JPH09263608A - Method for producing boron-containing resin - Google Patents
Method for producing boron-containing resinInfo
- Publication number
- JPH09263608A JPH09263608A JP7437896A JP7437896A JPH09263608A JP H09263608 A JPH09263608 A JP H09263608A JP 7437896 A JP7437896 A JP 7437896A JP 7437896 A JP7437896 A JP 7437896A JP H09263608 A JPH09263608 A JP H09263608A
- Authority
- JP
- Japan
- Prior art keywords
- group
- boron
- thermoplastic resin
- extruder
- boronic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 229910052796 boron Inorganic materials 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 229920005989 resin Polymers 0.000 title description 7
- 239000011347 resin Substances 0.000 title description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 32
- 150000001639 boron compounds Chemical class 0.000 claims abstract description 22
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 15
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- 239000001257 hydrogen Substances 0.000 claims abstract description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 8
- 238000009835 boiling Methods 0.000 claims abstract description 6
- -1 borate ester Chemical class 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 10
- 239000012535 impurity Substances 0.000 abstract description 9
- 229920001577 copolymer Polymers 0.000 description 14
- 125000005620 boronic acid group Chemical group 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- 229920000098 polyolefin Polymers 0.000 description 10
- UYANAUSDHIFLFQ-UHFFFAOYSA-N borinic acid Chemical group OB UYANAUSDHIFLFQ-UHFFFAOYSA-N 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- ZADPBFCGQRWHPN-UHFFFAOYSA-N boronic acid Chemical compound OBO ZADPBFCGQRWHPN-UHFFFAOYSA-N 0.000 description 7
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 6
- 125000000524 functional group Chemical group 0.000 description 6
- 229920002554 vinyl polymer Polymers 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- VEWFZHAHZPVQES-UHFFFAOYSA-N boron;n,n-diethylethanamine Chemical compound [B].CCN(CC)CC VEWFZHAHZPVQES-UHFFFAOYSA-N 0.000 description 5
- 229910000085 borane Inorganic materials 0.000 description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical class OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 125000005619 boric acid group Chemical group 0.000 description 2
- MCQRPQCQMGVWIQ-UHFFFAOYSA-N boron;methylsulfanylmethane Chemical compound [B].CSC MCQRPQCQMGVWIQ-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000002685 polymerization catalyst Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- AAYWIXGLVAEPTP-UHFFFAOYSA-N 2,3-dimethylbutan-2-ylboron Chemical compound [B]C(C)(C)C(C)C AAYWIXGLVAEPTP-UHFFFAOYSA-N 0.000 description 1
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 1
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 1
- HMUJOIKMUAQZQZ-UHFFFAOYSA-N B(OC1CCCCC1)OC1CCCCC1 Chemical group B(OC1CCCCC1)OC1CCCCC1 HMUJOIKMUAQZQZ-UHFFFAOYSA-N 0.000 description 1
- KAKIEONGVIRLLB-UHFFFAOYSA-N CBOC Chemical group CBOC KAKIEONGVIRLLB-UHFFFAOYSA-N 0.000 description 1
- DQAQWFXUIUBFKB-UHFFFAOYSA-N CBOCC Chemical group CBOCC DQAQWFXUIUBFKB-UHFFFAOYSA-N 0.000 description 1
- AVZSFFJXEUUJIQ-UHFFFAOYSA-N CCBO Chemical group CCBO AVZSFFJXEUUJIQ-UHFFFAOYSA-N 0.000 description 1
- DFOTYIBNFBKXBR-UHFFFAOYSA-N CCBOC Chemical group CCBOC DFOTYIBNFBKXBR-UHFFFAOYSA-N 0.000 description 1
- RBNZKVBPNZRPEU-UHFFFAOYSA-N CCCCBOC Chemical group CCCCBOC RBNZKVBPNZRPEU-UHFFFAOYSA-N 0.000 description 1
- FGMZCSZIFQZIKC-UHFFFAOYSA-N CCCCOBOCCCC Chemical group CCCCOBOCCCC FGMZCSZIFQZIKC-UHFFFAOYSA-N 0.000 description 1
- XUWLWZZNDRHFII-UHFFFAOYSA-N CCCOBOCCC Chemical group CCCOBOCCC XUWLWZZNDRHFII-UHFFFAOYSA-N 0.000 description 1
- CZASJXVOMKVOGD-UHFFFAOYSA-N CCOBOCC Chemical group CCOBOCC CZASJXVOMKVOGD-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002879 Lewis base Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- CDSGJHCARATGKG-UHFFFAOYSA-N bis(3-methylbutyl)borane Chemical compound CC(C)CCBCCC(C)C CDSGJHCARATGKG-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- UORVGPXVDQYIDP-BJUDXGSMSA-N borane Chemical class [10BH3] UORVGPXVDQYIDP-BJUDXGSMSA-N 0.000 description 1
- HHPKBHOIUWPRIE-UHFFFAOYSA-N borane 1,4-oxathiane Chemical compound B.C1CSCCO1 HHPKBHOIUWPRIE-UHFFFAOYSA-N 0.000 description 1
- LISGWWQJIMNQTP-UHFFFAOYSA-N boranyloxyborane Chemical group BOB LISGWWQJIMNQTP-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- PVYPHUYXKVVURH-UHFFFAOYSA-N boron;2-methylpropan-2-amine Chemical compound [B].CC(C)(C)N PVYPHUYXKVVURH-UHFFFAOYSA-N 0.000 description 1
- KHYAFFAGZNCWPT-UHFFFAOYSA-N boron;n,n-diethylaniline Chemical compound [B].CCN(CC)C1=CC=CC=C1 KHYAFFAGZNCWPT-UHFFFAOYSA-N 0.000 description 1
- LRJRPHROCLHMHK-UHFFFAOYSA-N boron;n,n-dimethylmethanamine Chemical compound [B].CN(C)C LRJRPHROCLHMHK-UHFFFAOYSA-N 0.000 description 1
- BYKCUMSOQIPHSR-UHFFFAOYSA-N boron;n-ethyl-n-propan-2-ylpropan-2-amine Chemical compound [B].CCN(C(C)C)C(C)C BYKCUMSOQIPHSR-UHFFFAOYSA-N 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- NNTOJPXOCKCMKR-UHFFFAOYSA-N boron;pyridine Chemical compound [B].C1=CC=NC=C1 NNTOJPXOCKCMKR-UHFFFAOYSA-N 0.000 description 1
- VLLYOYVKQDKAHN-UHFFFAOYSA-N buta-1,3-diene;2-methylbuta-1,3-diene Chemical compound C=CC=C.CC(=C)C=C VLLYOYVKQDKAHN-UHFFFAOYSA-N 0.000 description 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- ZDQWVKDDJDIVAL-UHFFFAOYSA-N catecholborane Chemical compound C1=CC=C2O[B]OC2=C1 ZDQWVKDDJDIVAL-UHFFFAOYSA-N 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- XNYOSXARXANYPB-UHFFFAOYSA-N dicyclohexylborane Chemical compound C1CCCCC1BC1CCCCC1 XNYOSXARXANYPB-UHFFFAOYSA-N 0.000 description 1
