JPH08285917A - Adapter device for circuit board inspection - Google Patents

Abstract

(57) [Abstract] [Purpose] It is suitable for inspection of circuit boards with a high degree of wiring freedom and a high degree of integration, is easy to manufacture, and is economical when the anisotropic conductive elastomer layer is worn. To provide a circuit board inspection adapter device capable of recovering its function. [Structure] It has a separable front connector and a backup connector, and is inserted between a circuit board and a tester connection portion for inspection to electrically connect them.
The front connector includes an anisotropic conductive elastomer layer integrated on the upper surface and an insulating substrate having a contact electrode on the lower surface,
The conductive path forming portion of the anisotropic conductive elastomer layer corresponding to the electrode to be inspected and the contact electrode are connected by a through conductive path. The backup connector includes an inner surface electrode on the upper surface, an outer surface electrode on the lower surface, an insulating substrate having a through conductive path connecting them, and an integrated anisotropic conductive elastomer layer on the upper surface. The pitch of the contact electrode, the conductive path forming portion, and the outer surface electrode increases in this order.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board inspection adapter device used for electrically connecting a circuit board such as a printed circuit board to a tester for the purpose of inspecting the circuit board.

[0002]

2. Description of the Related Art In general, various electronic functional elements are formed on a surface of a circuit board such as a printed circuit board with a considerably high degree of integration, and each element is connected to each other and each element is connected to a peripheral lead. Wiring portions for electrically connecting to the electrodes are similarly formed with high density. Then, for such a circuit board, in order to confirm that the circuit exhibiting the intended function is completed when the manufacture is completed, in the circuit board, the element portion, the wiring portion,
It is necessary to inspect an appropriate part of the conductive part such as the lead electrode part whether it is electrically connected or insulated from another predetermined part.

Such a circuit board is inspected by a tester, and in order to perform this, a large number of electrodes to be inspected set in the conductive portion of the circuit board are electrically connected to the inspection connection portion of the tester. It is necessary to do this and an adapter device is used to achieve this. Various connectors can be used as this adapter device.

However, at present, in circuit boards, conductive parts such as functional elements are becoming finer and the degree of integration thereof is considerably higher, and accordingly, the density of electrodes and wirings in the connector is also increased. It is necessary to increase the resolution to obtain a high resolution, and for this reason,
Conventionally, for example, a multilayer wiring type connector is preferably used. This multilayer wiring type connector is formed by integrally laminating a plurality of insulating layers, a surface electrode corresponding to an electrode to be inspected of a circuit board to be inspected is formed on the surface of the laminated body, and a tester is formed on the back surface. A back electrode corresponding to the contact of the inspection connection part is formed, and the front surface electrode and the back surface electrode are an in-plane wiring part arranged on the front surface, the back surface and each layer of the insulating layer laminate, and The in-plane wiring portions are electrically connected to each other by the through wiring portions.

[0005]

However, in the multi-layer wiring type connector, as will be described in detail below, since a plurality of insulating layers are integrated, an electrode or wiring is added for manufacturing reasons. However, there is a problem that the density cannot be sufficiently high.

For example, as shown in FIG. 4A, in a multilayer wiring type connector 60 having a three-layer structure, a surface insulating layer 61
In the case of electrically connecting the surface electrode A formed on the surface of the other surface electrode B to the other surface electrode B, the connection wiring may be formed on the surface of the surface insulating layer 61 most simply. A large number of other electrodes or wiring portions are usually formed on the surface, and these are wiring prohibited portions in which connection wiring cannot be provided. In FIG. 4A, such a wiring prohibited portion N indicated by a black circle.
Is not only the surface of the surface insulating layer 61 but also the surface insulating layer 61.
And the intermediate insulating layer 62, between the intermediate insulating layer 62 and the back insulating layer 63, and on the surface of the back insulating layer 63.

In order to provide the connection wiring by bypassing the wiring prohibited portion N or avoiding contact with the wiring prohibited portion N, the surface wiring portion S1 and the in-plane wiring portion S2 between the surface insulating layer 61 and the intermediate insulating layer 62 are provided. , The in-plane wiring portion S3 between the intermediate insulating layer 62 and the back surface insulating layer 63, the back surface wiring portion S4 on the surface of the back surface insulating layer 63, and the surface insulating layer 61 extending through in the thickness direction, A through wiring portion T1 electrically connecting electrodes or in-plane wiring portions provided on both surfaces of the layer 61 to each other, a similar through wiring portion T2 formed in the intermediate insulating layer 62, and a similar formed in the back surface insulating layer 63. It is necessary to form and arrange the through wiring part T3 of FIG.

However, in the all-layer through wiring portion Ta related to the front surface electrode B in the structure of FIG. 4A, all of the front surface insulating layer 61, the intermediate insulating layer 62 and the back surface insulating layer 63 are continuously arranged along a straight line. It is a conductive path that penetrates, and this is relatively easy to manufacture because it is sufficient to form a through hole that continuously and linearly penetrates the whole and dispose a conductive material by metal plating or the like inside it. On the other hand, due to the existence of the all-layer through-wiring portion Ta, a wiring prohibited portion is formed at the same point in all insulating layers, so that the degree of freedom of wiring is significantly reduced, and the wiring board type is a multilayer wiring board type. The advantage of this will be greatly diminished.

