JPH09117126A - Power converter - Google Patents
Power converterInfo
- Publication number
- JPH09117126A JPH09117126A JP27078295A JP27078295A JPH09117126A JP H09117126 A JPH09117126 A JP H09117126A JP 27078295 A JP27078295 A JP 27078295A JP 27078295 A JP27078295 A JP 27078295A JP H09117126 A JPH09117126 A JP H09117126A
- Authority
- JP
- Japan
- Prior art keywords
- smoothing capacitor
- semiconductor switching
- terminal
- positive
- output
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 claims abstract description 39
- 238000009499 grossing Methods 0.000 claims abstract description 35
- 239000004065 semiconductor Substances 0.000 claims abstract description 34
- 239000011810 insulating material Substances 0.000 claims abstract description 5
- 238000006243 chemical reaction Methods 0.000 claims abstract description 4
- 238000001816 cooling Methods 0.000 claims description 14
- 238000005192 partition Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Power Conversion In General (AREA)
Abstract
(57)【要約】
【課題】電力変換装置において、複数の半導体スイッチ
素子と、平滑コンデンサと、正極負極の直流母線および
出力バーとの配置によって半導体スイッチ素子あるいは
平滑コンデンサに生じる電流分担の不均一を是正する。
【解決手段】平滑コンデンサ2から半導体スイッチ素子
1へ接続する正極および負極の直流母線3,4を絶縁材
8を介して積層状に配置する。また複数の半導体スイッ
チ素子1の出力端子を短絡して出力端子台との間に接続
される各相の出力バー5の形状をトーナメント状として
中央部に角穴を設ける。
(57) Abstract: In a power conversion device, a plurality of semiconductor switching elements, a smoothing capacitor, and a DC bus of positive and negative electrodes and an output bar are arranged, so that a current sharing occurring in the semiconductor switching element or the smoothing capacitor is uneven. To correct. SOLUTION: Positive and negative DC busbars 3 and 4 connected from a smoothing capacitor 2 to a semiconductor switch element 1 are arranged in a laminated manner with an insulating material 8 interposed therebetween. Further, the output terminals of the plurality of semiconductor switching elements 1 are short-circuited to form a tournament-shaped output bar 5 for each phase connected to the output terminal block, and a square hole is provided at the center.
Description
【0001】[0001]
【発明の属する技術分野】この発明は、電力変換装置に
関し、特に部品の配置ならびに母線の構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power converter, and more particularly to arrangement of parts and structure of busbars.
【0002】[0002]
【従来の技術】図4は従来例の構成を示す正面図であ
る。図4において、上側に半導体スイッチ素子1を、そ
の下側に平滑コンデンサ2を配置し、平滑コンデンサ2
の端子は母線の形状を簡単にするために、(+)端子を
上側に、(−)端子を下側に向けて配置され、平滑コン
デンサに封入されている電解液が化学変化あるいは温度
上昇によって気化し、ガスになって内圧が上昇した場合
にこの内圧を逃がす防爆弁6の位置が左側になってい
る。2. Description of the Related Art FIG. 4 is a front view showing the structure of a conventional example. In FIG. 4, the semiconductor switch element 1 is arranged on the upper side, and the smoothing capacitor 2 is arranged on the lower side thereof.
In order to simplify the shape of the bus bar, the () terminal is placed with the (+) terminal facing up and the (-) terminal facing down, and the electrolytic solution enclosed in the smoothing capacitor may change due to a chemical change or temperature rise. The position of the explosion-proof valve 6 that releases this internal pressure when it vaporizes and becomes gas and the internal pressure rises is on the left side.
【0003】平滑コンデンサ2の(+)端子を一括する
正極直流母線10を設け、この正極直流母線10と半導
体スイッチ素子1とを(+)バー10Aで接続してい
る。同様に(−)端子を一括する負極直流母線11を設
け、この負極直流母線11と半導体スイッチ素子1とを
(−)バー11Aで接続している。図5は従来例の出力
バーの斜視図である。図5において、出力バー12は各
相の半導体スイッチ素子1の出力端子を短絡させた短絡
バー12Aの中央から引き出されている。この場合は半
導体スイッチ素子1の各出力端子から出力バー12への
配線距離は、出力バー12から遠い距離にある半導体ス
イッチ素子と、近い距離にある半導体スイッチ素子とで
不均一になっている。A positive electrode direct current bus bar 10 is provided which collects the (+) terminals of the smoothing capacitor 2, and the positive electrode direct current bus line 10 and the semiconductor switch element 1 are connected by a (+) bar 10A. Similarly, a negative electrode DC bus line 11 that collectively includes (-) terminals is provided, and the negative electrode DC bus line 11 and the semiconductor switch element 1 are connected by a (-) bar 11A. FIG. 5 is a perspective view of a conventional output bar. In FIG. 5, the output bar 12 is pulled out from the center of the short-circuit bar 12A in which the output terminals of the semiconductor switch elements 1 of the respective phases are short-circuited. In this case, the wiring distance from each output terminal of the semiconductor switching element 1 to the output bar 12 is not uniform between the semiconductor switching element located far from the output bar 12 and the semiconductor switching element located close to it.