- VAWRKITUPUFMHV-UHFFFAOYSA-N dimethoxyborane Chemical group COBOC VAWRKITUPUFMHV-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- AIGRXSNSLVJMEA-FQEVSTJZSA-N ethoxy-(4-nitrophenoxy)-phenyl-sulfanylidene-$l^{5}-phosphane Chemical compound O([P@@](=S)(OCC)C=1C=CC=CC=1)C1=CC=C([N+]([O-])=O)C=C1 AIGRXSNSLVJMEA-FQEVSTJZSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000007527 lewis bases Chemical class 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000004492 methyl ester group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- GCNZPJDTQWLYEN-UHFFFAOYSA-N methylborinic acid Chemical group CBO GCNZPJDTQWLYEN-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- ZCYXXKJEDCHMGH-UHFFFAOYSA-N nonane Chemical compound CCCC[CH]CCCC ZCYXXKJEDCHMGH-UHFFFAOYSA-N 0.000 description 1
- BKIMMITUMNQMOS-UHFFFAOYSA-N normal nonane Natural products CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 1
- YCIMNLLNPGFGHC-UHFFFAOYSA-N o-dihydroxy-benzene Natural products OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- LGQXXHMEBUOXRP-UHFFFAOYSA-N tributyl borate Chemical compound CCCCOB(OCCCC)OCCCC LGQXXHMEBUOXRP-UHFFFAOYSA-N 0.000 description 1
- AJSTXXYNEIHPMD-UHFFFAOYSA-N triethyl borate Chemical compound CCOB(OCC)OCC AJSTXXYNEIHPMD-UHFFFAOYSA-N 0.000 description 1
- WRECIMRULFAWHA-UHFFFAOYSA-N trimethyl borate Chemical compound COB(OC)OC WRECIMRULFAWHA-UHFFFAOYSA-N 0.000 description 1
- LTEHWCSSIHAVOQ-UHFFFAOYSA-N tripropyl borate Chemical compound CCCOB(OCCC)OCCC LTEHWCSSIHAVOQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
(57)【要約】
【課題】 不純物の少ないホウ素含有熱可塑製樹脂を
製造すること。
【解決手段】押出機中で、二重結合量を0.0001m
eq/g以上含有する熱可塑性樹脂(A)にホウ素−水
素結合を有するホウ素化合物(B)を反応させ、次いで
分子内に水酸基を1個または2個有し、かつ760mm
Hg下で沸点300℃以下の化合物(C)を添加するホ
ウ素含有熱可塑性樹脂の製造法。(57) Abstract: To produce a boron-containing thermoplastic resin containing few impurities. SOLUTION: In the extruder, the amount of double bonds is 0.0001 m.
A thermoplastic resin (A) containing eq / g or more is reacted with a boron compound (B) having a boron-hydrogen bond, and then has 1 or 2 hydroxyl groups in the molecule, and 760 mm
A method for producing a boron-containing thermoplastic resin, which comprises adding a compound (C) having a boiling point of 300 ° C. or lower under Hg.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、生産性および経済
性に優れ、かつ不純物の少ない、ホウ素含有熱可塑性樹
脂の製造法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a boron-containing thermoplastic resin which is excellent in productivity and economy and has few impurities.
【0002】[0002]
【従来の技術】テトラヒドロフラン等の溶媒を用い、フ
ラスコ等の反応容器中で炭素−炭素二重結合を有する熱
可塑性樹脂にホウ素−水素結合を有するホウ素化合物を
反応させることが知られている(特開平3−11540
2、特開平4−45104)。また、二重結合を有する
オレフィン系重合体にボラン錯体およびホウ酸エステル
を反応させ、ボロン酸基を有するポリオレフィンを製造
する方法が知られている(特開平7−33820)。2. Description of the Related Art It is known to react a thermoplastic resin having a carbon-carbon double bond with a boron compound having a boron-hydrogen bond in a reaction vessel such as a flask using a solvent such as tetrahydrofuran (special feature: Kaihei 3-11540
2, JP-A-4-45104). There is also known a method of producing a polyolefin having a boronic acid group by reacting an olefin polymer having a double bond with a borane complex and a borate ester (JP-A-7-33820).
【0003】[0003]
【発明が解決しようとする課題】しかし、従来法では、
溶剤を使用する必要があるため、溶媒への溶解、溶媒除
去、溶媒精製等の操作が必要で、複雑な工程が必要であ
った。また、過剰の試薬由来のホウ素化合物等の不純物
を除去するのが困難であった。また、従来法は、バッチ
式で製造するため、大量生産に向いていなかった。しか
して、本発明の目的は、より簡単な工程により、さらに
好ましくは溶媒を使用せずに、不純物の少ないホウ素含
有熱可塑性樹脂を製造する方法を提供することにある。However, in the conventional method,
Since it was necessary to use a solvent, operations such as dissolution in the solvent, removal of the solvent, and solvent purification were necessary, and complicated steps were required. Further, it has been difficult to remove impurities such as boron compounds derived from excess reagents. In addition, the conventional method is not suitable for mass production because it is manufactured in a batch system. Therefore, it is an object of the present invention to provide a method for producing a boron-containing thermoplastic resin having less impurities by a simpler process, more preferably without using a solvent.
【0004】[0004]
【課題を解決するための手段】上記目的は、押出機中
で、二重結合量を0.0001meq/g以上含有する
熱可塑性樹脂(A)にホウ素−水素結合を有するホウ素
化合物(B)を反応させ、次いで、分子内に水酸基を1
個または2個有し、かつ760mmHg下で沸点300
℃以下の化合物(C)を添加することによって達成され
る。The above object is to provide a thermoplastic resin (A) having a double bond content of 0.0001 meq / g or more with a boron compound (B) having a boron-hydrogen bond in an extruder. React, then add 1 hydroxyl group in the molecule
Have one or two, and have a boiling point of 300 at 760 mmHg
This is achieved by adding the compound (C) at a temperature of not higher than 0 ° C.
【0005】[0005]
【発明の実施の形態】本発明において、二重結合を0.
0001meq/g以上含有する熱可塑性樹脂(A)と
は、主鎖、側鎖あるいは末端から選ばれる少なくとも1
つに炭素−炭素二重結合を有する熱可塑性樹脂である。
二重結合を0.0001meq/g以上含有する熱可塑
性樹脂(A)とは、1)通常のオレフィン系重合体ある
いはビニル系重合体の末端に二重結合を有するもの;
2)通常のオレフィン系重合体あるいはビニル系重合体
を無酸素条件下、熱分解して得た、末端に二重結合を有
するオレフィン系重合体あるいはビニル系重合体。;
3)オレフィンあるいはビニル系重合体とジエン系重合
体との共重合により得た、オレフィン−ジエン系共重合
体あるいはビニル−ジエン系共重合体などが挙げられ
る。1)の製法については、公知のオレフィン系重合体
あるいはビニル系重合体の製法を用いることができる
が、特に、連鎖移動剤として水素を用いず、重合触媒と
してメタロセン系重合触媒を用い、オレフィン系単量体
を重合する製法(例えば、DE4030399)が好ま
しい。2)の製法については、公知の方法(例えばUS
2835659、3087922)によりオレフィン系
重合体を窒素下や真空条件下等の無酸素条件下で300
℃〜500℃の温度、反応時間1分〜10時間で熱分解
して得る方法が好ましい。3)の製法については、公知
のチーグラー系触媒を用いてオレフィン−ジエン系共重
合体を得る方法が好ましく(例えば特開昭50−442
81、DE3021273)、また公知のビニル−ジエ
ン系共重合体をラジカル重合またはアニオン重合で得る
方法も挙げられる。BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, a double bond is replaced by 0.