In order to reduce such problems, FIG.
As shown in (b), it extends from the front surface or the back surface, but does not penetrate all the insulating layers, but forms a via hole, which is also called a blind hole, as a hole. It is also known to form the section Tb. With such a configuration, the degree of freedom of wiring is increased as compared with the case of forming a through hole, but on the other hand, extremely precise control is required in the work for forming a blind hole accurately. Therefore, the manufacturing is not easy, and the manufacturing cost is high.

As described above, in the conventional adapter device using the multi-layer wiring type connector, sufficient resolution cannot be obtained because a sufficiently large degree of freedom of wiring cannot be obtained, and as a result, inspection of a circuit board having a high degree of integration is performed. However, there is a problem in that it is difficult to manufacture and the manufacturing cost is high if the wiring can not be sufficiently dealt with, or a relatively large degree of freedom of wiring can be obtained.

Further, as an adapter device using a multi-layer wiring type connector, one having an anisotropic conductive elastomer layer provided on the surface of the connector has been developed so that the electrodes to be inspected of the circuit board to be inspected are not damaged. However, in such a configuration, if the anisotropic conductive elastomer layer is worn due to the circuit board to be inspected being contacted many times, the entire adapter device must be replaced. There is a problem that it is not economical because it must be done.

The present invention is intended to solve the above problems, and an object of the present invention is to sufficiently inspect a circuit board having a high degree of integration and a high degree of integration because wiring freedom is sufficiently high. The present invention provides an adapter device for inspecting a circuit board, which can meet the above requirements, is easy to manufacture, has a low manufacturing cost, and can economically recover its function when the anisotropic conductive elastomer layer on the surface is damaged. Especially.

[0013]

A circuit board inspection adapter device of the present invention is inserted between a circuit board to be inspected and an inspection connection portion of a tester, and an electrode to be inspected of the circuit board and An adapter device for inspecting a circuit board, which electrically connects an inspection connecting portion of a tester, wherein a whole board-shaped front connector arranged on the side of the circuit board and the front connector are separably stacked with each other. An entire board-shaped backup connector arranged between the front connector and the tester connection portion, the front connector comprising: (a) an insulating substrate; and (b) an insulating substrate. An anisotropic conductive elastus which is provided by integrally laminating so as to cover the upper surface of the board (a) and has a conductive path forming portion arranged corresponding to the electrodes to be inspected of the circuit board, and which contacts the circuit board. And mer layer, (c) an insulating substrate (a)
Of the contact electrodes formed on the lower surface of the substrate at small reference grid points with a small pitch, and (d) the anisotropic conductive elastomer layer (b) formed so as to extend in the thickness direction of the insulating substrate (a). ) And a through conductive path for electrically connecting the conductive path forming portion to the contact electrode, the backup connector has (b) an insulating substrate and (b) an upper surface of the insulating substrate (b). An inner surface electrode formed at a position corresponding to the contact electrode (c) of the front connector,
(C) The contact electrode (c) is integrally laminated so as to cover the upper surface of the insulating substrate (a) on which the inner surface electrode is formed.
An anisotropic conductive elastomer layer that is in contact with the lower surface of the front connector and that has a conductive path forming portion arranged at an intermediate reference grid point position with a pitch larger than the pitch of the minute reference grid points according to ) Arranged at a coarse reference grid point position formed on the lower surface of the insulating substrate (a) at a pitch larger than the pitch of the intermediate reference grid points related to the conductive path forming portion in the anisotropic conductive elastomer layer (c). And an outer surface electrode, and (e) a through conductive path formed to extend in the thickness direction of the insulating substrate (a) for electrically connecting the inner surface electrode (b) and the outer surface electrode (d). The outer surface electrode (d) is electrically connected to the inspection connecting portion of the tester.

[0014]

According to the circuit board inspecting adapter device of the present invention, even when the electrodes to be inspected on the circuit board to be inspected are fine ones with a high-density complicated pattern having a fine pitch, the front connector Through the backup connector and the backup connector, the required electrical connection of the circuit board to the test connection portion of the tester can be reliably achieved.

Since the front connector and the backup connector can be separated from each other, when the anisotropic conductive elastomer layer forming the surface of the front connector is worn, only the front connector needs to be replaced. Can still be used as is. Further, in both of the front connector and the backup connector, since the insulating layer is only one layer made of the insulating substrate, the through conductive path can be always formed by using the through hole, so that the manufacturing is easy. Since the manufacturing cost is low and a multilayer wiring structure is substantially achieved as a whole, a very large degree of freedom of wiring can be obtained, and it is possible to sufficiently cope with the inspection of a circuit board having a high degree of integration.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to the drawings. FIG. 1 shows a schematic configuration of a circuit board inspecting adapter device 10 according to an embodiment of the present invention, showing a part of a circuit board 12 to be inspected arranged on an upper side and a tester arranged on a lower side. FIG. 5 is an explanatory cross-sectional view showing together with an inspection connecting portion 15. Reference numeral 13 denotes an electrode to be inspected on the circuit board 12.

