JPH088267B2 - Die bonding equipment - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a die bonding apparatus, and more particularly to a die bonding apparatus with improved positioning accuracy and reduced generation of dust from a semiconductor chip. .

[Outline of Invention]

The present invention provides a die bonding apparatus having a means for holding and fixing a semiconductor chip, wherein the means for holding and fixing has a pair of chuck claws which come into contact with and sandwich the side surface of the semiconductor chip facing the set. A pair of chuck claws that come into contact with and sandwich the other pair of opposite side faces, each chuck claw being in contact with a portion other than a corner of the semiconductor chip to sandwich the semiconductor chip By doing so, it is possible to improve the positioning accuracy and reduce the generation of dust from the semiconductor chip.

[Conventional technology]

Hereinafter, the semiconductor chip holding and fixing means in the conventional die bonding apparatus will be described with reference to FIG. Seventh
In the figure, reference numeral 1 is a pyramid collet, and this pyramid collet 1 has four pyramidal surfaces 10 at the lower end surface to form a truncated pyramidal space 11, and an air passage 12 communicating with this space 11 is axially arranged. The air passage 12 is provided, and is connected to a vacuum generating device (not shown) such as a compressor. Reference numeral 2 is a semiconductor chip that has been diced in the dicing process and has been carried onto a positioning stage (not shown).

Next, the operation of the pyramid collet 1 described above will be described. First, place the pyramid collet 1 on the semiconductor chip 2,
The four-sided pyramid surface 10 of the pyramid collet 1 and four edges (four edges formed by the upper surface and the four side surfaces) of the semiconductor chip 2 are brought into contact with each other. next,
By driving the vacuum generator, the space surrounded by the four-sided pyramid surface 10 of the pyramid collet 1 and the upper surface of the semiconductor chip 2 is evacuated, the semiconductor chip 2 is positioned, and the semiconductor chip 2 is positioned.
Hold and fix. The pyramidal collet 1 holding and fixing the semiconductor chip 2 is transferred to the die bond position, and the semiconductor chip 2 is die bonded at the die bond position.

[Problems to be solved by the invention]

However, since the above-described pyramid collet 1 holds and fixes the semiconductor chip 2 by bringing the four edges of the semiconductor chip 2 into contact with the four pyramid surface 10, the four pyramid surface 10 of the pyramid collet 1 and the four corners of the semiconductor chip 2 The contact with the ridge is a line contact. Therefore, when the relative positions of the pyramid collet 1 and the semiconductor chip 2 are deviated, the semiconductor chip 2 may be held and fixed in an inclined state as shown by the chain double-dashed line in FIG. The positioning accuracy is, for example, about ± 50 μm to 10 μm, and there is a problem that the accuracy cannot be improved. Moreover, since the semiconductor chip 2 enters the space 11 of the pyramid collet 1 and is hidden by the pyramid collet 1, there is a problem in that the positioning state of the semiconductor chip 2 cannot be pattern-recognized at the die bond position.

Further, as shown in the enlarged view of FIG. 5, the semiconductor chip 2 has a roughened upper edge 22 between the upper surface 20 and the four side surfaces 21 and a lower edge 23 between the lower surface 23 and the four side surfaces 21 in the dicing process. There are cracks 24 and remaining parts 25 in the area (the figure is shown extremely). Therefore, when the four-sided pyramid surface 10 of the pyramid collet 1 and the four edges 22 of the semiconductor chip 2 are brought into contact with each other, a large amount of dust is generated due to chipping or the like. In addition, there is a problem that the above-mentioned dust is absorbed by the vacuum action of the pyramid collet 1 and a large amount adheres to the upper surface of the semiconductor chip 2.

An object of the present invention is to provide a die bonding apparatus capable of improving positioning accuracy and reducing the generation of dust from a semiconductor chip.

[Means for solving problems]

According to the present invention, in a die bonding apparatus having a means for holding and fixing a semiconductor chip, the holding and fixing means includes a pair of chuck claws that come into contact with and sandwich the pair of side surfaces of the semiconductor chip. A pair of chuck claws that come into contact with and sandwich the other pair of opposite side faces, each chuck claw being in contact with a portion other than a corner of the semiconductor chip to sandwich the semiconductor chip It is characterized by being done.

[Action]

According to the present invention, the semiconductor chip can be reliably held and fixed by holding and fixing the pair of opposite side surfaces of the semiconductor chip and the other pair of opposite side surfaces by surface contact. Moreover, by holding and fixing the semiconductor chip from the side surface, the semiconductor chip is not hidden by the holding and fixing means,
The pattern of the positioning state of the semiconductor chip can be recognized at the die bond position. Further, by holding and fixing the side surfaces of the semiconductor chip, in particular, a pair of chuck claws that come into contact with and sandwich the pair of opposite side surfaces of the semiconductor chip and another pair of opposite side surfaces come into contact with each other. And a pair of chuck claws for sandwiching the semiconductor chip, and each chuck claw is configured to come into contact with a portion other than a corner portion of the semiconductor chip to sandwich the semiconductor chip. It is possible to support by avoiding rough ridges, cracks and remaining parts, avoiding the problem of dust generation,
Moreover, the semiconductor chip can be securely held and fixed.