The thermoplastic resin (A) containing 0001 meq / g or more means at least 1 selected from the main chain, side chains or terminals.
It is a thermoplastic resin having a carbon-carbon double bond.
The thermoplastic resin (A) having a double bond content of 0.0001 meq / g or more means 1) a resin having a double bond at the end of a usual olefin polymer or vinyl polymer;
2) An olefin polymer or vinyl polymer having a double bond at a terminal, which is obtained by thermally decomposing an ordinary olefin polymer or vinyl polymer under oxygen-free conditions. ;
3) An olefin-diene copolymer or a vinyl-diene copolymer obtained by copolymerization of an olefin or vinyl polymer and a diene polymer may be mentioned. Regarding the production method of 1), a known production method of an olefin polymer or a vinyl polymer can be used. In particular, hydrogen is not used as a chain transfer agent, a metallocene polymerization catalyst is used as a polymerization catalyst, and an olefin polymer is used. A production method of polymerizing a monomer (for example, DE4030399) is preferable. Regarding the production method of 2), a known method (for example, US
2835659, 3087922) to prepare an olefin-based polymer at 300 under oxygen-free conditions such as under nitrogen or under vacuum.
A method of thermal decomposition at a temperature of ℃ to 500 ℃ and a reaction time of 1 minute to 10 hours is preferable. Regarding the production method of 3), a method of obtaining an olefin-diene copolymer using a known Ziegler catalyst is preferable (for example, JP-A-50-442).
81, DE 3021273), and a method of obtaining a known vinyl-diene copolymer by radical polymerization or anion polymerization.
【0006】熱可塑性樹脂(A)中の二重結合は0.0
001meq/g以上含有することが重要であり、上限
には特に制限はないが、約1eq/gである。好適には
0.001meq/g以上、さらには0.005meq
/g以上である。また、上限については0.5meq/
g以下が好ましく、さらに好ましくは0.2meq/g
以下である。The double bond in the thermoplastic resin (A) is 0.0
It is important to contain 001 meq / g or more, and there is no particular upper limit, but it is about 1 eq / g. Suitably 0.001 meq / g or more, and further 0.005 meq
/ G or more. The upper limit is 0.5 meq /
g or less is preferable, and more preferably 0.2 meq / g
It is as follows.
【0007】二重結合を有する熱可塑性樹脂(A)の具
体例としては、ポリエチレン(高密度ポリエチレン、中
密度ポリエチレン、低密度ポリエチレン、直鎖状低密度
ポリエチレン、超低密度ポリエチレン等)、エチレン−
プロピレン共重合体、ポリプロピレン、ポリブテン、ポ
リ(3−メチル−1−ペンテン)等のオレフィン系重合
体;エチレン−プロピレン−エチリデンノルボルネン共
重合体、エチレン−イソプレン共重合体等のオレフィン
−ジエン系共重合体、ポリスチレン、ポリ塩化ビニル等
のビニル系重合体;ポリブタジエン、ポリイソプレン、
ブタジエン−イソプレンのブロックおよびランダム共重
合体、プタジエン−スチレンのブロックおよびランダム
共重合体、イソプレン−スチレンのブロックおよびラン
ダン共重合体等のジエン系重合体およびその水添物;ポ
リフェニレンエーテル;ポリフェニレンスルフィド等が
挙げられる。前記重合体の中で、ポリエチレン(高密
度、中密度、直鎖状低密度、超低密度)およびエチレン
−プロピレン共重合体、ポリプロピレンが特に好まし
い。Specific examples of the thermoplastic resin (A) having a double bond include polyethylene (high density polyethylene, medium density polyethylene, low density polyethylene, linear low density polyethylene, ultra low density polyethylene, etc.), ethylene-
Olefin-based polymers such as propylene copolymer, polypropylene, polybutene and poly (3-methyl-1-pentene); olefin-diene-based copolymers such as ethylene-propylene-ethylidene norbornene copolymer and ethylene-isoprene copolymer Vinyl polymers such as coalesce, polystyrene and polyvinyl chloride; polybutadiene, polyisoprene,
Diene polymers such as butadiene-isoprene block and random copolymers, ptadiene-styrene block and random copolymers, isoprene-styrene block and landan copolymers, and hydrogenated products thereof; polyphenylene ether; polyphenylene sulfide, etc. Is mentioned. Among the above polymers, polyethylene (high density, medium density, linear low density, ultra low density), ethylene-propylene copolymer, and polypropylene are particularly preferable.
【0008】本発明に使用するホウ素−水素結合を有す
るホウ素化合物(B)とは、少なくとも1つのホウ素−
水素結合を有するホウ素化合物である。この具体例とし
ては、ジボラン、テトラボラン、ペンタボラン、ヘキサ
ボラン、デカボラン類等のボラン類;ボラン−テトラヒ
ドラフラン錯体、ボラン−トリエチルアミン錯体、ボラ
ン−トリメチルアミン錯体、ボラン−ピリジン錯体、ボ
ラン−t−ブチルアミン錯体、ボラン−N,N−ジイソ
プロピルエチルアミン錯体、ボラン−ジメチルアミン錯
体、ボラン−N,N−ジエチルアニリン錯体、ボラン−
4−メチルモルフォリン錯体、ボラン−メチルスルフィ
ド錯体、ボラン−1,4−チオキサン錯体、ボラン−ト
リブチルフォスフィン錯体等のボランとルイス塩基の錯
体;テキシルボラン、カテコールボラン、9−ボラビシ
クロ[3,3,1]ノナン、ジイソアミルボラン、ジシ
クロヘキシルボラン等の炭化水素あるいは炭化水素オキ
シ置換ボラン等が挙げられ、このうち化学的安定性の点
からボラン−トリエチルアミン錯体(トリエチルアミン
ボラン)、ボラン−メチルスルフィド錯体等が好まし
い。The boron compound (B) having a boron-hydrogen bond used in the present invention means at least one boron-
It is a boron compound having a hydrogen bond. Specific examples thereof include boranes such as diborane, tetraborane, pentaborane, hexaborane, and decaborane; borane-tetrahydrafuran complex, borane-triethylamine complex, borane-trimethylamine complex, borane-pyridine complex, borane-t-butylamine complex, Borane-N, N-diisopropylethylamine complex, borane-dimethylamine complex, borane-N, N-diethylaniline complex, borane-
Complexes of borane and Lewis bases such as 4-methylmorpholine complex, borane-methyl sulfide complex, borane-1,4-thioxane complex, borane-tributylphosphine complex; thexylborane, catecholborane, 9-borabicyclo [3,3,3] 1] Hydrocarbons such as nonane, diisoamylborane, and dicyclohexylborane, or hydrocarbon oxy-substituted borane, and the like. Among them, from the viewpoint of chemical stability, borane-triethylamine complex (triethylamineborane), borane-methylsulfide complex, etc. preferable.
