JPH09139650A - Crystal oscillator and method of manufacturing the same - Google Patents
Crystal oscillator and method of manufacturing the sameInfo
- Publication number
- JPH09139650A JPH09139650A JP32234295A JP32234295A JPH09139650A JP H09139650 A JPH09139650 A JP H09139650A JP 32234295 A JP32234295 A JP 32234295A JP 32234295 A JP32234295 A JP 32234295A JP H09139650 A JPH09139650 A JP H09139650A
- Authority
- JP
- Japan
- Prior art keywords
- crystal
- electrode
- etching
- exciting electrode
- crystal element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 65
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000005530 etching Methods 0.000 claims abstract description 20
- 230000005284 excitation Effects 0.000 claims description 18
- 238000000605 extraction Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 abstract description 3
- 238000000151 deposition Methods 0.000 abstract description 2
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005498 polishing Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、良好なCI値を得るこ
とができる水晶振動子及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crystal unit capable of obtaining a good CI value and a manufacturing method thereof.
【0002】[0002]
【従来の技術】近時、種々の電子機器の周波数、時間等
の基準として圧電振動子が用いられている。特に圧電体
として水晶を用いた水晶振動子は、電気的な特性も良好
で安価なために多くの電子機器に多用されている。この
ような水晶振動子で、特に形状の小型のものでは水晶片
を短冊形に成形したものが用いられ、たとえば長さ5〜
8mm、幅2mm程度のものがある。2. Description of the Related Art Recently, piezoelectric vibrators have been used as a reference for frequency, time, etc. of various electronic devices. In particular, a crystal resonator using crystal as a piezoelectric body is widely used in many electronic devices because it has good electric characteristics and is inexpensive. In such a crystal unit, a crystal unit formed into a rectangular shape is used as a crystal unit having a small size, for example, a length of 5 to 5
Some have a width of about 8 mm and a width of about 2 mm.
【0003】しかしながら、このように水晶片の形状を
小さくすると、水晶振動子の電気的特性を代表するクリ
スタル・インピーダンス(以下CIという)が高くなっ
て良好な振動特性を得られなくなり、場合によっては使
用できなくなることもあった。このためCI値を低くす
る手段として、水晶片の板面を曲面に成形するベベル加
工が行われている。However, if the shape of the crystal piece is reduced in this way, the crystal impedance (hereinafter referred to as CI), which is representative of the electrical characteristics of the crystal resonator, becomes high, and good vibration characteristics cannot be obtained. It was sometimes impossible to use it. For this reason, as a means for lowering the CI value, beveling for shaping the plate surface of the crystal blank into a curved surface is performed.
【0004】ベベル加工の一例としては、多数の水晶片
を研磨材とともに長筒状の容器に収納して、容器を軸方
向に交互に傾けるようにしたものがある。そして水晶片
を研磨材とともに容器の端部から端部へ移動させること
によって水晶片の板面を容器の内壁にならった曲面に研
磨加工するようにしている。As an example of bevel processing, there is a method in which a large number of crystal pieces are housed together with an abrasive in a long cylindrical container and the containers are alternately inclined in the axial direction. By moving the crystal piece together with the polishing material from one end of the container to the other end, the plate surface of the crystal piece is polished into a curved surface that follows the inner wall of the container.
【0005】しかしながらベベル加工は、加工に長時間
を要し、加工後の水晶片の表面には加工歪層が残留する
ために面粗さも大きい。しかも加工量、加工精度の均一
化も困難なために特性のバラツキも大きく、加工中に割
れ、欠け等によって使用できなくなる水晶片もあった。
このため水晶片の加工工程における加工費の上昇をきた
し、CI値もそれほど低くできない問題があった。However, the bevel processing requires a long time for processing, and the processed strained layer remains on the surface of the crystal piece after processing, so that the surface roughness is large. Moreover, since it is difficult to make the processing amount and processing accuracy uniform, there are large variations in characteristics, and some crystal pieces cannot be used due to cracks, chips, etc. during processing.
For this reason, there has been a problem that the processing cost in the process of processing the crystal piece increases and the CI value cannot be lowered so much.
【0006】[0006]
【発明が解決しようとする課題】本発明は上記の事情に
鑑みてなされたもので、加工費の低減を図ることがで
き、しかも良好なCI特性を得られ、特に大量生産に適
し、しかも個々の水晶振動子の特性のバラツキも少ない
水晶振動子及びその製造方法を提供することを目的とす
るものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is possible to reduce the processing cost, obtain good CI characteristics, and particularly suitable for mass production. It is an object of the present invention to provide a crystal unit having less variation in characteristics of the crystal unit and a method for manufacturing the same.