This adapter device 10 includes a circuit board 12
The front connector 20 has a plate shape and is placed on the side
And a backup connector 3 that is entirely plate-shaped and is arranged below the front connector 20 so as to be stacked.
0, which are manufactured independently of each other and stacked so as to be separable from each other.

The front connector 20 has an insulating substrate 21 made of an appropriate resin, and an anisotropic conductive elastomer layer 22 is laminated and integrally provided so as to cover the upper surface of the insulating substrate 21. The anisotropic conductive elastomer layer 22 has conductive path forming portions 23 each extending in the thickness direction and electrically insulated from adjacent ones.
It is formed in a shape and a position corresponding to the pattern corresponding to the second electrode 13 to be inspected, that is, the pattern opposite to the pattern of the electrode 13 to be inspected, and slightly protruding outward. Contact electrodes 25 are formed on the lower surface of the insulating substrate 21 at appropriate positions on small reference grid points with a small pitch.

Further, an upper surface electrode 24 is formed on the upper surface of the insulating substrate 21 so as to be located in the entire region directly below the conductive path forming portion 23 of the anisotropic conductive elastomer layer 22, and further, if necessary, An upper surface wiring portion 27 connected to the upper surface electrode 24 is formed. Further, a lower surface wiring portion 28 connected to the contact electrode 25 is formed on the lower surface of the insulating substrate 21 as needed.

A through conductive path 26 is formed so as to extend through the insulating substrate 21 in the thickness direction, whereby a conductive path forming portion 23 of the anisotropic conductive elastomer layer 22 and, for example, a position directly below it. Alternatively, the contact electrode 25 existing in the vicinity thereof is electrically connected. In the insulating substrate 21, the through conductive path 26 is formed at the position where the through conductive path 26 is formed.
5, the upper surface wiring portion 27 and the contact electrode 25 are directly connected, the upper surface electrode 24 and the lower surface wiring portion 28 are directly connected, and the upper surface wiring portion 27.
And the lower surface wiring portion 28 may be directly connected to each other.

The backup connector 30 has an insulating substrate 31 made of an appropriate resin.
On the upper surface of the one or more anisotropic conductive elastomer layers 32 corresponding to the contact electrodes 25 of the front connector 20.
Of the inner surface electrode 34 so as to be located immediately below the conductive path forming portion 33 of
And an inner surface wiring portion 37 connected to the inner surface electrode 34 is formed if necessary.

Further, an anisotropic conductive elastomer layer 32 is laminated and integrally provided so as to cover the entire upper surface of the insulating substrate 31 on which the inner electrode 34 and the inner wiring portion 37 are formed. In this anisotropic conductive elastomer layer 32, a large number of conductive path forming portions 33 each extending in the thickness direction and electrically insulated from adjacent ones are provided as a minute reference for the contact electrode 25 of the front connector 20. All of the intermediate reference grid point positions having a pitch larger than the grid point pitch are formed so as to project slightly upward.

Further, on the lower surface of the insulating substrate 31, a conductive path is formed in the anisotropic conductive elastomer layer 32 corresponding to the connecting contacts 16 arranged at the standard lattice point positions in the test connecting portion 15 of the tester. The outer surface electrode 35 arranged at the coarse reference grid point position having a pitch larger than the pitch of the intermediate reference grid point related to the portion 33 is provided, and the outer surface wiring portion 38 connected to the outer surface electrode 35 is provided as necessary. Has been formed.

A through conductive path 36 is formed so as to extend through the insulating substrate 31 in the thickness direction, whereby the inner electrode 34 and the outer electrode 35 are electrically connected. In the insulating substrate 31, the position where the through conductive path 36 is formed is such that the through conductive path 36 directly connects the inner surface electrode 34 and the outer surface electrode 35, and the inner surface wiring portion 37 and the outer surface electrode 35 are directly connected to each other. May be connected to the inner surface electrode 34, the outer surface wiring portion 38 may be directly connected, and the inner surface wiring portion 37 and the outer surface wiring portion 38 may be directly connected.

In the above, it is preferable that the insulating substrate 21 of the front connector 20 and the insulating substrate 31 of the backup connector 30 are both heat resistant materials having high dimensional stability, and various resins are used. However, the glass fiber reinforced epoxy resin is most suitable.

The anisotropic conductive elastomer layer 32 of the backup connector 30 is formed so as to be integrally adhered or adhered to the surface of the insulating substrate 31. As shown in FIG. 2, the anisotropic conductive elastomer layer 32 is adjacent to a large number of conductive path forming portions 33 each having conductive particles P densely packed in an insulating elastic polymer material E. The objects are insulated from each other by the insulating portion 40. In each conductive path formation portion 33, the conductive particles P are oriented so as to be aligned in the thickness direction, and a conductive path extending in the thickness direction is formed. The conductive path forming portion 33 may be a pressurizing conductive portion whose resistance value is reduced to form a conductive path when pressed and compressed in the thickness direction. On the other hand, the insulating portion 40 does not have a conductive path formed in the thickness direction even when pressure is applied.