【0009】本発明において、熱可塑性樹脂(A)にホ
ウ素化合物(B)およびホウ酸エステル(D)を反応さ
せる方法はより好適な態様である。このホウ酸エステル
(D)としては、例えばホウ酸トリメチル、ホウ酸トリ
エチル、ホウ酸トリプロピル、ホウ酸トリブチル、ホウ
酸エチレングリコールエステル、ホウ酸プロピレングリ
コールエステル、ホウ酸トリメチレングリコールエステ
ル、ホウ酸1,3−ブタンジオールエステル、ホウ酸ネ
オペンチルグリコールエステル等のホウ酸エステルが好
ましく、これらのなかで特に、ホウ酸トリメチレングリ
コールエステル、ホウ酸1,3−ブタンジオールエステ
ル、ホウ酸ネオペンチルグリコールエステル等のエステ
ルが好ましい。これらのホウ酸エステルを添加すること
により、ホウ素化合物(B)の添加時にしばしば起こる
架橋を防ぐと同時に、化学的に安定なボロン酸エステル
基という形でホウ素含有基を導入できる。In the present invention, a method of reacting the thermoplastic resin (A) with the boron compound (B) and the borate ester (D) is a more preferable embodiment. Examples of the borate ester (D) include trimethyl borate, triethyl borate, tripropyl borate, tributyl borate, ethylene glycol borate ester, propylene glycol borate ester, trimethylene glycol borate ester, boric acid 1 , 3-butanediol ester, boric acid neopentyl glycol ester and the like are preferable, and among these, boric acid trimethylene glycol ester, boric acid 1,3-butanediol ester, boric acid neopentyl glycol ester are particularly preferable. Etc. are preferred. By adding these boric acid esters, it is possible to prevent the cross-linking that often occurs when the boron compound (B) is added, and at the same time to introduce the boron-containing group in the form of a chemically stable boronic acid ester group.
【0010】本発明の分子内に水酸基を1個または2個
有する化合物(C)の沸点としては760mmHg下で
の沸点が300℃以下であることが重要で、60℃から
300℃の範囲が好ましく、60℃から250℃の範囲
がより好ましい。このような化合物(C)としては、例
えば、メタノール、エタノール、1−プロパノール、2
−プロパノール、1−ブタノール、2−ブタノール等の
低級アルコール;エチレングリコール、1,2−プロピ
レングリコール、トリメチレングリコール、1,4−ブ
タンジオール、1,3−ブタンジオール、1,2−ブタ
ンジオール等の低級ジオールが挙げられる。As the boiling point of the compound (C) having one or two hydroxyl groups in the molecule of the present invention, it is important that the boiling point under 760 mmHg is 300 ° C. or less, and the range of 60 ° C. to 300 ° C. is preferable. The range of 60 ° C to 250 ° C is more preferable. Examples of such a compound (C) include methanol, ethanol, 1-propanol, and 2
-Lower alcohols such as propanol, 1-butanol, 2-butanol; ethylene glycol, 1,2-propylene glycol, trimethylene glycol, 1,4-butanediol, 1,3-butanediol, 1,2-butanediol, etc. Lower diols of
【0011】本発明に使用する押出機としては、特に制
限はなく、一軸押出機、二軸同方向回転押出機、二軸異
方向回転押出機のいずれを用いてもよいが、二軸同方向
回転押出機あるいは二軸異方向回転押出機が好ましい。
また、押出機の樹脂出口近くにベントを設けることが好
ましい。これにより過剰のホウ素化合物を除去および回
収することができる。また、1台の多段ベントを有する
押出機を使用してもよいし、2台以上の押出機を使用し
てもよい。1台の押出機を用いる場合、押出機の本体側
から順に、1)熱可塑性樹脂(A)のフィード口、2)
ホウ素化合物(B)およびホウ酸エステル(D)の添加
口、3)ベント口、水酸基を有する化合物(C)の添加
口および5)ベント口を有する多段式押出機が好まし
く、スクリュー形状としては、前記2)、3)、4)お
よび5)の間にそれぞれシールあるいは逆ネジスクリュ
ーを有していることが好ましい。2台の押出機を使用す
る場合、1台目の押出機では本体側から順に、1)熱可
塑性樹脂(A)のフィード口、2)ホウ素化合物(B)
およびホウ酸エステル(D)の添加口および3)ベント
口を有する押出機が好ましく、2台目の押出機では本体
側から順に、1)1台目の押出機で得られた樹脂をフィ
ードするためのフィード口、水酸基を有する化合物
(C)の添加口およびベント口を有する押出機が好まし
く、前記1台目および2台目の押出機のスクリュー形状
としては前記2)および3)の間にシールあるいは逆ネ
ジスクリューを有していることが好ましい。本発明に使
用するホウ素化合物(B)は高温では空気中の酸素ある
いは水あるいは酸素により分解されるため、押出機中の
酸素および水蒸気の濃度はできるだけ低いことが好まし
い。従って、押出機のフィーダーに窒素ガスを流した
り、押出機に脱気用ベント口を設けることが好ましい。
押出機内の最高温度は使用する熱可塑性樹脂(A)およ
びホウ素化合物(B)によって異なるが、通常、(A)
の融点から350℃の範囲が好ましく、さらに(A)の
融点+10℃から300℃の範囲がより好ましい。熱可
塑性樹脂(A)とホウ素化合物(B)を反応させた後、
未反応のホウ素化合物(B)を除去、特に減圧下で除去
した後に、水酸基を有する化合物(C)を添加するのが
好適である。ここでは未反応のホウ素化合物は、ホウ素
量に換算して、500ppm以下さらには100ppm
以下になるように除去するのがよい。ここで減圧とは、
内部の真空度が300mmHg以下、好ましくは50m
mHg以下である。水酸基を有する化合物を添加するこ
とにより、不純物をより効率的に除くことができる。ま
た同時に、反応によって導入されたボロン酸基のエステ
ルの種類をエステル交換反応により、添加した水酸基を
有する化合物のエステルに変えることもできる。水酸基
を有する化合物(C)を添加したあと、さらに減圧状態
にし、未反応のホウ素化合物(B)を除去することが好
ましい。この除去により、不純物のホウ素化合物の量は
ホウ素量に換算して、100ppm以下、さらには20
ppm以下とすることが好ましい。The extruder used in the present invention is not particularly limited, and any of a single-screw extruder, a twin-screw co-rotating extruder and a twin-screw different-direction rotating extruder may be used. A rotary extruder or a twin-screw counter-rotating extruder is preferred.