【0007】[0007]
【課題を解決するための手段】本発明の第1の発明は、
水晶片の電極の非形成部位をエッチングして段差を形成
したことを特徴とする水晶振動子であり、第2の発明は
水晶片の板面の中央部に励振電極を形成する工程と、水
晶片をエッチングして電極の非形成部位に段差を形成す
る工程と、励振電極を水晶片の板面の端部へ導出する導
出電極を形成する工程とを具備する水晶振動子の製造方
法である。Means for Solving the Problems A first invention of the present invention is:
A second aspect of the present invention is a crystal resonator characterized in that a step is formed by etching a portion of the crystal piece where the electrode is not formed. A second aspect of the present invention is a step of forming an excitation electrode in a central portion of a plate surface of the crystal piece A method of manufacturing a crystal resonator, comprising: a step of etching a piece to form a step in a portion where an electrode is not formed; .
【0008】[0008]
【実施例】以下、本発明の一実施例の水晶振動子を、図
1に示す平面図、図2に示す厚みを誇張した図1のA−
A線矢示断面図、図3に示す流れ図を参照して詳細に説
明する。図中1は水晶片で、人工水晶の結晶を結晶軸に
対して所定の角度に切断して板状に切り出し矩形に成形
したものである。そして水晶片の両側板面の各中央部に
対面するように円形に励振電極2を蒸着している(図3
a)。なお励振電極2を蒸着する際に、この励振電極2
を水晶片1の周縁部へ導出する引き出し電極も形成して
おく。1 is a plan view of a crystal resonator according to an embodiment of the present invention, and FIG. 2 is an exaggerated thickness shown in FIG.
This will be described in detail with reference to the sectional view taken along the line A and the flow chart shown in FIG. In the figure, reference numeral 1 denotes a crystal piece, which is obtained by cutting an artificial crystal crystal at a predetermined angle with respect to a crystal axis, cutting it into a plate shape, and molding it into a rectangular shape. The excitation electrodes 2 are vapor-deposited in a circular shape so as to face the central portions of both side plate surfaces of the crystal blank (see FIG. 3).
a). When depositing the excitation electrode 2, the excitation electrode 2
An extraction electrode for leading out to the peripheral portion of the crystal piece 1 is also formed.
【0009】そして、励振電極2自体をマスクとして、
水晶片1をエッチング液に浸漬して励振電極2の非形成
部位をエッチングして段差3を形成する(図3b)。こ
の際に引き出し電極の形成部位にも段差を生じるが、一
般に水晶片の全体の面積に比してその割合は小さい。水
晶の結晶をエッチングするために用いるエッチング液と
しては、たとえばフッ化アンモニウム溶液を用いればよ
い。Then, using the excitation electrode 2 itself as a mask,
The quartz piece 1 is dipped in an etching solution to etch a portion where the excitation electrode 2 is not formed to form a step 3 (FIG. 3b). At this time, a step is also formed in the portion where the extraction electrode is formed, but the ratio is generally smaller than the entire area of the crystal piece. As an etching liquid used for etching the crystal of quartz, for example, an ammonium fluoride solution may be used.
【0010】そして図1に斜線で示す水晶片1の励振電
極2の非形成部位4を、図2において破線で囲んで示す
ようにエッチングして除去する。このようなエッチング
を行うことによって切断・研磨等の加工工程において水
晶片の表面に生じた微細な割れ、欠け、加工歪等の残留
する部位を除去することができる。Then, a non-formation portion 4 of the excitation electrode 2 of the crystal blank 1 shown by hatching in FIG. 1 is removed by etching as shown by being surrounded by a broken line in FIG. By performing such etching, it is possible to remove the remaining portions such as fine cracks, chips, processing strains and the like that have occurred on the surface of the crystal piece in the processing steps such as cutting and polishing.
【0011】なお、このように励振電極2及び引き出し
電極を形成し、電極の非形成部位をエッチングした水晶
片1は、引き出し電極の導出端をリード端子に保持して
金属容器等に気密に封止し、リード端子を介して励振電
極を外部へ導出した状態で電子機器等に実装して使用さ
れる。The crystal element 1 in which the excitation electrode 2 and the extraction electrode are formed in this way, and the portion where the electrode is not formed is etched, the crystal element 1 is held hermetically in a metal container or the like while holding the extraction end of the extraction electrode in the lead terminal. It is stopped and the excitation electrode is led out to the outside through the lead terminal and mounted on an electronic device or the like for use.
