JPH09169871A - Surface-treated filler and resin composition using the same - Google Patents
Surface-treated filler and resin composition using the sameInfo
- Publication number
- JPH09169871A JPH09169871A JP33203595A JP33203595A JPH09169871A JP H09169871 A JPH09169871 A JP H09169871A JP 33203595 A JP33203595 A JP 33203595A JP 33203595 A JP33203595 A JP 33203595A JP H09169871 A JPH09169871 A JP H09169871A
- Authority
- JP
- Japan
- Prior art keywords
- filler
- resin
- group
- carbon atoms
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000945 filler Substances 0.000 title claims abstract description 32
- 239000011342 resin composition Substances 0.000 title claims description 8
- 239000000203 mixture Substances 0.000 claims abstract description 14
- ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 1H-imidazole silane Chemical compound [SiH4].N1C=NC=C1 ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 8
- 239000001257 hydrogen Substances 0.000 claims abstract description 8
- 150000002431 hydrogen Chemical class 0.000 claims abstract description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000003365 glass fiber Substances 0.000 claims abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 22
- 239000011347 resin Substances 0.000 abstract description 22
- 239000012767 functional filler Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 6
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000007849 furan resin Substances 0.000 description 2
- 238000007429 general method Methods 0.000 description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 2
- 239000001095 magnesium carbonate Substances 0.000 description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical group O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
Abstract
(57)【要約】
【課題】 樹脂の強度、耐久性向上のための機能性フ
ィラーの提供。
【解決手段】 下記一般式(1)、(2)あるいは
(3)で示されるイミダゾールシランまたはこれらの混
合物で処理されたフィラー(ただし、ガラス繊維は除
く)。
【化1】
(但し、R1は水素、ビニル基または炭素数が1〜5の
アルキル基、R2は水素または炭素数が1〜20のアル
キル基、R3、R4が炭素数が1〜3のアルキル基、nは
1〜3)(57) [Abstract] [PROBLEMS] To provide a functional filler for improving the strength and durability of a resin. A filler treated with an imidazole silane represented by the following general formula (1), (2) or (3) or a mixture thereof (excluding glass fiber). Embedded image (However, R 1 is hydrogen, a vinyl group or an alkyl group having 1 to 5 carbon atoms, R 2 is hydrogen or an alkyl group having 1 to 20 carbon atoms, and R 3 and R 4 are alkyl groups having 1 to 3 carbon atoms. Group, n is 1 to 3)
Description
【0001】[0001]
【発明の属する技術】本発明は電気・電子部品、接着
剤、塗料、複合材等の用途に用いられる樹脂組成物に関
し、特に力学的特性を向上させるための充填剤およびそ
れを用いた樹脂組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition used for electric / electronic parts, adhesives, paints, composite materials and the like, and particularly a filler for improving mechanical properties and a resin composition using the same. It is about things.
【0002】[0002]
【従来の技術】従来から充填剤はコスト低減、軽量化、
力学的強度向上を目的に、反応性のないものが添加され
てきた。しかし、このような不活性な充填剤では耐久性
がないため、耐久性の改善を目的に、活性なフィラーが
用いられている。化学的に表面を活性化させる方法とし
ては、アミノ基、エポキシ基、メルカプト基等の官能基
を有する、シラン系あるいはチタン系、化合物を用いた
方法が一般的である。2. Description of the Related Art Conventionally, fillers have been reduced in cost and weight,
Non-reactive substances have been added for the purpose of improving mechanical strength. However, since such an inert filler has no durability, an active filler is used for the purpose of improving durability. As a method for chemically activating the surface, a method using a silane-based or titanium-based compound having a functional group such as an amino group, an epoxy group, and a mercapto group is generally used.
【0003】[0003]
【発明が解決しようとする課題】しかし、従来から知ら
れているカップリング剤で処理されたフィラーでは、樹
脂の強度や耐久性が向上するものの、その効果が充分で
はない。However, the filler treated with the conventionally known coupling agent improves the strength and durability of the resin, but its effect is not sufficient.
【0004】本発明の目的は、樹脂の強度、耐久性に優
れた樹脂組成物のための、機能性フィラーを提供するこ
とにある。An object of the present invention is to provide a functional filler for a resin composition having excellent resin strength and durability.