Further, it is preferable to provide a vent near the resin outlet of the extruder. As a result, excess boron compound can be removed and recovered. Moreover, you may use the extruder which has one multistage vent, and may use two or more extruders. When using one extruder, from the main body side of the extruder, in order from 1) the feed port of the thermoplastic resin (A), 2)
A multi-stage extruder having an addition port for the boron compound (B) and borate ester (D), 3) a vent port, an addition port for the compound (C) having a hydroxyl group and 5) a vent port is preferable, and the screw shape is It is preferable to have a seal or a reverse threaded screw between the above 2), 3), 4) and 5). When using two extruders, in the first extruder, from the main body side, 1) the feed port of the thermoplastic resin (A), 2) the boron compound (B)
And an extruder having a borate ester (D) addition port and 3) a vent port are preferable, and the second extruder feeds the resin obtained by the first extruder in order from the main body side. An extruder having a feed port for the above, an addition port for the compound (C) having a hydroxyl group, and a vent port is preferable, and the screw shapes of the first and second extruders are between the above 2) and 3). It preferably has a seal or a reverse screw. Since the boron compound (B) used in the present invention is decomposed by oxygen in the air or water or oxygen at a high temperature, it is preferable that the concentrations of oxygen and water vapor in the extruder are as low as possible. Therefore, it is preferable to flow nitrogen gas into the feeder of the extruder or to provide a vent port for deaeration in the extruder.
The maximum temperature in the extruder varies depending on the thermoplastic resin (A) and the boron compound (B) used, but usually (A)
The melting point of (A) to 350 ° C. is preferable, and the melting point of (A) + 10 ° C. to 300 ° C. is more preferable. After reacting the thermoplastic resin (A) with the boron compound (B),
It is preferable to add the compound (C) having a hydroxyl group after removing the unreacted boron compound (B), especially under reduced pressure. Here, the unreacted boron compound is converted into the amount of boron and is 500 ppm or less, and further 100 ppm.
It is better to remove so that: Here, decompression means
Internal vacuum is less than 300mmHg, preferably 50m
mHg or less. Impurities can be removed more efficiently by adding a compound having a hydroxyl group. At the same time, the type of ester of the boronic acid group introduced by the reaction can be changed to the ester of the added compound having a hydroxyl group by transesterification reaction. After adding the compound (C) having a hydroxyl group, it is preferable to further reduce the pressure to remove the unreacted boron compound (B). By this removal, the amount of the boron compound as an impurity is converted into the amount of boron and is 100 ppm or less, further 20
It is preferable to set it to ppm or less.
【0012】ホウ素化合物(B)の添加法としては、通
常、押出機のバレルの途中からポンプにより注入する方
法、あるいは、原料樹脂にあらかじめドライブレンドす
る方法、あるいは前記の途中で注入する方法およびあら
かじめドライブレンドする方法を併用する方法が挙げら
れる。ホウ素化合物(B)の添加量は特に制限はない
が、熱可塑性樹脂(A)に対し、0.001〜10重量
%の範囲が好ましく、さらに好ましくは、0.01〜5
重量%の範囲である。また、ホウ酸エステル(D)の添
加量の好適な範囲は熱可塑性樹脂(A)に対し、0.0
1〜100重量%の範囲が好ましく、さらに好ましくは
0.05〜10重量%の範囲である。また、水酸基を有
する化合物(C)の添加量は特に制限はないが、熱可塑
性樹脂(A)に対し、0.1〜100重量%の範囲が好
ましく、さらに好ましくは0.5〜20重量%の範囲で
ある。The boron compound (B) is usually added by a pump in the middle of the barrel of the extruder, by dry-blending with the raw material resin in advance, or by injection in the middle of the above. A method of using a dry blending method in combination is mentioned. The amount of the boron compound (B) added is not particularly limited, but it is preferably in the range of 0.001 to 10% by weight, more preferably 0.01 to 5 with respect to the thermoplastic resin (A).
% By weight. Further, the preferable range of the addition amount of the borate ester (D) is 0.0 with respect to the thermoplastic resin (A).
The range of 1 to 100% by weight is preferable, and the range of 0.05 to 10% by weight is more preferable. The amount of the compound (C) having a hydroxyl group is not particularly limited, but is preferably in the range of 0.1 to 100% by weight, more preferably 0.5 to 20% by weight, based on the thermoplastic resin (A). Is the range.
【0013】本発明によってえられるホウ素含有熱可塑
性樹脂の代表例としては、ボロン酸基、ボリン酸基およ
び水の存在下でボロン酸基またはボリン酸基に転化しう
るホウ素含有基から選ばれる少なくとも一つの官能基を
有する熱可塑性樹脂が挙げられる。ここでボロン酸基、
ボリン酸基あるいは水の存在下でボロン酸またはボリン
酸基に転化しうるホウ素含有基からなる群より選ばれる
少なくとも一つの官能基がホウ素−炭素結合により主
鎖、側鎖または末端に結合した熱可塑性樹脂である。こ
のうち前記官能基が側鎖または末端に結合した熱可塑性
樹脂が好ましく、末端に結合した熱可塑性樹脂が最適で
ある。ここで末端とは片末端または両末端を意味する。As a representative example of the boron-containing thermoplastic resin obtained by the present invention, at least a boronic acid group, a borinic acid group, and a boron-containing group which can be converted into a boronic acid group or a borinic acid group in the presence of water. A thermoplastic resin having one functional group may be mentioned. Where the boronic acid group,
Heat in which at least one functional group selected from the group consisting of a boric acid group or a boron-containing group capable of being converted to a boronic acid or a boric acid group in the presence of water is bound to the main chain, side chain or terminal by a boron-carbon bond. It is a plastic resin. Of these, a thermoplastic resin having the functional group bonded to the side chain or the terminal is preferable, and a thermoplastic resin bonded to the terminal is most suitable. Here, the term "end" means one end or both ends.
【0014】本発明において、ボロン酸基とは、下記式
(I)で示されるものである。In the present invention, the boronic acid group is represented by the following formula (I).
【0015】[0015]
【化1】 Embedded image
【0016】また水の存在下でボロン酸基に転化しうる
ホウ素含有基(以下単にホウ素含有基と略記する)とし
ては、水の存在下で加水分解を受けて上記式(I)で示
されるボロン酸基に転化しうるホウ素含有基であればど
のようなものでもよいが、代表例として下記一般式(I
I)で示されるボロン酸エステル基、下記一般式(II
I)で示されるボロン酸無水物基、下記一般式(IV)
で示されるボロン酸塩基が挙げられる。Further, the boron-containing group which can be converted to a boronic acid group in the presence of water (hereinafter simply referred to as a boron-containing group) is hydrolyzed in the presence of water and is represented by the above formula (I). Any boron-containing group that can be converted to a boronic acid group may be used, but as a representative example, the following general formula (I
A boronic acid ester group represented by I), represented by the following general formula (II
A boronic acid anhydride group represented by I), the following general formula (IV)
And a boronic acid group represented by.
