JP2002134906A - Thermocompression bonding apparatus and thermocompression bonding method for electronic components - Google Patents
Thermocompression bonding apparatus and thermocompression bonding method for electronic componentsInfo
- Publication number
- JP2002134906A JP2002134906A JP2000320617A JP2000320617A JP2002134906A JP 2002134906 A JP2002134906 A JP 2002134906A JP 2000320617 A JP2000320617 A JP 2000320617A JP 2000320617 A JP2000320617 A JP 2000320617A JP 2002134906 A JP2002134906 A JP 2002134906A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- thermocompression bonding
- suction
- tool
- thermocompression
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】
【課題】 熱圧着における押圧荷重や温度分布のばらつ
きを防止することができる電子部品の熱圧着装置および
熱圧着方法を提供することを目的とする。
【解決手段】 電子部品に熱圧着ツールを当接させて熱
と荷重によりワークに圧着する電子部品の熱圧着装置に
おいて、電子部品と当接し吸引孔５ａと連通する吸着溝
５ｂが格子状に形成された当接面５ｃを、電子部品上面
の面積に対する電子部品と接触する接触面積の比率が７
０％〜８０％の範囲であり、かつ吸着溝５ｂの最大幅が
０．３ｍｍ以下であるように設定する。これにより、熱
圧着時の熱伝達状態や押圧荷重の分布を均一にして、良
好な熱圧着を行うことができる。
(57) [Problem] To provide a thermocompression bonding apparatus and a thermocompression bonding method for electronic components, which can prevent a variation in a pressing load and a temperature distribution in thermocompression bonding. SOLUTION: In a thermocompression bonding apparatus for an electronic component in which a thermocompression bonding tool is brought into contact with an electronic component and heat and pressure is applied to a work, a suction groove 5b in contact with the electronic component and communicating with a suction hole 5a is formed in a lattice shape. The contact surface 5c has a contact area ratio of 7 to the electronic component upper surface area.
It is set so as to be in the range of 0% to 80% and the maximum width of the suction groove 5b is 0.3 mm or less. Thereby, the heat transfer state and the distribution of the pressing load during the thermocompression bonding can be made uniform, and good thermocompression bonding can be performed.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品を基板な
どのワークに熱圧着する電子部品の熱圧着装置および熱
圧着方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermocompression bonding apparatus and a thermocompression bonding method for electronic components for thermocompression bonding electronic components to a work such as a substrate.
【０００２】[0002]
【従来の技術】電子部品を基板などのワークに実装する
方法として熱圧着が知られている。この方法は、電子部
品のバンプなどの接合部を被接合面に対して所定の荷重
で押圧しながら電子部品を加熱することにより、接合部
を半田付けもしくは熱硬化性接着剤により接合するもの
である。この熱圧着に用いられる熱圧着ツールは、電子
部品を吸着保持させる吸着ツールを兼ねる場合が多く、
電子部品との当接面には真空吸着用の吸着溝が設けられ
る。電子部品を吸着保持する際には、この吸着溝に連通
した吸引孔から真空吸引することにより、当接面に電子
部品を真空吸着する。そして、異なる種類の電子部品を
対象とする場合には、熱圧着ツールの当接面には、電子
部品の種類やサイズに合わせた吸着溝が形成される。2. Description of the Related Art Thermocompression bonding is known as a method for mounting an electronic component on a work such as a substrate. In this method, an electronic component is heated while pressing a joint such as a bump of an electronic component against a surface to be joined with a predetermined load, thereby joining the joint with a solder or a thermosetting adhesive. is there. The thermocompression bonding tool used for thermocompression bonding often also serves as a suction tool for holding an electronic component by suction.