【0005】[0005]
【課題を解決するための手段】本発明は下記一般式
(1)、(2)あるいは(3)で示される構造のイミダ
ゾールシランまたはこれらの混合物により表面を改質す
る事により得られたフィラーを用いることにより、強
度、耐久性に優れた樹脂組成物が得られることを見出
し、本発明に至った。The present invention provides a filler obtained by modifying the surface with an imidazolesilane having a structure represented by the following general formula (1), (2) or (3) or a mixture thereof. It was found that a resin composition excellent in strength and durability can be obtained by using it, and the present invention has been completed.
【0006】即ち、本発明は、下記一般式(1)、
(2)あるいは(3)で示されるイミダゾールシランま
たはこれらの混合物を処理して得られるフィラーおよび
このフィラーを用いた樹脂組成物を提供するものであ
る。That is, the present invention provides the following general formula (1):
The present invention provides a filler obtained by treating the imidazole silane represented by (2) or (3) or a mixture thereof, and a resin composition using the filler.
【0007】[0007]
【化2】 Embedded image
【0008】本発明に用いるフィラーの使用量は、特に
制限はないが、樹脂100重量部に対して通常10〜5
00重量部、好ましくは50〜300重量部である。1
0重量部未満では目的とする強度が発現されず、また5
00重量部を超えた場合樹脂強度が低下する。The amount of the filler used in the present invention is not particularly limited, but is usually 10 to 5 relative to 100 parts by weight of the resin.
The amount is 00 parts by weight, preferably 50 to 300 parts by weight. 1
If the amount is less than 0 parts by weight, the desired strength will not be exhibited, and 5
If it exceeds 100 parts by weight, the resin strength will decrease.
【0009】本発明に使用する樹脂は特に制限はなく、
熱硬化性樹脂、熱可塑性樹脂等有機材料であれば使用す
ることができる。The resin used in the present invention is not particularly limited,
Any organic material such as thermosetting resin or thermoplastic resin can be used.
【0010】熱硬化性樹脂としては、フェノール樹脂、
アミン樹脂、フラン樹脂、エポキシ樹脂、珪素樹脂、ア
クリル樹脂およびポリイミド樹脂が挙げられる。As the thermosetting resin, phenol resin,
Examples thereof include amine resin, furan resin, epoxy resin, silicon resin, acrylic resin and polyimide resin.
【0011】フェノール樹脂としては、ノボラックタイ
プ、レゾールタイプ、ポリ−p−ビニルフェノール樹脂
などが挙げられる。Examples of the phenol resin include novolac type, resol type and poly-p-vinylphenol resins.
【0012】アミン樹脂としては、ユリア樹脂、メラミ
ン樹脂、グアナミン樹脂などが挙げられる。Examples of the amine resin include urea resin, melamine resin and guanamine resin.
【0013】フラン樹脂としては、フルフリルアルコー
ル樹脂、フルフリルアルコール・フルフラール共縮合樹
脂、フルフラール・フェノール共縮合樹脂、フルフラー
ル・ケトン共縮合樹脂などが挙げられる。Furan resins include furfuryl alcohol resins, furfuryl alcohol / furfural co-condensation resins, furfural / phenol co-condensation resins, furfural / ketone co-condensation resins and the like.
【0014】エポキシ樹脂としては、ビスフェノールA
ジグリシジルエーテル、ビスフェノールFジグリシジル
エーテル、ポリアルキレンオキサイドジグリシジルエー
テルや側鎖または主鎖にゴム、ウレタン、ポリエーテ
ル、ポリエステル等の可撓性樹脂で変性されたもの等が
挙げられ、単独または2種類以上混合して使用すること
ができる。As the epoxy resin, bisphenol A
Examples thereof include diglycidyl ether, bisphenol F diglycidyl ether, polyalkylene oxide diglycidyl ether, and those whose side chain or main chain is modified with a flexible resin such as rubber, urethane, polyether, polyester, etc., alone or 2 A mixture of more than one type can be used.
【0015】熱可塑性樹脂としては、ナイロン、ポリエ
チレン、ポリプロピレン、ポリ塩化ビニル、ポリスチレ
ン、ポリカーボネート、ポリウレタンABSおよびアク
リル樹脂などが挙げられる。Examples of the thermoplastic resin include nylon, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polycarbonate, polyurethane ABS and acrylic resin.