【0017】[0017]
【化2】 Embedded image
【0018】[0018]
【化3】 Embedded image
【0019】[0019]
【化4】 Embedded image
【0020】{式中、X,Yは水素原子、脂肪族炭化水
素基(炭素数1〜20の直鎖状、または分岐状アルキル
基、またはアルケニル基など)、脂環式炭化水素基(シ
クロアルキル基、シクロアルケニル基など)、芳香族炭
化水素基(フェニル基、ビフェニル基など)を表わし、
X,Yは同じ基でもよいし、異なっていても良い。また
XとY葉結合していてもよい。ただしX,Yがともに水
素原子である場合は除かれる。またR↑1,R↑2,R
↑3は上記X,Yと同様の水素原子、脂肪族炭化水素
基、脂環式炭化水素基、芳香族炭化水素基を表わし、R
↑1,R↑2,R↑3は同じ基でもよいし、異なってい
てもよい。またMはアルカリ金属またはアルカリ土類金
属を表わす。また上記のX,Y,R↑1,R↑2,R↑
3には他の基、たとえばカルボキシル基、ハロゲン原子
などを有していてもよい。}[In the formula, X and Y are hydrogen atoms, aliphatic hydrocarbon groups (straight chain or branched alkyl groups having 1 to 20 carbon atoms, alkenyl groups, etc.), alicyclic hydrocarbon groups (cyclo Alkyl group, cycloalkenyl group, etc.), aromatic hydrocarbon group (phenyl group, biphenyl group, etc.),
X and Y may be the same group or different. Also, X and Y lobes may be bonded. However, it is excluded when both X and Y are hydrogen atoms. Also R ↑ 1, R ↑ 2, R
↑ 3 represents a hydrogen atom, an aliphatic hydrocarbon group, an alicyclic hydrocarbon group or an aromatic hydrocarbon group similar to the above X and Y, and R
↑ 1, R ↑ 2 and R ↑ 3 may be the same or different. M represents an alkali metal or an alkaline earth metal. Also, the above X, Y, R ↑ 1, R ↑ 2, R ↑
3 may have another group such as a carboxyl group or a halogen atom. }
【0021】一般式(II)〜(IV)で示されるボロ
ン酸エステルの具体例としてはボロン酸ジメチルエステ
ル基、ボロン酸ジエチルエステル基、ボロン酸ジプロピ
ルエステル基、ボロン酸ジブチルエステル基、ボロン酸
ヘキシルエステル基、ボロン酸ジシクロヘキシルエステ
ル基、ボロン酸エチレングリコールエステル基、ボロン
酸1,2−プロパンジオールエステル基、ボロン酸トリ
メチレングリコールエステル基、ボロン酸1,3−ブタ
ンジオールエステル基、ボロン酸ネオペンチルグリコー
ルエステル基、ボロン酸カテコールエステル基、ボロン
酸グリセリンエステル基、ボロン酸トリメチロールエタ
ンエステル基等のボロン酸エステル基;ボロン酸無水物
基;ボロン酸のアルカリ金属塩、ボロン酸のアルカリ土
類金属塩等が挙げられる。Specific examples of the boronic acid ester represented by the general formulas (II) to (IV) include boronic acid dimethyl ester group, boronic acid diethyl ester group, boronic acid dipropyl ester group, boronic acid dibutyl ester group, and boronic acid. Hexyl ester group, boronic acid dicyclohexyl ester group, boronic acid ethylene glycol ester group, boronic acid 1,2-propanediol ester group, boronic acid trimethylene glycol ester group, boronic acid 1,3-butanediol ester group, boronic acid neo Boronic acid ester groups such as a pentyl glycol ester group, a boronic acid catechol ester group, a boronic acid glycerin ester group, and a boronic acid trimethylolethane ester group; a boronic acid anhydride group; an alkali metal salt of boronic acid, an alkaline earth acid of boronic acid. Examples include metal salts It is.
【0022】また本発明において、ボリン酸基とは、下
記式(V)で示されるものである。In the present invention, the borinic acid group is represented by the following formula (V).
【0023】[0023]
【化5】 Embedded image
【0024】また水の存在下でボリン酸基に転化しうる
ホウ素含有基としては、水の存在下で加水分解を受けて
上記式(V)で示されるボリン酸基に転化しうるホウ素
含有基であればどのようなものでもよいが、代表例とし
て下記一般式(VI)で示されるボリン酸エステル基、
下記一般式(VII)で示されるボリン酸無水物基、下
記一般式(VIII)で示されるボリン酸塩基が挙げら
れる。The boron-containing group which can be converted to a borinic acid group in the presence of water is a boron-containing group which can be converted to a borinic acid group represented by the above formula (V) by being hydrolyzed in the presence of water. Any of them may be used, but as a representative example, a borinic acid ester group represented by the following general formula (VI),
Examples thereof include a borinic acid anhydride group represented by the following general formula (VII) and a borinic acid group represented by the following general formula (VIII).
【0025】[0025]
【化6】 [Chemical 6]
【0026】[0026]
【化7】 Embedded image
【0027】[0027]
【化8】 Embedded image
【0028】{前記(V〜VIII)式中、Xは前記一
般式(II)のXと同じ意味であり、Zは前記のXと同
様の脂肪族炭化水素基、脂環式炭化水素基、芳香族炭化
水素基を表わす。またXとZは結合していてもよい。ま
たR↑1,R↑2,R↑3は前記の一般式(IV)のR
↑1,R↑2,R↑3と同じ意味である。またMは前記
一般式(IV)のMと同じ意味である。}{In the formulas (V to VIII), X has the same meaning as X in the general formula (II), Z is the same aliphatic hydrocarbon group, alicyclic hydrocarbon group as X described above, Represents an aromatic hydrocarbon group. Further, X and Z may be bonded. Further, R ↑ 1, R ↑ 2 and R ↑ 3 are R of the general formula (IV).
It has the same meaning as ↑ 1, R ↑ 2, and R ↑ 3. Further, M has the same meaning as M in the general formula (IV). }
【0029】一般式(V)〜(VIII)で示されるボ
リン酸エステル基の具体例としてはX,Z,R↑1,R
↑2,R↑3がメチル基、エチル基、プロピル基、ブチ
ル基、1−メチルプロピル基、ペンチル基、ヘキシル
基、フェニル基等の低級炭化水素基を示すものが挙げら
れる。代表例としてはメチルボリン酸基、メチルボリン
酸メチルエステル基、エチルボリン酸基、エチルボリン
酸メチルエステル基、メチルボリン酸エチルエステル
基、ブチルボリン酸メチルエステル基、3−メチルボリ
ン酸−2−ブチルボリン酸メチルエステル基が挙げられ
る。前記の官能基の中で特にボロン酸エチレングリコー
ルエステル基などのボロン酸エステル基がエチレン−ビ
ニルアルコール共重合体などのビニルアルコール共重合
体との相溶性の点から好ましい。なお前記の水の存在下
でボロン酸基またはボリン酸基に転化しうるホウ素含有
基とは、熱可塑性樹脂(A)を、水または水と有機溶媒
(トルエン、キシレン、アセトンなど)との混合液体、
またホウ酸水溶液と前記有機溶媒との混合液中で反応時
間10分〜2時間、反応温度室温〜150℃の条件下に
加水分解した場合にボロン酸基またはボリン酸基に転化
しうる基を意味する。Specific examples of the borinic acid ester group represented by the general formulas (V) to (VIII) include X, Z, R ↑ 1, R.