In the illustrated example, on the outer surface of the anisotropic conductive elastomer layer 32, the conductive path forming portion 33 forms a protruding portion protruding from the surface of the insulating portion 40. According to such a configuration, the anisotropic conductive elastomer layer 32
Is compressed in the thickness direction, the degree of compression depends on the insulating portion 40.
Since the conductive path forming portion 33 is larger, a conductive path having a sufficiently low resistance value is surely formed, which makes it possible to reduce the degree of change in the resistance value with respect to the change or change in the pressing force. As a result, the anisotropic conductive elastomer layer 3
Even if the pressing force applied to 2 is non-uniform, the desired electrical connection can be reliably achieved.

When the conductive path forming portion 33 forms a protrusion in this manner, the protrusion height h of the protrusion is the total thickness t (t = h + d, d) of the anisotropic conductive elastomer layer 32. Is the thickness of the insulating portion 40). Further, the total thickness t of the anisotropic conductive elastomer layer 32
Is preferably 300% or less of the electrode pitch p defined as the distance between the centers of the conductive path formation portions 33, that is, t ≦ 3p. By satisfying such a condition, even if the pressing force applied to the conductive path forming portion 33 changes, the change in conductivity of the conductive path forming portion 33 due to the change is suppressed sufficiently small. is there.

When the conductive path forming portion 33 forms a protruding portion, it is not always necessary that the entire plane of the protruding portion has conductivity, and for example, 20% or less of the electrode pitch is provided on the periphery of the protruding portion. The conductive path non-formation part of may exist. Further, the minimum value of the separation distance r between the adjacent conductive path forming portions 33 is preferably 10% or more of the width R of the conductive path forming portions 33. By satisfying such a condition, it is possible to sufficiently avoid the possibility that the conductive path forming portions 33 adjacent to each other electrically contact with each other due to the lateral displacement when the protrusion is deformed due to pressure. can do. In the above example, the planar shape of the conductive path forming portion 33 can be a circle having a necessary area, or any other suitable shape.

As the conductive particles P in the conductive path forming portion 33, for example, particles of a metal exhibiting magnetism such as nickel, iron, cobalt or particles of an alloy thereof, or gold, silver, palladium, rhodium or the like in these particles is used. And non-magnetic metal particles or glass beads or other inorganic particles or polymer particles plated with a conductive magnetic material such as nickel or cobalt.

The particle size of the conductive particles is 3 to 20 so that the conductive path forming portion 33 can be easily deformed under pressure and sufficient electrical contact can be obtained between the conductive particles in the conductive path forming portion 33.
The thickness is preferably 0 μm, and particularly preferably 10 to 100 μm.

As the insulating and elastic polymeric substance E forming the conductive path forming portion 33, a polymeric substance having a crosslinked structure is preferable. Examples of the curable polymer material that can be used to obtain the crosslinked polymer material include silicone rubber, polybutadiene, natural rubber, polyisoprene, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber. , Ethylene-propylene copolymer rubber, urethane rubber, polyester rubber, chloroprene rubber, epichlorohydrin rubber, soft liquid epoxy resin and the like.

Specifically, it is preferable to use a material for a polymer substance which is in a liquid state before the curing treatment and is integrated with the insulating substrate 31 after the curing treatment so as to be in a close contact state or an adhesive state. From such a point of view, as a suitable material for the polymer substance, liquid silicone rubber, liquid urethane rubber, soft liquid epoxy resin and the like can be mentioned. Additives such as a silane coupling agent and a titanium coupling agent can be added to the polymer material in order to improve the adhesion of the anisotropic conductive elastomer layer 32 to the insulating substrate 31.

As the material forming the insulating portion 40, the same or different material as the polymer material forming the conductive path forming portion 33 can be used. Similarly, it is in a state of being in close contact with the insulating substrate 31 after the curing treatment. Alternatively, the one that holds the bonded state and is integrated with the insulating substrate 31 is used.

The anisotropic conductive elastomer layer 22 of the front connector 20 is also formed so as to be integrally adhered or adhered to the surface of the insulating substrate 21. The anisotropic conductive elastomer layer 22 is basically as described above except that the position and the planar shape of the conductive path forming portion 23 are set to the position and shape corresponding to the electrode 13 to be inspected of the circuit board 12. The backup conductive connector 30 may have the same structure as the anisotropic conductive elastomer layer 32.