【0016】これらの樹脂は、単独または2種類以上混
合して使用することができる。These resins can be used alone or in admixture of two or more.
【0017】また樹脂の種類により硬化剤、重合開始
剤、促進剤が必要である。さらに、必要に応じ難燃剤、
低応力剤、酸化防止剤を配合することができる。Further, a curing agent, a polymerization initiator and an accelerator are required depending on the type of resin. In addition, if necessary flame retardant,
A low stress agent and an antioxidant can be added.
【0018】硬化剤としてはアミン系、酸無水物系、フ
ェノール樹脂系などの硬化剤が挙げられる。Examples of the curing agent include amine type, acid anhydride type and phenol resin type curing agents.
【0019】重合開始剤としてはジアゾ系、過酸化物系
の熱重合開始剤や、アセトフェノン系、ベンゾイン系の
光重合開始剤などが挙げられる。Examples of the polymerization initiator include diazo type and peroxide type thermal polymerization initiators, and acetophenone type and benzoin type photopolymerization initiators.
【0020】促進剤としては3級アミン、有機金属塩、
芳香族ホスフィン、フェノール類などが挙げられる。As the accelerator, a tertiary amine, an organic metal salt,
Examples include aromatic phosphines and phenols.
【0021】難燃剤としては有機難燃剤であるりん系、
ハロゲン系、無機難燃剤である硼素系などが挙げられ
る。As the flame retardant, an organic flame retardant such as phosphorus,
Examples thereof include halogen-based and boron-based inorganic flame retardants.
【0022】酸化防止剤としてはフェノール系、りん
系、硫黄系などが挙げられる。Examples of the antioxidant include phenol type, phosphorus type and sulfur type.
【0023】本発明に用いられるフィラーの形状として
は、球状、針状、板状が挙げられる。フィラーの種類に
は制限がなく、シリカ、珪藻土、アルミナ、酸化亜鉛、
酸化鉄、酸化マグネシウム、酸化錫、酸化チタン等の酸
化物、水酸化マグネシウム、水酸化アルミニウム、塩基
性炭酸マグネシウム等の水酸化物、炭酸カルシウム、炭
酸亜鉛、ハイドロタルサイト、炭酸マグネシウム等の炭
酸塩、硫酸バリウム、石膏等の硫酸塩、珪酸カルシウ
ム、タルク、硝子ビーズ、セリサイト活性白土、ベント
ナイト等の珪酸塩、窒化アルミ、窒化珪素等の窒化物、
グラファイト、木炭粉末、カーボンブラック等の炭素類
および各種金属が挙げられる。The shape of the filler used in the present invention may be spherical, needle-like or plate-like. There is no limit to the type of filler, and silica, diatomaceous earth, alumina, zinc oxide,
Oxides such as iron oxide, magnesium oxide, tin oxide and titanium oxide, hydroxides such as magnesium hydroxide, aluminum hydroxide and basic magnesium carbonate, carbonates such as calcium carbonate, zinc carbonate, hydrotalcite and magnesium carbonate. , Barium sulfate, sulfate such as gypsum, calcium silicate, talc, glass beads, sericite activated clay, silicate such as bentonite, aluminum nitride, nitride such as silicon nitride,
Carbons such as graphite, charcoal powder, carbon black, and various metals can be mentioned.
【0024】なお、本発明において、ガラス繊維はフィ
ラーに含まれないものとする。In the present invention, glass fiber is not included in the filler.
【0025】本発明に用いられる処理剤として、下記一
般式(1)、(2)あるいは(3)で示されるイミダゾ
ールシランまたはこれらの混合物が用いられる。As the treating agent used in the present invention, imidazole silane represented by the following general formula (1), (2) or (3) or a mixture thereof is used.
【0026】[0026]
【化3】 Embedded image
【0027】(但し、R1は水素、ビニル基または炭素
数が1〜5のアルキル基、R2は水素または炭素数が1
〜20のアルキル基、R3、R4は炭素数が1〜3のアル
キル基、nは1〜3) 上記式(1)〜(3)中のR1〜R4は各規定されたとお
りの意義を有するが、特に合成の容易性からR1は水
素、メチル、エチル、ウンデシル、ヘプタデシルが好ま
しく、R2は水素、メチル、ビニルが好ましく、また
R3、R4はメチル、エチルが好ましい。(However, R 1 is hydrogen, a vinyl group or an alkyl group having 1 to 5 carbon atoms, and R 2 is hydrogen or 1 carbon atom.