Examples include those in which ↑ 2 and R ↑ 3 represent a lower hydrocarbon group such as a methyl group, an ethyl group, a propyl group, a butyl group, a 1-methylpropyl group, a pentyl group, a hexyl group, and a phenyl group. Representative examples include a methylborinic acid group, a methylborinic acid methyl ester group, an ethylborinic acid group, an ethylborinic acid methyl ester group, a methylborinic acid ethyl ester group, a butylborinic acid methyl ester group, and a 3-methylborinic acid-2-butylborinic acid methyl ester group. To be Among the above functional groups, a boronic acid ester group such as a boronic acid ethylene glycol ester group is particularly preferable from the viewpoint of compatibility with a vinyl alcohol copolymer such as an ethylene-vinyl alcohol copolymer. The boron-containing group that can be converted into a boronic acid group or a borinic acid group in the presence of water is a thermoplastic resin (A), or a mixture of water or water and an organic solvent (toluene, xylene, acetone, etc.). liquid,
Further, a group capable of being converted into a boronic acid group or a borinic acid group when hydrolyzed in a mixed solution of an aqueous boric acid solution and the organic solvent under a reaction time of 10 minutes to 2 hours and a reaction temperature of room temperature to 150 ° C. means.
【0030】本発明によって得られた、ホウ素含有熱可
塑性樹脂は、エチレン−ビニルアルコール共重合体、ビ
ニルアルコール系重合体等の多価水酸基を含有する重合
体と高い反応性を有するため、これらの重合体の相溶化
剤、改質剤、接着剤等として有用である。また、ボロン
酸基等のホウ素含有基は水酸基やアミノ基等の官能基に
容易に化学的に変換可能であるため、これらの官能基を
有する高分子の合成中間体としても有用である。ホウ素
含有熱可塑性樹脂中のホウ素含有量は使用される用途に
より異なるが、0.00001〜1ミリ等量/g(me
q/g)が好ましく、さらに好ましくは0.0001〜
0.3meq/gである。The boron-containing thermoplastic resin obtained by the present invention has a high reactivity with a polymer containing a polyhydric hydroxyl group such as an ethylene-vinyl alcohol copolymer and a vinyl alcohol-based polymer. It is useful as a polymer compatibilizer, modifier, adhesive, and the like. Further, a boron-containing group such as a boronic acid group can be easily chemically converted into a functional group such as a hydroxyl group or an amino group, and thus is also useful as a synthetic intermediate for a polymer having such a functional group. The boron content in the boron-containing thermoplastic resin varies depending on the application used, but is 0.00001 to 1 milliequivalent / g (me
q / g) is preferable, and more preferably 0.0001 to
It is 0.3 meq / g.
【0031】以下実施例により、本発明をさらに詳しく
説明するが、本発明はこれらに制限されるものではな
い。ポリオレフィン中の二重結合量は重パラキシレンを
溶媒として用い、270MHz↑1H−NMRにより定
量した。実施例1および実施例2のポリオレフィン中の
ボロン酸基量は重キシレンを溶媒として用い、500M
Hz↑1H−NMRにより定量した。The present invention will be described in more detail with reference to the following examples, but the present invention is not limited thereto. The amount of double bonds in the polyolefin was determined by 270 MHz ↑ 1H-NMR using heavy paraxylene as a solvent. The amount of boronic acid groups in the polyolefins of Examples 1 and 2 was 500M using heavy xylene as a solvent.
It was quantified by Hz ↑ 1H-NMR.
【0032】実施例1 下記の樹脂フィーダー(押出機C1部分)、液体フィー
ダー1(押出機C3部分)、液体フィーダー2(押出機
C11部分)、ベント1(押出機C8部分)およびベン
ト2(押出機C14部分)を有する37φ二軸押出機に
エチレン−プロピレン−エチリデンノルボルネン共重合
体(A)(三井石油化学製「三井EPT」(商品名)3
120P、メルトインデックス(MI)4g/10分
(190℃、2160g荷重)、二重結合量0.4me
q/g}を4kg/hrの割合で供給後、ベント1およ
びベント2の内圧が約20mmHgにまで減圧した。こ
の後、液体フィーダー1からはトリエチルアミンボラン
(B)とホウ酸1,3−ブタンジオールエステル(D)
の重量比29:71混合液を0.6kg/hrの割合で
添加し、また液体フィーダー2からは0.4kg/hr
の割合でエチレングリコール(C)を添加した。これに
よりメルトインデックス(MI)3g/10分(190
℃、2160g荷重)、不純物がホウ素量に換算して1
5ppmの、側鎖にボロン酸エチレングリコールエステ
ル基を0.28meq/g有するエチレン−プロピレン
共重合体を得た。 押出機:TEM−35B(東芝機械製、同方向2軸押出機) D=37mm、L/D=53.8 液体フィーダー位置:C3およびC11 ベント位置 :C6およびC14 窒素置換 :フィーダー部に1L/分の割合で窒素ガスを流す スクリュー構成 :C5、C7およびC10にシールを配置 温度設定 C1〜C6 :200℃ C7〜C15 :250℃ ダイ :250℃ スクリュー回転数:150rpmExample 1 The following resin feeder (extruder C1 part), liquid feeder 1 (extruder C3 part), liquid feeder 2 (extruder C11 part), vent 1 (extruder C8 part) and vent 2 (extruder). Ethylene-propylene-ethylidene norbornene copolymer (A) (Mitsui Petrochemical's "Mitsui EPT" (trade name) 3 in a 37φ twin-screw extruder having a machine C14 part).
120P, melt index (MI) 4g / 10 minutes (190 ° C, 2160g load), double bond amount 0.4me
After supplying q / g} at a rate of 4 kg / hr, the internal pressure of the vent 1 and the vent 2 was reduced to about 20 mmHg. Then, from the liquid feeder 1, triethylamine borane (B) and boric acid 1,3-butanediol ester (D) were obtained.
A weight ratio of 29:71 was added at a rate of 0.6 kg / hr, and 0.4 kg / hr from the liquid feeder 2.