A suction groove for vacuum suction is provided on a contact surface with the electronic component. When the electronic component is suction-held, the electronic component is vacuum-sucked on the contact surface by vacuum suction through a suction hole communicating with the suction groove. When a different type of electronic component is targeted, a suction groove is formed on the contact surface of the thermocompression bonding tool according to the type and size of the electronic component.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来の
吸着ツールを兼用した熱圧着ツールでは、大型の電子部
品を熱圧着対象とする場合には、吸着溝の幅などのサイ
ズが大きくなることに伴って、以下のような問題が生じ
ている。すなわち吸着溝の幅が増大すると、真空吸引時
の負圧による吸引力が、吸着溝範囲のみに集中して作用
する結果、電子部品の上下方向の変形を招く場合があ
る。However, in the case of a conventional thermocompression bonding tool which also functions as a suction tool, when a large electronic component is to be subjected to thermocompression, the size of the suction groove and the like are increased. Therefore, the following problems have arisen. That is, when the width of the suction groove is increased, the suction force due to the negative pressure at the time of vacuum suction acts intensively only in the suction groove range, so that the electronic component may be vertically deformed.
【０００４】そしてこの変形状態のまま電子部品をワー
クに対して押圧すると、押圧荷重のばらつきを生じやす
い。また熱圧着時には熱圧着ツールを介して電子部品を
加熱するが、この場合吸着溝の範囲は電子部品と接触し
ていないためこの範囲からは熱が伝達されない。この結
果、熱圧着時の電子部品の温度分布にばらつきを生じ
る。このような押圧荷重や温度分布のばらつきは熱圧着
品質の不良を招く結果となる。このように従来の電子部
品の熱圧着には、熱圧着ツールの吸着溝配置に起因し
て、押圧荷重や温度分布のばらつきを生じるという問題
点があった。If the electronic component is pressed against the work in this deformed state, the pressing load tends to vary. Further, at the time of thermocompression bonding, the electronic component is heated via the thermocompression bonding tool. In this case, since the area of the suction groove is not in contact with the electronic component, heat is not transmitted from this area. As a result, variations occur in the temperature distribution of the electronic components during thermocompression bonding. Such variations in the pressing load and the temperature distribution result in poor thermocompression bonding quality. As described above, the conventional thermocompression bonding of an electronic component has a problem in that the pressing load and the temperature distribution vary due to the arrangement of the suction grooves of the thermocompression tool.
【０００５】そこで本発明は、熱圧着における押圧荷重
や温度分布のばらつきを防止することができる電子部品
の熱圧着装置および熱圧着方法を提供することを目的と
する。Accordingly, an object of the present invention is to provide a thermocompression bonding apparatus and a thermocompression bonding method for electronic components, which can prevent a variation in pressing load and temperature distribution in thermocompression bonding.
【０００６】[0006]
【課題を解決するための手段】請求項１記載の電子部品
の熱圧着装置は、電子部品に熱と荷重を作用させてワー
クに圧着する電子部品の熱圧着装置であって、前記電子
部品の上面に当接して電子部品を真空吸着によって保持
しこの電子部品を加熱するとともに前記ワークに対して
押圧する熱圧着ツールと、この熱圧着ツールの電子部品
との当接面に設けられた吸着溝と、熱圧着ツールを貫通
して設けられ前記吸着溝に連通した吸引孔と、この吸引
孔と接続された真空吸引手段とを備え、前記熱圧着ツー
ルの電子部品との当接面は、電子部品上面の面積に対す
る電子部品と接触する接触面積の比率が７０％〜８０％
の範囲に設定され、かつ吸着溝の最大幅が０．３ｍｍ以
下である。According to a first aspect of the present invention, there is provided a thermocompression bonding apparatus for an electronic component, which applies heat and load to the electronic component to press the electronic component against a workpiece. A thermocompression bonding tool that contacts the upper surface to hold the electronic component by vacuum suction, heats the electronic component, and presses the thermocompression tool against the work; A suction hole provided through the thermocompression bonding tool and communicating with the suction groove; and a vacuum suction unit connected to the suction hole. The ratio of the contact area in contact with the electronic component to the area of the component upper surface is 70% to 80%
And the maximum width of the suction groove is 0.3 mm or less.
【０００７】請求項２記載の電子部品の熱圧着装置は、
請求項１記載の電子部品の熱圧着装置であって、前記吸
着溝が格子状に形成されている。According to a second aspect of the present invention, there is provided a thermocompression bonding apparatus for electronic parts.
2. The thermocompression bonding apparatus for an electronic component according to claim 1, wherein the suction grooves are formed in a lattice shape.
