JP2617249B2 - Supply device of semiconductor chip to lead frame - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for supplying a plurality of semiconductor chips adhered to a surface of an expansion sheet in a wafer tray one by one to a predetermined position in a lead frame. .

[0002]

2. Description of the Related Art Conventionally, a supply apparatus of this type has a wafer tray on a side of a lead frame transfer path, as described in, for example, JP-A-56-98835. And the wafer tray is moved by a XY table in two directions of an X-axis direction and a Y-axis direction orthogonal to each other on a plane parallel to a horizontal plane. On the other hand, above these, a pickup collet that reciprocates in a horizontal direction between the wafer tray and the lead frame is provided, and the semiconductor chip is picked up from an expansion sheet in the wafer tray by the pickup collet. ,
In general, the pickup collet is configured to supply the semiconductor chip to the lead frame by horizontally moving to a position above the lead frame and descending.

However, in this conventional supply device, the reciprocating movement distance of the pickup collet in the horizontal direction is large, so that the speed at which semiconductor chips are supplied one by one to the lead frame is extremely slow, and the wafer tray is horizontally moved. Therefore, there is a problem that the lateral width of the device is greatly increased. Therefore, Japanese Patent Application Laid-Open No. 59-22 as prior art is disclosed.
No. 9826 discloses a configuration in which the wafer tray is disposed in parallel with a vertical plane perpendicular to a horizontal plane, and one pickup collet is vertically rotated between a horizontal sideways posture and a vertically downward posture. By doing so, we proposed a device that can increase the speed and reduce the width.

[0004]

However, in this prior art, the semiconductor chip is picked up from the wafer tray by setting the pickup collet in a horizontal sideways posture, and then the pickup collet is moved in a vertically downward posture. By supplying the semiconductor chip to the lead frame, in other words, the pickup of the semiconductor chip from the wafer tray and the supply of the semiconductor chip to the lead frame,
When a semiconductor chip is being picked up from a wafer tray, the supply of the semiconductor chip to the lead frame is stopped, and conversely, when the semiconductor chip is being supplied to the lead frame. Since the pickup of the semiconductor chips from the wafer tray is stopped, there is a problem that the speed of supplying the semiconductor chips one by one to the lead frame cannot be sufficiently improved yet.

An object of the present invention is to provide an apparatus capable of greatly improving the speed of supplying semiconductor chips on a wafer tray to a lead frame one by one.

[0006]

In order to achieve this technical object, the present invention provides a wafer tray on a side of a transfer path for transferring a lead frame with the semiconductor chip mounting portion of the lead frame being substantially horizontal. The expansion sheet in the wafer tray is disposed so as to be parallel to a vertical plane perpendicular to a horizontal plane, and the wafer tray is placed on an XY table in two axial directions orthogonal to each other in a plane parallel to the vertical plane. The rotating body is provided at a portion between the lead frame and the wafer tray, and the rotating body includes both a surface of an expansion sheet on the wafer tray and a semiconductor chip mounting portion on the lead frame. About 4
The rotating body is arranged to rotate around an axis inclined at an angle of 5 degrees, and a pickup collet is provided at least at each of the left and right ends of the rotating body.

[0007]

According to this structure, when one of the pickup collets provided at least on both right and left ends of the rotating body is located at a position facing the wafer tray, the other pickup collet is moved to the opposite position.
It is located at a position facing the lead frame.

Then, after the semiconductor chip is picked up from the expansion sheet on the wafer tray by the one pickup, the rotator is rotated around its axis so that the one pickup collet faces the lead frame. In this state, the other pickup collet faces the wafer tray, and in this state, the semiconductor chip in the one pickup collet can be supplied to the lead frame, and at the same time, the other pickup collet can be supplied to the lead frame. Thus, the semiconductor chips on the wafer tray can be picked up.

[0009]

As described above, according to the present invention, it is possible to simultaneously pick up a semiconductor chip from a wafer tray and supply a semiconductor chip to a lead frame. In other words, it is possible to pick up a semiconductor chip from a wafer tray. And the time required to supply the semiconductor chips to the lead frame can be overlapped, so that by making the wafer tray perpendicular to the horizontal plane,
Although the width of the apparatus is reduced, the speed at which semiconductor chips on the wafer tray are supplied one by one to the lead frame can be greatly improved.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. In the figure, reference numeral 1 denotes a lead frame 2 having semiconductor chip mounting portions 2a at intervals of a constant pitch P intermittently at intervals of the pitch P along the longitudinal direction in a state where the semiconductor chip mounting portions 2a are substantially horizontal. The transfer path is designed to be transferred to the transfer path 1;
Table 3 is provided.

The XY table 3 is provided with a wafer tray 4 having a large number of semiconductor chips 6 adhered to the surface of an expansion sheet 5, and the expansion sheet 5 in the wafer tray 4 is formed on the lead frame 2 in plan view. The wafer tray 4 is mounted so that its longitudinal direction is parallel and perpendicular to the horizontal plane when viewed from the side, and this wafer tray 4 is referred to as an X-axis direction in a vertical direction and a Y-axis direction in a horizontal direction. 5 is configured to move in two axial directions orthogonal to each other in a plane parallel to the surface of the fifth element.

Reference numeral 8 denotes a rotating shaft having a rotating body 9 attached to the tip, and the rotating shaft 8 is
The axis 8a of the rotating shaft 8 is aligned with the wafer tray 4
Are rotatably supported at an angle of approximately 45 degrees with respect to both the surface of the expansion sheet 5 and the semiconductor chip mounting portion 2a of the lead frame 2.

