JPH08228073A - Processing equipment for soldering - Google Patents

Abstract

PURPOSE: To prevent the slippage of a lead for an electronic part to solder on a printed board. CONSTITUTION: The hold-down plate 1 of a processing equipment E1 for soldering pushes each lead L1 of an electronic part against solder H1 precoated on the part foot lands F1 of a printed board B1 , and each lead L1 is heated and melted. The underside 11 of the hold-down plate 1 consists of a pair of non-slip sections 11a with fine projections and a flat surface 11b between both non-slip sections 11a, and the non-slip sections 11a prevent the slippage of each lead L1 of the electronic part and the generation of lateral slippage on the surfaces of solder H1 curved in an oval shape and the generation of the trouble of solder bridges, etc., due to the generation of lateral slippage.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering processing apparatus which is suitable for soldering electronic parts having a narrow lead pitch (lead pitch), for example, TAB parts.

[0002]

2. Description of the Related Art Generally, when soldering an electronic component having a narrow lead pitch such as a TAB component, a component foot land of a printed circuit board is pre-coated with a required amount of solder in advance and the electronic component is mounted on the printed circuit board. After mounting and aligning each lead with the component foot land, the soldering processing device is pressed against each lead, and the solder is heated and melted through the leads. There is.

FIG. 4 is a partial schematic sectional view showing a soldering processing apparatus E ₀ used in such a soldering method, which includes a holding plate 101 vertically reciprocated by a pressure cylinder 101a. A heating block 10 which is brought into contact with the upper surface (rear surface) of the pressing plate 101 to heat it.
The heating block 102 has a resistance heater (not shown). The heating block 102 is brought into contact with the holding plate 101 to heat the holding plate 101 for a predetermined time and then lifted from the upper surface of the holding plate 101 by the lift cylinder 102a.

The lower surface 111 of the holding plate 101 is brought into contact with each lead L ₀ of the electronic component P ₀ (see FIG. 5) placed on the printed circuit board B ₀ , and each lead is pressed by the pressure cylinder 101a. Pressed by L ₀ .

[0005] Thus pressing plate 101 is pressed against the respective lead L ₀ is heated the solder H ₀ thereunder transmit heat of the heating block 102 to the respective lead L _0, it melted, and this pressurized Flow horizontally.

[0006] The solder H ₀ has been precoated to the part foot lands F ₀ on the printed board B ₀ as described above, heated by transferred from the heating block 102 through the presser plate 101 and the lead L ₀ heat Then, the lead L ₀ and the component foot land F ₀ are spread and joined to each other. At this time, as shown in FIG.
The pressure of 1 crushes the solder H ₀ into a flat shape, the wetted surface is enlarged, and the joining force is significantly improved.

After heating the holding plate 101 for a predetermined time, the heating block 102 is lifted from the upper surface of the holding plate 101 by driving the lift cylinder 102a. Then, cool air is blown from the blower tube 103 to the pressing plate 101 to cool it, and after confirming that the temperature of the solder H ₀ has become below the solidus point, the pressurizing cylinder 101a is reversely driven and pressed. Raise plate 101.

According to this method, if the alignment between the leads of the electronic component and the component foot land on the printed circuit board is appropriate, there is no risk of a solder bridge or the like occurring between the leads. It is suitable for soldering parts and is widely used.

[0009]

[SUMMARY OF THE INVENTION] However, according to the conventional art, as shown in FIG. 6, the printed board B ₀
The surface of the pre-coated solder H ₀ is generally curved in an oval shape due to surface tension. On the other hand, each lead of an electronic component having a narrow lead pitch generally has an extremely thin wall and is easily bent. Therefore, pressurized it presses the presser plate 101 to each lead L ₀ and, in the initial heating to process lead L ₀ is solder surface pressed against the solder H ₀ in the state of unmelted Slip to cause lateral slippage and induce troubles such as solder bridges.

That is, as described above, when the thin and easily bendable lead L ₀ is pressed against the surface of the solder H ₀ curved in an oval shape, the lead L ₀ slips at the curved portion to cause a significant positional deviation between the two. It will be in a depressed state between the foot lands F ₀ . If the solder H ₀ is melted in this state, the melted solder H ₀ is adjacent to the component foot land F.
_{Even when 0} is reached and a solder bridge X is generated as shown in FIG. 7, and even when the adjacent component foot land F _{0 is} not reached, the lead pitch between the leads L ₀ is substantially extremely narrowed, so that the electrical conductivity is reduced. This results in a significant loss of insulation reliability.