【０００８】請求項３記載の電子部品の熱圧着方法は、
電子部品に熱と荷重を作用させてワークに圧着する電子
部品の熱圧着方法であって、電子部品との当接面に吸着
溝が形成された熱圧着ツールを前記電子部品の上面に当
接させて電子部品を真空吸着によって保持する工程と、
この熱圧着ツールに保持された電子部品を熱圧着ツール
によって加熱するとともにワークに対して押圧する工程
とを含み、前記熱圧着ツールの電子部品との当接面は、
電子部品上面の面積に対する電子部品と接触する接触面
積の比率が７０％〜８０％の範囲に設定され、かつ吸着
溝の最大幅が０．３ｍｍ以下である。According to a third aspect of the present invention, there is provided a thermocompression bonding method for an electronic component.
A thermocompression bonding method for an electronic component, in which heat and load are applied to an electronic component to apply pressure to a work, wherein a thermocompression bonding tool having a suction groove formed on a contact surface with the electronic component is brought into contact with an upper surface of the electronic component. And holding the electronic component by vacuum suction,
Heating the electronic component held by the thermocompression tool with the thermocompression tool and pressing the work against the workpiece, wherein the contact surface of the thermocompression tool with the electronic component is
The ratio of the area of contact with the electronic component to the area of the upper surface of the electronic component is set in the range of 70% to 80%, and the maximum width of the suction groove is 0.3 mm or less.
【０００９】各請求項記載の発明によれば、熱圧着ツー
ルの電子部品との当接面において、電子部品上面の面積
に対する電子部品と接触する接触面積の比率が７０％〜
８０％の範囲でかつ吸着溝の最大幅が０．３ｍｍ以下と
なるような吸着溝配置パターンに設定することにより、
熱圧着時の熱伝達状態や押圧荷重の分布を均一にして、
良好な熱圧着を行うことができる。According to the present invention, the ratio of the contact area of the thermocompression bonding tool to the electronic component on the contact surface with the electronic component is 70% to 70%.
By setting the suction groove arrangement pattern such that the maximum width of the suction groove is 80% and the maximum width of the suction groove is 0.3 mm or less,
Uniform heat transfer state and pressing load distribution during thermocompression bonding
Good thermocompression bonding can be performed.
【００１０】[0010]
【発明の実施の形態】次に本発明の実施の形態を図面を
参照して説明する。図１は本発明の一実施の形態の電子
部品の熱圧着装置の部分正面図、図２は本発明の一実施
の形態の電子部品の熱圧着装置の熱圧着ツールの反転斜
視図、図３、図４は本発明の一実施の形態の電子部品の
熱圧着装置の熱圧着ツールの下面図、図５は本発明の一
実施の形態の電子部品の熱圧着方法の説明図である。Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a partial front view of a thermocompression bonding apparatus for electronic components according to an embodiment of the present invention. FIG. 2 is an inverted perspective view of a thermocompression bonding tool of the thermocompression bonding apparatus for electronic components according to one embodiment of the present invention. FIG. 4 is a bottom view of a thermocompression bonding tool of an electronic component thermocompression bonding apparatus according to one embodiment of the present invention, and FIG. 5 is an explanatory diagram of a thermocompression bonding method for electronic components according to one embodiment of the present invention.
【００１１】まず図１を参照して電子部品の熱圧着装置
の構造を説明する。図１において、ステージ１が図示し
ない可動テーブル上に設けられている。ステージ１には
上面に電極２ａが形成されたワークである基板２が保持
されている。ステージ１の上方には、熱圧着部３が配設
されている。熱圧着部３は昇降押圧機構１０によって昇
降する昇降ブロック８を備えており、昇降ブロック８の
下面には、断熱部材７を介して発熱部６が取り付けられ
ている。発熱部６の下面には更に熱圧着ツール５が着脱
自在に装着されている。First, the structure of a thermocompression bonding apparatus for electronic components will be described with reference to FIG. In FIG. 1, a stage 1 is provided on a movable table (not shown). The stage 1 holds a substrate 2 which is a work having an electrode 2a formed on the upper surface. Above the stage 1, a thermocompression bonding section 3 is provided. The thermocompression bonding unit 3 includes an elevating block 8 that is moved up and down by an elevating and pressing mechanism 10, and a heating unit 6 is attached to the lower surface of the elevating block 8 via a heat insulating member 7. A thermocompression bonding tool 5 is further detachably mounted on the lower surface of the heat generating section 6.