Then, a vacuum suction type collet 11a is mounted on one end of a rotating body 9 attached to the end of the rotary shaft 8, and a vacuum suction type collet 11b is mounted on the other end. On the other hand, the rotation shaft 8
Is connected to a rotary drive mechanism (not shown), and the rotary drive mechanism causes the two pickup collets 11 a and 11 b at both ends of the rotating body 9 to reciprocate between the wafer tray 4 and the lead frame 2 by 180 degrees. It only reciprocates intermittently.

On the back side of the expansion sheet 5 in the wafer tray 4, a push-up mechanism 12 for the semiconductor chip 6 is provided.
Is configured as described below. That is, there is provided a box 12a having one end face closed by a diaphragm 12b and the other end face closed by a transparent plate 12c, and a ring body which comes into contact with or close to the back face of the expansion sheet 5 in the wafer tray 4 on the diaphragm 12b. In the box 12a, a push-up needle 12e projecting from the transparent plate 12c into the ring body 12d is provided in the box 12a.
2c. Further, a three-way switching valve 16 for an air passage 15 is provided in the middle of a vacuum transmission passage 14 that communicates the inside of the box 12a with a vacuum generation source such as a vacuum pump 13 and the like.
The state is switched between a state in which a vacuum is transmitted into a and a state in which the inside of the box 12a communicates with the atmosphere.

The diameter of the push-up needle 12e in the push-up mechanism 12 is smaller than one side of the semiconductor chip 6, and the back surface of the push-up mechanism 12 has the wafer. A recognition sensor 17 for recognizing the semiconductor chip 6 in the expansion sheet 5 of the tray 4 through the transparent plate 12c and the expansion sheet 5 is provided.

In this configuration, the recognition sensor 17
Upon recognizing that the semiconductor chip 6 is located on the same axis as the push-up needle 12e in the push-up mechanism 12, the three-way switching valve 16 switches to a state in which vacuum is transmitted into the box 12a. Then, the diaphragm 12b of the push-up mechanism 12 moves the expansion sheet 5 of the wafer tray 4 to the ring 12d.
While the diaphragm 12 is adsorbed,
The semiconductor chip 6 on the surface of the expansion sheet 5 is moved back into the box 12a until the diaphragm 12b comes into contact with the stopper 12f in the box 12a, as shown in FIG. Stick out.

Therefore, one of the pickup collets 11a and 11b at both ends of the rotating body 9 faces one of the pickup collets 11a facing the wafer tray 4.
Is moved toward the expansion sheet 5 by the first reciprocating mechanism 18 so that the semiconductor chip 6 protruding as described above is vacuum-sucked to the one pickup collet 11a and picked up.

When the semiconductor chip 6 is picked up by the one pickup collet 11a in this manner, the inside of the box 12a is released to the atmosphere by the switching operation of the three-way switching valve 16, and the diaphragm 12b is returned to its original state by its elastic force. XY table 3
After the next operation, the next semiconductor chip 6 is fed to a position on the same axis as the push-up needle 12e, and is repeatedly pushed out as shown in FIG.

On the other hand, the one pickup collet 11a that picks up the semiconductor chip 6 is located at a position facing the semiconductor chip mounting portion 2a of the lead frame 2 by rotating the rotating body 9 by 180 degrees.
Since the other pickup collet 11b faces the wafer tray 4, in this state, the one pickup collet 11a is advanced toward the lead frame 2 by the second reciprocating mechanism 19, and then the vacuum suction is performed. By releasing, the semiconductor chip 6 can be supplied to the semiconductor chip mounting portion 2a of the lead frame 2 and at the same time, the other pickup collet 11
The semiconductor chip 6 on the wafer tray 4 can be picked up by advancing the wafer b toward the wafer tray 4 by the first reciprocating mechanism 18. Are supplied one by one to each semiconductor chip mounting portion 2a in the lead frame 2.

In the above embodiment, two pickup collets 11a and 11b are provided for the rotating body 9 and the rotating body 9 is reciprocated by 180 degrees. However, as shown by a two-dot chain line in FIG. 2, four pickup collets are provided for the rotating body 9 and the rotating body 9 is configured to rotate by 90 degrees in the same direction. The number of pickup collets provided on the body may be four or more.

[Brief description of the drawings]

FIG. 1 is a vertical sectional front view showing an embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a side view taken along the line III-III in FIG. 1;

FIG. 4 is a plan view as viewed from IV-IV in FIG. 1;

FIG. 5 is an enlarged view of a main part of FIG. 1;

FIG. 6 is a diagram showing an operation state of FIG. 5;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transfer path 2 Lead frame 2a Semiconductor chip mounting part 3 XY table 4 Wafer tray 5 Expansion sheet 6 Semiconductor chip 8 Rotating shaft 8a Axis 9 Rotating body 10 Bearing part 11a, 11b Pickup collet 12 Push-up mechanism

Continuation of front page (56) References JP-A-63-100737 (JP, A) JP-A-63-41032 (JP, A) JP-A-2-67739 (JP, A) JP-A-2-205040 (JP) JP-A-62-26833 (JP, A) JP-A-2-20332 (JP, U) JP-A-62-157153 (JP, U)

Claims (1)

(57) [Claims] 1. A wafer tray is mounted on a side of a transfer path for transferring a lead frame with the semiconductor chip mounting portion of the lead frame being substantially horizontal, and an expansion sheet on the wafer tray is positioned in a vertical plane perpendicular to a horizontal plane. The wafer tray is arranged so as to be parallel to each other, and is moved on an XY table in two axial directions orthogonal to each other on a plane parallel to the vertical plane. In the region between the two, the rotating body is rotated around an axis inclined at an angle of approximately 45 degrees with respect to both the surface of the expansion sheet in the wafer tray and the semiconductor chip mounting portion in the lead frame. And a pickup collet is provided at least at each of the left and right ends of the rotating body. Supplying apparatus for semiconductor chips for the lead frame, characterized in that provided.