In the adapter device having the above structure, the front connector 2 is provided on the backup connector 30.
In a state where 0s are positioned and stacked on each other, the circuit board 12 to be inspected is positioned on the upper surface side of the anisotropic conductive elastomer layer 22 of the front connector 20, and the tester is inspected on the lower surface side of the backup connector 30. The connection portion 15 is arranged so as to be positioned. Then, the front connector 20 and the backup connector 30 are clamped in the thickness direction (vertical direction in FIG. 1) between the circuit board 12 and the tester connection portion 15 by an appropriate clamping means. It

In such a state, the circuit board 12
The electrode 13 to be inspected is pressed by the conductive path forming portion 23 of the anisotropic conductive elastomer layer 22 of the front connector 20 and thereby electrically connected to the contact electrode 25 through the through conductive path 26. Become. At the same time, the contact electrode 25 of the front connector 20 is pressed against the conductive path forming portion 33 of the anisotropic conductive elastomer layer 32 of the backup connector 30, whereby the contact electrode 25 is applied to the outer surface electrode 35 via the inner surface electrode 34 and the through conductive path 36. It is in an electrically connected state. Then, the outer surface electrode 35 is brought into contact with and electrically connected to the test connecting portion 15 of the tester.

As a result, the electrodes 13 to be inspected on the circuit board 12
However, the adapter device 10 including the front connector 20 and the backup connector 30 realizes a state of being electrically connected to the inspection connecting portion 15 of the tester. In this state, the electrode 13 to be inspected on the circuit board 12 is The tester checks the electrical connection status. At this time, the electrodes 13 to be inspected of the circuit board 12
Since the anisotropic conductive elastomer layer 22 which is flexible and rich in elasticity is directly contacted with the surface on which is located, the surfaces of the electrode 13 to be inspected and the circuit board 12 are not damaged.

In the adapter device having the above construction,
Front connector 20 and backup connector 30
Since and are configured to be independent of each other, both surfaces of the insulating substrate in each of them can be used as the wiring portion formation surface. That is, in the example of FIG. 1, the upper wiring portion 27 and the lower wiring portion 28 can be formed on the insulating substrate 21 of the front connector 20, and the inner wiring portion 37 and the outer surface of the insulating substrate 31 of the backup connector 30 can be formed. The wiring portion 38 can be formed.

In addition, in each of the insulating substrates 21 and 31, in order to form the through conductive paths 26 and 36, a hole is formed through each of the insulating substrates 21 and 31. Therefore, it is not necessary to form a through hole that continuously and linearly penetrates all of the plurality of laminated insulating layers, and therefore, the degree of freedom of wiring can be increased and The whole is easy to manufacture and the cost is low.

This becomes more apparent when the adapter device of the above embodiment is compared with the configuration of FIG. 4, for example. That is, in the adapter device of the above-described embodiment, the surfaces that can be used as the wiring part forming surfaces are the two surfaces of each of the insulating substrates 21 and 31, that is, four surfaces in total, and because of the through conductive paths 26. It is sufficient to simply form a hole in the insulating substrate. On the other hand, in the example of FIG. 4, the surface that can be used as the wiring part formation surface is the surface of the surface insulating layer 61, the inner surfaces of the surface insulating layer 61 and the intermediate insulating layer 62, and the intermediate insulating layer 62 and the back insulating layer 6.
Although there are a total of four surfaces including the inner surface of No. 3 and the surface of the back surface insulating layer 63, it is necessary to form a through hole that continuously extends all of the plurality of insulating substrates, or a blind hole having a dead end. Need to be formed.

In the backup connector 30, the position of the conductive path forming portion 33 of the anisotropic conductive elastomer layer 32 is the contact electrode 2 of the front connector 20.
5 is set to an intermediate reference grid point position larger than the pitch of the minute reference grid points, and the position of the outer surface electrode 35 is set to a coarse reference grid point position larger than the pitch of the intermediate reference grid points related to the conductive path forming portion 33. Therefore, even if the electrodes 13 to be inspected on the circuit board 12 are fine and have a high density, it is possible to easily achieve a state in which the electrodes 13 are surely electrically connected to the inspection connection portion 15 of the tester. Therefore, high resolution and high reliability can be obtained.

In a specific example of the adapter device having the above-mentioned configuration, the pitch of the fine reference grid points related to the contact electrodes 25 is 0.2 mm, the intermediate reference grid related to the conductive path forming portion 33 of the anisotropic conductive elastomer layer 32. The point pitch is 0.
The pitch of the coarse reference grid points related to the outer surface electrode 35 is 5 mm, which is 5 mm, but these can be freely set or changed.

Further, when the inspection is performed a number of times, the anisotropic conductive elastomer layer 22 of the front connector 20 against which the circuit boards are repeatedly contacted and pressed gradually wears, but the front connector 20 is backed up. Since it is configured to be separable from the connector 30, it is not necessary to replace the entire adapter device,
Since the backup connector 30 can be used as it is by replacing only the front connector 20, it is possible to economically restore the initial function of the adapter device.