【００１２】熱圧着ツール５の中央部には吸引孔５ａが
貫通して設けられており、吸引孔５ａは、発熱部６、断
熱部材７、昇降ブロック８にそれぞれ形成された真空吸
引用の内孔６ａ，７ａ，８ａを介して真空吸引手段９に
接続されている。熱圧着ツール５を電子部品４の上面に
当接させた状態で真空吸引手段９を駆動することによ
り、熱圧着ツール５はバンプ４ａが形成された電子部品
４を下面に吸着して保持する。A suction hole 5a is provided at the center of the thermocompression bonding tool 5 so as to penetrate therethrough. The suction hole 5a is formed in each of the heat generating portion 6, the heat insulating member 7, and the elevating block 8 for vacuum suction. It is connected to vacuum suction means 9 through holes 6a, 7a, 8a. By driving the vacuum suction means 9 with the thermocompression bonding tool 5 in contact with the upper surface of the electronic component 4, the thermocompression bonding tool 5 sucks and holds the electronic component 4 on which the bumps 4a are formed on the lower surface.
【００１３】熱圧着ツール５によって電子部品４を保持
した状態で、昇降押圧機構１０を駆動して昇降ブロック
８を下降させることにより、電子部品４のバンプ４ａは
基板２の電極２ａに当接する。この状態で発熱部６によ
って電子部品４を加熱すると共に、昇降押圧機構１０に
よって電子部品４を押圧することにより、電子部品４は
バンプ４ａが電極２ａに接合されて基板２に熱圧着され
る。このとき断熱部材７によって昇降ブロック８への熱
伝達が遮断される。While the electronic component 4 is held by the thermocompression bonding tool 5, the lifting / lowering mechanism 10 is driven to lower the lifting block 8, so that the bumps 4 a of the electronic component 4 come into contact with the electrodes 2 a of the substrate 2. In this state, the electronic component 4 is heated by the heating unit 6 and pressed by the lifting / lowering mechanism 10, whereby the electronic component 4 is thermocompression-bonded to the substrate 2 with the bumps 4 a joined to the electrodes 2 a. At this time, heat transfer to the lifting block 8 is blocked by the heat insulating member 7.
【００１４】次に図２、図３を参照して熱圧着ツール５
について説明する。熱圧着ツール５の下面は電子部品と
の当接面５ｃとなっており、図２に示すように当接面５
ｃの中心部には電子部品吸着用の吸引孔５ａが開口して
いる。当接面５ｃには、吸引孔５ａと連通した吸着溝５
ｂが格子状に形成されており、当接面５ｃに電子部品４
を当接させた状態で吸引孔５ａから真空吸引することに
より、吸着溝５ｂの範囲が負圧となり、電子部品４は当
接面５ｃに真空吸着される。Next, referring to FIG. 2 and FIG.
Will be described. The lower surface of the thermocompression bonding tool 5 is a contact surface 5c with the electronic component, and as shown in FIG.
A suction hole 5a for sucking an electronic component is opened at the center of c. The contact surface 5c has a suction groove 5 communicating with the suction hole 5a.
b is formed in a lattice shape, and the electronic component 4
Is sucked from the suction hole 5a in a state in which the electronic components 4 are in contact with each other, the area of the suction groove 5b becomes negative pressure, and the electronic component 4 is vacuum-sucked on the contact surface 5c.