To 20 alkyl groups, R 3 and R 4 are alkyl groups having 1 to 3 carbon atoms, and n is 1 to 3) R 1 to R 4 in the above formulas (1) to (3) are as specified. However, R 1 is preferably hydrogen, methyl, ethyl, undecyl or heptadecyl, R 2 is preferably hydrogen, methyl or vinyl, and R 3 or R 4 is preferably methyl or ethyl in view of ease of synthesis. .
【0028】これらの合成法に関しては特開平5−18
6479号公報に開示されている。この合成法によって
上記式(1)〜(3)で表されるイミダゾールシランの
混合物として得られる場合にも、特に分離する必要もな
く混合物の形態で使用することが有利である。Regarding the synthesis method of these, Japanese Patent Laid-Open No. 5-18
No. 6479. Even when it is obtained as a mixture of the imidazole silanes represented by the above formulas (1) to (3) by this synthetic method, it is advantageous to use it in the form of a mixture without any need for separation.
【0029】本発明のイミダゾールシランの処理量(被
覆量)は特に制限はないが、フィラー100重量部に対
して通常0.001〜10重量部、好ましくは0.00
2〜5重量部である。0.001重量部未満では期待す
る効果が発現せず、また10重量部を超えると硬化樹脂
が脆くなると共に吸水性が高まり耐久性が低下する。本
発明のフィラーは前述のイミダゾールシランで表面を処
理することが重要であるが、その他表面処理剤で処理し
たフィラーを併用することもできる。その他の表面処理
剤としては、シラン系カップリング剤、チタネート系カ
ップリング剤、アルミネート系カップリング剤などが挙
げられる。The treatment amount (coating amount) of the imidazole silane of the present invention is not particularly limited, but is usually 0.001 to 10 parts by weight, preferably 0.00, based on 100 parts by weight of the filler.
2 to 5 parts by weight. If it is less than 0.001 part by weight, the expected effect is not exhibited, and if it exceeds 10 parts by weight, the cured resin becomes brittle and the water absorbency increases, and the durability decreases. It is important that the surface of the filler of the present invention is treated with the above-mentioned imidazole silane, but other fillers treated with a surface treating agent can be used together. Examples of other surface treatment agents include silane coupling agents, titanate coupling agents, aluminate coupling agents, and the like.
【0030】イミダゾールシランのフィラーへの処理方
法としては、一定のpHの水−溶媒に注入溶解させ、加
水分解させた後にフィラーに反応させる水溶液法、少量
の水を含む有機溶媒に溶解し反応させる有機溶媒法およ
び激しく撹拌したフィラーにイミダゾールシランの水溶
液または有機溶液を吹きかけるスプレー法が挙げられ
る。As the method for treating the imidazole silane with the filler, an aqueous solution method of injecting and dissolving in a water-solvent having a constant pH, hydrolyzing and then reacting with the filler, and dissolving and reacting in an organic solvent containing a small amount of water are reacted. An organic solvent method and a spray method in which an aqueous solution or an organic solution of imidazole silane is sprayed on a vigorously stirred filler are included.
【0031】本発明の樹脂組成物を成形材料として調製
する場合の一般的方法は、前述の樹脂、イミダゾールシ
ランで処理したフィラー、場合により硬化剤等、他の成
分を配合し、ミキサー等により充分均一に混合した後、
更に加熱下ニーダ等により溶融混合を行い、冷却し成形
材料とすることができる。The general method for preparing the resin composition of the present invention as a molding material is to add the above-mentioned resin, a filler treated with imidazolesilane, and optionally other components such as a curing agent, and mix thoroughly with a mixer or the like. After mixing evenly,
Further, it can be melt-mixed under heating with a kneader or the like, and cooled to obtain a molding material.
【0032】成形加工の一般的な方法としては、注型、
トランスファー成形、射出成形、圧縮成形などが知られ
ている。加熱による硬化は、150℃以上に加熱するこ
とが望ましい。As a general method of molding, casting,
Transfer molding, injection molding, compression molding and the like are known. Curing by heating is preferably performed by heating to 150 ° C. or higher.