〔Example〕

An embodiment of the die bonding apparatus of the present invention will be described below with reference to FIGS. 1 to 4.

FIG. 1 is a perspective view, and FIG. 2 is a side view in a die-bonded state. In the figure, reference numeral 3 is a positioning stage, and the semiconductor chip 2 diced on the positioning stage 3 is conveyed and positioned. Reference numeral 4 denotes X-direction holding and fixing means for holding and fixing a pair of opposed side surfaces of the semiconductor chip 2. The X-direction holding and fixing means 4 is capable of reciprocating in the X direction with the base 40. The movable positioning member 41 mounted, the fixed positioning member 42 fixed to the base 40, the pulse motor 43 as a drive device mounted on the base 40, and the movable positioning member of the pulse motor 43.
41 and a power transmission means 44 interposed therebetween. The movable positioning member 41 has an L-shape, and has a base end engaged with a guide rail 400 on the upper surface of the base body 40 so as to be capable of reciprocating in the X direction, and a chuck claw 410 protruding from the distal end in the X direction. The fixed positioning member 42 also has an L-shape, the base end of which is fixed to the upper surface of the base body 40, and the chuck claw 420 is provided on the tip of the fixed positioning member 42 so as to face the chuck claw 410 of the movable positioning member 41 with the positioning stage 3 interposed therebetween. To do. The power transmission means 44 is interposed between the base body 40 and the movable positioning member 41 to constantly urge the movable positioning member 41 in the protruding direction of the chuck claw 410.
And a pinion 441 attached to the rotary shaft of the pulse motor 43.
And a rack 442 that meshes with the pinion 441, and a cam 443 that is fixed to the rack 442 and abuts on the movable positioning member 41.
Consists of The pulse motor 43 is linked to a detector (not shown) such as a photosensor via a control device (not shown), and the control device is operated by a detection signal from the detector,
Forward, reverse, stop, etc. are controlled by controlling the number of pulses. Although not shown in the drawing, the X-direction holding and fixing means 4 is conveyed between the positioning stage 3 and a stage (not shown) for die bonding by a conveying device.

Reference numeral 5 is a holding and fixing means in the Y direction (direction orthogonal to the X direction) for holding and fixing the opposite side surfaces of the other set of the semiconductor chip 2, and the holding and fixing means 5 in the Y direction positions the movable positioning member 51. The stage 3 or a frame of a die bonding apparatus is mounted so as to be capable of reciprocating in the Y direction, and a chuck claw 510 is provided at the tip of the movable positioning member 51 so as to project in the Y direction. On the other hand, the fixed positioning member 52 is fixed to the positioning stage 3 or the frame of the die bonding apparatus, and the chuck claw 520 is attached to the tip of the fixed positioning member 52.
Is provided so as to face the chuck claws 510 of the movable positioning member 51 with the positioning stage 3 interposed therebetween. Movable positioning member 5
The tension spring 53 is interposed between the 1 and the positioning stage 3,
The movable positioning member 51 is constantly urged in the protruding direction of the chuck claw 510. A cylinder 54 is mounted on the positioning stage 3, and a piston rod 540 of the cylinder 54 is fixed to the movable positioning member 51 by penetrating the positioning stage 3.
The cylinder 54 is linked to a detector (not shown) such as a photo sensor via a controller (not shown). As a result, the cylinder 54 is controlled by the control device by the detection signal from the detector, such as forward, backward, and stop.

Chuck claws 410, 420 of the X-direction holding and fixing means 4 described above.
And chuck claws 510 and 520 of the holding and fixing means 5 in the Y direction
Has a width slightly smaller than the length of each side surface of the semiconductor chip 2, a thickness smaller than the thickness of the semiconductor chip 2, and is configured to face the vicinity of the center of a smooth flat surface of the side surface of the semiconductor chip 2. There is.

Further, the chucking force and the positioning position of the X-direction holding and fixing means 4 and the Y-direction holding and fixing means 5 can be changed by adjusting the control device.

In the figure, 6 is a member to which the semiconductor chip 2 is die-bonded,
Reference numeral 7 is a microscope for pattern recognition during die bonding.
Although not shown in the drawing, the holding and fixing means 4 in the X direction or the member 6 to be die-bonded are mounted on the correcting XYθ stage.

The die bonding apparatus of the present invention in this embodiment has the above-mentioned configuration, and its operation will be described below.