The present invention has been made in view of the above problems of the prior art. When the soldering member such as the lead of the electronic component is soldered with the solder pre-coated on the printed circuit board, the soldering member is used. It is an object of the present invention to provide a soldering processing device capable of avoiding a trouble such as a solder bridge caused by the lateral deviation of the solder.

[0012]

In order to achieve the above object, the soldering processing apparatus of the present invention comprises a holding plate which is reciprocally movable in a predetermined direction, a driving means for reciprocating the holding plate, and the holding plate. The holding plate has a holding surface having a non-slip means for preventing lateral displacement of the holding plate when pressed by the soldering member.

The non-slip means may be a plurality of protrusions.

Further, it is desirable that each projection has a tapered shape.

Further, it is preferable that a part of the pressing surface of the pressing plate is provided with anti-slip means and the remaining part is provided with a flat surface.

[0016]

Operation: The pressing plate is pressed against a soldering member such as a lead of an electronic component placed on the printed circuit board, and the heat of the heating means is placed under the soldering member between the pressing plate and the electronic component. To heat and melt it. The melted solder spreads between the component foot land of the printed circuit board and the soldering member of the electronic component to bond them.

At least a part of the pressing surface of the pressing plate that comes into contact with the soldering member of the electronic component is provided with anti-slip means composed of a plurality of protrusions, whereby the pressing plate is pressed against the soldering member of the electronic component. When doing so, it is possible to prevent the soldering member from slipping on the surface of the solder and causing lateral shift.

In this way, troubles such as solder bridges caused by lateral displacement of the soldering member can be avoided, and soldering with extremely high electrical connection can be performed.

If each projection of the anti-slip means has a tapered shape such as a cone shape or a pyramid shape, the lateral displacement of the soldering member of the electronic component can be prevented more reliably.

Further, if the non-slip means is provided on a part of the pressing surface of the pressing plate and the flat surface is provided on the remaining part, a large contact is made between the soldering member of the electronic component and the pressing plate. The surface can be secured and the heat transfer between them can be promoted, and the time required for the soldering process can be greatly saved.

[0021]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows a soldering processing apparatus E _{1 according} to one embodiment. (A) is a perspective view thereof, (b) is a bottom view showing only a holding plate, and (c) is an initial stage of a soldering process. It is a partial elevational view showing the state of FIG.

The soldering processing apparatus E ₁ includes a holding plate 1 which is vertically reciprocated by a pressure cylinder 1a which is a driving means, and a heating means which is brought into contact with the upper surface of the holding plate 1 to heat it. The heating block 2 is provided with a certain heating block 2. The heating block 2 has a resistance heater (not shown). The heating block 2 is brought into contact with the pressing plate 1 to heat it for a predetermined time, and then lifted from the upper surface of the pressing plate 1 by the lift cylinder 2a. .

The lower surface 11 which is the pressing surface of the pressing plate 1 is provided with a pair of anti-slip portions 11a having fine protrusions which are anti-slip means, and a flat surface 11b which is arranged between them.

The holding plate 1 is lowered onto the printed circuit board B ₁ by the driving of the pressure cylinder 1a, and the lower surface 11 of the holding plate 1 is pressed.
Is a lead L that is a soldering member for the electronic component P ₁ (shown in FIG. 2A) mounted on the printed circuit board B ₁ .
Is pressed into _1, the solder H ₁ thereunder a thermal heating block 2 is in contact with the upper surface of the pressing plate 1 tell each lead L ₁ heating, melting, and this pressurized horizontally Let it flow.

The solder H ₁ is pre-coated on the component foot land F ₁ on the printed board B _{1 in the same} manner as in the conventional example, and the solder block H ₁ is pressed from the heating block 2 to the holding plate 1 and the lead L _1.
It is heated and melted by the heat transmitted via the lead L ₁ and the component foot land F ₁ and spreads between them to join them. At this time, the pressure of the pressing plate 1 causes the solder H _{1 to} be flattened as shown in FIG. 2, so that the wetted surface is enlarged and the joining force is greatly improved.

The heating block 2 has a holding plate 1 for a predetermined time.
After being heated, it is lifted from the upper surface of the holding plate 1 by driving the lift cylinder 2a. Then, cold air is blown from the blower pipe 3 to the holding plate 1 to cool it, and the solder H
_After confirming that the temperature of ₁ has fallen below the solidus point, the pressure cylinder 1a is reversely driven to raise the holding plate 1. Figure 2
(B) shows the lead L ₁ thus soldered to the printed board B ₁ .