【0033】[0033]
【発明の実施の形態】以下に、実施例を挙げて本発明を
具体的に説明するが、本発明は実施例により限定される
ものではない。なお、例中の「部」および「%」とは
「重量部」および「重量%」を意味する。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be specifically described below with reference to Examples, but the present invention is not limited to the Examples. The "parts" and "%" in the examples mean "parts by weight" and "% by weight".
【0034】製造例1 水、エタノール1:1混合物100部にイミダゾールシ
ラン(注1)2部を加え、フィラーとの反応性を高める
べく、塩酸を加え酸性(pH約5)とすることにより、
カップリング剤のアルコキシシリル基をヒドロキシシリ
ル基とした後、フィラー(注2)100部を加えた。1
昼夜撹拌し、溶媒を瀘過し、数回エタノールで洗浄した
後、減圧下100℃で1時間乾燥し、イミダゾールシラ
ン処理フィラー(IS−1)を得た。Production Example 1 2 parts of imidazolesilane (Note 1) was added to 100 parts of a 1: 1 mixture of water and ethanol, and hydrochloric acid was added to make it acidic (pH about 5) in order to enhance the reactivity with the filler.
After making the alkoxysilyl group of the coupling agent a hydroxysilyl group, 100 parts of a filler (Note 2) was added. 1
The mixture was stirred for 24 hours, filtered with a solvent, washed with ethanol several times, and dried under reduced pressure at 100 ° C. for 1 hour to obtain an imidazolesilane-treated filler (IS-1).
【0035】(注1)一般式(1)〜(3)のR1=R2
=H;R3=CH3;n=3であるイミダゾールシラン
(各式の混合組成比(1):(2):(3)=45:2
2:33の混合物) (注2)シリカ(品名:ST−7;平均粒径:30μ
m;(株)龍森社製) 製造例2 製造例1に使用したフィラー(ST−7)100部、同
イミダゾールシラン0.2部およびエタノール100部
を混合し、60℃で1時間撹拌後、揮発成分を留去し
た。続いて減圧した100℃で1時間乾燥し、イミダゾ
ールシラン処理フィラー(IS−2)を得た。(Note 1) R 1 = R 2 in the general formulas (1) to (3)
= H; R 3 = CH 3 ; n = 3 imidazole silane (mixed composition ratio of each formula (1) :( 2) :( 3) = 45: 2
2:33 mixture) (Note 2) Silica (product name: ST-7; average particle size: 30 μ)
m; manufactured by Tatsumori Co., Ltd. Production Example 2 100 parts of the filler (ST-7) used in Production Example 1, 0.2 part of the same imidazole silane and 100 parts of ethanol were mixed, and after stirring at 60 ° C. for 1 hour. The volatile components were distilled off. Subsequently, it was dried at 100 ° C. under reduced pressure for 1 hour to obtain an imidazolesilane-treated filler (IS-2).
【0036】製造例3 製造例1においてイミダゾールシランに代えてエポキシ
シラン(注3)を使用した以外は製造例1と同様に処理
し、エポキシシラン処理フィラー(ES−1)を得た。Production Example 3 An epoxysilane-treated filler (ES-1) was obtained in the same manner as in Production Example 1 except that epoxysilane (Note 3) was used in place of imidazolesilane.
【0037】(注3)γ−グリシドキシプロピルトリメ
トキシシラン(KBM403;信越化学工業(株)製) 製造例4 製造例2において、イミダゾールシランに代えてエポキ
シシラン(注3)を使用した以外は製造例2と同様に処
理し、エポキシシラン処理フィラー(ES−2)を得
た。(Note 3) γ-glycidoxypropyltrimethoxysilane (KBM403; manufactured by Shin-Etsu Chemical Co., Ltd.) Production Example 4 In Production Example 2, epoxy silane (Note 3) was used instead of imidazole silane. Was treated in the same manner as in Production Example 2 to obtain an epoxysilane-treated filler (ES-2).
【0038】実施例1〜4、比較例1〜7 エポキシ樹脂(注4)100部に表1に示した各成分を
表1に示した量比で使用し、均一となるよう混合した。
この混合物を長さ10cm*幅3cm*厚み0.4cm
の型に流し込み、1次硬化100℃×1時間、2次硬化
150℃×1時間とし、成形体を作製した。Examples 1 to 4 and Comparative Examples 1 to 7 100 parts of the epoxy resin (Note 4) was used by mixing the components shown in Table 1 in the ratios shown in Table 1 so as to be uniform.
