring board
JP4244721B2 (en) Forming method of coaxial structure through hole
KR19990049190A (en) Printed Circuit Board Manufacturing Method
KR960036874A (en) Manufacturing Method of Flexible PCB
JP3202836B2 (en) Manufacturing method of multilayer printed wiring board
JPS588600B2 (en) Ryomen Print High Senban no Seizouhouhou

Legal Events

Date Code Title Description
S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20070710

Year of fee payment: 9

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080710

Year of fee payment: 10

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090710

Year of fee payment: 11

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090710

Year of fee payment: 11

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090710

Year of fee payment: 11

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090710

Year of fee payment: 11

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100710

Year of fee payment: 12

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100710

Year of fee payment: 12

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110710

Year of fee payment: 13

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120710

Year of fee payment: 14

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130710

Year of fee payment: 15

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term