The front connector and the backup connector in the adapter device of the present invention each have a single insulating substrate as a base and are not integrally laminated with other insulating substrates, so that warping or the like is prevented. Since the possibility of deformation is very small, high flatness and high dimensional stability are always obtained, and both have anisotropic conductive elastomer layers,
Multiple elastomer layers will be interposed between the circuit board to be inspected and the tester's test connection, and as a result, the circuit board, front connector and backup connector, tester's test connection, etc. Since it is possible to sufficiently absorb the displacement of the dimension, it is possible to achieve a good pinching state between the circuit board and the tester connection portion of the tester. Can be inspected.

Further, the anisotropic conductive elastomer layers 22, 3
Since 2 is formed integrally with the insulating substrates 21 and 31, the anisotropic conductive elastomer layers 22 and 3 are not affected by environmental changes such as thermal history due to temperature changes.
There is no displacement between the insulating substrate 21 and the insulating substrates 21 and 31 such as displacement.

In the present invention, the anisotropic conductive elastomer layers of the front connector and the backup connector are not limited to those in which each of the conductive path forming portions is formed so as to project from the periphery thereof, and are flat. It may have a surface. Further, in the front connector and the backup connector, it is not essential that the anisotropic conductive elastomer layers of both have basically the same structure, and each has an appropriate structure according to the purpose. be able to.

Although one embodiment of the present invention has been described above, in the present invention, the thickness thereof is provided between the front connector 20 and the backup connector 30 or between the backup connector 30 and the tester connection portion of the tester. A suitable anisotropically conductive connector having a conductive path in the direction, for example, a connector having the same configuration as the front connector 20 or the backup connector 30 may be additionally provided. In this case, the electrode pitch of each connector may be arranged. It is possible to obtain an even higher resolution by properly setting.

The circuit board to be inspected by the adapter device of the present invention is not particularly limited, and it is possible to perform an electrical inspection on the electrodes to be inspected on various circuit boards. Further, the tester and its inspection connecting portion are not particularly limited as long as the adapter device of the present invention can be pinched between the tester and the circuit board. Also, the tester connecting portion does not have to be provided integrally with the tester body,
It may have an independent structure electrically connected to the tester.

In the present invention, by stacking a plurality of front connectors each having a different shape or size to form a front connector composite, a plurality of electrode placement surfaces are provided at different levels like a so-called digging circuit board. A circuit board provided with can also be an inspection target.

FIG. 5 is an explanatory perspective view showing the basic structure of the engraved circuit board, and FIG. 6 is a sectional view for explaining the arrangement and wiring of the integrated circuit chips on the engraved circuit board of FIG. The digging circuit board 70 in the illustrated example is
The whole is, for example, a rectangular plate-shaped multilayer wiring board, and in the central region of one surface thereof, there is formed a planar rectangular first recess 71A having a size smaller than the outer dimensions of the circuit board 70. As a result, the region remaining on the one surface forms a rectangular frame-shaped first electrode placement surface 70A that surrounds the opening of the first recess 71A.

The bottom surface of the first recess 71A is formed with the second recess 71B having a planar rectangular shape having a size smaller than the size of the first recess 71A in the central region thereof.
The rectangular frame-shaped second electrode placement surface 70B is formed to remain in the outer peripheral region. Furthermore, a third frame 71C having a rectangular frame shape is formed on the bottom surface of the second recess 71B by forming a third recess 71C having a planar rectangular shape with a smaller size in the same manner. Has been done. Then, by forming a rectangular central through hole 72 smaller than the size of the third recess 71C on the bottom surface of the third recess 71C,
A rectangular frame-shaped chip arrangement step 73 is left and formed.

In the digging circuit board 70 having such a structure, as shown in FIG. 6, a so-called bare integrated circuit chip 80 is arranged and fixed on the step surface of the chip arrangement step 73, and the integrated circuit chip is fixed. 80 predetermined electrodes are provided with a total of three electrode placement surfaces 70A via appropriate wire rings 75.
To 70C, the corresponding terminal electrodes 76A to 76C are electrically connected.

Therefore, in the digging circuit board 70,
The electrode arrangement surface to be formed on the one surface is divided into a plurality of (three in the illustrated example) surface portions, which are in a state of surrounding the integrated circuit chip 80 at different levels in a stepwise manner. For this reason, since the dugout circuit board 70 is configured as a multilayer wiring board, the wiring 75 ensures reliable electrical connection to the electrodes of the integrated circuit chip 80 that is fine and has a high arrangement density. Can be achieved.

However, since a plurality of electrode arrangement surfaces are provided at different levels in the thickness direction of the board for such a digging circuit board 70, the electrodes to be inspected arranged on one plane are arranged. In a normal circuit board inspection device configured to contact each other, it is possible to realize a state in which the inspection connection portion is electrically connected to the electrodes to be inspected on all electrode arrangement surfaces all at once or simultaneously. Very difficult. Therefore, in practice, it is necessary to perform the inspection for each electrode arrangement surface, and as a result, there is a problem that the inspection efficiency becomes extremely low.

According to the present invention, however, as will be described in detail below, a circuit board which can be extremely easily executed as a target circuit board to be inspected even for a digged circuit board. A test adapter device can be constructed.