This mixture is 10 cm long * 3 cm wide * 0.4 cm thick
It was poured into a mold of (1) and the primary curing was performed at 100 ° C. for 1 hour and the secondary curing was performed at 150 ° C. for 1 hour to prepare a molded body.
【0039】(注4)ビスフェノールA型エポキシ樹脂
(品名:エピコート828;油化シェル)エポキシ
(株)製、エポキシ等量:190)(Note 4) Bisphenol A type epoxy resin (Product name: Epicoat 828; Yuka Shell) Epoxy Co., Ltd., epoxy equivalent: 190)
【0040】[0040]
【表1】 [Table 1]
【0041】1)ジシアンジアミド(品名:AH−15
4;味の素(株)製) 2)フェノール樹脂(品名:EK−170;OH基当
量:361g/eq;油化シェルエポキシ(株)製) 3)ジアミノジフェニルメタン(関東化学(株)製) 4)イソフォロンジアミン(東京化成(株)製) 5)2エチル4メチルイミダゾール(品名:2E4M
Z;四国化成工業(株)製) 6)メチルテトラヒドロ無水フタル酸(品名:HN−2
200;日立化成(株)製) 7)長さ80mm、厚さ4mm、幅10mmのサイズに
加工後、JIS K 6911に準じ、曲げ強さを測定
した。1) Dicyandiamide (Product name: AH-15
4; Ajinomoto Co., Inc. 2) Phenolic resin (Product name: EK-170; OH group equivalent: 361 g / eq; Yuka Shell Epoxy Co., Ltd.) 3) Diaminodiphenylmethane (Kanto Chemical Co., Inc.) 4) Isophorone diamine (manufactured by Tokyo Chemical Industry Co., Ltd.) 5) 2 ethyl 4 methyl imidazole (Product name: 2E4M
Z; Shikoku Kasei Co., Ltd. 6) Methyltetrahydrophthalic anhydride (Product name: HN-2)
200; manufactured by Hitachi Chemical Co., Ltd.) 7) After processing into a size having a length of 80 mm, a thickness of 4 mm and a width of 10 mm, the bending strength was measured according to JIS K 6911.
【0042】8)得られた試験片を90℃に加熱した水
に17hr浸漬した後、JIS K6911に準じ測定
した。8) The obtained test piece was immersed in water heated to 90 ° C. for 17 hours, and then measured according to JIS K6911.
【0043】[0043]
【発明の効果】以上のように、本発明のイミダゾールシ
ランで処理したフィラーを用いた場合、フィラー表面上
に存在するイミダゾール基が、硬化触媒及び反応起点と
して作用することにより、エポキシ基と比べ、有機マト
リックスとの間に化学結合が生じやすくなること、また
相対的に高い極性基による誘起効果を含む物理的吸着の
ため、初期特性の向上がみられるばかりでなく、耐久性
も向上しイミダゾールシランが効果的に機能し、高い曲
げ強度を示した。As described above, when the filler treated with the imidazole silane of the present invention is used, the imidazole group present on the filler surface acts as a curing catalyst and a reaction starting point, and thus, compared with the epoxy group, Due to the fact that a chemical bond is easily formed with the organic matrix and the physical adsorption including the inducing effect by the relatively high polar group, not only the initial characteristics are improved, but also the durability is improved and the imidazolesilane is improved. Worked effectively and showed high bending strength.
【0044】従って密着性が必要な接着剤、封止材、塗
料、積層材、成形材等の用途として有用である。Therefore, it is useful as an adhesive, a sealing material, a coating material, a laminated material, a molding material and the like which require close adhesion.
