JP3814458B2 - Quartz crystal bevel processing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a bevel processing method for a crystal resonator (crystal piece), which is an industrial technical field, and more particularly, to a bevel processing method by etching with reduced processing time.
[0002]
[Prior art]
BACKGROUND OF THE INVENTION Crystal resonators are widely used in electronic devices including communication devices as frequency and time reference sources and filter elements. One of these is a crystal unit having a good vibration characteristic by obliquely cutting the outer periphery.
[0003]
(Example of Prior Art) FIGS. 5 to 7 are diagrams for explaining a conventional example. FIG. 5 is a cutting direction view of a crystal piece, FIG. 6 is a diagram of a metal tube for bevel processing, and FIG. FIG.
The crystal resonator is formed of an AT-cut crystal piece 1 and is formed in, for example, a strip shape. The AT cut is a cutting angle at which the principal plane perpendicular to the Y axis of the crystal axis (XYZ) is inclined by 35 ° 15 ′ from the Z axis to the Y axis. The newly created axes are designated as Y ′ and Z ′ axes. In this example, the strip-shaped crystal piece 1 is formed long in the Z′-axis direction.
[0004]
In general, a large number of crystal pieces 1 are put together with a polishing agent into a metal cylinder 2 shown in FIG. 6 or a sphere (not shown) and rotated, so that both ends of the crystal piece 1 are cut into slopes along a curved surface. Bevel processing is performed (FIG. 7).
[0005]
In such a case, the vibration energy is concentrated on the flat portion in the central region and the boundary of the outer periphery is dispersed, so that the crystal impedance is reduced to suppress the spurious of the contour system. Normally, opposing excitation electrodes are formed on both main surfaces of the crystal piece 1, and extraction electrodes are extended to both ends. Then, both ends are held and hermetically sealed in a container (not shown).
[0006]
[Problems to be solved by the invention]
(Problems of the prior art) However, in the above-described bevel processing method, the processing amount is determined using the weight of the crystal piece 1, gravity, centrifugal force, abrasive particle size, and the like as parameters. Therefore, there are problems such as long processing time, both ends (sides) in the long side direction are processed, but both sides in the short side direction are difficult to be processed, processing variation is large, and the crystal piece 1 is easily damaged. there were.
[0007]
The object of the present invention is to provide a bevel processing method for a crystal resonator which is particularly excellent in workability by shortening the processing time.
[0008]
[Means for Solving the Problems]
The present invention provides a beveling process of the crystal oscillator formed by ablating the outer periphery of both main surfaces in the thickness direction at a strip and the crystal blank made of AT-cut obliquely, by joining the crystal piece in the thickness direction to form an integrated lens, in that the integral lens was put in the etching solution was excised outer peripheral bonding surface of the integrated lens obliquely, to form an inclined surface which becomes concave outer periphery of the crystal piece Let it be a basic solution.
[0009]
[Action]
In the present invention, since the outer peripheral portion of the integrated crystalline lens is removed by etching, the processing speed is high. Further, since the processing is performed in an etching solution, both the long side and the short side are cut off almost evenly. And the processing variation is small and the crystal piece 1 is not damaged. An embodiment of the present invention will be described below.
[0010]
【Example】
FIG. 1 is a diagram for explaining a bevel processing method according to an embodiment of the present invention. In addition, the same number is attached | subjected to the same part as a prior art example figure, and the description is abbreviate | omitted or abbreviate | omitted.
First, a large number of rectangular crystal pieces 1 made of AT cut are joined together by an adhesive (not shown) to form a rectangular parallelepiped integrated crystal body 3. Also in this example, the crystal piece 1 is long in the Z′-axis direction. Next, the integrated crystal piece 1 is put into an etching solution such as hydrofluoric acid.
[0011]
In such a case, the etching solution penetrates into the joint surface of each crystal piece 1 in the integrated crystal body 3 and erodes almost uniformly from the ridge line portion of the crystal piece 1 toward the center portion on each side of both main surfaces ( 2 to 4). Strictly speaking, the etching rate varies depending on the direction of the crystal axis of quartz, and the Z-axis direction is the fastest. Therefore, in this case, the machining amount in the long side (Z ′ axis) direction is slightly increased. The inclined surface is slightly concave. The bevel processing is controlled by the composition of the etching solution, the etching time, and the like.
[0012]
For this reason, since the bevel processing is performed by chemical etching, the processing speed is much faster than the mechanical processing described above. Incidentally, when the processing amount in the long side direction of the crystal piece 1 is the same, the etching is about 10 to 100 times faster.
[0013]
In addition, since both ends in the long side direction as well as both sides in the short side direction are processed substantially uniformly, it is easy to confine the vibration energy in the central part, and an improvement in vibration characteristics can be expected. Further, since the amount of processing between the crystal pieces 1 is uniform, the variation is small. Furthermore, since the processing is performed in the etching solution, the crystal piece 1 is hardly damaged.
[0014]
[Other matters]
In the above-described embodiment, all four sides of both main surfaces of the crystal piece 1 are beveled. However, for example, when only both ends in the long side direction are beveled, both side surfaces in the short side direction of the integrated crystalline lens 3. A resist film may be provided and shielded, and only an arbitrary side can be beveled.
[0015]
Further, the crystal piece 1 is formed as a long strip in the Z′-axis direction as an AT cut, but it may be long in the X-axis direction, a disk shape, or a BT or SC cut. It can be applied to the crystal piece 1 that requires a surface. Although the bevel is cut obliquely, it may be straight (planar) or curved. Further, although the crystal piece 1 is bonded with an adhesive, both main surfaces may be mirror-polished and bonded directly.
[0016]
【The invention's effect】
The present invention provides a beveling process of the crystal oscillator formed by ablating the outer periphery of both main surfaces in the thickness direction at a strip and the crystal blank made of AT-cut obliquely, by joining the crystal piece in the thickness direction Since the integrated crystalline lens is formed, the integrated crystalline lens is put into an etching solution, the outer periphery of the joint surface in the integrated crystalline lens is obliquely cut , and the inclined surface that is concave is formed on the outer periphery of the crystal piece. In particular, it is possible to provide a bevel processing method for a crystal resonator that has a short processing time and excellent workability.
[Brief description of the drawings]
FIG. 1 is a view of an integrated crystalline lens for explaining an embodiment of the present invention.
FIG. 2 is a diagram of a crystal piece according to an embodiment of the present invention.
FIG. 3 is a side view in the long side direction of a crystal piece for explaining an embodiment of the present invention.
FIG. 4 is a side view of a crystal piece in the short piece direction for explaining an embodiment of the present invention.
FIG. 5 is a cutting direction view of a crystal piece for explaining a conventional example.
FIG. 6 is a diagram of a metal tube for bevel processing for explaining a conventional example.
FIG. 7 is a diagram of a crystal piece for explaining a conventional example.
[Explanation of symbols]
1 crystal piece, 2 metal cylinder, 3 integrated crystal.

Claims (1)

In beveling process of the crystal oscillator formed by ablating the outer periphery of both main surfaces in the thickness direction at an angle in the strip and the crystal blank made of AT-cut, integrated lens by bonding the crystal piece in the thickness direction formed, the integrated lens was excised periphery of the joint surface in an etching solution wherein the integral lens was put in obliquely, characterized in that the formation of the inclined surface to be concave on the outer periphery of the crystal piece crystal How to bevel a vibrator.

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