【００１５】ここで、吸着溝５ｂの幅ｂには上限が設定
されており、最大幅が０．３ｍｍ以下となるように設計
される。吸着溝の幅に上限を設ける理由は、吸着溝の幅
が大きくなると当接面５ｃから電子部品４への熱伝達に
むらが生じるためである。また図３に示す吸着溝５ｂの
配列ピッチＰ、すなわち配列密度は、当接面５ｃに電子
部品４が当接した状態において、電子部品４の上面の面
積に対する電子部品と接触する接触面積の比率（接触面
積比率）が、７０％〜８０％の範囲の比率となるように
設定される。Here, an upper limit is set for the width b of the suction groove 5b, and the suction groove 5b is designed so that the maximum width is 0.3 mm or less. The reason why the upper limit of the width of the suction groove is set is that if the width of the suction groove is increased, the heat transfer from the contact surface 5c to the electronic component 4 becomes uneven. The arrangement pitch P of the suction grooves 5b shown in FIG. 3, that is, the arrangement density is the ratio of the contact area in contact with the electronic component to the area of the upper surface of the electronic component 4 when the electronic component 4 is in contact with the contact surface 5c. (Contact area ratio) is set to be a ratio in the range of 70% to 80%.
【００１６】この範囲を下回ると当接面５ｃから電子部
品４への熱伝達が悪くなり、接合に時間がかかってしま
う。逆に上回ると電子部品４を吸引して保持する力が不
足する。更に吸着溝５ｂの配列を格子状にすると共に、
その配列ピッチＰを一定にしている。これにより当接面
５ｃからの熱伝達が均一になる。また吸着溝５ｂと配列
ピッチＰの寸法を設計基準として標準化することによ
り、以下に説明するような効果を得る。If it is below this range, the heat transfer from the contact surface 5c to the electronic component 4 will be poor, and it will take a long time to join. On the contrary, if it exceeds, the power to suck and hold the electronic component 4 becomes insufficient. Further, the arrangement of the suction grooves 5b is formed in a lattice shape,
The arrangement pitch P is constant. Thereby, heat transfer from the contact surface 5c becomes uniform. By standardizing the dimensions of the suction groove 5b and the arrangement pitch P as design criteria, the following effects can be obtained.
【００１７】図４は、熱圧着対象の電子部品に応じて専
用に設計された２つの熱圧着ツール５，５’の下面を対
比して示したものである。すなわち、２つの電子部品の
サイズが異なる場合には、それぞれのサイズＢ，Ｂ’に
対応して、異なる大きさの当接面を備えた熱圧着ツール
５，５’が設計される。このように当接面の大きさが異
なる場合にあっても、図４に示すように吸着溝５ｂ，
５’ｂの幅ｂや配列ピッチＰは同一であり、同一の吸着
溝配置パターンが採用される。本実施の形態では、吸着
溝の幅ｂを０．３ｍｍ、配列ピッチＰを２ｍｍとしてい
る。FIG. 4 shows the lower surfaces of two thermocompression tools 5, 5 'specially designed according to the electronic components to be thermocompression-bonded. That is, when the sizes of the two electronic components are different, thermocompression bonding tools 5 and 5 ′ having different sizes of contact surfaces are designed corresponding to the respective sizes B and B ′. Even when the contact surfaces have different sizes, as shown in FIG. 4, the suction grooves 5b,
The width b and the arrangement pitch P of 5′b are the same, and the same suction groove arrangement pattern is adopted. In the present embodiment, the width b of the suction groove is 0.3 mm, and the arrangement pitch P is 2 mm.
【００１８】このように同一の吸着溝配置パターンを採
用することにより、電子部品のサイズに応じて当接面の
サイズを変更する際においても、常に前述の接触面積比
率はほぼ一定値に保たれる。したがって、熱圧着ツール
の設計時には単に当接面のサイズを電子部品に合わせて
決定するだけでよく、その都度個別に吸着溝配置を決定
していた従来の設計方法に比べて、設計作業を大幅に簡
略化することができる。By employing the same suction groove arrangement pattern as described above, even when the size of the contact surface is changed in accordance with the size of the electronic component, the above-mentioned contact area ratio is always kept at a substantially constant value. It is. Therefore, when designing a thermocompression bonding tool, it is only necessary to determine the size of the contact surface according to the electronic component, and the design work is significantly larger than the conventional design method in which the arrangement of the suction groove is determined individually each time. Can be simplified.