Claims (2)
(3)で示されるイミダゾールシランまたはこれらの混
合物で処理されたフィラー(ただし、ガラス繊維は除
く)。 【化1】 (但し、R1は水素、ビニル基または炭素数が1〜5の
アルキル基、R2は水素または炭素数が1〜20のアル
キル基、R3、R4が炭素数が1〜3のアルキル基、nは
1〜3)1. A filler treated with an imidazole silane represented by the following general formula (1), (2) or (3) or a mixture thereof (excluding glass fiber). Embedded image (However, R 1 is hydrogen, a vinyl group or an alkyl group having 1 to 5 carbon atoms, R 2 is hydrogen or an alkyl group having 1 to 20 carbon atoms, and R 3 and R 4 are alkyl groups having 1 to 3 carbon atoms. Group, n is 1 to 3)
脂組成物。2. A resin composition containing the filler treated in claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33203595A JP3847360B2 (en) | 1995-12-20 | 1995-12-20 | Surface-treated filler and resin composition using the same |
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JP33203595A JP3847360B2 (en) | 1995-12-20 | 1995-12-20 | Surface-treated filler and resin composition using the same |
Publications (2)
Publication Number | Publication Date |
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JPH09169871A true JPH09169871A (en) | 1997-06-30 |
JP3847360B2 JP3847360B2 (en) | 2006-11-22 |
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JP33203595A Expired - Lifetime JP3847360B2 (en) | 1995-12-20 | 1995-12-20 | Surface-treated filler and resin composition using the same |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004244635A (en) * | 2003-02-13 | 2004-09-02 | Bayer Inc | Elastomer compound containing silica filler |
WO2006095590A1 (en) * | 2005-03-10 | 2006-09-14 | Nippon Mining & Metals Co., Ltd. | Filler for resin, resin base material containing same and electronic component substrate material |
WO2007032424A1 (en) * | 2005-09-15 | 2007-03-22 | Sekisui Chemical Co., Ltd. | Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate |
JP2008037926A (en) * | 2006-08-02 | 2008-02-21 | Asahi Glass Co Ltd | Curable composition |
JP2008239900A (en) * | 2007-03-28 | 2008-10-09 | Furukawa Electric Co Ltd:The | Resin composition, resin molding made from the resin composition, and insulated electric wire covered with the resin composition |
JP2010280892A (en) * | 2005-03-30 | 2010-12-16 | Yokohama Rubber Co Ltd:The | Thermosetting resin composition, and molding material and potting material using the same |
JPWO2010024391A1 (en) * | 2008-09-01 | 2012-01-26 | 積水化学工業株式会社 | Laminate and method for producing laminate |
-
1995
- 1995-12-20 JP JP33203595A patent/JP3847360B2/en not_active Expired - Lifetime
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004244635A (en) * | 2003-02-13 | 2004-09-02 | Bayer Inc | Elastomer compound containing silica filler |
WO2006095590A1 (en) * | 2005-03-10 | 2006-09-14 | Nippon Mining & Metals Co., Ltd. | Filler for resin, resin base material containing same and electronic component substrate material |
JP5072094B2 (en) * | 2005-03-10 | 2012-11-14 | Jx日鉱日石金属株式会社 | Resin filler, resin base material containing the same, and electronic component base material |
JP2010280892A (en) * | 2005-03-30 | 2010-12-16 | Yokohama Rubber Co Ltd:The | Thermosetting resin composition, and molding material and potting material using the same |
WO2007032424A1 (en) * | 2005-09-15 | 2007-03-22 | Sekisui Chemical Co., Ltd. | Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate |
GB2444010A (en) * | 2005-09-15 | 2008-05-21 | Sekisui Chemical Co Ltd | Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate |
DE112006002475T5 (en) | 2005-09-15 | 2008-07-24 | Sekisui Chemical Co., Ltd. | Resin composition, sheet-formed body, prepreg, cured body, laminate and multi-layer laminate |
GB2444010B (en) * | 2005-09-15 | 2010-12-08 | Sekisui Chemical Co Ltd | Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate |
JP2008037926A (en) * | 2006-08-02 | 2008-02-21 | Asahi Glass Co Ltd | Curable composition |
JP2008239900A (en) * | 2007-03-28 | 2008-10-09 | Furukawa Electric Co Ltd:The | Resin composition, resin molding made from the resin composition, and insulated electric wire covered with the resin composition |
JPWO2010024391A1 (en) * | 2008-09-01 | 2012-01-26 | 積水化学工業株式会社 | Laminate and method for producing laminate |
JP4911795B2 (en) * | 2008-09-01 | 2012-04-04 | 積水化学工業株式会社 | Manufacturing method of laminate |
Also Published As
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