First, when the semiconductor chip 2 diced on the positioning stage 3 is conveyed, the cylinder 54 operates to move the movable positioning member 51 in the Y direction, and the movable positioning member 51 and the fixed positioning member 52 cause the semiconductor chip to move. Two
The positioning in the Y direction is completed. Then, the pulse motor
43 is driven to move the movable positioning member 41 in the X direction, and the positioning of the semiconductor chip 2 in the X direction is completed. At this time, since the chuck claws 410 and 420 of the X-direction holding and fixing means 4 and the chuck claws 510 and 520 of the Y-direction holding and fixing means 5 are in surface contact with the four side surfaces of the semiconductor chip 2 to hold and fix the semiconductor chip 2, line contact. Thus, the semiconductor chip 2 can be securely held and fixed as compared with the pyramid collet that holds and fixes the semiconductor chip 2. Therefore, a positioning accuracy of ± 20 μm or less can be obtained. Moreover, four chuck claws 410, 420,
As shown in FIG. 6, the 510 and 520 contact the vicinity of the center of a smooth flat surface on the side surface of the semiconductor chip 2 while avoiding the ridges 22, the cracks 24, and the remaining portions 25 that are roughened in the dicing process of the semiconductor chip 2. Compared to the pyramid collet that contacts the ridge 22 of No. 2, less dust is generated. In addition, chuck claws 410, 420,
Since the semiconductor chip 2 is held and fixed by 510 and 520, unlike the pyramid collet that holds and fixes the semiconductor chip 2 by the vacuum action, there is no fear that dust will be attracted and adhere to the semiconductor chip 2 in large amounts.

When the positioning in the X direction and the Y direction is completed as described above, the holding and fixing means 5 in the Y direction is released, and the holding and fixing means 4 in the X direction holds and fixes the semiconductor chip 2, The semiconductor chip 2 is conveyed from the positioning stage 3 to the die bond stage together with the holding and fixing means 4 in the X direction. In this die bond stage,
The semiconductor chip 2 is die-bonded to the member 6. At this time, since the chuck claws 410 and 420 of the holding and fixing means 4 in the X direction are held and fixed from the side surface of the semiconductor chip 2, the semiconductor chip 2 is not hidden under the holding and fixing means 4 in the X direction. Therefore, the pattern of the positioning state of the semiconductor chip 2 can be recognized by the microscope 7 or the like during die bonding. Therefore, the pattern is recognized and the correction XY
By moving the θ table, the positioning accuracy can be further improved to ± 5 μm or less.

FIG. 3 is a partial plan view showing the deformed side of the chuck claw, and FIG. 4 is a view on arrow IV in FIG.

The chuck claws 411, 421, 511, 521 of this example have small projections 412, 422, 512, 522 projecting from their tips and the contact surface with the semiconductor chip 2 is made small, so that the generation of dust can be further suppressed.

〔The invention's effect〕

As is clear from the above, the die-bonding device of the present invention is configured so that the holding and fixing means is composed of chuck claws that come into contact with one set of opposite side surfaces of the semiconductor chip and another set of opposite side surfaces. The following operational effects can be achieved.

(1) Since the two pairs of chuck claws are in surface contact with the two opposing side surfaces of the semiconductor chip, the semiconductor chip can be securely held and fixed. Therefore, the positioning accuracy can be improved.

(2) Since the semiconductor chip is held and fixed from the side surface, the semiconductor chip is not hidden by the holding and fixing means, and the positioning state of the semiconductor chip can be pattern-recognized at the die bond position. Therefore, the positioning accuracy can be further improved.

(3) Since the chuck claw holds and fixes the side surface of the semiconductor and is in contact with other than the corners, the semiconductor chip can be held and fixed while avoiding rough edges, cracks, and remaining portions in the dicing process of the semiconductor chip. . Therefore, less dust is generated. Moreover, dust is less likely to adhere to the upper surface of the semiconductor chip.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the die bonding apparatus of the present invention, and FIG. 2 is a side view showing a die bonding state,
FIG. 3 is a plan view showing a modified example of the chuck claw, FIG. 4 is a view taken in the direction of arrow IV in FIG. 3, FIG. 5 is an enlarged side view of a semiconductor chip, and FIG. FIG. 7 is an explanatory view of a state in which the chuck claw of the bonding apparatus and a conventional pyramid collet are held and fixed, and FIG. 7 is a sectional view showing a pyramid collet of a conventional example. 2 ... Semiconductor chip, 3 ... Positioning stage, 4 ...
X-direction holding and fixing means, 5 ... Y-direction holding and fixing means,
410, 420, 510, 520 ... Chuck claw, 6 ... Die-bonded member, 7 ... Microscope.

Claims (1)

[Claims] 1. A die bonding apparatus having means for holding and fixing a semiconductor chip, wherein the means for holding and fixing comprises a pair of chuck claws for contacting and sandwiching a pair of opposed side surfaces of the semiconductor chip. A pair of chuck claws that come into contact with and sandwich the other pair of side faces, each chuck claw contacting a portion other than a corner of the semiconductor chip to sandwich the semiconductor chip. A die bonding device characterized by being formed.