FIG. 3 is an explanatory sectional view showing an example of an adapter device for inspecting a circuit board according to the present invention, which is constructed so as to be applicable to the inspection of a digging circuit board. In this FIG.
The digging circuit board 70 is shown in a state in which each of the electrode placement surfaces 70A to 70C faces downward.
The electrodes 77A to 77C to be inspected are formed to slightly project.

A backup spacer 82 having a thickness equivalent to the depth is disposed in the central through hole 72, and the third recess 71C is provided in the third recess 71C.
Simulated chip 83 having a size and shape adapted to is arranged. 77D is a ground electrode connected to an integrated circuit chip to be arranged later.

A third front connector 20C having a shape matching the second recess 71B is arranged in the second recess 71B of the digging circuit board 70. Simulated chip 83 in the central area
And the outer peripheral region faces the third electrode arrangement surface 70C. In addition, in the first recess 71A, a second shape having a shape adapted to the first recess 71A is formed.
The front connector 20B is arranged such that the central region of the second front connector 20B faces the third front connector 20C and the outer peripheral region faces the second electrode arrangement surface 70B. Furthermore, this second
Front connector 20B and first electrode arrangement surface 70
A state in which the first front connector 20A is disposed on the outer surface side of A, the central region of the first front connector 20A faces the second front connector 20B, and the outer peripheral region faces the first electrode placement face 70A. It is said that

Then, the first front connector 20A
A backup connector 30 is disposed on the outer surface side of the tester, and a tester connecting portion 15 is disposed therethrough. 90 is an elastic body for pressing.

The first front connector 20A to the third front connector 20C have the same basic structure as the above-mentioned front connector, and include an insulating substrate and an anisotropic conductive member integrally provided on the insulating substrate. Conductive anisotropic layer, the conductive path forming portion is formed in the anisotropic conductive elastomer layer in the outer peripheral region in a pattern corresponding to the corresponding electrode to be inspected. That is, the inspected electrode 77A of the first electrode arrangement surface 70A is in the outer peripheral area of the first front connector 20A, and the inspected electrode 77B of the second electrode arrangement surface 70B is in the outer peripheral area of the second front connector 20B. And the third front connector 20C
The electrode 77 to be inspected on the third electrode placement surface 70C
Conductive path forming portions are provided in a pattern that respectively matches C.

According to this structure, the third front connector 20C directly contacts the third electrode arrangement surface 70C in the outer peripheral area in a state where the whole is pressed by the pressing elastic body 90 and the like. Inspected electrode 77C
Elastically contact with the inspected electrode 77C, and finally, the above-described function as the front connector is exerted on the inspected electrode 77C. Also, the second front connector 20B
Is brought into direct contact with the second electrode placement surface 70B in its outer peripheral region and elastically contacts the electrode 77B to be inspected, and in the end, the function as a front connector is exerted with respect to the electrode 77B to be inspected. At the same time, it also functions as a backup connector for the third front connector 20C. Further, similarly, the first front connector 20A also comes into direct contact with the first electrode arrangement surface 70A in the outer peripheral region thereof and elastically contacts the inspected electrode 77A.
It functions as a front connector for A and simultaneously functions as a backup connector for the second front connector 20B.

As described above, according to the above-described circuit board inspection adapter device, even for the circuit board to be inspected in which the electrodes to be inspected are provided on the plurality of electrode arrangement surfaces positioned at different levels, By arranging multiple front connectors in a stack, it is possible to obtain a state in which at least a part of the front surface of one of the front connectors is in direct contact with any of the electrode placement surfaces, and as a result, all of the electrode placement surfaces are On the other hand, the state in which the desired electrical connection is achieved can be realized reliably and extremely easily.
That is, when a so-called digging circuit board is used as the inspection target circuit board, the number of steps, the height of the step, the shape, etc. of the digging circuit board are different, but according to the configuration of the present invention, According to the state of the circuit board to be inspected, the number of front connectors and their respective shapes are appropriately selected, and by combining them to form a front connector composite, the circuit to be inspected is surely obtained. It is possible to construct an adapter device for circuit board inspection having a contact surface corresponding to the electrode arrangement surface of the board.

[0064]

According to the circuit board inspecting adapter device of the present invention, even when the electrodes to be inspected of the circuit board to be inspected are fine ones with a high-density complicated pattern having a minute pitch, Through the front connector and the backup connector, it is possible to reliably achieve the required electrical connection of the circuit board to the test connecting portion of the tester.

According to the circuit board inspection adapter device of the present invention, since the front connector and the backup connector can be separated from each other, when the anisotropic conductive elastomer layer forming the surface of the front connector is damaged. Since only the front connector needs to be replaced and the backup connector can be used continuously, the initial function can be economically restored. Further, in both of the front connector and the backup connector, since the insulating layer is only one layer made of the insulating substrate, the through conductive path can be always formed by using the through hole, so that the manufacturing is easy. Since the manufacturing cost is low and a multilayer wiring structure is substantially achieved as a whole, a very large degree of freedom of wiring can be obtained, and it is possible to sufficiently cope with the inspection of a circuit board having a high degree of integration.