Ethylene glycol (C) was added at a ratio of. This gives a melt index (MI) of 3 g / 10 minutes (190
℃, 2160g load), impurities converted to the amount of boron 1
5 ppm of an ethylene-propylene copolymer having 0.28 meq / g of boronic acid ethylene glycol ester group on the side chain was obtained. Extruder: TEM-35B (Toshiba Machine, same-direction twin-screw extruder) D = 37 mm, L / D = 53.8 Liquid feeder position: C3 and C11 Vent position: C6 and C14 Nitrogen substitution: 1 L / at feeder part Flow nitrogen gas at a rate of: Screw configuration: seals are placed on C5, C7 and C10 Temperature setting C1 to C6: 200 ° C C7 to C15: 250 ° C Die: 250 ° C Screw rotation speed: 150 rpm
【0033】比較例1 液体フィーダー2へのエチレングリコール供給を行わな
い以外、実施例1と同様な条件で試験を行った結果、メ
ルトインデックス(MI)3g/10分(190℃、2
160g荷重)、不純物量がホウ素量に換算して280
ppmの、側鎖にボロン酸1,3−ブタンジオールエス
テル基を0.28meq/g有するエチレン−プロピレ
ン共重合体を得た。Comparative Example 1 A test was conducted under the same conditions as in Example 1 except that the ethylene glycol was not supplied to the liquid feeder 2. As a result, the melt index (MI) was 3 g / 10 minutes (190 ° C., 2 ° C.).
160 g load), the amount of impurities converted to the amount of boron is 280
An ethylene-propylene copolymer having 0.28 meq / g of boronic acid 1,3-butanediol ester group in the side chain was obtained in ppm.
【0034】実施例2 樹脂フィーダーより、超低密度ポリエチレン{住友化学
製「エクセレン」(商品名)EUL430、MI=4g
/10分、二重結合量0.047meq/g}を10k
g/hrの割合で添加し、液体フィーダー1からはトリ
エチルアミンボラン(B)とホウ酸1,3−ブタンジオ
ールエステル(D)の重量比29:71混合溶液を0.
4kg/hrの割合で添加を行う以外は実施例1と同様
の条件で試験を行った結果、メルトインデックス(M
I)4g/10分(190℃、2160g荷重)、不純
物がホウ素量に換算して5ppmの、末端にボロン酸エ
チレングリコールエステル基を0.04meq/g有す
る、超低密度ポリエチレンを得た。Example 2 From a resin feeder, ultra low density polyethylene {“Excellen” (trade name) EUL430 manufactured by Sumitomo Chemical Co., Ltd., MI = 4 g)
/ 10 minutes, double bond amount 0.047 meq / g} 10 k
The mixture was added at a ratio of g / hr, and from the liquid feeder 1, a mixed solution of triethylamine borane (B) and boric acid 1,3-butanediol ester (D) in a weight ratio of 29:71 was adjusted to 0.9.
As a result of performing the test under the same conditions as in Example 1 except that the addition was performed at a rate of 4 kg / hr, the melt index (M
I) 4 g / 10 min (190 ° C., 2160 g load), ultra low density polyethylene having 5 ppm of boronic acid ethylene glycol ester group at the end as an impurity in terms of boron amount of 5 ppm was obtained.
【0035】[0035]
【発明の効果】本発明によれば、エチレン−ビニルアル
コール系共重合体などの多価水酸基を有する重合体との
良好な相溶性を有するホウ素含有熱可塑性樹脂を押出機
により容易に製造できる。According to the present invention, a boron-containing thermoplastic resin having good compatibility with a polymer having a polyhydric hydroxyl group such as an ethylene-vinyl alcohol copolymer can be easily produced by an extruder.
Claims (2)
meq/g以上含有する熱可塑性樹脂(A)にホウ素−
水素結合を有するホウ素化合物(B)を反応させ、次い
で分子内に水酸基を1個または2個有し、かつ760m
mHg下で沸点300℃以下の化合物(C)を添加する
ことを特徴とするホウ素含有熱可塑性樹脂の製造法。1. The amount of double bonds in an extruder is 0.0001.
Boron is contained in the thermoplastic resin (A) containing meq / g or more.
React with a boron compound (B) having a hydrogen bond, then has one or two hydroxyl groups in the molecule, and 760 m
A process for producing a boron-containing thermoplastic resin, which comprises adding a compound (C) having a boiling point of 300 ° C. or lower under mHg.
meq/g以上含有する熱可塑性樹脂(A)にホウ素−
水素結合を有するホウ素化合物(B)およびホウ酸エス
テル(D)を反応させ、次いで分子内に水酸基を1個ま
たは2個有し、かつ760mmHg下で沸点300度以
下の化合物(C)を添加することを特徴とするホウ素含
有熱可塑性樹脂の製造法。2. The amount of double bonds is 0.0001 in the extruder.
Boron is contained in the thermoplastic resin (A) containing meq / g or more.
A boron compound (B) having a hydrogen bond is reacted with a borate ester (D), and then a compound (C) having one or two hydroxyl groups in the molecule and having a boiling point of 300 degrees or less under 760 mmHg is added. A method for producing a boron-containing thermoplastic resin, comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7437896A JP3598424B2 (en) | 1996-03-28 | 1996-03-28 | Method for producing boron-containing resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7437896A JP3598424B2 (en) | 1996-03-28 | 1996-03-28 | Method for producing boron-containing resin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09263608A true JPH09263608A (en) | 1997-10-07 |
JP3598424B2 JP3598424B2 (en) | 2004-12-08 |
Family
ID=13545456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7437896A Expired - Lifetime JP3598424B2 (en) | 1996-03-28 | 1996-03-28 | Method for producing boron-containing resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3598424B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000256915A (en) * | 1999-01-06 | 2000-09-19 | Kuraray Co Ltd | Fiber for hardening hydraulic material and cured product |
WO2002060961A1 (en) * | 2001-02-01 | 2002-08-08 | Kuraray Co., Ltd. | Block copolymer and thermoplastic resin composition |
JP2006176788A (en) * | 2001-02-01 | 2006-07-06 | Kuraray Co Ltd | Block copolymer and thermoplastic resin composition |
WO2016176023A1 (en) * | 2015-04-27 | 2016-11-03 | Dow Global Technologies Llc | Process for making a fabricated article from polyolefin |
-
1996
- 1996-03-28 JP JP7437896A patent/JP3598424B2/en not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000256915A (en) * | 1999-01-06 | 2000-09-19 | Kuraray Co Ltd | Fiber for hardening hydraulic material and cured product |
WO2002060961A1 (en) * | 2001-02-01 | 2002-08-08 | Kuraray Co., Ltd. | Block copolymer and thermoplastic resin composition |
US6949298B2 (en) | 2001-02-01 | 2005-09-27 | Kuraray Co., Ltd. | Block copolymer and thermoplastic resin composition |
JP2006176788A (en) * | 2001-02-01 | 2006-07-06 | Kuraray Co Ltd | Block copolymer and thermoplastic resin composition |
US7109272B2 (en) | 2001-02-01 | 2006-09-19 | Kuraray Co., Ltd. | Block copolymer and thermoplastic resin composition |
KR100830357B1 (en) * | 2001-02-01 | 2008-05-20 | 가부시키가이샤 구라레 | Block Copolymer and Thermoplastic Compositions |
WO2016176023A1 (en) * | 2015-04-27 | 2016-11-03 | Dow Global Technologies Llc | Process for making a fabricated article from polyolefin |
Also Published As
Publication number | Publication date |
---|---|
JP3598424B2 (en) | 2004-12-08 |
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