【0004】[0004]
【発明が解決しようとする課題】このような従来の構成
では、平滑コンデンサ2の防爆弁6の位置が上側にない
ために平滑コンデンサの内部で電極を固定している樹脂
が下側に沈降して防爆弁6が詰まり易いという問題があ
った。近年ではスイッチの高速化に伴って半導体スイッ
チ素子にIGBT(絶縁ゲートバイポーラトランジス
タ)を使用する電力変換装置が増えている。In such a conventional structure, since the explosion-proof valve 6 of the smoothing capacitor 2 is not located on the upper side, the resin fixing the electrodes inside the smoothing capacitor settles down. There is a problem that the explosion-proof valve 6 is easily clogged. In recent years, power conversion devices that use IGBTs (insulated gate bipolar transistors) for semiconductor switching elements have been increasing along with the speeding up of switches.
【0005】このような電力変換装置では半導体スイッ
チ素子のオン/オフを切り換える時間間隔が短くなり、
配線距離の不均一つまり配線インダクタンスの不均一が
半導体スイッチ素子の電流分担に大きく影響する。半導
体スイッチ素子の電流分担にアンバランスが生じると、
過電流による素子破壊を助長するので半導体スイッチ素
子の定格やスナバ回路容量の増大を招き、ひいてはコス
トの上昇や装置の大型化を招くことになる。またスナバ
コンデンサの持つ配線インダクタンスにより、スイッチ
ング時に電圧が跳ね上がり半導体スイッチ素子に過電圧
が印加されるおそれもあった。In such a power converter, the time interval for switching on / off of the semiconductor switching element becomes short,
The nonuniform wiring distance, that is, the nonuniform wiring inductance greatly affects the current sharing of the semiconductor switch element. When imbalance occurs in the current sharing of the semiconductor switch element,
Since the breakdown of the element due to overcurrent is promoted, the rating of the semiconductor switching element and the snubber circuit capacity are increased, which in turn increases the cost and the size of the device. Further, the wiring inductance of the snubber capacitor may cause a voltage jump at the time of switching and an overvoltage may be applied to the semiconductor switch element.
【0006】そこでこの発明の目的は、配線インダクタ
ンスを均一にするとともにその値自体を小さくして、半
導体スイッチ素子の定格およびスナバ回路容量の増大を
防止し、コストの低減および装置の小型化を図ることが
できる電力変換装置を提供することにある。Therefore, an object of the present invention is to make the wiring inductance uniform and reduce its value to prevent an increase in the rating of the semiconductor switch element and the snubber circuit capacity, thereby reducing the cost and downsizing the device. An object of the present invention is to provide a power conversion device capable of performing the above.
【0007】[0007]
【課題を解決するための手段】上記の目的を達成するた
めにこの発明は、冷却体上に、複数の半導体スイッチ素
子と、これらの半導体スイッチ素子に接続されたスナバ
コンデンサと、電源となる平滑コンデンサと、この平滑
コンデンサに接続された正極および負極の直流母線とが
少なくとも配置される電力変換装置において、平滑コン
デンサから半導体スイッチ素子へ接続する正極および負
極の直流母線が絶縁材を介して積層状に配置され、平滑
コンデンサの端子を正面から見て(−)端子を左側に、
(+)端子を右側にして平滑コンデンサの内圧が上昇し
た場合にこの内圧を逃がす防爆弁を上側に向けて配置す
る。In order to achieve the above-mentioned object, the present invention provides a plurality of semiconductor switching elements, a snubber capacitor connected to these semiconductor switching elements, and a smoothing power source on a cooling body. In a power converter in which at least a capacitor and positive and negative DC buses connected to the smoothing capacitor are arranged, positive and negative DC buses connected from the smoothing capacitor to the semiconductor switch element are laminated via an insulating material. Is located on the left side of the smoothing capacitor terminal when viewed from the front,
With the (+) terminal on the right side, arrange the explosion-proof valve facing upwards, which releases the internal pressure of the smoothing capacitor when it rises.