Further, by stacking a plurality of front connectors each having a different shape or size to form a front connector composite, a plurality of electrode arrangement surfaces are provided at different levels like a so-called recessed circuit board. The circuit board on which it is mounted can also be an inspection target.

[Brief description of drawings]

FIG. 1 is an explanatory cross-sectional view showing a schematic configuration of a circuit board inspection adapter device according to an embodiment of the present invention together with a part of a circuit board to be inspected and a test connection portion of a tester.

FIG. 2 is an enlarged sectional view for explaining an example of an anisotropic conductive elastomer layer portion in the adapter device of FIG.

FIG. 3 is an explanatory view showing a configuration of an adapter device for inspecting a circuit board of the present invention, which is suitable for a case where a digging circuit board is a circuit board to be inspected, and in which a front connector complex is composed of a plurality of front connectors. FIG.

FIG. 4 is an explanatory diagram of a multilayer wiring type connector, in which (a) has a through hole formed therein, and (b) has a blind hole formed therein.

FIG. 5 is an explanatory perspective view showing a basic configuration of a digging circuit board.

6 is a cross-sectional view for explaining the arrangement and wiring of integrated circuit chips on the digging circuit board of FIG. 5;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Adapter device 12 Circuit board 13 Electrode to be inspected 15 Connection part for inspection 20 Front connector 20A First front connector 20B Second front connector 20C Third front connector 21 Insulating substrate 22 Anisotropic conductive elastomer layer 23 Conductive path Forming part 24 Upper surface electrode 25 Contact electrode 26 Through conductive path 27 Upper surface wiring part 28 Lower surface wiring part 30 Backup connector 31 Insulating substrate 32 Anisotropic conductive elastomer layer 33 Conductive path forming part 34 Inner surface electrode 16 Connection contact 35 Outer surface electrode 36 Through conductive path 37 Inner surface wiring section 38 Outer surface wiring section 40 Insulation section P Conductive particles E Polymeric substance 60 Multilayer wiring type connector 61 Surface insulation layer A, B Surface electrode 62 Intermediate insulation layer 63 Backside insulation layer N Wiring prohibited area S1 surface Wiring part S2, S3 In-plane distribution Line portion S4 Backside wiring portion T1, T2, T3 Through wiring portion Ta All-layer through wiring portion Tb Local layer through wiring portion 70 Dug circuit board 70A First electrode arrangement surface 70B Second electrode arrangement surface 70C Third electrode arrangement surface 71A 1st recess 71B 2nd recess 71C 3rd recess 72 Central through-hole 73 Chip arrangement | positioning step 75 Wire ring 76A-76C
Terminal electrode 77A to 77C Inspected electrode 77D Earth electrode 80 Integrated circuit chip 82 Backup spacer 83 Simulated chip 90 Pressing elastic body

Claims (1)

[Claims] 1. A circuit board which is interposed between a circuit board to be inspected and a test connecting portion of a tester and electrically connects an electrode to be inspected of the circuit board and a test connecting portion of the tester. An inspection adapter device, which is entirely arranged on the side of a circuit board and has a plate-shaped front connector and is separably stacked with the front connector, and between the front connector and a tester connection part for inspection. The whole arranged has a plate-shaped backup connector, and the front connector is provided by integrally laminating (a) an insulating substrate and (b) an upper surface of the insulating substrate (a). An anisotropic conductive elastomer layer having a conductive path forming portion arranged corresponding to the electrode to be inspected of the circuit board and facing the circuit board; and (c) on the lower surface of the insulating board (a). Been formed A contact electrode arranged at a small reference grid point position with a small pitch; and (d) a conductive path forming portion of the anisotropic conductive elastomer layer (b) formed so as to extend in the thickness direction of the insulating substrate (a). The backup connector comprises: a through conductive path for electrically connecting to a contact electrode, wherein the backup connector comprises: (a) an insulating substrate; and (b) an upper surface of the insulating substrate (a), the contact electrode of the front connector being provided. (C) an inner surface electrode formed at a position corresponding to (c) and (c) an integrally laminated layer covering the upper surface of the insulating substrate (a) on which the inner surface electrode is formed.
An anisotropic conductive elastomer layer, which has a conductive path forming portion arranged at an intermediate reference grid point position with a pitch larger than the pitch of the minute reference grid points according to the above, and is in contact with the lower surface of the front connector. ) Arranged at a coarse reference grid point position, which is formed on the lower surface of the insulating substrate (a) and has a pitch larger than the pitch of the intermediate reference grid points related to the conductive path forming portion in the anisotropic conductive elastomer layer (c). And an outer surface electrode, and (e) a through conductive path formed to extend in the thickness direction of the insulating substrate (a) and electrically connecting the inner surface electrode (b) and the outer surface electrode (d). An adapter device for inspecting a circuit board, wherein the outer electrode (d) is electrically connected to an inspection connecting portion of a tester.