【0012】このようにすればエッチングによって大量
の水晶片を一括して加工することができる。そして、エ
ッチング液を均一に対流させることによって加工時間に
応じて加工量を正確に制御することができ、容易に加工
量の均一化を図ることができる。そして従来、広く行わ
れていた機械的なベベル加工と異なり、加工後の水晶片
の面粗さも小さく、水晶片に割れ、欠け等の損傷も生じ
ない。またエッチングによって、水晶片の表面の微細な
割れ、欠け、加工歪等の残留する層は除去されるために
良好な振動特性を得ることができる。In this way, a large number of crystal pieces can be collectively processed by etching. Then, by uniformly convection the etching liquid, the processing amount can be accurately controlled according to the processing time, and the processing amount can be easily made uniform. Further, unlike the mechanical bevel processing which has been widely performed conventionally, the surface roughness of the crystal piece after the processing is small, and the crystal piece is not damaged such as cracked or chipped. Further, by etching, the remaining layers such as fine cracks, chips, and processing strains on the surface of the crystal piece are removed, so that good vibration characteristics can be obtained.
【0013】なお本発明は、上記実施例に限定されるも
のではなく、種々の形状の水晶振動子に適用することが
できる。またエッチング工程もエッチング液を用いたウ
エット・エッチングに限らず、ガスを用いたドライ・エ
ッチング等を行うようにしてもよいことは勿論である。The present invention is not limited to the above embodiment, but can be applied to various types of crystal resonators. Further, the etching step is not limited to wet etching using an etching solution, and it goes without saying that dry etching using gas may be performed.
【0014】また上記実施例では、励振電極2をマスク
として用いるようにしたが、励振電極2の上にエッチン
グの際に侵されることなく励振電極2を保護することの
できるマスクを形成するようにしてもよい。この場合
は、エッチングの終了した後マスクを除去しておく必要
がある。さらに上記実施例では、励振電極2を形成する
際に引き出し電極も形成するようにしたが、引き出し電
極はエッチングを終了した後に行うようにしてもよい。
このようにすれば、水晶片の面積に対して引き出し電極
の面積が大きな割合を占める小型の水晶振動子の場合に
有効である。Further, in the above embodiment, the excitation electrode 2 is used as a mask, but a mask capable of protecting the excitation electrode 2 without being attacked during etching is formed on the excitation electrode 2. May be. In this case, it is necessary to remove the mask after etching is completed. Further, in the above-described embodiment, the extraction electrode is also formed when the excitation electrode 2 is formed, but the extraction electrode may be formed after the etching is completed.
This is effective in the case of a small crystal resonator in which the area of the extraction electrode occupies a large proportion of the area of the crystal piece.
【0015】[0015]
【発明の効果】以上詳述したように、本発明によれば大
量の水晶片を安価に加工することができ、大量生産に適
し、CI特性も良好で特性のばらつきも少ない水晶振動
子及びその製造方法を提供することができる。As described above in detail, according to the present invention, it is possible to process a large amount of crystal pieces at a low cost, is suitable for mass production, has a good CI characteristic and a small variation in the characteristic, and a crystal resonator thereof. A manufacturing method can be provided.
【図1】本発明の一実施例の水晶振動子の水晶片の平面
図である。FIG. 1 is a plan view of a crystal piece of a crystal resonator according to an embodiment of the present invention.
【図2】図1に示す平面図のA−A線矢示断面図であ
る。2 is a cross-sectional view taken along the line AA of the plan view shown in FIG.
【図3】本発明の方法を説明する流れ図である。FIG. 3 is a flow chart illustrating the method of the present invention.
1 水晶片 2 励振電極 3 段差 4 (電極の)非形成部位 5 引き出し電極 1 Quartz piece 2 Excitation electrode 3 Step 4 Non-formed part (of electrode) 5 Extraction electrode
Claims (4)
て電極の非形成部位に段差を形成したことを特徴とする
水晶振動子。1. A crystal resonator, wherein a portion of a crystal piece where no electrode is formed is etched to form a step at the portion where no electrode is formed.
る工程と、 水晶片をエッチングして電極の非形成部位に段差を形成
する工程と、を具備する水晶振動子の製造方法。2. A method of manufacturing a crystal resonator, comprising: a step of forming an excitation electrode in a central portion of a plate surface of a crystal piece; and a step of etching the crystal piece to form a step at a portion where an electrode is not formed. .