【0008】また複数の半導体スイッチ素子の出力端子
を短絡して出力端子台との間に接続される各相の出力バ
ーの形状をトーナメント状として中央部に角穴を設け
る。この発明の構成によると、平滑コンデンサから半導
体スイッチ素子へ接続する正極および負極の直流母線を
絶縁材を介して積層状に配置する母線構造とすることに
よって平滑コンデンサの防爆弁の位置を上側に向けるこ
とができるから、防爆弁の詰まりを大幅に解消すること
ができる。Further, the output terminals of a plurality of semiconductor switching elements are short-circuited to form a tournament-shaped output bar for each phase connected to the output terminal block, and a square hole is provided in the central portion. According to the configuration of the present invention, the positive and negative DC bus lines connected from the smoothing capacitor to the semiconductor switching element are arranged in a laminated manner with the insulating material interposed between them so that the explosion-proof valve of the smoothing capacitor is directed upward. Therefore, the clogging of the explosion-proof valve can be largely eliminated.
【0009】また、正極直流母線と負極直流母線とが近
接している部分の面積を大きくすることができるから、
放熱面積が増大し平滑コンデンサ内部の熱が端子を介し
て放散され温度上昇が抑えられるとともに、平滑コンデ
ンサと各半導体スイッチ素子との間の配線インダクタン
スが減少する。さらに各相の出力バーの形状をトーナメ
ント状として中央部に角穴を設けることによって半導体
スイッチ素子間の電流分担のバランスが良くなる。Further, since the area of the portion where the positive electrode DC busbar and the negative electrode DC busbar are close to each other can be increased,
The heat dissipation area increases, the heat inside the smoothing capacitor is dissipated through the terminals, and the temperature rise is suppressed, and the wiring inductance between the smoothing capacitor and each semiconductor switch element decreases. Further, the output bar of each phase is formed into a tournament shape, and a square hole is provided in the central portion to improve the balance of current sharing among the semiconductor switch elements.
【0010】また構造上バランス抵抗をモジュール化す
ることが可能となり、配線レスが実現できる。Further, the balance resistor can be modularized structurally, and wiring can be eliminated.
【0011】[0011]
【発明の実施の形態】図1は本発明の実施例を示す正面
図、図2は図1の上部に配置された平滑コンデンサ2の
詳細斜視図である。図1および図2において、この実施
例では平滑コンデンサ2を6個並列に接続したものを2
段直列とし、計12個を端子面を手前側に向けて配置
し、平滑コンデンサ取付板13に取り付けている。また
平滑コンデンサ2の端子は左側が(−)端子、右側が
(+)端子の配置になるようにして防爆弁6を上側に向
けている。1 is a front view showing an embodiment of the present invention, and FIG. 2 is a detailed perspective view of a smoothing capacitor 2 arranged in the upper portion of FIG. In FIG. 1 and FIG. 2, in this embodiment, two smoothing capacitors 2 connected in parallel are two.
A total of 12 terminals are arranged in series, with the terminal surface facing the front side, and mounted on the smoothing capacitor mounting plate 13. Further, the terminals of the smoothing capacitor 2 are arranged so that the left side is the (-) terminal and the right side is the (+) terminal, and the explosion-proof valve 6 is directed to the upper side.
【0012】平滑コンデンサ2の端子面上には正極直流
母線3と負極直流母線4とが絶縁材8を介して絶縁され
積層状に組み付けられている。9は平滑コンデンサ2を
2段直列に接続するための正負短絡バーである。7はモ
ジュール化したバランス抵抗である。平滑コンデンサ取
付板13には、平滑コンデンサ2を冷却するために2基
の冷却ファン20が冷却ファン固定板16、18、およ
び19によって取り付けられている。17は冷却ファン
20用のコンデンサである。On the terminal surface of the smoothing capacitor 2, a positive electrode DC busbar 3 and a negative electrode DC busbar 4 are insulated via an insulating material 8 and assembled in a laminated form. Reference numeral 9 is a positive / negative short-circuit bar for connecting the smoothing capacitors 2 in two stages in series. Reference numeral 7 is a modularized balance resistor. Two cooling fans 20 for cooling the smoothing capacitor 2 are attached to the smoothing capacitor mounting plate 13 by cooling fan fixing plates 16, 18, and 19. Reference numeral 17 is a condenser for the cooling fan 20.