【００１９】図５は、このような熱圧着ツール５によっ
てバンプ付きの電子部品４を基板２に熱圧着している状
態を示している。図５に示すように、吸着溝５ｂの配列
は電子部品４の上面の全範囲にわたって均一に配置され
ていることから、熱圧着ツール５を介して電子部品４に
伝達される発熱部６からの熱や、昇降押圧機構１０によ
る押圧荷重は、電子部品４の上面全体にわたって当接面
５ｃから伝達される。これにより、押圧荷重が偏在する
ことによる電子部品４の撓み変形や、電子部品が偏って
加熱されることに起因して発生する熱圧着不良が発生し
ない。FIG. 5 shows a state where the electronic component 4 with bumps is thermocompression-bonded to the substrate 2 by such a thermocompression tool 5. As shown in FIG. 5, since the arrangement of the suction grooves 5 b is uniformly arranged over the entire range of the upper surface of the electronic component 4, the arrangement of the suction grooves 5 b from the heat generating portion 6 transmitted to the electronic component 4 via the thermocompression bonding tool 5. The heat and the pressing load by the lifting / lowering pressing mechanism 10 are transmitted from the contact surface 5 c over the entire upper surface of the electronic component 4. Thereby, the bending deformation of the electronic component 4 due to the uneven distribution of the pressing load and the thermocompression failure caused by the uneven heating of the electronic component do not occur.
【００２０】[0020]
【発明の効果】本発明によれば、熱圧着ツールの電子部
品との当接面において、電子部品上面の面積に対する電
子部品と接触する接触面積の比率が７０％〜８０％の範
囲でかつ吸着溝の最大幅が０．３ｍｍ以下となるような
吸着溝配置パターンに設定したので、熱圧着時の熱伝達
状態や押圧荷重の分布を均一にして、良好な熱圧着を行
うことができる。According to the present invention, at the contact surface of the thermocompression bonding tool with the electronic component, the ratio of the contact area in contact with the electronic component to the area of the upper surface of the electronic component is in the range of 70% to 80% and the suction is performed. Since the suction groove arrangement pattern is set so that the maximum width of the groove is 0.3 mm or less, the heat transfer state and the distribution of the pressing load at the time of thermocompression bonding can be made uniform, and good thermocompression bonding can be performed.
【図１】本発明の一実施の形態の電子部品の熱圧着装置
の部分正面図FIG. 1 is a partial front view of a thermocompression bonding apparatus for electronic components according to an embodiment of the present invention.
【図２】本発明の一実施の形態の電子部品の熱圧着装置
の熱圧着ツールの反転斜視図FIG. 2 is an inverted perspective view of a thermocompression bonding tool of the thermocompression bonding apparatus for electronic components according to one embodiment of the present invention.
【図３】本発明の一実施の形態の電子部品の熱圧着装置
の熱圧着ツールの下面図FIG. 3 is a bottom view of the thermocompression bonding tool of the thermocompression bonding apparatus for electronic components according to one embodiment of the present invention.
【図４】本発明の一実施の形態の電子部品の熱圧着装置
の熱圧着ツールの下面図FIG. 4 is a bottom view of the thermocompression bonding tool of the thermocompression bonding apparatus for electronic components according to one embodiment of the present invention.
【図５】本発明の一実施の形態の電子部品の熱圧着方法
の説明図FIG. 5 is an explanatory diagram of a thermocompression bonding method for an electronic component according to an embodiment of the present invention.