を形成する際に各励振電極を水晶片の端部へ導出する引
き出し電極を形成しておくことを特徴とする水晶振動子
の製造方法。3. A crystal oscillator according to claim 2, wherein when forming the excitation electrodes, extraction electrodes for leading each excitation electrode to the end of the crystal piece are formed. Method.
グを行った後に各励振電極を水晶片の端部へ導出する引
き出し電極を形成することを特徴とする水晶振動子の製
造方法。4. The method for manufacturing a crystal resonator according to claim 2, wherein after the etching is performed, a lead electrode for leading each excitation electrode to the end of the crystal piece is formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32234295A JPH09139650A (en) | 1995-11-15 | 1995-11-15 | Crystal oscillator and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32234295A JPH09139650A (en) | 1995-11-15 | 1995-11-15 | Crystal oscillator and method of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09139650A true JPH09139650A (en) | 1997-05-27 |
Family
ID=18142579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32234295A Pending JPH09139650A (en) | 1995-11-15 | 1995-11-15 | Crystal oscillator and method of manufacturing the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09139650A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006352828A (en) * | 2005-05-16 | 2006-12-28 | Epson Toyocom Corp | Piezoelectric substrate and manufacturing method thereof |
WO2019054349A1 (en) * | 2017-09-13 | 2019-03-21 | 株式会社村田製作所 | Crystal oscillator element and method for producing same |
-
1995
- 1995-11-15 JP JP32234295A patent/JPH09139650A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006352828A (en) * | 2005-05-16 | 2006-12-28 | Epson Toyocom Corp | Piezoelectric substrate and manufacturing method thereof |
WO2019054349A1 (en) * | 2017-09-13 | 2019-03-21 | 株式会社村田製作所 | Crystal oscillator element and method for producing same |
TWI676353B (en) * | 2017-09-13 | 2019-11-01 | 日商村田製作所股份有限公司 | Crystal vibration element and manufacturing method thereof |
CN111052602A (en) * | 2017-09-13 | 2020-04-21 | 株式会社村田制作所 | Crystal oscillation element and method for manufacturing same |
CN111052602B (en) * | 2017-09-13 | 2023-09-29 | 株式会社村田制作所 | Crystal vibration element and method for manufacturing same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3878032B2 (en) | Thin film bulk acoustic resonator device and improved method for manufacturing the same | |
JP3888107B2 (en) | Etching method of piezoelectric diaphragm for piezoelectric vibrating device | |
KR20160037898A (en) | Composite board and method for making same | |
TWI591868B (en) | Piezoelectric quartz wafer with double convex structure and processing method thereof | |
CN106059527A (en) | AT-cut crystal element, crystal resonator and crystal oscillator | |
CN111919383A (en) | Bulk acoustic wave resonator device and method of manufacturing the same | |
US20100141100A1 (en) | Method of manufacturing piezoelectric oscillating pieces, piezoelectric oscillating piece, and piezoelectric resonator | |
JPH09139650A (en) | Crystal oscillator and method of manufacturing the same | |
JP2008085997A (en) | Manufacturing method of thickness shear vibration piece, thickness shear vibration piece, thickness shear vibrator, and oscillator | |
US4224547A (en) | Adjusting the frequency of piezoelectric crystal devices via fracturing the crystal surface | |
JP3814458B2 (en) | Quartz crystal bevel processing method | |
JPH04294622A (en) | Production of piezoelectric element | |
WO2017012347A1 (en) | Piezoelectric quartz wafer with single convex structure | |
CN110401429A (en) | Crystal oscillator and manufacturing method thereof | |
RU2169986C2 (en) | Crystal resonator manufacturing process | |
JPH10209785A (en) | Transducer manufacturing method | |
JPH06204784A (en) | Crystal vibration chip and its processing method | |
JP3244770B2 (en) | Method of manufacturing piezoelectric element for piezoelectric motor | |
JPH04130810A (en) | Manufacturing method of AT-cut crystal vibrating piece | |
JP2003017983A (en) | Elastic wave device wafer and elastic wave device using the same | |
JPH08330883A (en) | Thickness slip crystal unit | |
JP2007096369A (en) | Metal mask and piezoelectric vibration element dividing method | |
WO2007037455A9 (en) | Quartz substrate | |
JP2545692B2 (en) | Manufacturing method of thickness-sliding crystal unit | |
JPH07154180A (en) | Method for manufacturing surface acoustic wave element |