【0013】冷却ファン20の運転によって生じる通風
空気流は仕切板15によって仕切られていて、いずれか
の冷却ファン20が停止した場合にこれを検知するため
にそれぞれの通風路にサーマルガード14が設けられて
いる。平滑コンデンサ2の下部に、冷却体上に取り付け
られた複数の半導体スイッチ素子1が配置され、この半
導体スイッチ素子1の出力端子を短絡して装置の出力端
子台に接続する各相の出力バー5が配置されている。The ventilation airflow generated by the operation of the cooling fan 20 is partitioned by a partition plate 15, and a thermal guard 14 is provided in each ventilation passage to detect when one of the cooling fans 20 is stopped. Has been. Below the smoothing capacitor 2, a plurality of semiconductor switch elements 1 mounted on the cooling body are arranged, and the output terminals of each phase are connected by short-circuiting the output terminals of the semiconductor switch elements 1 to the output terminal block of the device. Are arranged.
【0014】図3は本発明の実施例の出力バーを示す斜
視図である。図3において、トーナメント状に形成した
出力バー5の中央に角穴5Aを設けることによって電流
の方向が図3に示す矢印のようになり、角穴5Aの大き
さを適切に定めることによって各半導体スイッチ素子が
受け持つ電流分担をほぼ均一にすることができる。FIG. 3 is a perspective view showing the output bar of the embodiment of the present invention. In FIG. 3, by providing a square hole 5A at the center of the tournament-shaped output bar 5, the direction of the current becomes as shown by the arrow in FIG. 3, and by appropriately determining the size of the square hole 5A, each semiconductor It is possible to make the current sharing of the switch element almost uniform.
【0015】[0015]
【発明の効果】この発明によれば、配線インダクタンス
を均一にするとともにその値自体を小さくして、半導体
スイッチ素子の定格およびスナバ回路容量の増大を防止
し、コストの低減および装置の小型化を図ることができ
る電力変換装置が得られる。According to the present invention, the wiring inductance is made uniform and the value itself is made small to prevent the rating of the semiconductor switching element and the snubber circuit capacity from increasing, thereby reducing the cost and downsizing the device. A power converter that can be achieved is obtained.
【図1】本発明の実施例を示す正面図FIG. 1 is a front view showing an embodiment of the present invention.
【図2】図1の上部に配置された平滑コンデンサの詳細
斜視図FIG. 2 is a detailed perspective view of a smoothing capacitor arranged in the upper part of FIG.
【図3】本発明の実施例の出力バーを示す斜視図FIG. 3 is a perspective view showing an output bar according to an embodiment of the present invention.
【図4】従来例の構成を示す正面図FIG. 4 is a front view showing a configuration of a conventional example.
【図5】従来例の出力バーの斜視図FIG. 5 is a perspective view of a conventional output bar.
1 半導体スイッチ素子 2 平滑コンデンサ 3 正極直流母線 4 負極直流母線 5 出力バー 5A 角穴 6 防爆弁 7 バランス抵抗 8 絶縁材 9 正負短絡バー 13 平滑コンデンサ取付板 14 サーマルガード 15 仕切板 16 冷却ファン固定板 17 冷却ファン用コンデンサ 18 冷却ファン固定板 19 冷却ファン固定板 20 冷却ファン 1 Semiconductor Switching Element 2 Smoothing Capacitor 3 Positive DC Bus Bus 4 Negative DC Bus 5 Output Bar 5A Square Hole 6 Explosion-proof Valve 7 Balance Resistance 8 Insulation Material 9 Positive / Negative Shorting Bar 13 Smoothing Capacitor Mounting Plate 14 Thermal Guard 15 Partition Plate 16 Cooling Fan Fixing Plate 17 Cooling Fan Capacitor 18 Cooling Fan Fixing Plate 19 Cooling Fan Fixing Plate 20 Cooling Fan
Claims (3)
と、これらの半導体スイッチ素子に接続されたスナバコ
ンデンサと、電源となる平滑コンデンサと、この平滑コ
ンデンサに接続された正極および負極の直流母線とが少
なくとも配置される電力変換装置において、平滑コンデ
ンサから半導体スイッチ素子へ接続する正極および負極
の直流母線を絶縁材を介して積層状に配置したことを特
徴とする電力変換装置。1. A plurality of semiconductor switching elements, a snubber capacitor connected to these semiconductor switching elements, a smoothing capacitor serving as a power source, and positive and negative DC busbars connected to the smoothing capacitor on a cooling body. In the power conversion device in which at least are arranged, the positive and negative DC busbars connected from the smoothing capacitor to the semiconductor switch element are arranged in a laminated manner with an insulating material interposed therebetween.