１ ステージ ２ 基板 ３ 熱圧着部 ４ 電子部品 ５ 熱圧着ツール ５ａ 吸引孔 ５ｂ 吸着溝 ５ｃ 当接面 ９ 真空吸引手段 １０ 昇降押圧機構 Reference Signs List 1 stage 2 substrate 3 thermocompression unit 4 electronic component 5 thermocompression tool 5a suction hole 5b suction groove 5c contact surface 9 vacuum suction means 10 lifting / lowering pressing mechanism
Claims (3)
圧着する電子部品の熱圧着装置であって、前記電子部品
の上面に当接して電子部品を真空吸着によって保持しこ
の電子部品を加熱するとともに前記ワークに対して押圧
する熱圧着ツールと、この熱圧着ツールの電子部品との
当接面に設けられた吸着溝と、熱圧着ツールを貫通して
設けられ前記吸着溝に連通した吸引孔と、この吸引孔と
接続された真空吸引手段とを備え、前記熱圧着ツールの
電子部品との当接面は、電子部品上面の面積に対する電
子部品と接触する接触面積の比率が７０％〜８０％の範
囲に設定され、かつ吸着溝の最大幅が０．３ｍｍ以下で
あることを特徴とする電子部品の熱圧着装置。An electronic component thermocompression bonding device for applying heat and load to an electronic component to apply pressure to a work, wherein the electronic component is brought into contact with an upper surface of the electronic component to hold the electronic component by vacuum suction, and to hold the electronic component. A thermocompression tool that heats and presses against the work, a suction groove provided on a contact surface of the thermocompression tool with an electronic component, and is provided through the thermocompression tool and communicates with the suction groove. A suction hole, and a vacuum suction means connected to the suction hole, wherein a contact surface of the thermocompression bonding tool with the electronic component has a contact area ratio of 70% with respect to the area of the upper surface of the electronic component. A thermocompression bonding apparatus for an electronic component, wherein the apparatus is set to a range of about 80% and the maximum width of the suction groove is 0.3 mm or less.
を特徴とする請求項１記載の電子部品の熱圧着装置。2. The thermocompression bonding apparatus for an electronic component according to claim 1, wherein said suction grooves are formed in a lattice shape.
圧着する電子部品の熱圧着方法であって、電子部品との
当接面に吸着溝が形成された熱圧着ツールを前記電子部
品の上面に当接させて電子部品を真空吸着によって保持
する工程と、この熱圧着ツールに保持された電子部品を
熱圧着ツールによって加熱するとともにワークに対して
押圧する工程とを含み、前記熱圧着ツールの電子部品と
の当接面は、電子部品上面の面積に対する電子部品と接
触する接触面積の比率が７０％〜８０％の範囲に設定さ
れ、かつ吸着溝の最大幅が０．３ｍｍ以下であることを
特徴とする電子部品の熱圧着方法。3. A thermocompression bonding method for an electronic component, wherein heat and load are applied to the electronic component to apply pressure to a workpiece, wherein the thermocompression bonding tool has a suction groove formed on a contact surface with the electronic component. Holding the electronic component by vacuum suction by contacting the upper surface of the thermocompression bonding tool; and heating the electronic component held by the thermocompression bonding tool by the thermocompression bonding tool and pressing against the work. The contact surface of the tool with the electronic component has a contact area ratio of 70% to 80% with respect to the area of the upper surface of the electronic component, and the maximum width of the suction groove is 0.3 mm or less. A thermocompression bonding method for an electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000320617A JP2002134906A (en) | 2000-10-20 | 2000-10-20 | Thermocompression bonding apparatus and thermocompression bonding method for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000320617A JP2002134906A (en) | 2000-10-20 | 2000-10-20 | Thermocompression bonding apparatus and thermocompression bonding method for electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002134906A true JP2002134906A (en) | 2002-05-10 |
Family
ID=18798872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000320617A Pending JP2002134906A (en) | 2000-10-20 | 2000-10-20 | Thermocompression bonding apparatus and thermocompression bonding method for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002134906A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005112537A1 (en) * | 2004-05-17 | 2005-11-24 | Matsushita Electric Industrial Co., Ltd. | Part feeding head device and part mounting head device |
| WO2005122237A1 (en) * | 2004-06-08 | 2005-12-22 | Matsushita Electric Industrial Co., Ltd. | Component mounting method and component mounting apparatus |
| WO2008103263A3 (en) * | 2007-02-16 | 2008-11-27 | Heetronix | Platen for use with a thermal attach and detach system which holds components by vacuum suction |
| EP2381465A1 (en) * | 2010-04-22 | 2011-10-26 | Kulicke & Soffa Die Bonding GmbH | Tool tip interface for a die handling tool |