The prior art similarly to the printed board B ₁ on the component foot lands F ₁ precoated solder H ₁ of the surface is curved in oval shape due to surface tension, while
Since each lead L ₁ has an extremely thin wall and has a property of being easily bent, at the beginning of the soldering step, the pressing plate 1 is applied with each lead L ₁ placed on the surface of the solder H ₁ curved in an oval shape. If pressed, lead L ₁ will be solder H
There is a risk of slippage and slippage on the surface of ₁ .

A non-slip portion 11a of the lower surface 11 of the holding plate 1.
Configured is a provided in order to prevent lateral deviation of such leads L _1, firmly grip the surface of the lead L ₁ by fine protrusions on the surface of the slip parts 11a, preventing the lateral displacement Has been done.

Further, the flat surface 11b between the two anti-slip portions 11a has the holding plate 1 and the leads L _{1 so} that sufficient heat is transferred from the holding plate 1 to the solder H ₁ via the leads L _1.
It is provided to secure a wide contact surface between the two.

It is desirable that the projection of each anti-slip portion 11a has a tapered shape such as a pyramid shape or a conical shape. By making each projection tapered in this way, it is possible to more reliably prevent slippage between the pressing plate 1 and each lead L ₁ .

According to the present embodiment, by providing the non-slip portion on the lower surface of the pressing plate, the lead L ₁ can be prevented from slipping and troubles such as solder bridge caused by this can be easily avoided. If electronic components are mounted on a printed circuit board using such a soldering device, the reliability of electrical connection of electronic components can be greatly improved.

The shape of the non-slip portion of the pressing plate is not limited to a pair of thin belt-like ones along both edges of the lower surface of the pressing plate as shown in FIG. It may be a single belt-like member provided at the center of the presser plate, or as shown in FIG. 3 (a), it may be a plurality of belt-like non-slip portions 21a that obliquely cross the lower surface of the holding plate 21. Alternatively, as shown in (b), a large number of mottled non-slip portions 31a scattered on the lower surface of the pressing plate 31 may be used.

[0034]

Since the present invention is configured as described above, it has the following effects.

When soldering a soldering member such as a lead of an electronic component with solder pre-coated on a printed circuit board, troubles such as a solder bridge caused by lateral displacement of the soldering member are avoided, and reliability of electrical connection is improved. It is possible to perform soldering with extremely high properties.

In particular, it is suitable for mounting an electronic component having a narrow lead pitch on a printed board, and can greatly contribute to downsizing and high performance of various electronic devices.

[Brief description of drawings]

1A and 1B show a soldering processing apparatus according to an embodiment, in which FIG. 1A is a perspective view thereof, FIG. 1B is a bottom view showing only a holding plate, and FIG. 1C is an initial state of a soldering process. It is a partial elevation view shown.

2A and 2B are views for explaining soldering by the apparatus of FIG. 1, in which FIG. 2A is a schematic cross-sectional view showing a state immediately before the end;
(B) is a partial schematic cross-sectional view showing a printed circuit board and leads after completion of soldering.

FIG. 3 is a bottom view showing a modified example of the pressing plate, (a) is a first modified example, and (b) is a second modified example.

FIG. 4 is a schematic cross-sectional view showing a conventional example.

5 is a schematic cross-sectional view showing another state immediately before the end of the soldering step by the apparatus of FIG.

FIG. 6 is an explanatory diagram illustrating a state in which a lead slips in a conventional example.

FIG. 7 is an explanatory diagram illustrating a solder bridge generated in a conventional example.

[Explanation of symbols]

 1, 21, 31 Holding plate 1a Pressurizing cylinder 2 Heating block 2a Lift cylinder 11a, 21a, 31a Non-slip part 11b Flat surface

Claims (4)

[Claims] 1. A holding plate which is reciprocally movable in a predetermined direction, a drive means for reciprocating the holding plate, and a heating means for heating the holding plate, wherein the holding plate is pressed by a soldering member. A processing device for soldering, characterized in that it is provided with a pressing surface having a non-slip means for preventing the lateral displacement when the soldering occurs. 2. The soldering processing apparatus according to claim 1, wherein the non-slip means is a plurality of protrusions. 3. The soldering processing apparatus according to claim 2, wherein each protrusion has a tapered shape. 4. The solder according to claim 1, wherein a part of the pressing surface of the pressing plate is provided with anti-slip means, and the remaining part is provided with a flat surface. Processing equipment for attachment.