ンサの端子を正面から見て(−)端子を左側に、(+)
端子を右側にして平滑コンデンサの内圧が上昇した場合
にこの内圧を逃がす防爆弁を上側に向けて配置したこと
を特徴とする電力変換装置。2. The device according to claim 1, wherein the terminal of the smoothing capacitor is viewed from the front (-) terminal on the left side and (+)
An electric power converter characterized in that an explosion-proof valve for escaping the internal pressure of the smoothing capacitor when the internal pressure of the smoothing capacitor rises with the terminal on the right side is arranged facing upward.
体スイッチ素子の出力端子を短絡して出力端子台との間
に接続される各相の出力バーの形状を、トーナメント状
として中央部に角穴を設けたことを特徴とする電力変換
装置。3. The shape of the output bar for each phase connected to the output terminal block by short-circuiting the output terminals of the plurality of semiconductor switch elements in the central part as a tournament according to claim 1. An electric power converter having a square hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27078295A JP3486828B2 (en) | 1995-10-19 | 1995-10-19 | Power converter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27078295A JP3486828B2 (en) | 1995-10-19 | 1995-10-19 | Power converter |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09117126A true JPH09117126A (en) | 1997-05-02 |
JP3486828B2 JP3486828B2 (en) | 2004-01-13 |
Family
ID=17490928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27078295A Expired - Fee Related JP3486828B2 (en) | 1995-10-19 | 1995-10-19 | Power converter |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3486828B2 (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2777109A1 (en) * | 1998-04-06 | 1999-10-08 | Gec Alsthom Transport Sa | CAPACITOR BATTERY, ELECTRONIC POWER DEVICE COMPRISING SUCH A BATTERY AND ELECTRONIC POWER ASSEMBLY COMPRISING SUCH A DEVICE |
US6845017B2 (en) * | 2000-09-20 | 2005-01-18 | Ballard Power Systems Corporation | Substrate-level DC bus design to reduce module inductance |
US6906404B2 (en) | 2003-05-16 | 2005-06-14 | Ballard Power Systems Corporation | Power module with voltage overshoot limiting |
JP2005176576A (en) * | 2003-12-15 | 2005-06-30 | Toshiba Corp | Power converting device |
US6987670B2 (en) | 2003-05-16 | 2006-01-17 | Ballard Power Systems Corporation | Dual power module power system architecture |
US7012810B2 (en) | 2000-09-20 | 2006-03-14 | Ballard Power Systems Corporation | Leadframe-based module DC bus design to reduce module inductance |
US7180763B2 (en) | 2004-09-21 | 2007-02-20 | Ballard Power Systems Corporation | Power converter |
US7289329B2 (en) | 2004-06-04 | 2007-10-30 | Siemens Vdo Automotive Corporation | Integration of planar transformer and/or planar inductor with power switches in power converter |
US7295448B2 (en) | 2004-06-04 | 2007-11-13 | Siemens Vdo Automotive Corporation | Interleaved power converter |
US7426099B2 (en) | 2005-06-30 | 2008-09-16 | Continental Automotive Systems Us, Inc. | Controller method, apparatus and article suitable for electric drive |
US7443692B2 (en) | 2003-05-16 | 2008-10-28 | Continental Automotive Systems Us, Inc. | Power converter architecture employing at least one capacitor across a DC bus |
JP2009152151A (en) * | 2007-12-21 | 2009-07-09 | Toshiba Mitsubishi-Electric Industrial System Corp | Fuse and semiconductor power converter |
JP2012222990A (en) * | 2011-04-11 | 2012-11-12 | Fuji Electric Co Ltd | Inverter device |
WO2013136415A1 (en) * | 2012-03-12 | 2013-09-19 | 三菱電機株式会社 | Power conversion apparatus |
CN115395760A (en) * | 2022-08-19 | 2022-11-25 | 深圳市禾望电气股份有限公司 | A super high power H-bridge power unit module |
-
1995
- 1995-10-19 JP JP27078295A patent/JP3486828B2/en not_active Expired - Fee Related
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0949752A1 (en) * | 1998-04-06 | 1999-10-13 | Alstom Transport S.A. | Capacitor bank, power electronic device comprising such a bank and power electronic assembly comprising such device |
US6249448B1 (en) | 1998-04-06 | 2001-06-19 | Alstom Transport Sa | Electronic power device and electronic power assembly comprising such a device |
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