| JP2012104693A (en) * | 2010-11-11 | 2012-05-31 | Shibuya Kogyo Co Ltd | Bonding device |
| JP2015115497A (en) * | 2013-12-12 | 2015-06-22 | 澁谷工業株式会社 | Bonding device |
| WO2017065073A1 (en) * | 2015-10-16 | 2017-04-20 | 東レエンジニアリング株式会社 | Bonding head and mounting device |
| WO2020231068A1 (en) * | 2019-05-10 | 2020-11-19 | (주)포인트엔지니어링 | Micro led adsorbent body, method for manufacturing micro led display using same, and micro led display |
-
2000
- 2000-10-20 JP JP2000320617A patent/JP2002134906A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005112537A1 (en) * | 2004-05-17 | 2005-11-24 | Matsushita Electric Industrial Co., Ltd. | Part feeding head device and part mounting head device |
| US7650691B2 (en) | 2004-05-17 | 2010-01-26 | Panasonic Corporation | Component supply head device and component mounting head device |
| WO2005122237A1 (en) * | 2004-06-08 | 2005-12-22 | Matsushita Electric Industrial Co., Ltd. | Component mounting method and component mounting apparatus |
| JP2005353696A (en) * | 2004-06-08 | 2005-12-22 | Matsushita Electric Ind Co Ltd | Component mounting method and component mounting apparatus |
| CN100461358C (en) * | 2004-06-08 | 2009-02-11 | 松下电器产业株式会社 | Component mounting method and component mounting device |
| WO2008103263A3 (en) * | 2007-02-16 | 2008-11-27 | Heetronix | Platen for use with a thermal attach and detach system which holds components by vacuum suction |
| EP2381465A1 (en) * | 2010-04-22 | 2011-10-26 | Kulicke & Soffa Die Bonding GmbH | Tool tip interface for a die handling tool |
| JP2012104693A (en) * | 2010-11-11 | 2012-05-31 | Shibuya Kogyo Co Ltd | Bonding device |
| JP2015115497A (en) * | 2013-12-12 | 2015-06-22 | 澁谷工業株式会社 | Bonding device |
| WO2017065073A1 (en) * | 2015-10-16 | 2017-04-20 | 東レエンジニアリング株式会社 | Bonding head and mounting device |
| WO2020231068A1 (en) * | 2019-05-10 | 2020-11-19 | (주)포인트엔지니어링 | Micro led adsorbent body, method for manufacturing micro led display using same, and micro led display |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6234277B2 (en) | Crimping head, mounting apparatus and mounting method using the same | |
| JP2002134906A (en) | Thermocompression bonding apparatus and thermocompression bonding method for electronic components | |
| US5192015A (en) | Method for wire bonding | |
| JP4586583B2 (en) | Semiconductor device bonding method | |
| KR101093060B1 (en) | Mounting method and structure of electronic parts with bump | |
| JP3449185B2 (en) | Electronic component bonding equipment | |
| JP3185783B2 (en) | Nozzle for thermocompression bonding of chips | |
| JPH11274202A (en) | Bump forming device and chip tray used in bump formation | |
| JP3348830B2 (en) | Solder bump bonding apparatus and solder bump bonding method | |
| JP4934831B2 (en) | Manufacturing method of semiconductor package | |
| JPH1022349A (en) | Chip thermocompression device | |
| JP3395609B2 (en) | Solder bump formation method | |
| JP2001079949A (en) | Thermocompression bonding equipment | |
| JP3589159B2 (en) | Bonding apparatus and bonding method for electronic component with bump | |
| JP3337068B2 (en) | Method for joining electronic components using flux sheet | |
| JP3656631B2 (en) | Electronic component bonding tool and bonding apparatus | |
| KR102760328B1 (en) | Tool horn for bonding with integrated heat and ultrasonic vibration and bonding method using the same | |
| JP4307047B2 (en) | Electronic component bonding tool and bonding apparatus | |
| JPH10107074A (en) | Bump bonder | |
| JP2002313834A (en) | Bonding stage, wire bonder and method for mounting circuit board mounting unit | |
| JP3409688B2 (en) | Bonding tool and bonding device for electronic components | |
| JP3987164B2 (en) | Method for forming protruding electrodes on IC PAD | |
| JP2006005031A (en) | Component mounting apparatus and component mounting method | |
| KR20250035256A (en) | Semiconductor package bonding tool and semiconductor package manufacturing method using the same | |
| JP2712592B2 (en) | Bonding tool and fixing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20040831 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20041130 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050121 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20050510 |